TW201038659A - Resin composition - Google Patents

Abstract

A resin composition which has excellent low-temperature curability and can give a cured object having excellent moisture imnermeabilitv The resin composition comprises an epoxy resin and an ionic liquid.

Description

[Technical Field] The present invention relates to a resin composition and a film for sealing an organic EL element using the same. [Prior Art] The organic EL (electroluminescence) element is weak to moisture. When the display device or the illumination device is formed using an organic EL device, the organic material itself is deteriorated by moisture, and the brightness is lowered and the light is not emitted. The interface between the electrode and the organic EL layer is deviated by the influence of moisture, and the metal is oxidized to have a high resistance. Therefore, for example, as shown in Fig. 4, on the organic EL element 2 formed on the glass substrate 1, the glass 4 to which the moisture absorbing material 3 is attached is placed at a predetermined interval and opposed to each other so that the substrate i and the glass plate 4 are placed. An inert gas atmosphere or a vacuum state is formed to perform a sealed can closure process. However, the thickness of the closed Q structure portion including the organic EL element and the two glass sheets is increased, so that the display device or the illumination device cannot be sufficiently thinned. Therefore, as shown in Fig. 1, it is proposed to form the curable resin composition layer 6 on the entire surface of the organic EL element 2 coated on the glass substrate 1 on which the organic EL element 2 is formed, and to be bonded thereto. In the base material 7, the curable resin composition layer 6 is cured to form a closed structure of the hardened layer (hereinafter, the closed structure is referred to as "total sealing of the organic EL element" or simply "completely closed") (Patent Document 1). However, in the patent document: 1, the curable resin composition is an acrylic ultraviolet hard-5-201038659 resin composition, which has a problem that the organic EL element is deteriorated or a portion where ultraviolet rays are not reached (not The hardened part) does not easily produce the problem of a highly reliable closed structure. Further, when compared with an epoxy resin, the acrylic resin is not preferable in terms of physical properties such as heat resistance. Therefore, in recent years, a thermosetting composition containing an epoxy resin as a main component has been reviewed (for example, Patent Document 2). However, in order to suppress the deterioration of the heat of the organic EL element, it is necessary to have excellent low-temperature hardenability, and when the cured product of the epoxy resin is compared with the cured product of the acrylic resin, it is not good in moisture permeability resistance. Therefore, it is necessary to improve the moisture permeability resistance of the cured product, but it has not yet reached a curable resin composition containing an epoxy resin as a main agent which can sufficiently satisfy the requirement. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2006-70221. It is a resin composition of a cured product which is excellent in moisture permeability. In order to solve the above problems, the inventors of the present invention have further infiltrated the results of the review. It has been found that the present invention can be completed by using a resin composition containing an epoxy resin and an ionic liquid. In other words, the present invention encompasses the following. (1) A resin composition characterized by containing an epoxy resin and an ionic liquid. (2) The resin composition according to the above (1), wherein the ionic liquid is composed of an ammonium cation or a squamous cation, and an N-mercaptoamino acid ion or a carboxylic acid anion. (3) The resin composition according to (1) or (2) above which further contains a hygroscopic metal oxide. (4) The resin composition according to any one of (1) to (3) above which further comprises an inorganic chelating material. (5) A resin composition sheet which is formed by forming a layer of the resin composition according to any one of (1) to (4) on a support. (A) The resin composition sheet according to the above (5), which is used for sealing an organic EL element. (7) An organic EL device comprising the sheet of the resin composition for sealing an organic E L element described in the above (6). [Effect of the Invention] Q By the resin composition of the present invention, it is 14,000. {: The following (better than 1 2 ° C) or less is rapidly hardened at a low temperature to form a cured product excellent in moisture permeability resistance and excellent in adhesion strength. In addition, the resin composition of the present invention and the resin composition sheet using the same can be suitably used as a coating material, a bonding material, and a sealing device which are used for various devices and components thereof which are susceptible to heat deterioration and which have a moisture-proof effect. A material or the like can easily form a coating structure, a bonded structure, a closed structure, and the like which have high moisture resistance and high reliability. In particular, it is possible to provide a highly reliable organic EL display device or an organic EL illumination device. 201038659 [Mode for Carrying Out the Invention] Hereinafter, the present invention will be described in a suitable embodiment. The resin composition of the present invention is characterized by containing an epoxy resin and an ionic liquid. The term "ionic liquid" as used herein generally means "a salt composed of an anion and a cation which melts in a temperature range of about loot or less", but in the present specification means "consisting of an anion and a cation" a salt that melts in a temperature range below the hardening temperature." In other words, it is a salt which melts in a temperature range of 14 (TC or less (preferably 120 ° C or less)), and has an epoxy resin hardening effect. [Epoxy resin] The epoxy resin used in the present invention is an average It is sufficient to have two or more epoxy groups per molecule, such as bisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin, Naphthalene type epoxy resin, bisphenol F type epoxy resin, phosphorus-containing epoxy resin, bisphenol S type epoxy resin, aromatic epoxy propylamine type epoxy resin (for example, tetraglycidyldiamine diphenyl group) Methane, triepoxypropyl-P-aminophenol, diepoxypropyl toluidine, diepoxypropyl aniline, etc.), alicyclic epoxy resin, aliphatic chain epoxy resin, phenol novolac type Epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, epoxy resin with butadiene structure, diepoxypropoxy ether compound of bisphenol, two rings of naphthalenediol Oxypropoxylates, phenolic propyl ethers, and alcohols -8- 201038659 diepoxypropoxylate And an alkyl group-substituted product, a halide, a hydride, etc. of the epoxy resin, etc. The epoxy resin may be used in combination of any one or two or more kinds. The epoxy resin maintains high heat resistance of the resin composition of the present invention. In terms of properties and low moisture permeability, among these, bisphenol A type epoxy resin, bisphenol F type epoxy resin 'phenol novolac type epoxy resin, biphenyl aralkyl type epoxy resin' A phenol aralkyl type epoxy resin, an aromatic propylene oxide type epoxy resin, an epoxy resin having a dicyclopentadiene structure, etc. 〇 In addition, the epoxy resin may be in a liquid form and may be a solid. In the form of a liquid or a solid, the "liquid" and the "solid" are in the form of an epoxy resin at a normal temperature (25 ° C), in terms of coatability, workability, and adhesion. It is preferable to use at least 10% by weight or more of the entire epoxy resin as a liquid. Further, in the present invention, in terms of reactivity, the epoxy resin has an epoxy equivalent of 100 to 1,000. Preferably, the preferred one is in the range of 120 to 1000 Q. Here, the epoxy equivalent system contains 1 gram. The number of grams of epoxy resin (g/eq) 'measured according to the method specified in Jis K 723 6 [Ionic liquid] The ionic liquid used in the present invention has a function as a resin curing agent. The resin composition is preferably used in a state in which the ionic liquid is uniformly dissolved in the epoxy resin. The cation constituting the ionic liquid, such as imidazolium salt, piperidine-9, 201038659 salt ion, warm; An ammonium cation such as a phosphonium salt, a pyridylium salt ion, a sulfonium salt ion, or a pyridine key ion; a squamous cation such as a tetraalkyl squamous cation (for example, tetrabutyl sulfonium ion, tributylhexyl hydrazine ion, etc.) An anion such as a triethylsulfonium ion or the like, an anion of an ionic liquid, such as a fluoride ion, a chloride ion, a bromide ion, an iodide ion, or the like; an alkyl group such as a methanesulfonate ion; Sulfate anion; trifluoromethanesulfonate ion, hexafluorophosphonic acid ion, trifluoroparagon (pentafluoroethyl) phosphonic acid ion, bis(trifluoromethanesulfonyl) quinone imine ion, trifluoroacetate ion a fluorine-containing compound such as tetrafluoroboric acid ion; an phenolic anion such as a phenol ion, a 2-methoxyphenol ion or a 2,6-di-tert-butylphenol ion; an aspartate ion, a valley Acidic amino acid ion such as aminic acid ion; neutral amino acid ion such as glycine ion, alanine ion, phenylalanine ion; N-benzhydryl propylamine ion, N-ethyl decyl benzene a N-acid amino acid ion represented by the following general formula (1); a formic acid ion, an acetic acid ion, a decanoic acid ion, a 2-pyrrolidone-5- group, such as a propylamine ion, an N-ethlyl glycine acid ion or the like; A carboxylic acid anion such as a carboxylate ion, an α-lipoic acid ion, a lactate ion, a tartaric acid ion, a hippuric acid ion, a quinone-methyl hippuric acid ion, or a benzoic acid ion. 【化1】 〇

-10- 201038659 (wherein RC 0- is a fluorenyl group derived from a linear or branched fatty acid having 1 to 5 carbon atoms, or a substituted or unsubstituted benzamidine group, -ΝΗ-CHX- C〇2 is an acidic amino acid ion such as aspartic acid or glutamic acid, or a neutral amino acid ion such as glycine acid, alanine ion or phenylalanine ion. The cation of the liquid is preferably an ammonium cation or a ruthenium cation, and more preferably an imidazole salt or a ruthenium ion. More specifically, 'imidazole iron salt ion has 1-ethyl-3-methylimidazole gun salt ion, 1-butyl-3-methylimidazolium salt ion, 1-propyl-3-methylimidazole salt In addition, the ion is equal to the anion of the ionic liquid, and the phenol-based anion is preferably a fluorenyl-mercapto-amino acid ion or a carboxylic acid-based anion represented by the general formula (1) as a fluorenyl-mercaptoamino acid ion. Or a carboxylic acid anion is more preferable. Specific examples of the phenolic anion, such as 2,6-di-tert-butylphenol, are separated from the Q. Further, specific examples of the 'carboxylic acid anion, such as acetate ion, citric acid ion, 2-pyrrolidone-5-carboxylic acid ion, formic acid ion, α-lipoic acid, lactate ion, tartaric acid ion, hippuric acid ion, strontium-methyl group Horse uric acid ion, etc., wherein 'with acetic acid ion, 2-pyrrolidone-5-carboxylic acid ion 'formic acid ion, lactate ion, tartaric acid ion, hippuric acid ion, Ν-methyl hippuric acid ion preferably' with acetic acid ion, strontium - Methyl hippuric acid ion and formic acid ion are more preferable. Further, specific examples of the indole-fluorenylamino acid ion represented by the general formula (1) such as Ν-benzimidylalanine ion, Ν-acetylphenyl phenylalanine ion, aspartate ion , glycine acid ion ' Ν - acetyl methionine ion, etc., -11 - 201038659 wherein N-benzhydryl propylamine ion, N-acetyl phenylalanine ion, N-ethyl thioglycolate The amine acid ion is preferred, and the N-acetylglycolic acid ion is more preferred. Specific ionic liquids, such as lauric acid-1-butyl-3-methylimidazolium, tetrabutylscale-2-pyrrolidone-5-carboxylate, tetrabutyliron acetate, tetrabutyl phthalate Salt, tetrabutylammonium trifluoroacetate, tetrabutylphosphonium alpha-lipoate, tetrabutylammonium formate, tetrabutyl garrate, bis(tetrabutyl) tartaric acid, tetrabutyl urate Squama salt, Ν-methyl horse uric acid tetrabutyl sulfonium salt, benzamidine-DL-alanine tetrabutyl sulfonium salt, Ν-ethyl phenyl phenylalanine tetrabutyl sulfonium salt, 2,6-two - 3-butylphenol tetrabutyl ketone salt, L-aspartic acid monotetrabutyl sulphate salt, glycine acid tetrabutyl rust salt, Ν-acetamidoglycine tetrabutyl iron salt, lactic acid 1-ethyl-3-methylimidazolium salt, acetate-1-ethyl-3-methylimidazolium salt, formic acid_1_ethyl_3_methylimidazole key salt, hippuric acid-1-B 3-methylimidazolium salt, Ν-methyl horse uric acid-1-ethyl-3-methylimidazolium salt, bis(1-ethyl-3-methylimidazolium) tartaric acid, bismuth-B Mercaptoglycine-1-ethyl-3-methylimidazolium salt is preferred, tetrabutylphosphonium sulphate-acetate, 1-ethyl-3-methyl acetate Carbazole salt, formic acid-l-ethyl-3-methylimidazolium salt, hippuric acid-1-ethyl-3-methylimidazolium salt, Ν-methyl hippuric acid-1-ethyl-3-methyl The base imidazole salt is more preferred. The method for synthesizing an ionic liquid used in the present invention is a precursor composed of a cationic moiety such as an alkyl imidazolium salt, an alkyl pyridyl salt, an alkylammonium salt, an alkyl phosphonium salt or the like, and an anion site containing a halogen. An anion exchange method for reacting with NaBF4, NaPF6, CF3S03Na or LiN(S02CF3)2; reacting an amine-based substance with an acid ester to introduce an alkyl group, and forming an organic acid residue of -12-201038659 to form an anion The acid ester method; and the neutralization of the amine, the neutralization of the salt, etc., are not limited thereto. The cation can be used in the solvent neutralization method, and an equivalent amount of anion can be used, and the solvent in the obtained reaction liquid can be directly used, and the solvent (methanol, toluene, ethyl acetate, acetone, etc.) can be used for pre-shrinking. The amount of the ionic liquid to be added is not particularly limited as long as it is an epoxy resin, and is preferably 5% by weight to 5% by weight per 100 parts by weight of the epoxy resin. When it is less than 0.1%, the hardenability tends to decrease. When it is more than 1 part by weight, the service life and the moisture permeability resistance of the cured product tend to decrease. [Polythiol compound] The resin composition of the present invention may further contain a polythiol compound having at least two or more thiol groups in the ionic liquid. By using a thiol compound having two or more thiol groups in the Q group, it can be hard. Specifically, for example, trimethylolpropane ginseng (thioethanol pentaerythritol oxime (thioglycolate), ethylene glycol dithioethylene trimethylolpropane ginseng (β-thiopropionate), pentaerythritol quinone Propionate), dipentaerythritol poly(β-thiopropionate). For example, a thiol compound obtained by esterification of an alcohol with a mercapto organic acid does not necessarily have to be a basic substance, and has two or more thiol compounds in the molecule. Similarly, for example, 1, 4-butane dithiol, 1,6-hexane disulfide, organic acid anion, and cation and cation can be added with liquid concentration, 0.1 to 10 parts by volume, The constituent objects and molecules are composed of an alcoholic acid ester having a differentiation rate, an alkyd ester, an alcohol having a thiol group, a thiol group, and a 1,10-?13-201038659 decanedithiol. a polythiol compound; a terminal thiol group-containing polyether: a terminal thiol group-containing polysulfide; a thiol compound obtained by reacting an epoxy compound with hydrogen sulfide; by using a polythiol compound and a ring When a thiol compound having a terminal thiol group obtained by the reaction of an oxygen compound is used as a reaction catalyst in the production step, a de-alkali treatment can be used, and a molecule having an alkali metal ion concentration of 50 ppm or less can be used. a thiol compound having more than one thiol group. The method for removing the alkali, for example, dissolving the treated polythiol compound in an organic solvent such as acetone or methanol, and adding an acid such as dilute hydrochloric acid or dilute sulfuric acid. And after desalting by extraction and washing The method or the method of adsorbing by using an ion exchange resin, the method of purifying by distillation, etc., but it is not limited by these. In the resin composition of this invention, when this polythiol compound is used, an epoxy resin and poly The mixing ratio of the thiol compound is preferably from 0.2 to 1.2 in terms of the number of SH equivalents/epoxide equivalent. When the amount is less than 0.2, sufficient rapid hardenability cannot be obtained'. Further, when it is more than 1.2, it may be damaged. The physical properties of the cured product such as heat resistance are preferably 0.5 to 1.0 in terms of adhesive stability. [Hygroscopic metal oxide] In the resin composition of the present invention, the moisture resistance of the cured product is further enhanced. When used, it can be combined with an ionic liquid and a hygroscopic metal oxide. Here, "hygroscopic metal oxide" means a metal which has the ability to absorb moisture and chemically react with moisture absorbed to form a hydroxide. Specifically, for example, calcium oxide, magnesium oxide, cerium oxide, cerium oxide, etc. These may be used singly or in combination of two or more kinds, among which, high hygroscopicity, cost, and the original -14-201038659 In terms of stability, calcium oxide is more When the particle size of the hygroscopic metal oxide is too large, there is a fear that the coarse organic particles are damaged by the organic EL element, and the smaller the particle size is, the more the particle is bonded. The smaller the diameter is, the more likely it is to cause poor dispersion in the formation of cohesive particles between the particles, and it is difficult to sufficiently impart a high resistance to moisture permeability. Moreover, the hygroscopic metal oxide is 0.001 to 10 The range of μιη is better, and the average particle diameter is preferably in the range of 0. Further, when the average particle diameter of the hygroscopic metal oxide is within the former range, coarse particles having a particle diameter of 20 μm or more are not used. The absence of the coarse particles is advantageous in that it does not damage in the blocking step. The average particle diameter of the hygroscopic metal oxide can be measured by the laser scattering method based on the Mie|spot theory. Specifically, the Q laser diffraction type particle size distribution measuring apparatus is configured to form a particle size distribution of the oxide on a volume basis, and the medium diameter can be measured as a flat measurement sample, and it is preferable to use a supersonic wave to oxidize the hygroscopic metal. . The laser diffraction type particle size distribution measuring device can be manufactured by the company LA-500. The hygroscopic metal oxide can be used as a surface treating agent. By using the surface treatment of the hygroscopic metal oxide, the adhesion stability of the hardenable material prevents the moisture from reacting with the hygroscopic metal oxide during the pre-hardening phase or the composition is improved in the closed step and the tree However, it is more preferable because the composition has a mean particle diameter of 00 1 to 5 μηη. .EL element [Mie] scatters, by hygroscopic gold average particle size. Dispersion in the use of the surface of the market to improve the viscosity of the resin in the -15- 201038659 shape. For the surface treatment agent used for the surface treatment, for example, a higher fatty acid, an alkyl decane, a decane coupling agent or the like can be used. Among them, a higher fatty acid or a alkyl decane is preferable. The higher fatty acid is preferably a higher fatty acid having a carbon number of 18 or more such as stearic acid, montanic acid, orchisamic acid or palmitic acid. One or two or more of these may be used. Among them, stearic acid is preferred. Alkanodecanes such as methyltrimethoxydecane, ethyltrimethoxydecane, hexyltrimethoxydecane, octyltrimethoxydecane, decyltrimethoxydecane,octadecyltrimethoxydecane,dimethyl Dimethoxy decane, octyl triethoxy decane, n-octadecyl dimethyl (3-(trimethoxymethyl decyl) propyl) ammonium chloride, etc., one or two of these may be selected More than one kind. A decane coupling agent such as 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, 3-glycidoxypropyl(dimethoxy)methyl Epoxy decane coupling agent of decane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane; 3-mercaptopropyltrimethoxydecane, 3-mercaptopropylmethyltri An oxane coupling agent such as ethoxy decane, 3-mercaptopropylmethyldimethoxydecane and 11-decylundecyltrimethoxydecane; 3-aminopropyltrimethoxydecane, 3- Aminopropyltriethoxydecane, 3-aminopropyldimethoxymethylnonane, N-phenyl-3-aminopropyltrimethoxydecane, N-methylaminopropyltrimethoxy Baseline, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane, and Ν(2-aminoethyl)-3-aminopropyldimethoxymethyldecane, etc. Amino decane coupling agent; 3-ureido--16- 201038659 ureido decane coupling agent such as propyl triethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane and vinyl Vinyl oxime such as bis ethoxy decane a coupling agent; a styryl decane coupling agent such as P-styryltrimethoxydecane; an acrylic acid such as 3-propoxypropyltrimethoxydecane or 3-methylpropoxypropyltrimethoxydecane; Ester decane coupling agent; isocyanate decane coupling agent such as 3-isocyanate propyl trimethoxy decane, bis(triethoxymethyl decyl propyl) disulfide, bis (triethoxy carbaryl propyl propyl) a thioether decane coupling agent such as tetrasulfide; phenyl hydrazine trimethoxy decane, methacryloxypropyl trimethoxy decane, imidazolium, triazine decane, and the like. These may be used alone or in combination of two or more. The surface treatment can be carried out, for example, by subjecting an untreated hygroscopic metal oxide to a stirring and dispersing at a normal temperature by a mixer, and adding a surface treatment agent (higher fatty acid, alkyl decane or decane coupling agent) to spray treatment, and stirring 5 ~60 minutes will be carried out. As the mixer, a conventional mixer such as a mixer of a V mixer, a bow mixer, a conical mixer, a mixer such as a Q-mixer or a cement mixer, a ball mill, a cutting mill or the like can be used. Further, when the moisture absorbing material is pulverized by a ball mill or the like, the above-mentioned higher fatty acid, alkyl decane or decane coupling agent is mixed and subjected to a surface treatment. The treatment amount of the surface treatment agent (higher fatty acid, alkyl decane or decane coupling agent) is different depending on the type of the hygroscopic metal oxide or the type of the surface treatment agent, and is relative to the hygroscopic metal oxide. It is preferably 1 to i% by weight, more preferably 1 to 5% by weight. In the resin composition of the present invention, the content of the hygroscopic metal oxide is in the range of -17 to 201038659 1 to 40% by weight relative to the nonvolatile content of the resin composition of 1% by weight. Preferably, it is preferably in the range of 1 to 30% by weight, preferably in the range of 5 to 20% by weight, and particularly preferably in the range of 7 to 18% by weight, preferably in the range of 9 to 16% by weight. When the content is too small, the effect of sufficiently incorporating the hygroscopic metal oxide cannot be obtained. When the content is too large, the viscosity of the composition tends to increase, or the strength of the cured product decreases and becomes brittle. [Inorganic medicinal material] The resin composition of the present invention may contain an inorganic ruthenium material in terms of moisture permeability resistance of the cured product, prevention of rebound during film processing, improvement of adhesion, and the like. Inorganic chelating materials such as cerium oxide, aluminum oxide, barium sulfate, talc, clay, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate, barium titanate, Calcium titanate, magnesium titanate, barium titanate, titanium oxide, barium zirconate, calcium zirconate, and the like. Among them, in order to maintain the low moisture permeability and high adhesion of the cured resin, talc and mica are preferred, and talc is more preferable. The inorganic filler may be used alone or in combination of two or more. In the resin composition of the present invention, when the inorganic filler is used, the content of the inorganic filler is in the range of 1 to 50% by weight based on 1% by weight of the nonvolatile component of the resin composition. Preferably, it is more preferably in the range of 1 to 40% by weight, particularly preferably in the range of 5 to 30% by weight, and most preferably in the range of 10 to 20% by weight. When the content is too small, the effect of sufficiently mixing the hygroscopic metal oxide cannot be obtained. When the content is too large, the viscosity of the composition tends to increase, and the strength of the cured product tends to decrease and become brittle. -18- 201038659 The upper limit 平均 of the average particle diameter of the inorganic ruthenium material used in the present invention is preferably 10 μηη in terms of handleability, more preferably 5 μιηη, and 2.5 μιηη, especially preferably 1·5 μιη. good. Further, the lower limit of the average particle diameter of the inorganic chelating material is preferably 〇5 μmη in order to prevent the viscosity of the resin composition from becoming high. The average particle size of the inorganic chelating material can be determined by the laser diffraction/scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the zero-free chargeable material can be prepared on a volume basis by a laser diffraction type particle size distribution measuring apparatus, and the particle diameter of the medium can be measured as an average particle diameter. It is preferred to measure the sample to use an inorganic cerium filling material dispersed in water by ultrasonic waves. For the laser diffraction type particle size distribution measuring device, LA-5 00, etc., manufactured by Horiba, Ltd., can be used. [Rubber Particles] The resin composition of the present invention may contain rubber particles for the purpose of improving the mechanical strength of the cured product or relieving stress. The rubber particles Q are not dissolved in the organic solvent when the resin composition is prepared, and are not compatible with the components in the resin composition such as an epoxy resin, and are present in a dispersed state in the varnish of the resin composition. good. The rubber particles are generally prepared such that the molecular weight of the rubber component is not dissolved in the level of the organic solvent or the resin, and is, for example, a core-shell type rubber particle or a crosslinked acrylonitrile butadiene. Rubber particles, crosslinked styrene butadiene rubber particles, acrylic rubber particles, and the like. The core-shell type rubber particle-based particles have rubber particles of a core layer and a shell layer, and for example, a shell layer of an outer layer is a glassy polymer, and a shell layer of an inner layer is a rubber-like polymer, or an outer layer - 19-201038659 The three-layer structure of the shell layer is a glassy polymer, the middle layer is a rubbery polymer, and the core layer is a glassy polymer. The glass layer is composed of, for example, a polymer of methyl methacrylate or the like, and a rubbery polymer layer such as butyl acrylate polymer (butyl rubber). Specific examples of the core-shell type rubber particles are as follows: Staphyloid AC3832, AC3816N (above is Ganz Chemi cal), Metablen KW-4426 (Mitsubishi)

Rayon (share) system, F351 (Japan Zeon (share) system) and so on. Specific examples of the acrylonitrile butadiene rubber (NBR) particles are, for example, XER-91 (manufactured by JSR Co., Ltd.). Specific examples of the styrene butadiene rubber (SBR) particles are, for example, XSK-5 00 (manufactured by JSR Co., Ltd.). Specific examples of acrylic rubber particles, such as

Metablen W300A, W450A (above is Mitsubishi Rayon). The average particle diameter of the rubber particles is preferably in the range of 0.005 to Ιμηη, more preferably in the range of 0.2 to 0.6 μηη. The average particle diameter of the rubber particles can be measured by a dynamic light scattering method. For example, the rubber particles are uniformly dispersed in a suitable organic solvent by ultrasonic waves or the like, and FPRA - 1000 (manufactured by Otsuka Electronics Co., Ltd.) is used to prepare the particle size distribution of the rubber particles by weight, and the medium particles are used. The diameter is measured as an average particle diameter. When the rubber particles are used in the resin composition of the present invention, the rubber particles are contained in an amount of 0.1 to 20% by weight, preferably 0.1 to 10% by weight based on 100% by weight of the nonvolatile component of the resin composition. % is better. When the amount is less than 0.1% by weight, the effect of sufficiently blending the rubber particles is not obtained, and when it is more than 20% by weight, the heat resistance and the moisture permeability resistance may be lowered. -20 - 201038659 [The thermoplastic resin] The resin composition of the present invention may contain a thermoplastic resin in order to impart flexibility to the cured product and maintain good processability when the resin composition is applied. The thermoplastic resin is, for example, a phenoxy resin, a polyvinyl acetal resin, a polyimide resin, a polyamidimide resin, a polyether maple resin, a polyboron resin or the like. These thermoplastic resins may be used alone or in combination of two or more. The thermoplastic resin can impart flexibility and prevent peeling at the time of coating, and the weight average molecular weight is preferably 30,00 Torr or more, more preferably 50,000 or more. However, when the weight average molecular weight is too large, the compatibility with the epoxy resin tends to decrease, and the weight average molecular weight is preferably 1,000,000 or less, more preferably 800,000 or less. Further, the "weight average molecular weight of the thermoplastic resin" referred to herein is measured by gel permeation chromatography (GPC) (polystyrene conversion). By the weight average molecular weight of the GPC method, specifically, the Shimadzu Corporation (stock) LC-9A/RID-6A is used as a measuring device, and Shodex K-800P/K-804L/K-804L manufactured by Showa Denko Co., Ltd. is used. As a column, chloroform was used as the movement equivalent, and the measurement was performed at a column temperature of 40 ° C, and was determined using a standard polystyrene calibration line. In the foregoing examples, the thermoplastic resin is more preferably a phenoxy resin. The phenoxy resin is excellent in compatibility with the "phenoxy resin", and has little effect on the adhesion and moisture resistance of the cured product of the resin composition of the present invention. The phenoxy resin has, for example, one or more selected from the group consisting of a bisphenol A skeleton, a bisphenol-21 - 201038659 F skeleton, a bisphenol S skeleton, a bisphenol acetophenone skeleton, a novolak resin skeleton, a biphenyl skeleton, an anthracene skeleton, and A skeleton of a cyclopentadiene skeleton, a raw spinel skeleton, a naphthalene skeleton, an anthracene skeleton, an adamantane skeleton, a terpene skeleton, or a trimethylcyclohexane skeleton. The phenoxy resin may be used in combination of two or more kinds. A commercially available product of a phenoxy resin, for example, 1 2 5 6 , 42 50 (a phenoxy resin containing a bisphenol A skeleton) manufactured by Japan Epoxy Resin Co., Ltd., and YX8100 (a bisphenol S manufactured by Japan Epoxy Resin Co., Ltd.) Benzene phenolic resin), Japan Epoxy Resin Co., Ltd. ΥΧ6954. (phenoxy resin containing a acetophenone skeleton), Union Carbide ΡΚΗΗ (weight average molecular weight (Mw) 42600, number average molecular weight ( Μη) 11200) Etc., DF280, FX293, Japan Epoxy Resin (shares) YL7553BH30, YL6794, YL7213, YL7290, YL7482, etc. When a thermoplastic resin is used in the resin composition of the present invention, the content of the thermoplastic resin is preferably in the range of 1 to 50% by weight based on 1% by weight to 5% by weight of the nonvolatile component of the resin composition. A range of 3 to 25% by weight is more preferable. When the amount is less than 1% by weight, the effect of sufficiently blending the thermoplastic resin is not obtained, and when it is more than 50% by weight, the moisture permeability of the cured product tends to be lowered. [Coupling Agent] The resin composition of the present invention may contain a coupling agent in terms of adhesion to a binder, a cured product, moisture permeability resistance, and the like. The coupling agent is, for example, a titanium coupling agent, an aluminum coupling agent, a decane coupling agent or the like. Among them, a coupling agent of decane-22-201038659 is preferred. Further, the coupling agent may be used singly or in combination of two or more kinds. Decane coupling agents such as 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropyltriethoxydecane, 3-glycidoxypropyl(dimethoxy)methyl Epoxy decane coupling agent of decane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxydecane; 3-mercaptopropyltrimethoxydecane, 3-mercaptopropyltriethoxy Tertyl decane coupling agent such as decane, 3-mercaptopropylmethyldimethoxydecane and 11-decylundecyltrimethoxydecane; 0; 3-aminopropyltrimethoxydecane, 3 -Aminopropyltriethoxydecane, 3-aminopropyldimethoxymethylnonane, N-phenyl-3-aminopropyltrimethoxydecane, N-methylaminopropyltrimethyl Oxydecane, N-(2-aminoethyl)_3-aminopropyltrimethoxydecane, and N-(2-aminoethyl)-3-aminopropyldimethoxymethyldecane Amine decane coupling agent; urea-based decane coupling agent such as 3-ureidopropyltriethoxy decane, vinyl trimethoxy decane, vinyl triethoxy decane and vinyl methyl diethoxy Vinyl decane coupling agent such as decane; P-styrene based a phenothiyl decane coupling agent such as oxydecane; an acrylate decane coupling agent such as 3-propenyloxypropyltrimethoxydecane or 3-methylpropoxypropyltrimethoxydecane; - an isocyanate-based oxime coupling agent such as isocyanate propyl trimethoxy decane, bis(triethoxymethyl decyl propyl) disulfide, bis (triethoxymethyl decyl propyl ) tetrasulfide, etc. a thioether decane coupling agent; phenyltrimethoxydecane, methacryloxypropyltrimethoxynonane, imidazolium, triazine decane, and the like. Among these, an epoxy group-based decane coupling agent is more preferable. When a coupling agent is used in the resin composition of the present invention, the content of the coupling agent is preferably from 0.5 to 10% by weight based on the nonvolatile content of 100% by weight of the resin composition, and is preferably from 0.5 to 10% by weight. 〇 5 to 5 wt% is better. When the content is outside the range, the effect of improving the adhesion by adding a coupling agent cannot be obtained. The resin composition of the present invention may optionally contain various resin additives other than the above-mentioned components within a range in which the effects of the present invention can be exhibited. The resin additive is, for example, an organic filler such as strontium powder, nylon powder or fluorine powder, a tackifier such as white stone or organic benton, a polyoxyalkylene system, a fluorine-based or a polymer-based antifoaming agent. Or an adhesion-imparting agent such as a leveling agent, a triazole compound, a thiazole compound, a triazine compound or a porphyrin compound. [Resin Composition Sheet] The resin composition of the present invention can be directly applied to a coated object or a bonded object to form a resin composition film (layer), but the resin composition of the present invention is formed on the support. The resin composition sheet of the layer is laminated on the object to be coated or the object to be bonded, and the resin composition layer is transferred to the object to be coated or the object to be bonded. Industrially, a method of using the sheet of the resin composition is preferred. The resin composition sheet can be dried by a conventional method, for example, by dissolving a varnish in which the resin composition is dissolved in an organic solvent, applying a varnish to the support, and then drying the organic solvent by heating or hot air blowing. A resin composition layer is formed and manufactured. The support used in the resin composition sheet is, for example, polyolefin such as polyethylene, polypropylene, or polyvinyl chloride, polyethylene terephthalate (hereinafter abbreviated as "PET"), polyethylene naphthalate. Polyester 'polycarbonate-24- 201038659, plastic film such as polyimine. The plastic film is better with PET. The support body can be subjected to mold release treatment in addition to gasket treatment and corona treatment. The mold release treatment is carried out by, for example, a release treatment of a release agent such as a polyoxyalkylene resin-based release agent, an alkoxide resin-based release agent, or a fluororesin-based release agent. The thickness of the support is not particularly limited, and the range of use of 10 to 150 μm is preferably in the range of 2 to 150 μm, and the range of 2 to 100 μm is more preferable in terms of handleability of the resin composition sheet. q organic solvents such as acetone, methyl ethyl ketone (hereinafter abbreviated as "ΜΕΚ"), ketones such as cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, Acetate such as carbitol acetate, cellosolve, carbitol such as butyl carbitol, aromatic hydrocarbon such as toluene or xylene, dimethylformamide, dimethyl Indoleamine, hydrazine-methylpyrrolidone, and the like. The organic solvent may be used singly or in combination of two or more. The drying conditions are not particularly limited to 5 0 to 1 0 0. (: It is advisable to carry out 3~0 1 5 minutes.

The thickness of the resin composition layer formed after drying is preferably from 3 μm to 200 μm, preferably from 5 μm to 1 μm, and most preferably from 5 μm to 50 μm. In the case where the resin composition sheet for the organic EL element sealing is used as described below, in the closed structure, the resin composition layer (hardened layer) is laminated on the substrate (see Fig. 1), and moisture is invaded due to When the resin composition layer is thinned from the side of the resin composition layer (hardened layer), it is preferable that the contact area with the outside air is small and the moisture is blocked. In addition, when the thickness of the layer is too small, the substrate is formed on the substrate on which the organic EL-25-201038659 element is formed (hereinafter referred to as "organic EL element forming substrate"), and the thickness of the coating film is lowered. The workability at the time of the substrate is lowered. The resin composition layer can protect the film from protection, and can also be protected by a protective film to prevent dust from adhering or scratching the surface of the resin composition layer. It is preferable that the protective film is made of the same plastic film as the support. Further, the protective film can be subjected to mold release treatment in addition to the gasket treatment and the corona treatment. The thickness of the protective film is not particularly limited, and a range of 1 to 40 μm is preferably used, and a range of 1 〇 to 3 0 μm is more preferable. [Blocking of the organic EL device] The resin composition of the present invention and the resin composition sheet are, for example, a resin composition for sealing an organic EL element or a resin composition sheet for sealing an organic EL element. When the resin composition or the resin composition sheet of the present invention is used to close the organic EL element, the resin composition layer is first formed on the organic EL element formation substrate by coating the organic EL element. When the resin composition is directly used, the material is applied to form a resin composition layer. The resin composition is preferably in a varnish state in which an epoxy resin, an ionic liquid, and other materials which are required to be blended are used. To the extent that the organic EL element is not affected, the aforementioned solvent or the like may be added as needed. When a solvent is used, it is dried after coating to form a resin composition layer. The thickness of the resin composition layer is the same as the thickness of the aforementioned resin composition sheet. When a resin composition sheet is used, it is sufficient to use a moisture-repellent property on a support of the resin composition sheet, and the object is used as a sealing substrate (that is, a group specified by symbol 7 in Fig. 1 of -26-201038659). material). The moisture-proof support (closed substrate) is a plastic film having moisture resistance, a metal foil such as a copper box or an aluminum foil, or the like. A plastic film having moisture resistance, for example, a plastic film obtained by vapor-depositing an inorganic substance such as cerium oxide (cerium oxide), cerium nitride, SiCN or amorphous cerium on the surface. The plastic film herein may be the same as the above-described examples. Commercially available plastic film with moisture resistance, such as Techbarrier HX, AX, LX, L series (manufactured by Mitsubishi Plastics Co., Ltd.) or X-BARRIER (manufactured by Mitsubishi Plastics Co., Ltd.) with improved moisture resistance. As the closed substrate, a multilayer structure having two or more layers can also be used. When the resin composition layer of the resin composition sheet is protected by a protective film, the resin composition layer is directly bonded to the organic EL element forming substrate, and the resin composition sheet is laminated on the organic EL element forming substrate. The method of laminating may be a batch type or a continuous type of rolls. When the support of the resin composition sheet has a moisture-proof property (that is, a closed substrate), the resin composition sheet is laminated on the organic EL element forming substrate, and the following resin composition is directly subjected to the peeling support without Q. The layer is thermally hardened (by thereby completing the sealing treatment of the organic EL element). Further, when the support is not moisture-proof, it is preferable to peel off the support and to melt the closed base material on the exposed resin composition layer, and to perform the heat hardening operation of the resin composition layer described below. In this case, the sealing substrate may be a plastic film having a moisture-proof property, a metal foil such as a copper foil or an aluminum foil, or a glass plate or a metal plate which is not suitable for use as a support for the resin composition sheet. Flexible substrate. The pressure of the closed substrate at the time of pressure fusion is preferably about 0.5 to 10 kgf/cm2, and when it is melted under heating, the temperature is about -27-201038659 50 to 130 °C. Further, the thickness of the closed substrate is preferably 5 mm or less, more preferably 1 mm or less, and most preferably ΙΟΟμηη or less, in order to prevent moisture from permeating, and preferably 5 μm or more. More preferably, it is more preferably 10 μm or more, and more preferably 20 μm or more. The closed substrate can also be attached using two or more sheets. As shown in Fig. 1, when the organic EL element 2 is formed on the glass substrate 1, when the glass substrate 1 side is used as the display surface of the display device or the light-emitting surface of the lighting fixture, the sealing substrate 7 does not necessarily have to use a transparent material. Use metal plates, metal foils, etc. Conversely, when the organic EL element is formed on a substrate formed of a material having low opacity or low transparency, when the substrate side is closed as a display surface of a display device or a light-emitting surface of a lighting fixture, the substrate is usually closed using a glass plate or Transparent plastic film (or board), etc. After the base material is melted by the sealing material (when the support of the resin sheet for sealing the organic EL element is used as the sealing substrate, after the resin composition sheet for the organic EL element sealing is laminated), the resin composition layer can be formed. The heat-hardening treatment 'closed structure for the purpose of formation (the closed structure shown in Fig. 1). The method of thermally hardening the resin composition layer is not particularly limited, and various methods can be used. For example, a "hot air circulating oven, an infrared heater, a heating tube", a high-frequency induction heating device, and heating by a heat to heat (heat to wh1). The resin composition of the present invention has excellent low-temperature hardenability, and is about 1 to 20 minutes in a low temperature range of 1 to 40 ° C or less (preferably i 2 (rC or less, more preferably 1 to 10 ° C or less)). The curing is performed in a short period of time (preferably 90 minutes or less, and more preferably 60 minutes or less). Therefore, the organic EL element may be deteriorated due to heat, and the amount of the organic EL element may be extremely reduced from -28 to 201038659. The lower limit of the hardening temperature and the hardening time can ensure that the adhesiveness (adhesiveness) of the cured product is sufficiently satisfied, and the curing temperature is preferably 50 ° C or more, more preferably 55 ° C or more, and the hardening time is 20 Preferably, it is more preferably 30 minutes or more, and more preferably 30 minutes or more. It is understood from the examples and comparative examples described below that the resin composition of the present invention is a resin composition containing an epoxy resin and an ionic liquid at a low temperature. It can be quickly hardened to form a cured product which is excellent in moisture permeability and excellent in adhesion strength. In particular, it is excellent in moisture permeability resistance, and it does not have a tendency to reduce adhesion over time, and has a firm adhesiveness. Material film (layer). The ionic liquid and the hygroscopic metal oxide are blended in the epoxy resin to form a cured product having improved moisture permeability resistance. [Examples] Hereinafter, the present invention will be more specifically described by way of Examples and Comparative Examples. However, the present invention is not limited by these examples. Q The materials (raw materials) used in the examples and comparative examples are as follows: (A) Epoxy resin • 828EL (made by Japan Epoxy Resin Co., Ltd.): liquid bismuth Type a epoxy resin, epoxy equivalent (1 8 5 g/eq), low chlorine type epoxy resin. • NC3 00 0 (manufactured by Nippon Kayaku Co., Ltd.): biphenyl aralkyl type epoxy resin, epoxy Equivalent (2 75g/eq), MEK solution prepared with 70wt% solid content. • GOT (manufactured by Nippon Kayaku Co., Ltd.): m-toluidine diglycidylamine (liquid -29- 201038659), epoxy equivalent (135g) /eq) • Epiclon EXA835LV (manufactured by DIC): liquid bismuth f-type epoxy resin, epoxy equivalent 160-170g/eq. • Epicot 828 (made by Japan Epoxy Resin Co., Ltd.): double 酣^ type epoxy resin Low chlorine type • Epicot 10 0 1 (made by Japan Epoxy Resin Co., Ltd.): solid bisphenol A type epoxy tree Epoxy equivalent (47 5 g/eq) (B) Hardener (ionic liquid) • N-Ethyl glycine tetrabutyl phosphonium salt • N-methyl hippuric acid 1-ethyl-3- Methylimidazole gun salt • Acetate-1-ethyl-3-methylimidazole gun salt (acetic acid-1-ethyl-3-methylimidazolium salt) • Formic acid-1-ethyl-3-methylimidazole key Salt (solid dispersion type hardener) • Amicure MY-24 (Ajinomoto Fine Techno company, average particle size 1 〇μ m) • 2PZ-CNS-PW (made by Shikoku Chemical Co., Ltd.): trimellitic acid-1-cyano Crude product of base ethyl-2-phenylimidazole gun salt, average particle size 1 〇μηι (anhydride type hardener) • RikacidMH-700 (manufactured by Nippon Chemical and Chemical Co., Ltd.): methylhexahydrobenzene-30- 201038659 Anhydride (liquid hardener) • 2E4MZ (manufactured by Shikoku Chemicals Co., Ltd.): 2-ethyl-4-methylimidazole•1B2MZ (manufactured by Shikoku Chemical Co., Ltd.): 1-benzyl-2-methylimidazole (C) Phenoxy resin ◎ YX6954 (manufactured by J ap an Epoxy Resin Co., Ltd.): a high heat-resistant phenoxy resin, a weight average molecular weight (40000), and a MEK solution prepared to have a solid content of 35 wt%. • YL7213 (manufactured by Japan Epoxy Resin Co., Ltd.): a heat-resistant phenoxy resin, a weight average molecular weight (35,000), and a MEK solution prepared to have a solid content of 35 wt%.

• PKHH (manufactured by InChem): a high heat-resistant phenoxy resin, a weight average molecular weight (42,600), and a MEK Ο solution prepared to have a solid content of 20% by weight. (D) Rubber particles • F351 (manufactured by Zeon, Japan): Acrylic core-shell resin particles, average particle diameter (〇.3μπι) (Ε) Hygroscopic metal oxide • Moistop #10 (manufactured by Sankyo Powder Co., Ltd.)·· Oxidation bromine, average particle size (4μιη), maximum particle size (15μιη) -31 - 201038659 •Breaked dolomite: MEK slurry for the wet pulverizer of the "light burnt dolomite" made by Giza Lime Co., Ltd. 40wt%, average particle size: 0.8 7 μιη) (F) Inorganic sputum material • SG95S (made by Japan Talc Co., Ltd.): talc, average particle size (1.4 μιη) • D-600 (made by Japan Talc Co., Ltd.): talc MEK slurry of wet pulverizer (solid content: 30% by weight, average particle diameter: ❽·72^111) (G) Surface treatment agent ΚΒΜ3103 (manufactured by Shin-Etsu Silicon Co., Ltd.): decyltrimethoxydecane-stearic acid (manufactured by Junsei Chemical Co., Ltd.) (H) Coupling agent: KBM-403 C by Shin-Seicon Co., Ltd.): 3-glycidoxypropyldimethoxy sand sand [Embodiment] The examples were adjusted in the order shown below. And the respective compositions of the comparative examples. The blending was carried out in the amounts shown in Tables 1 and 2. (Example 1) -32- 201038659 In liquid double-type A-type epoxy resin ("8 8 EL" manufactured by Japan Ep0Xy Resin Co., Ltd.) and liquid epoxy resin ("GOT" manufactured by Nippon Kayaku Co., Ltd.) 70 wt of a mixture of an acrylic core-shell resin ("F3 51" manufactured by Zenitron Co., Ltd.) and a biphenyl aralkyl epoxy resin ("NC3000" manufactured by Nippon Kayaku Co., Ltd.) MEK solution of % solid component, MEK solution of 35 wt% solid content of phenoxy resin ("YX6954" manufactured by Japan Epoxy Resin Co., Ltd.), talc powder 0 ("SG95S" manufactured by Nippon Talc Co., Ltd.), coupling agent (manufactured by Shin-Etsu Silicon Co., Ltd.) "KBM-403") was mixed with an AGI Homomixer Robomix type mixer (manufactured by Primix) (mixture η). Then, the mixture (mixture Η) 'ionic liquid hardener (tetrabutyl sulfonium ethoxide) and organic solvent (ΜΕΚ, acetone) are uniformly dispersed in a high-speed rotary mixer to obtain a varnish-like resin. Composition. Next, the thickness of the resin composition layer after drying is 40 μm by the release treatment surface of the PET film (thickness 3 8 μmη) which is treated with the alkyd-based resin composition as the varnish-like resin composition. Then, it was uniformly coated by a mold coater, and dried at 60 to 8 ° C for 6 minutes to obtain a resin composition sheet. (Example 2) A varnish-like resin composition was prepared in the same manner as in Example 1 except that an N-methyluric acid imidazole gun salt was used for the ionic liquid curing agent to prepare a resin composition sheet. (Example 3) -33 - 201038659 A varnish-like resin composition sheet was prepared in the same manner as in Example 1 except that imidazole acetate was used in the ionic liquid hardener. (Example 4) A varnish-like resin composition sheet was prepared by using the same method as in the example 1 of the ionic liquid hardener. (Example 5) A surface treatment was carried out by stirring a calcium oxide (three Moistop #10) and a surface treatment agent (pure chemical) with a cutting mill pulverizing apparatus. Then, in addition to using a liquid grease ("Gate" made by Nippon Epoxy Resin Co., Ltd. ("GOT" manufactured by Nippon Kayaku Co., Ltd.), the surface-treated calcium oxide was dispersed by a roll ("F351" manufactured by Zeon Corporation, Japan). Oxygen resin of 70 wt% solid content of "NC3000" manufactured by biphenyl aralkyl type ring company (MEK solution of 35 wt% solid content manufactured by Japan Epoxy Resin Co., Ltd., talc powder (daily SG95S)), coupling agent ( In the same method as the method described in the mixing example 1 of the first embodiment, the mixture of the mixture of the Shin-Etsu Siiicon Co., Ltd. and the AGI Homomixer Robomix type mixing compound was used to prepare the resin group key salt. In the case of the resin, the company's "stearic acid" bisphenol A type epoxy resin and the liquid epoxy resin core-shell resin, and the above-mentioned oxygen resin (Japan) EK solution, benzene "ΥΧ6954") talc company "g "ΚΒΜ-403") Mixer (Primix public Η, with a solid resin composition, -34- 201038659 to make a resin composition sheet. (Comparative 1) Acrylic core-shell resin (Japanese zeon) is used in addition to liquid double-cooled A-type epoxy resin ("828EL" manufactured by Japanl Epoxy Resin Co., Ltd.) and liquid epoxy resin (GOT manufactured by Nippon Kayaku Co., Ltd.) Company "F351"), solid dispersion type hardener ("jin_m" from Fine Chemical Co., Ltd.) replaced the mixture G' of Example 1 with a roll-dispersed mixture and did not use an ionic liquid hardener. (N-Ethylglycine glycinate tetrabutyl iron salt) In the same manner as in the method described in Example 1, a varnish-like resin composition was prepared to prepare a resin composition sheet. (Comparative Example 2) Except for use in liquid A bismuth A-type epoxy resin ("828EL" manufactured by Japan Epoxy Resin Co., Ltd.) and a liquid epoxy resin ("Q GOT" manufactured by Nippon Kayaku Co., Ltd.) are blended with acrylic core-shell resin ("F351" manufactured by Zeon Corporation, Japan) ), a cationic polymerization catalyst type hardener (2-ethyl-4-methyl mirruckine, "2E4MZ" manufactured by Shikoku Kasei Co., Ltd.), which replaced the mixture G' of Example 1 with a roll-dispersed mixture and did not use an ionic liquid. Hardener (N_ethyl glycosamine) A varnish-like resin composition was prepared in the same manner as in the method described in Example 1 to prepare a resin composition sheet. (Comparative Example 3) The liquid bismuth F-type epoxy was compounded in a quantitative manner. Resin ("EXA- 8 3 5 LV", manufactured by DIC Corporation) and bisphenol A epoxy resin ("Epicot 1001" manufactured by Japan Epoxy Resin Co., Ltd.) are uniformly dispersed with a solid dispersion hardener (trimellitic acid). Mixture of 1-cyanoethyl-2-phenylisoimidazole iron salt, "2PZ-CNS-PW" manufactured by Shikoku Kasei Co., Ltd., and 20 wt% of phenoxy resin ("PKHH" manufactured by InChem Co., Ltd.) A resin composition was prepared by using a MEK solution of a solid content and a sand compound coupling agent ("KBM403" manufactured by Shin-Etsu Silicon Co., Ltd.). Using this resin composition, a resin composition sheet was produced in the same manner as in the method described in Example 1. (Comparative Example 4) Epiclon EXA-8 3 5 LA (liquid bisphenol F type epoxy resin, manufactured by DIC Corporation), Rikacid MH-700 (methyl hexahydrophthalic anhydride, New Japan Physical and Chemical Co., Ltd.) were mixed in a predetermined amount. (1), 1B2MZ (1-benzyl-2-methylimidazole, manufactured by Shikoku Kasei Seisakusho Co., Ltd.) to obtain a resin composition. Using this resin composition, a sheet-like cured product having a thickness of 40 μm was obtained using a mold. (Comparative Example 5) Epicot 82 8 (liquid bisphenol quinone type epoxy resin low chlorine type, manufactured by Japan Epoxy Resin Co., Ltd.), Rikacid MH-700 (methyl hexahydrophthalic anhydride, New Japan Physicochemical) were mixed in a quantitative manner. A company made of 1B2MZ (1-benzyl-2-methylimidazole, manufactured by Shikoku Kasei Co., Ltd.) was used to prepare a resin composition. Using this resin composition, a sheet-like cured product having a thickness of 40 μm was obtained using a mold. -36- 201038659 (Example 6) Acrylic core shell in liquid bismuth A type epoxy resin ("828EL" manufactured by Japail Epoxy Resin Co., Ltd.) and liquid epoxy resin (Rgot" manufactured by Nippon Kayaku Co., Ltd.) Resin ("F351" manufactured by Zeon Co., Ltd.) In a roll-dispersed mixture (mixture G), calcium oxide ("Moistop #10" manufactured by Sankyo Powder Co., Ltd.) and biphenyl aralkyl type epoxy resin (Japan) 70 wt% MEK solution of "NC3000" manufactured by Pharmaceutical Co., Ltd., 35 wt% MEK solution of phenoxy oxide resin ("γχ6954" manufactured by Japan Epoxy Resin Co., Ltd.), talc powder (r SG95S manufactured by Nippon Talc Co., Ltd.), coupling agent (Shin-Etsu "KBM-403" manufactured by Silicon Co., Ltd. was mixed with an AGI Homomixer Robomix type mixer (manufactured by primix) (mixture Η). Then, the mixture (mixture Η), ionic liquid hardener (tetrabutylammonium ethionate) and organic solvent (plutonium, acetone) are uniformly dispersed in a high-speed rotary mixer to obtain a varnish. Resin composition. Next, a PET film treated with an alcoholic acid-based release agent in the varnish-like resin composition (the thickness of the resin composition layer after drying is 40 μηη, the thickness of the resin composition layer after drying is 40 μmη, The resin composition was uniformly coated by a coater and dried at 60 to 80 ° C for 6 minutes to obtain a resin composition sheet. (Example 7) Using a stirring type surface treatment apparatus, calcium oxide (tri-co-production) In the company's "Moistop #10"), varnish-like resin was prepared in the same manner as in Example 6 of the actual-37-201038659 by surface treatment with decyltrimethoxydecane ("KBM3103" manufactured by Shin-Etsu Silicon Co., Ltd.). In the composition, a resin composition sheet was produced, and the amount of mercaptotrimethylnonane treated in the surface treatment of calcium oxide was 2% by weight based on the calcium oxide. (Example 8) Except for stirring The surface treatment apparatus was subjected to surface treatment with stearic acid (manufactured by Junsei Chemical Co., Ltd.) on calcium oxide ("MoistoP#10" manufactured by Sankyo Powder Co., Ltd.), and N-methyl hippuric acid 1- as an ionic liquid hardener was used. Ethyl-3-methyl In the same manner as in Example 6, a varnish-like resin composition was prepared in the same manner as in Example 6 to prepare a resin composition sheet. Further, the amount of stearic acid treated in the surface treatment of calcium oxide was 2 with respect to calcium oxide. (Example 9) A mixture A in which a solid epoxy resin ("PUOOOH" manufactured by DIC Corporation) was dissolved in a phenoxy resin ("ME7213" manufactured by Japan Epoxy Resin Co., Ltd., and a MEK solution of 35 wt% solid content) was prepared. In addition, a mixture b in which stearic acid was dispersed was added to the MEK slurry (solid content: 40% by weight) of the fired dolomite (the wet pulverizer manufactured by Yoshizawa Lime Co., Ltd.), and the mixture A, the mixture B, and the talc were blended ( "D-600" manufactured by Japan Talc Co., Ltd. is a MEK slurry of 30% by weight of the solid-type pulverizer, a rubber fine particle dispersion liquid epoxy resin ("BpA32 8" manufactured by Nippon Shokubai Co., Ltd.), and epoxy resin. Potential hardening accelerator ("1)-CAT3502T" by Sunpro Co., Ltd.), liquid epoxy resin ("GOT" manufactured by Nippon Kayaku Co., Ltd. -38- 201038659), brothel coupling agent (ΚΒΜ-403, manufactured by Shin-Etsu Chemical Co., Ltd.) ") to AGI Homomixer A Robomix type mixer (manufactured by Primix) was mixed. An ionic liquid hardener (N-ethinylglycine tetrabutyl iron salt) was added thereto to be dispersed in a high-speed rotary mixer to obtain a varnish-like resin composition. Using this resin composition, a resin composition sheet was produced in the same manner as in the method described in Example 1. 0 (Example 1 〇) A varnish-like resin composition was prepared by the same method as in Example 9 on the basis of the following Table 3. Using this resin composition, a resin composition sheet was produced in the same manner as in the method described in Example 1. (Example 11) A varnish-like resin composition was prepared by the same method as in Example 9 on the basis of the following Table 3. Using this resin composition, a resin composition sheet was produced in the same manner as in the method described in Example 1. Further, Comparative Examples 4 and 5 correspond to Examples 1 and 2 of Patent Document 2 (JP-A-6-6022). Explain the various methods of measurement and evaluation methods. -39- 1 · Low-temperature hardening property|Measurement of the storage stability and evaluation The resin composition obtained by the Example and the comparative example was evaluated, and it was set as the heating of the resin composition layer in the temperature of 1280 degree and 90 minutes. Low-temperature hardenability and storage stability of the soft steel plate at the time of hardening. 201038659 First, a soft steel plate with a rectangular shape whose surface is honed by an endless belt (JIS #120) (JISG3141, SPCCD, 1st width: lOOmmx 2nd width: 25mmx thickness: 1.6mm) is used as shown in Fig. 2 A resin composition sheet 12 having a rectangular rectangular shape (first width: I2.5 mmx second width: 25 mm) 12 is laminated on one end portion of the surface UA of the soft steel sheet 11 in the longitudinal direction. The test piece 13 was produced by laminating under the conditions of a temperature of 80 ° C and a pressure of lkgf/cm 2 (9.8 x 10 Pa) by a vacuum laminator. Further, two identical pieces were produced in the test piece 13. Next, as shown in Fig. 3, the PET film 12B on both sides of the two test pieces I 3 was peeled off, and the resin composition layer 12A was opposed to each other and laminated under a width of 12 mm, at a pressure of about 300 g/cm 2 . Next, fixed by a holder, and subjected to a heat hardening treatment at 120 ° C / 90 minutes. Then, the tensile shear bond strength between the two test pieces was measured by a tenter universal testing machine (TENSILON UTM-5T manufactured by Toyo Seiki Co., Ltd.). The measurement conditions were a measurement temperature of 25 ° C and a tensile speed of 1 m m / m i η. The tensile shear bond strength after storage (initial) and after hardening treatment at room temperature (25t:, 4〇% RH) for 24 hours was measured. When the initial tensile shear bond strength after the hardening treatment is less than 17 Μ P a , the low-temperature hardenability is judged to be poor (X) '17 MPa or more, and when it is less than 19 MPa, it is judged to be good "〇"' 1 9 Μ P a The above is judged to be excellent "◎". In addition, the 'storage stability is based on the "stretch shear bond strength after 24 hours of storage" / "initial tensile shear bond strength" X 1 〇〇 (%) as the adhesion retention rate, and the adhesion retention rate is less than 70%. When the stability is judged to be -40- 201038659, it is judged to be "△" > 85% or more when it is less than 80%, and it is not more than 85%. When it is 100% or more, it is excellent "◎". However, when the tensile shear bond strength after 24 hours of storage is reduced to less than 15 MPa, it is not suitable for "X" when the adhesive strength is insufficient, and it is preferable when it is 15 MPa or more. "." 2-Measurement and Evaluation of Moisture Permeability (560 μm) Using 14 sheets of a resin composition sheet having a resin composition layer having a thickness of 40 μm obtained in the examples and the comparative examples, the conditions described in the foregoing items were sequentially laminated and overlapped. The resin composition layer of the layer had a total thickness of 560 μm of a laminated sheet. This product was subjected to a method of 12 (TC/90-minute heat-hardening-treated hardened material based on JISZ0208, and the conditions of temperature 85 ° C, humidity 85% RH, and 24 hours, and the amount of water vapor permeation was measured, and the measurement was performed every 1 m 2 . The amount of water vapor permeation. When the water vapor permeation amount is 250 g/m 2 * 24 hr or more, the moisture permeability resistance (5 60 μη: I ) is judged to be unsatisfactory ^ X", which is less than 250 g/m 2 < * 24 hr, 1 500 g / When m2 · 2 4 hr or more, it can be "△". If it is less than 150g/m, 24hr, 1 00g/m2#24hr or more, it is better, and it is excellent when it is less than 100g/m2*24hr. ^ When the evaluation is not performed, it is ^ -J ° and the test material is a cured product of a laminate sheet having a thickness of 560 μm. The overall closed structure of the organic EL element shown in Fig. 1 is observed, and the laminated sheet is laminated. The thickness of the cured product (5 60 μmη) 'the width of the portion in contact with the side of the organic EL element 2 of the curable resin composition layer (hardened layer) 6 in Fig. 1 (Fig. 1) W1 -41 - 201038659 3. Determination of moisture permeability (40 μm) and evaluation of resin groups prepared by the examples and comparative examples The resin composition layer (thickness: 40 μηι) of the product sheet was subjected to a heat hardening treatment at 120 ° C for 90 minutes, and the hardened layer peeled off from the support (PET film) was subjected to a method based on JIS Z0208 at a temperature of 85°. C, humidity 85% RH '24 hours, the amount of water vapor permeation is measured, and the water vapor per lm2 is measured. When the water vapor permeation amount is 300 g/m 2 * 24 hr or more, the moisture permeability resistance is judged to be poor. X" is less than 300g/m2*24hr and 250g/m2*24hr or more. It is excellent "◎" when it is less than 250g/m and 24hr. It is "-" when it is not evaluated. Evaluation of the laminating processability The resin composition layer of the resin composition sheet obtained in the examples and the comparative examples was evaluated for the lamination processability at the lowest melt viscosity at the time of temperature rise measurement. The lowest melt viscosity was a type Rheosol-G3000 manufactured by UBM. A parallel plate having a resin amount of 1 g and a diameter of 18 mm was measured at a measurement start temperature of 60 ° C, a temperature increase rate of 5 ° C / min, a measurement temperature of 60 ° C to 200 ° C, and a vibration number of 1 H z / d. The lowest viscosity η(η ) is used as the lowest melt viscosity. The lowest melt viscosity of the sexual system is less than 20,000 poise, which is better (〇), and the 20,000 poise or more is not good (X). When not evaluated, it is -42-201038659 5. The adhesion to the substrate is measured using 2 sheets. Aluminum foil (width: 50 mm, length: 50 mm, thickness: 50 μm) was superposed on one surface of the first aluminum foil on a resin composition layer (width: 40 mm, length: 50 mm) provided on the support, by a vacuum laminator at a temperature of 80 ° C The conditions of the pressure lkgf/cm2 (9·8χ 104Pa) are laminated. Then, the support was peeled off, and the second aluminum foil was placed on the exposed resin composition layer, and laminated under the same conditions to prepare a test piece having a three-layer structure of an aluminum foil, a resin composition layer, and an aluminum foil. The test piece was heat-cured under the conditions of 1 1 and 3 Torr, and then cut into a rectangular test piece having a width of 10 mm and a length of 50 mm. The length of the test piece was measured based on the T-peel test method of IS K_6854. Adhesiveness. The test results described above are shown in Tables 1 and 2. ❹ -43- 201038659 Example 8 *—to e>u> » CO ο S pg to § to si' Ο (115.3) © (19.0) I - - 〇(18*2) os r~x OS CO Example i 7 ! •CO e><〇5 CO ο S <*> ci m «ο § \£> δ 1 1 Ο (102.5) @ (20.0) 〇(18.9) ! OS o (10900) Implementation Example 6 5 CO 0» <D r- u> CO ο 3 CO CQ δ s IO s Ί· @ (67.6) ◎ (21.7) II ! 〇'(15.$) <§ o (8730) Comparative Example 2 ri C9 〇><〇Γ-tr> CO 8 S C4 s LO o ▼- X (321) I ◎ (20.1) i_ I 〇I (1M) 1 ratio, example | <〇〇> ( D 2 CO 3 S CO s U> s O (255) I 0 I (18.6) X 1 (14.8) <1 1 Real, Example | CO a> Φ S eo SS CO CO 8 <〇s in 8 T — 0 (285) Ο (110) 〇(18.6) I ! 〇1 07.6) OS 〇(8850) Real r « CO 〇> cd 卜 U) to Ο S § to 〇1-» O (256) 1 o (18.0) 1- 0 1 (19.4) I_ @1 1 Example 3 w 〇><D Bu xei CO SS 兮, 8 ir> or· (226) I 〇(17.8) I_ I- ! 〇1 ( 19.0) @i 1 Example 2 «〇to 〇> cd r* » IO CO ο S 3 s u> o 0 (277) 1 I o (18.0) 1- 〇 (19.5) 1 Real, Example 5 C9 A CCk 09 ο S « ci § u> s Τ» 0 (292) Λ (221.0) © (202) I- 〇1 (19.7) 〇go (3810) NC3000 (70% by weight of MEK solution) δ ΰ ΥΧ 6954 (35 wt% solid solution) N-glycosylglycine IV Butyl sulfonium salt 1 -1 N-methyl horse uric acid 1-ethyl-3-methylimidazolium salt _____ ... ________1 1-ethyl-3-methylimidazole acetate salt 1 1-ethyl formate -3-methylimidazole gun salt 1 ΜΥ-24 1 1 2E4MZ Ο 1 1 jellyfish g cr SS j SG95S 1 1 1 s 0Q water vapor transmission (e/mz*24hr) water vapor transmission (g/m2. 24hr) Initial tensile shear bond strength (MPa) _ ti| r Adhesion retention rate (%) Minimum melt viscosity (poise) 40//m moisture permeability 560//ra moisture resistance! Low temperature hardening preservation Stability laminating processability -44- 201038659 [Table 2] Comparative Example 3 Comparative Example 4 Comparative Example 5 Epodon EXA-835LV 25 100 Epicot 828 100 Epicot 1001 25 PKHH (70% solid content MEK solution) 50 2PZ-CNS-PW 0.5 RikacidMH-700 90 90 1B2MZ 2 2 KBM403 1 MEK 200 40 "m moisture vapor transmission resistance (g/m*.24hr> X (1755) X (812) X (694) 56〇MmSi moisture vapor transmission (e/m2>24hr) X (523.4) X (342.9) X (338.0) Tensile shear bond strength (MPa) at the initial stage of low-temperature hardening X (15.3) ◎ (19.1) ◎ (19.3) Tensile chevron bonding after 24 hours of storage stability Strength (MPa) X (14.8) X (17.4) X (18.5) Bond retention (%) 〇 (97) 〇 (91) 〇 (96) 加工 layer processing minimum melting viscosity (poise) 〇 (3000) - -

[Table 3] Example 9 Example 10 Example 11 PBA328 30 30 30 GOT 10 10 10 U-CAT3502T 3 3 3 KBM-403 1 1 1 HP7200H 60 60 60 YL7213 (35 wt% solid content MEK solution) 60 60 60 Burned dolomite slurry component 40wt%) 37.5 37.5 37.5 Stearic acid 0.6 0.6 0.6 D-600 graded slurry component 30wt%) 50 33 17 N-acetamidoglycine tetrabutyl quaternary salt 3 3 3 Adhesion to substrate (N/cm) 3.5 2.4 1.3 -45- 201038659 It can be seen from the comparison between the examples and the comparative examples that the tree of the present invention is hardened at a low temperature of 1200 ° C for a short time to a height. When it is bonded, it has a stable adhesiveness, and the hardened material has a low moisture permeability. Further, from Examples 9 to 11, it is known that the adhesive material is borrowed to improve the adhesion to the substrate. It can be seen that the sealing of the EL element is more useful. Therefore, the tree of the present invention and the resin composition sheet using the same can be suitably used as a device for preventing deterioration of heat and having moisture resistance, a constituent material thereof, a binder, a sealing material, and the like, and can be easily formed to have a high height. An organic EL display device is suitably provided for a reliable coating structure, a bonding structure, a closed structure, and the like. [Industrial use price] The resin composition of the present invention is a cured product which is rapidly hardened to have excellent adhesion at low temperature and low moisture permeability, and can be suitably used for flat panels, for example, in addition to organic sealing applications. The use of a moisture-proof protective film for a printed circuit board or a laminated film for anti-packaging of a lithium ion battery. The present invention is based on Japanese Patent Application No. 2009-0 1 3 684 2009-013686, the entire contents of which are incorporated herein by reference. [Simple description of the figure] The adhesion of the lipid composition is practically high. It is contained in the coating which is easy to be coated by the organic fat composition and is highly moisture-proof. In particular, the shape of the EL element, the sealing resin, the wet film, the number and the purpose of this description -46- 201038659 [Fig. 1] Fig. 1 is a typical cross-sectional view of the overall closed structure of the organic EL element. [Fig. 2] Fig. 2 is a typical view showing the steps of producing the test piece used in the evaluation tests of the examples and the comparative examples. [Fig. 3] Fig. 3 is a typical view of a sample (a laminate of two test pieces) which was supplied to a tensile test in the evaluation tests of the examples and the comparative examples. [Fig. 4] Fig. 4 is a typical cross-sectional view showing a closed structure of a can of an organic EL element. [Explanation of main component symbols] 1, 4: Glass substrate 2: Organic EL element 3: moisture absorbing material 5: sealing material 6: hardening resin composition layer (hardened layer) 7: closed substrate 1 1 : soft steel plate 1 2 : Resin composition sheet 1 2 A : Resin composition layer 12B : PET film 1 3 : Test piece - 47-

Claims (1)

201038659 VII. Patent application scope: 1. A resin composition characterized by containing an epoxy resin and an ionic liquid. 2. The resin composition according to claim 1, wherein the ionic liquid system is composed of an ammonium cation or a squamous cation, and an N-decylamino acid ion or a residual acid anion. 3. The resin composition of claim 1 or 2, which further comprises a hygroscopic metal oxide. The resin composition according to any one of claims 1 to 3, which further comprises an inorganic chelating material. A resin composition sheet which is formed by forming a layer of a resin composition according to any one of claims 1 to 4 on a support. 6. A sheet of a resin composition according to item 5 of the patent application, which is used for sealing an organic EL element. 7. An organic EL device characterized by using a sheet of a resin composition for sealing an organic EL element of claim 6 of the patent application. -48-