TW201023403A - LED package and backlight unit having the same - Google Patents

Abstract

A light emitting diode (LED) package includes: a main body mounted on a substrate; a light emitting diode that is mounted in the main body and emits light; and a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted. A backlight unit includes: a light guide plate configured to allow a light source to proceed to a liquid crystal panel; a light emitting diode (LED) mounted in a main body mounted on a substrate and generating a light source; and an LED package having a lead frame exposed to allow the main body to be selectively top-mounted or side-mounted, and being mounted on the light guide plate.

Description

201023403 "VI. Description of Invention: »[Proposal of Priority] This application claims to be filed on July 3, 2008, in Korean Patent Application No. 2008-064367 filed with the Korea Intellectual Property Office on July 3, 2008. Patent Application No. 2008-072564, Patent Application No. 2008-093102, filed on Sep. 23, 2008, and Patent Application No. 2008-104721, filed on Oct. 24, 2008, in 2008 Patent Application No. 2〇〇8一1472#, filed on October 24, 2009, and Patent Application No. 2〇〇9〇〇2788, filed on January 13, 2009, and in 2009 Priority of Patent Application No. 2, 〇〇 634 提出, filed on January 23, the contents of which are disclosed in this case for reference. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED package and a backlight unit having the same, and in particular to an LED package including an LED light source that is externally illuminated for use as a lighting unit, and includes the package The backlight unit of the piece and the light guide plate. 〇 [Prior Art] In general, the backlight unit has many advantages in terms of its lightness, such as high resolution and high resolution. It is replaced by a CRT display (LCD) used in display devices. The thin, low power consumption drive, therefore, is now being emitted by the liquid crystal light unit including the backlight unit and the light traces are supplied to the liquid crystal panel. The liquid crystal panel can be provided from the backlight unit for 5 weeks to display the image and transmittance. 94715 201023403 Generally, the LED package mounted in the backlight unit is mounted in the backlight and can be packaged according to the (edge type) (side view method) LED package tool #=edge type (top view method) LED package. Chrect type

Here, the edge type LED package has a structure of a side of a led. In this case, the LED filament is rounded off, and the light emitted from the leader plate is emitted toward the substrate. : The earth is reversed so that the LED direct type LED cracker has the LED being hydraulically constructed. That is to say, a plurality of lamps are arranged on the substrate...

The G light is emitted toward the front surface of the light guide plate. ¥First under the surface so that the 'LED package is made according to the purpose they want to achieve and does not allow compatible use (compatible use means interchangeable use), thus requiring a kind of The technology of compatible LED packages that are used interchangeably for the purpose achieved. </ br> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> A backlight unit that provides a local dimming structure. - Provided in accordance with an aspect of the present invention, a LED package comprising: mounted on a substrate, mounted on a county body towel, and provided with; and exposed impurities, such that the body is (10) selected (four) face or side The way to install. The lead frame may comprise a top electrode electrically connected to the substrate, 94715 4 201023403 * such that the LED may face the front surface of the substrate; form a 'shape with the top electrode and bend from the top electrode toward different sides a bent portion; and a side electrode formed at an end of the bent portion and electrically connected to the substrate to vertically mount the LED on the substrate. The side electrodes may be mounted on one side of the body. The top electrode may be formed on the lower surface of the body in an elongated manner. The top electrode can be mounted on one side of the body.侧面 The side electrodes can be formed on the other side of the body in a narrow manner to increase the mounting area with the board. According to another aspect of the present invention, an LED package includes: a body mounted on a substrate; an LED mounted in the body; a lead frame electrically connected to the LED; and a surface formed on the body and A contact portion to be mounted to the mounting area of the substrate is provided. The lead frame can be exposed to enable the body to be mounted side or top. The lead frame may include: a top electrode electrically connected to the substrate such that the LED may face the front surface of the substrate; a bent portion integrally formed with the top electrode and bent from the top electrode toward different sides; and forming The end of the bent portion is electrically connected to the substrate such that the LED is vertically mounted to the side electrode of the substrate. The side electrode can be mounted to one side of the body. The top electrode may be formed in a narrow manner on the lower surface of the body to increase the mounting area with the panel. 5 94715 201023403 The top electrode can be mounted on one side of the body. The side electrode may be formed on the other side of the body in an elongated manner to increase the mounting area with the board. The contact portion may be formed at a central portion of the body. The contact portion may be formed on a side of the body and has one end bent toward the substrate. The contact portion and the lead frame may be integrally formed. The lead frame may be bent inwardly and have a receiving portion for receiving the LED chip therein. According to another aspect of the present invention, a backlight unit includes: a light guide plate configured to allow a light source to travel to a liquid crystal panel; an LED mounted on a body of the device and generating a light source; and an LED package, The exposed lead frame is such that the body is selectively mounted on the top or side, and the LED package is mounted on the light guide. The lead frame may include: a top electrode electrically connected to the substrate, such that the LED may face the front surface of the substrate; a bent portion integrally formed with the top electrode and bent from the top electrode toward different sides; and formed on The end of the bent portion is electrically connected to the substrate such that the LED can be vertically mounted to the side electrode of the substrate. The backlight unit may additionally include a contact portion formed on the surface of the body and provided with a mounting area to be mounted to the substrate. The contact portion and the lead frame may be integrally formed. The contact portion may be formed at a central portion of the body. The contact portion may be formed on a side of the body and has an end that is curved toward 6 94715 201023403 toward the substrate. Γ1 solid-state light guide plate body-body forming. The moonlight sheet 70 may additionally include: a reflecting plate disposed at a lower portion of the light guide plate. The odd light unit may additionally include: an optical sheet disposed on an upper portion of the light guide plate. [Embodiment] A representative embodiment of the present invention will now be described in detail with reference to the drawings gg ^ ❹ &gt; However, the present invention can be implemented in many different forms and will not be construed as limiting the embodiments presented herein. Rather, these and other embodiments are provided so that this disclosure will be complete and thorough, and will be fully understood by those skilled in the art. In the drawings, for the sake of clarity, the shapes and dimensions may be exaggerated, and the same component symbols will be used in the various figures to singularly different components. Reference will now be made to the Fig. 1 and Fig. 1 to Fig. 67 to illustrate LED seals (4) and #光单元s in accordance with representative embodiments of the present invention. &lt;LED package&gt;, Fig. 1 is a perspective view of an LED package according to a first representative embodiment of the present invention. Fig. 2 is a perspective view showing a rear surface of the LED package of Fig. 1, Fig. 3 A cross-sectional view of the package of Figure 1. Referring to Figures 1 to 3, the LED package 1G includes a lead frame 20 and a body 3A.曰曰月可2: V1 (a semiconductor device on which a current is applied to emit light) 匕3 vapor color &amp; luminosity, green and red phosphorescence, or yellow, green, on the blue ray rib 94715 7 201023403 wafer And red broken light to achieve white light. Exciting the yellow, green, and red phosphors to emit yellow, green, and red light, and the yellow, green, and red wavelengths are mixed with the blue light emitted from the blue LED to output White light. A commonly used GaN-based nitride-based semiconductor can be used as the blue LED chip. One of sapphire, spinel, tantalum carbide (SiC), tantalum, zinc oxide (ZnO), gallium arsenide (GaAs), gallium nitride (GaN) substrates may be selected as the trivalent nitrogen The substrate of the compound-based semiconductor, the LED wafer 11 is an n-type nitride semiconductor layer, and an active layer is formed on the nitride semiconductor layer. The active layer may have one or more quantum well layers made of indium gallium nitride (InGaN) and GaN. A V-shaped distorted structure may be formed in a section of the n-type GaN-based semiconductor layer. The V-shaped curved structure can comprise both a flat growth surface and an inclined growth surface. The active layer may additionally comprise at least one quantum barrier layer, and the quantum barrier layer may be made of InGaN, GaN, or aluminum gallium nitride (AlGaN). Here, the band gap of the 量子 quantum barrier layer is larger than the band gap of the quantum well layer. A P-type nitride semiconductor layer is formed over the active layer and includes a p-type super lattice layer and a p-type GaN-based semiconductor layer. Here, the p-type superlattice layer may have a multilayer repeating structure including a GaN/InGaN-based, AlGaN/GaN-based, AlGaN/GaN/InGaN-based layer. The p-type nitride semiconductor layer may include a p-type superlattice layer, a P-type GaN layer formed on the P-type superlattice layer, and a P-type GaN contact formed on the p-type GaN layer 8 94715 201023403 Floor. A transparent electrode and a bonding electrode may be additionally formed over the p-type nitride semiconductor layer. The transparent electrode can be a transmissive oxide conducting layer. Fig. 4 schematically shows a V-shaped bent structure formed on the LEDs in the LEd wafer. The V-shaped bent structure may be continuously formed on at least one of the n-type semiconductor layer, the active layer, and the germanium-type semiconductor layer. The V-shaped bending structure can be formed around the threading dislocation, and can prevent the leakage current generated by the line difference and thereby improve the electrostatic discharge (ESD) effect by increasing the resistance of the region. . Further, the v-shaped bent structure makes the semiconductor surface have an irregular structure, and thus can improve the illuminance. ° That is, the line difference due to the lattice mismatch between the sapphire substrate and the GaN semiconductor formed on the sapphire substrate, and the current is concentrated to the line difference when the erbium static electricity is applied, thereby causing leakage current. Thus, the present invention has made various studies to reduce the leakage caused by ESD by reducing the leakage current caused by the line difference. In other words, in the present invention, the V-shaped bending structure is arbitrarily formed around the memory line region to increase the resistance of the region to cut off the current concentrated in the line difference row and thereby improve the resistance to ESD. In this case, the v-bend structure layer can be formed at a low growth temperature of 60 (TC or through a chemical etching and re_growth process). The thickness of the thus completed blue LED chip can be polished or etched. Method adjustment, with 9 94715 201023403, the entire thickness range from 50 micrometers (/zm) to 400Ara. Phosphorescent materials can contain fluorescent materials, YAG-based, TAG capable of converting light generated from LED wafers into white light a wavelength conversion unit of one of a base, a citrate group, a sulfide group, and a nitride-based light-filling material. The YAG and TAG-based fluorescent materials may be selected from (γ, Tb, Lu, Sc, u,

Gd, Sm) 3 (Al, Ga, In, Si, Fe) 5 (0, S) 12 : Ce and used, and the citrate-based phosphor can be selected from (Sr, Ba, Ca, Mg) 2Si04: ( Eu, F, Cl). Further, the 'sulfide-based filling material may be selected from (Ca, Sr) S · · Eu, (Sr, Ca, Ba) (Al, Ga) 2S4 : Eu, and the nitride-based can light quality may be (sr , Ca, Si, A1, 0) N: Eu (such as CaAlSiN4: Eu yS-SiAlON : Eu) or Ca- a SiAlON : Eu group (Cax, My) (Si, A1) 12 (0, N) 16' where M is at least one of Eu, Tb, Yb, and Er' and satisfies 0. 05 &lt; (x + y) &lt; 〇. 3, 0 · 02 &lt; χ &lt; 0 · 27 and 0· 〇3&lt;y&lt;0.3, and is selected from the group consisting of phosphorescent components and use. The red fill material can be filled with a nitride-based material containing N (e.g., CaAlSiN4: Eu). Nitride-based squama light has better reliability with respect to external environmental factors (such as heat, moisture, and the like) than sulfide-based phosphorescent materials, and has a small difference in the possibility of displacement. In particular, in order to obtain the reproducibility of the horse, it has a high phosphorescence excitation efficiency at a dominant wavelength of a blue LED chip which is limited to a specific range (425 nm (nm) to 460 nm). Other nitride-based phosphorescent or sulfide-based fills (e.g., CaAlSisN8: Eu) can be used as red scale light. For the green phosphor, you can use 10,000-SiAlON: Eu nitridation 94715 10 201023403, or (Bax, Sry, Mgz) Si〇4: Eu2+, F, Cl (〇&lt;x, gLezg'PKF 'CigOOOOOOppnO's base-light quality. These nitride-based or telluride-based phosphors also have high excitation efficiency in the main wavelength range of the blue LED chip (425 nm to 460 nm). Ideally, blue light One half amplitude (F WHN) of the LED chip ranges from 10 nm to 50 nm, the half amplitude of the green phosphor is from 3 〇 nm to 150 nm, and the half amplitude of the blue phosphor is from 5 〇 nm to 2 〇〇 nm. By making each light source have a half amplitude in the above range, white light with better color uniformity head 741 and better color quality can be obtained. Especially, since the main wavelength and half amplitude of the blue LED chip are limited to 425, respectively. From nm to 460 nm and 1〇ηιη to 5〇nm, it is possible to completely improve CaAlSiNs: Eu red phosphorescent and cold-SiA1〇N:

Eu group or (Bax, Sry, Mgz) Si〇4: Eu2+, F, Cl (0&lt;x, y$2, 0, 0PP "F, C1^500 〇〇〇〇ppm) based on the efficiency of green phosphorescence. , 蓝光 Blue LED chips can be changed to ultraviolet (UV) LED chips with a main wavelength range of approximately 380 nm to 425 nm, and in this case, in order to output white light, at least blue, green and red scales must be included in the phosphor ία (Ba, Sr, Ca) 5 (P〇4) 3Cl : (Eu2+, Mn2+) or Y2〇3 : (Bi3+,

Eu2+) may be selected to be blue phosphorescent, or YAG-based, TAG-based, citrate-based, sulfide-based, and nitride-based phosphorescent materials may be selected to be green and red phosphorescent. At the same time, it is also possible to produce white LEDs for outputting white light without using phosphorescent materials for 94715 11 201023403. For example, a second 'quantum well layer that produces a different wavelength (e.g., yellow light) may be additionally formed over and/or under the first quantum well layer to create an LED wafer that emits white light in combination with blue light. The quantum well layer can have a multi-quantum well structure, and the first and second quantum well layers can be formed by adjusting the number of germanium and In used to form the well layer 1. When the Dijon well layer emits light in the UV region (380 nm to 425 nm), the amount of In in the active layer can be adjusted to cause the second quantum well layer to emit blue light and the third quantum well layer to emit yellow light. Fig. 5(a) shows an emission spectrum of a white light LED according to a representative embodiment of the present invention. A red phosphorescent material and AzSi〇4: Eu (A: selected from Ba, Sr, and Ca) using a nitride-based combination of a blue LED and AAlSiN3: Eu (A: selected from at least one of Ba, Sr, and Ca) At least one of the bismuth-based green phosphorescent white LEDs obtains the emission spectrum of Fig. 5(a). As shown in Fig. 5(a), unlike the related art, the emission spectrum has sufficient light intensity in the red and green wavelength regions. In particular, a long-wavelength visible light region of 6 〇〇 nm or greater has a sufficiently high light intensity. In addition, the emission spectrum has blue, green, and red regions (RGB regions) emission wavelength peaks within 425 nm to 460 nm, 500 nm to 550 nm, and 600 nm to 650 nm, and emission compared to the blue region. The relative intensity of the peak, green region emission peaks is approximately, while the relative intensity of the red region emission peaks is approximately 60%. The emission peaks and corresponding correlation intensities of these primary color regions provide a very high level of color reproducibility (see Figure 94715 12 201023403 6). 〇 ❹ Fig. 5(b) shows the spectrum obtained by separating the white light having the emission spectrum of Fig. 5(a) by using blue, green and red filters. As shown in Fig. 5(b), the white light spectrum (see Fig. 5(a)) before separation is separated by two respective color filters and optical components (c〇i〇r fiiter). The spectra (blue, green, and red spectra) have substantially similar emission peaks and their relative intensities. That is to say, the blue, green and red light spectra obtained after the respective color filter transmissions, that is, the negligible emission peak shift, have the emission peaks of the RGB regions of the white light before the filter transmission. (425 nm to 460 (10), 500 nm to 550 nm, and 600 nm to 650 rnn) substantially the same peak. Further, after the color filter is transmitted, the relative intensity at each peak is substantially the same as the relative intensity at each peak. Therefore, it is possible to closely approach the respective _ color expressions of the natural colors by using the light of the three main colors obtained after the transmission of the color filter. The illustration in Fig. 6 is the chromaticity diagram of the CIE (four) color coordinate system] 'displays the [CD is - as , as shown in the figure 6 of the backlight unit of the white LED using the emission spectrum of Fig. 5 (4). When the backlight is white light of Fig. 5 (4), the triangular color coordinate area of the technique is shown, and the LCD display reaches the Λ angular color coordinate area (8). In the triangle color coordinate area 2, NTSC exhibits a color reproducibility of about 8〇%, which is about 2% higher than the color reproducibility (5)% to 65% of the related art, thus indicating a significant improvement in color reproducibility (C〇l 〇r repr〇dUCtiVity). In combination with the use of blue LEDs ^ ^ ^ "eight: free choice, ^, 94715 13 201023403 and Ca at least one of them." Lithium-based red phosphorescent and A2Si〇4:

Eu(A · selected from Ba, Sr, ^ η ^

At least one of Ca) is a green phosphorescent material that can be used in various compositions when needed. For example, by changing the proportion of synthesis (where the dog 々 °

Ca is replaced by at least the dragons of the Sr and Ba ^ /, T -), and can be replaced = the transmission peak or the relative intensity of the red light transmission peak = Figure 7 shows another representative embodiment in accordance with the present invention In particular, white light passes through the readings of the red scales and sm6SiG4: Eu as the green 勉f white light (10) together with the N-based blue LED (four) (4) 7 map. As shown in Fig. 7, the emission peak can be slightly changed, and the intensity at the peak can be changed in accordance with the change in the composition. However, an emission peak having a relative intensity of more than 20% (4) (4) (4) _ nm or a large long-wavelength visible light region provides a level of improved color reproducibility. In this manner, according to the combination of AA1SiN3:Eu (A: red wall quality selected from at least one of h, S1, and Ca, and A·: EuW: selected from ^^, and Ca, at least -) Cleavage-based green fill light output White light Compared to a yellow (four) light f related technology White light can improve the color reproducibility of LCD color display by more than 10%. Fig. 8a schematically illustrates the cross-sectional structure of a white LED element in accordance with a representative embodiment of the present invention in a schematic manner. Referring to Fig. 8a, the white LED device 1 is formed with a body 30 having a reflecting cup at its central portion, and a blue LED u mounted on the bottom surface of the reflecting cup. Encapsulation of the blue 14 94715 201023403 • Light-lit U transparent tree month sealant • Encapsulant 32 can be made, for example, by stone or m-cup, M1SiN3:Eu (A: choose from Μ~月曰= Made of % milk-based resin. Heart Tan from Ba, Sr, and Ca, at least 夕 -, nitride-based red disc light f 12 and A

Si&quot;, and Ca, to ^ \ 仙 (A. selected from Ba, one), citrate-based green 磕I#μn particles and A2Si〇4: EU(A.(四)ώ D. UU. It is selected from the phosphite-based green phosphorescent eight-in-the-sea enamel resin encapsulant 32 of Ba, Sr, and Cai. For remote access, &quot;&quot; granules are evenly distributed on the bottom surface of the reflector cup (not shown) formed in

cMP) is combined with the electrode of the blue LEDU to cover the _1P blue light emitted from the blue LED U (four) based on the red light-breaking 12 and A2Si 〇 · Ρ ,, (6) rat compound Zhe "m ^ and A2Sl 〇 4. Eui bismuth-based green phosphorescent U, so red phosphorescent and A2Si excited from the phosphorescent 12 from the green light of the sulphate-based green 12 fluorescing eutectic u-emitting red phosphorescent AA1SiN3:Eu nitride-based 〇4: The green phosphorescent f of Eu silicate can be excited at a relatively high efficiency from 425 (10) to the wavelength of paste nm, so the peak wavelength of the emission wavelength of blue LEDn is preferably in the range of about 425 nm to 460 nm. In addition, in order to optimize the level of color reproducibility, the emission peaks of the nitride-based red phosphorescent 12 and the citrate-based green phosphor 14 are preferably between 500 nm and 550 nm and 600 nm to 650 nm, respectively. The white LED package 10 is good in terms of phosphorescent material stability and exhibits improved level of color reproducibility, as explained above. 15 94715 201023403 Use of red and green phosphorescent 12 and 14 nitrides Base red ' AAlSiNs : Eu phosphorescent and 矽The salt-based green A2Si〇4: Ell phosphorescent' is not only relatively resistant to temperature and humidity, but also reacts to hardeners (such as platinum (pt)) added to the resin encapsulant 32. Causes little degradation. In fact, when performing reliability tests at high temperatures and high humidity levels, nitride-based red AAlSiNs: Eu phosphorescent and citrate-based green A2Si〇4: The light quality exhibits a higher degree of stability than the sulfide-based light quality of the related art. Fig. 8b shows a white light LED 元件 element according to another embodiment of the present invention. Referring to the first figure, the white LED device 1 〇 includes a resin encapsulant 32 having a convex lens shape (for example, forming a hemispherical lens), and a blue light LEd u encapsulated by a resin encapsulant 32. The above-described nitride-based phosphorescent substance 12 and a citrate-based green phosphorescent substance 14 is distributed within the resin encapsulant %. In this representative embodiment, no package body has a reflective cup, but a very wide beam angle can be implemented, and the blue LED 11 can be mounted directly on the circuit board. 10 picture shows A side view of a light source module for blaming light according to a representative embodiment of the present invention is schematically illustrated. The light source module and the light source unit of the Lcd backlight unit can be combined with various optical components (diffusion plates, light guide plates, reflectors, A cymbal, or the like is coupled to form a backlight assembly. Referring to FIG. 9 'a light source module containing plate (8) for backlighting (8) and an array of a plurality of white LED package members 10 mounted on the board. Conductive pattern ( Not shown) may be formed on the board (B) to be in contact with the LED package 1A. As described above with reference to FIG. 8a, each of the white LED packages 1A includes a black LED led wafer 11 mounted in a reflective cup, and the resin encapsulant 32 and the nitride-based red of the LED wafer n are encapsulated. The green phosphor 14 of the photo-fill 12 and the sulphate-based group is distributed in the resin encapsulant. Referring to Fig. 10, a light source module for an LCD backlight includes an array of a board (β) and a plurality of white LED package members. In this representative embodiment, the blue LED 10 is directly mounted on the board (B) in the form of a chip (chip_〇n_b〇ard ' COB). The package 10 is arranged as described above with reference to Figure 8b. Since each of the white LED packages has a hemispherical convex mirror (tree scorpion encapsulant 32) without a reflective wall, each white light LED package can have a wide beam angle. The wide beam angle of each white light source can provide a reduction in the size (thickness or width) of the LCD display. The white LED package 10' includes a blue (B) LED wafer u, a green (G) phosphor 14 and a red (R) phosphor 12. The green phosphor 14 and the red phosphor 12 are excited by the blue LED chip u to respectively emit green and red light' and the green and red wavelengths are mixed with a portion of the blue light emitted from the blue LED chip to output white light. Φ In particular, in a representative embodiment of the invention, the blue LED chip n is mounted directly on the board (B), and the phosphors _12 and R are distributed (preferably in a uniform manner) to encapsulate the circuit pattern resin encapsulation In the agent 32. The resin encapsulant 32 may have a hemispherical shape as a lens, and may be made of a eucalyptus resin or a mixed resin. Since the LED wafer π is directly mounted on the board (B) in a c〇B manner, it is possible to easily obtain a wider beam angle from each white LED. An electrode pattern or circuit pattern (not shown) is formed on the board (3), and the 947 circuit diagram of the 947 circuit diagram, and the IGBT circuit pattern is connected to the LED chip by, for example, conducting a η-two-line, a combination, or a flip chip. Because the white light source module contains a plurality of white LEDs, it can be used as a surface light source or a linear light source in a desired area. In this case, the white light 湃οσ ^ Yousong group can be advantageously used for LCD display. The light source of the greedy unit. The inventors of the present invention acted by combining green and red scale light and blue LED chips by limiting the main wavelength of the green LED chip 11 and the color coordinates of the area (6) E 1931 color coordinate system. Maximum level of color reproducibility.

In order to obtain the maximum color reproducibility from the combination of the blue LED wafer-green phosphor and the red phosphor, the main wavelength range of the blue LED wafer u is from 425 nm to 460 nm, after being excited by the blue LED wafer 11 The color coordinates of the red light excited by the red phosphorescent material 12 are based on the cie 1931 (X, Y) color coordinate system (〇. 5448, 0.4544), (〇. 7079, 0·2920), (0. 6427, 0 2905) and (0. 4794, 0. 4633)

The color coordinates of the green light excited by the green phosphor after the four vertices are surrounded by the blue LED wafer 11 are based on the CIE 1931 color coordinate system (0. 1270, 〇. 8037), Within the area surrounded by four vertices (〇. 4117, 0. 5861), (0. 4197, 0. 5316), and (0. 2555, 0. 5030). The color coordinate areas of the red and green phosphors are shown in Fig. 11 for reference purposes. As shown in Figure 11, by (〇. 5448, 0. 4544), (0·7079, 0. 2920), (0. 6427, 0· 2905), and (0·4794, 0. 4633) Irregular quadrilateral (r) formed by vertices, and by 94715 18 201023403 • (G. 127G, G. bribe), (Q. 4117, G. 5861), (()· 4197, G. 53i6) ' and The irregular quadrilateral formed by the four vertices of 0. 2555, 0.5030) (8) is not shown on the CIE 1931 chromaticity diagram. As mentioned above, the red phosphor and the green fill are selected such that their color coordinates are positioned within the irregular quadrilateral (r and g).

Here, the 'main wavelength is the dominant wavelength value obtained from the curve and photometric curve formed by integrating the spectrum of the output light (blue LED chip) measured by the equipment, which is a photometric factor considering humanity. The wavelength value. This dominant wavelength corresponds to the wavelength value at the point of the 连 value (0. 333, 0. 333) in the straight line connection of the CIE1931 color coordinate system and the value of the wire measured by the equipment corresponds to (10) 丨, the face of the chromaticity diagram. In the case of Yuqi, it should be η疋' different from the peak wavelength of the main wavelength to have the highest energy intensity 2 ^ also 疋 §, the peak wavelength is related to the highest intensity indicated by the spectrum of the output light measured by no relevant visibility The wavelength value. By limiting the dominant wavelength of the blue SLED wafer η to 425 (10) to 46 〇 (10), by limiting the red phosphorescent photo 12 under the SnBay CazAisiN3 : Eu(^x, ^ g ) table according to the color coordinates (according to CIE 1931) The color coordinate system) is formed by four vertices (〇. 5448, G. 4544), (G. mM. 292〇), (0. 64 hits '〇· 2905), and (〇. 4794, G. 4633). Within the quadrilateral, and by the same color seat as the red phosphorescent 12 (G. 127G, G. bribe), (〇. 4117, 〇. 5861), 1°. 2 97:0·5316) and (〇.2555, 〇. 5〇3〇) The four vertices represented by the &quot;Trn light quality 14, the white light source modules 600 and 900 used in the backlight unit can exhibit the color included in CIE 1975 The high color reproducibility of the very wide color coordinate regions of all L regions in the figure (see Fig. 94715 19 201023403 17). Such a still color reproducibility has not been achieved in the related art by combining a blue LED chip and red and green phosphorescent materials. When LED chips and red and green phosphors exceeding the main wavelength range and color coordinate area are used, the degree of color reproducibility or the color quality of the LCD display is lowered. In the related art, in order to obtain white light, the main wavelength of the blue LED chip used together with the red phosphorescent material and the green phosphorescent material is generally 460 nm or more. However, in the present representative embodiment, since the blue light having a shorter wavelength than that of the related art and the red and green phosphor having the color coordinates in the triangular region are used, it is possible to obtain a color reproduction which cannot be achieved by the related art. Sex. In the present representative embodiment, since the main wavelength range of the blue light (LED wafer) and the color (4) domain of the green and red light (counter f) are limited, the blue LED chip and the yellow light quality are combined with the related art. In this case, a large level of color reproducibility can be obtained, which is better than the color reproducibility of the blue LED chip and the green and red phosphors in combination with the color reproducibility of the blue LED wafer and the green and red phosphors. Overall light efficiency.

In addition, in the present representative embodiment, unlike the related art, when the light source module uses red, green, and blue light LED chips, the required number of UD 曰 片 片 can be reduced and the type of the led wafer used can be reduced to only — A type of wafer (ie, a blue LED wafer). The kind of - so can reduce package manufacturing costs and simplify the drive. ★, and 9 W power 九 /, 疋 'In the case of making additional circuits to prevent the addition of contrast or the curtain is like dragging (ie, motion blur), the circuit configuration can be simpler. 94715 20 201023403 • However, since the single LED wafer 11 and the LED wafer 11 containing the phosphorescent resin encapsulant 32 are included in the white light per unit area, the level of color uniformity can be compared with the use of red, The green and blue LED chips are better. Figure 13 is a cross-sectional view showing, in a schematic manner, a white light emitting device according to another representative embodiment of the present invention and a white light source 9A having the white light emitting device. In the representative embodiment of Fig. 13, the blue LED chip is directly mounted on the board (B) in the form of COB, and the blue LED chip 11 and the red and green phosphor forming units excited by the monitor LED wafer 11 are formed. Area white light emitting device. In order to maximize the level of color reproducibility, the blue LED wafer 11 and the red and green phosphors have the above-mentioned main wavelength and color coordinate range (ie, the main wavelength range from 425 nm to 460 nm, in the CIE 1931 color coordinate system by Irregular quadrilateral formed by four vertices (〇.5448, 〇.4544), (〇. 7079, 0. 2920), (〇·6427, 0. 2905), and (0.4794, 〇. 4633), and 〇.127〇,〇.8()37), (〇. 4m,〇. 5861), (〇· 4197, 〇· 5316) and (〇. 2555, 〇· 5_), the four vertices are formed Regular quadrilateral). In the present representative embodiment, the red and green phosphors are provided in the form of phosphorescent films 12 and 14, rather than in a mixed distribution manner within the resin encapsulant. In detail, as shown in FIG. 13, a green fill film comprising a green pot of light is ruined and deposited as a thin layer on the surface of the green LED wafer u to form a hemispherical transparent resin encapsulant on the surface. 32. A color phosphor film 12 is applied to the surface of the resin encapsulant 32. The position of the green disc light film and the red disc photo film can be reversed. That is, the red can 94147 21 201023403 photo film 12 can be coated on the LED wafer u, and the green phosphor film ‘ can be coated on the tree sap encapsulation 32. The green lining film 14 and the red stone dance 'photochemical film 12 can be opened by a resin film containing, for example, phosphorescent granules, respectively, and the above-mentioned nitrogen can be used as the light source in the squama film 12 and 14. Phosphate, sulfide group, or citrate-based phosphor. As described above, the transparent resin encapsulant 32 has a green (or red) phosphorescent film 14 or 12, and a red &lt;; or green) phosphor The plasma film 12 or 14 can further improve the color uniformity of the output white light. If the green and red phosphors (powder mixture) are only distributed in the resin encapsulant, the filling quality is not evenly distributed due to the difference in the specific gravity between the scales during the hardening process of the tree gum. It is possible that the layers are separated, thus resulting in a decrease in color uniformity in a single white light emitting device. However, as shown in Fig. 13, it is representative of the actual addition, since the green male photo film 14 and the red iridium film 12 separated by the resin encapsulant are used, the light is emitted from the blue LED wafer n = various angles. The blue light can be absorbed or transmitted by the phase film uniformly through the phosphorescent films 12 and 14, thereby obtaining an increase in the uniformity of the overall white light (additional improvement in color uniformity). In the representative embodiment shown in Fig. 13, since the green phosphorescent m η and the red disc photo-plasma separated by the resin encapsulant 32 are used, it is possible to reduce the light caused by the constituting light. loss. If the phosphorescent powder is distributed in the resin encapsulant, the phosphorescent light has been converted, and the first light (green light or red light) is diffused on the light path of the apricot; May cause light loss. However, in the representative of Fig. 13, the second light which has been transformed by the thin green or red filled light film 14 or 12, 94715 22 201023403 'is transmitted through the transparent tree moon encapsulant 32, or The radiation is radiated to the outside of the light-emitting device, so that light loss caused by the light-sensitive particles can be reduced. Moreover, in the representative embodiment of FIG. 13, the white light source module used for the backlight unit of the LCD display can be exhibited by using the main wavelength of the blue LED chip and the color coordinates of the green or red scale light in the above range. High color reproducibility, including almost all s_RGB areas. In addition, it is possible to reduce the number of LED chips and the manufacturing method of the driving circuit and the sealing member, and has the effect of reducing the unit cost. Of course, it is possible to limit the half amplitude of blue, green and red light to the above range. As in the above representative embodiment of the present invention, each of the LED chips is directly mounted on the circuit board in the form of (3), but the present invention is not so limited. The Lu's LED chip can be mounted on a package mounted on a circuit board. A representative embodiment using a separate package body is shown in Figure 15. Figure 14 is a schematic illustration of another embodiment in accordance with the present invention. A white light emitting device and a white light real image having the white light emitting device are exemplified. Referring to Fig. 14, each of the white light emitting devices includes a face member having a reflection = and a blue LED chip mounted in the reflector cup. In the embodiment of the package, the red and green phosphorescent film is in the form of a photo film. Sigh, not in a mixed distribution in the resin encapsulant. e, the green (or red) phosphorescent film 12 or 14 forms a transparent resin encapsulant 32 on the surface of the LED film 11 in a thin manner, and the phosphor film 12 and blue•t are formed. . The red (or green) phosphorescent film or 14 is applied to the surface of the resin encapsulant 32. ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,

Separated green light film 彳4 knows that V 疋贞 film 14 and red phosphorescent quality to obtain superior color uniformity level 岐 匕 匕 enough to use the example, because the use: before: ; / as the above representative The main wave, port, and 'color of the eight-color phosphorescent color of the blue-lighted LED in the η area, so that the color reproducibility of almost every part of the area can be achieved.

120 is a 1976 chromaticity diagram showing the color coordinate range obtained by using the white light source module according to the representative embodiment of the present invention and the white light source module according to the comparative example for the LCD display tkHh unit. As described above, the white light ray group according to the representative embodiment of the present invention is a light source module that emits a combination of white light Langxian and green and red scale light (see Fig. 9). According to the representative embodiment of the white light source module of the present invention, the blue LED chip has a main wavelength in the range of 425 nm to 働nm (especially the main wavelength of 445 nm), and the red nucleus emission red light has (0.5448, 0.4544), (U079, 〇. 2920), (〇. 6427, 0. 2905) and (0. 4794, 0. 4633)

*The color coordinates in the irregular quadrilateral formed by the point, and the green phosphorescent emission green light have the (0· 127G, 0. 8037), (0. 41!7, 〇· 5861), (〇. Four of 4197, 0. 5316) and (0. 2555, 0. 5030)! The dot is formed without the color coordinates in the quadrilateral. The white light source module of the first comparative example according to J and the representative embodiment of the present invention is a light source module that emits white light through a group of red, green and blue LED chips. Moreover, according to the white light source module of the second comparative example, a light source module using a cold cathode fluorescent lamp (cold cathode 24 94715 201023403 fluorescent iamp, CCFL) is used in the chromaticity diagram of Fig. 12' The color coordinate area of the LCD display in which the light source module is used in the backlight unit is displayed, and

The light source module of the first and second comparative examples is used in the color coordinate area of the LCD display in the backlight unit. As shown in Fig. 12, the LCD display using the backlight unit realizes a very wide color coordinate area including a portion of almost every s-RGB area. Such high color reproducibility has not been achieved in the related art by combining blue LED chips and red and green phosphors. An LCD display using a backlight unit (RGB LED BLU) according to the first comparative example uses a LED chip as a red, green, and blue light source to perform a wide color ridge area. However, as shown in Fig. 12, an LCD display using RGB Ε ) B) has a disadvantage of not being able to appropriately display the blue portion of the s_RGB area. In addition, if the three main colors are respectively performed by the LED chip without using phosphorescent material, the color uniformity will be lowered compared to the representative embodiment of the present invention, and the number of required LED chips will be increased to enhance manufacturing cost. In particular, the additional circuit configuration used to add contrast or local dimming will become complicated, and the cost of configuring the circuit will increase dramatically. As shown in Fig. 12, the LCD display using the foot (ccfl BLU) according to the second comparative example has a color coordinate area of a relatively narrow area, and color reproducibility and use of the BLU compared to the representative embodiment of the present invention. (10) 2 The color reproduction of the foot of the first comparative example is less reproducible. In addition, the 'cm foot* has environmental affinity, and a circuit for improving the foot effect (such as local dimming, contrast adjustment, and the like). Configuration 94715 25 201023403 is difficult or impossible to implement. In the representative examples described above, the red luminescent material of the (Sr, Ba, Ca)AlSiN3 : Eu nitride group, and the green phosphorescence of the (Sr, Ba, Ca) 2Si 〇 4 : Eu bismuth silicate group The substance exists in a state of being distributed in the resin encapsulant, but the present invention is not limited to this case. That is, for example, red and green phosphorescent materials may be formed on the surface of the blue LED in the form of a film (one layer or layers of phosphorescent film). In this case, the two types of phosphors may be mixed and contained in a single phosphor film, or each phosphor may be independently present in each layer. The lead frame 20 may include a separated first lead portion 21 and a second lead portion 24. The first lead portion 21 includes a bottom surface 21c on which the LED wafer 11 is mounted, a side wall surface 21b extending obliquely upward from the bottom surface 21c, and a curved portion extending from one end portion of the flat surface 21a and exposed to the main body The terminal portion 22 on one side of 30. With this configuration, the first lead portion 21 is formed with a recessed structure cavity 25 from the bottom surface 21c and the side wall surface 21b, and the LED wafer 11 is housed in the recess 25. Here, although not shown, the blue LED may be electrically connected to the bottom surface 21c by a conductive member (e.g., a solder ball or a wire). The second lead portion 24 includes the other end portion spaced apart from the flat surface 21a by a certain distance in a face-to-face manner, and a flat surface 24a electrically connected to the LED wafer 11 by a wire, and bent and extended from the flat surface 24a and The terminal portion 22 is exposed on the opposite side of the body 30. The main body 30 houses the lead frame 20 and serves to support the lead frame 20 26 94715 201023403 . and the pivot 1 of the sheet 1 so that they can be stably electrically connected. In this case, the body 30 includes an opening 31 to expose the recess containing the LED wafer 11. That is, the bottom surface 21c and the side wall surface 21b are exposed through the opening 31, and the bottom surface 21C is additionally exposed through the lower end surface of the main body to effectively release the heat generated from the f body 30 from the LED wafer 11. The terminal portions 22 of the first lead portions 21 and 24 of the first spear can penetrate through the two sides of the main body 30 so as to be pulled out and exposed. In this case, each terminal portion 22 can be bent downward to be positioned at the same horizontal position as the lower end surface of the main body 30. The detailed structure thereof will be described later. The sealing member 32 may be disposed at the opening 31 of the body 30 and additionally contain squama light. Here, the sealing member 32 may have a single structure. Or alternatively, the sealing member 32 may have a multilayer structure in which each layer has a different refractive index in order to improve light efficiency. In order to efficiently emit light from the LED wafer 11 'the lower layer of the sealing member 32 may have a smaller refractive index than the upper layer. 0 ® Although not shown, in order to increase the level of light reflectance, a reflective film may be provided on the surface of the lead frame 20. The reflective film can be made of a metal having a good light reflectance level. For example, the reflective crucible can be made of silver or aluminum. The reflective film can be formed by electroplating or by additionally stacking a film through which the light picking efficiency of the LED seal can be further increased. Ideally, 'multiple LED chips I' can be mounted on the bottom surface of the 94715 201023403 so that they can be connected in parallel' and an additional Zener diode (not shown) can be installed to electrically connect the LED chip to prevent static electricity. . The design of the pocket in accordance with a representative embodiment of the present invention will now be described with reference to Figures 3 and 15-17. Figure 15 is a schematic view showing the optical characteristics of the LED chip of Figure 3, Figure 16 is an enlarged cross-sectional view showing the design of the lead frame, and Figure 17 is a reliable high-temperature load applied to the LED package in accordance with the formed lead frame. The graph of the results of the degree test is not. As shown in Fig. 15, the LED chip 11 may be a rectangular flat hexahedral light source having a general structure. However, the present invention is not limited thereto, and the led wafer 11 may have various other shapes such as a regular hexahedral light source or an unequal regular hexahedral light source. In this case, when a current is applied to the LED wafer 11, light formed by the LED wafer 11 can be radiated from the upper surface and the side surface of the LED wafer 11. Here, when light formed at the center (F) of the LED wafer 11 is emitted from the side surface of the LED wafer 11, 'light can be distributed at the corner of the first light beam L1 passing through the upper corner of the LED wafer 11 and passing through the LED In the space between the corners of the second light beam L2 at the lower corner of the wafer 11. Among the light beams (i.e., light rays) generated from the side of the LED chip 11, the light beam directed to the lower portion of the lead frame 20 is reflected upwardly. In this case, however, among the light beams generated from the side faces of the LED wafer 11, a portion of the light beam directed to the upper portion of the lead frame 20 may be directly irradiated to the main body 30 to degrade the main body 30. 28 94715 201023403 To avoid this problem, the depth of the recess 25 can be adjusted to prevent 'light generated from the side of the LED wafer 11 directly toward the body 30, and in this case, the depth of the recess can be adjusted to allow at least A light beam L1 passes through the upper corner of the pocket 25. As a result, light generated from the side of the LED wafer 11 can be almost irradiated to the side wall surface of the lead frame 20. This is because the light passing through the upper corner of the LED chip 11, that is, the first light beam L1, is the outermost beam emitted from the side of the LED chip 11. Here, the upper corner of the pocket 25 is at the side wall φ surface 21b, and the flat surface 21a is brought into contact with each other. The depth of the recess 25 as shown in Fig. 16 will satisfy the following formula 2. [Equation 2] h = d+y/2 Here, 'h' is the depth of the recess 25, and 'd' is the length of the region, and this region is generated from the respective beams from the side of the LED wafer 11 to the lead The light beam at the upper portion of the frame 20 can be irradiated to the side wall surface 21b of the lead frame, and y is the south of the wafer 11. The depth (d) of the region can be obtained by Equation 3 shown below, in which the light is irradiated to the side wall surface 21b of the lead frame 20. [Equation 3] tan(a/2) = y/x = d/c, d = y / xxc, where 'X' is the width of the LED wafer 11, and 'c' is the width of the pocket 25. As such, the depth 'h' of the pocket 25 satisfies the following equation 29 94715 201023403 Equation 1. [Equation 1] h = y/xxc+y/2 Here, 'h' is the depth of the recess 25, 'X' is the width of the LED wafer 11, 'y' is the height of the LED wafer 11, and 'c' It is the width of the pocket 25. Figure 17 is a graphical representation of the results of a high temperature load reliability test performed on the LED package in accordance with the formed lead frame 20. As shown in Fig. 17, it is noted that the LED package S1 including the lead frame having the recess has a smaller degradation rate than the LED package S2 having the flat lead frame. Thus, by including a recess in the lead frame, degradation of the body by light from the LED wafer can be prevented. In addition, by stably designing the depth of the recess, the degradation of the body can be more effectively prevented. One or more LED wafers can be mounted by adjusting the number of leadframes, and in this case, each LED wafer can emit light of the same or different. As illustrated, the terminal portion 22 is exposed through both sides of the body 30 to electrically connect the LED wafer 11 to the board. The terminal portion 22 may include the upper end electrode 22a, the curved portion 22b, and the side surface electrode 22c exposed from the main body 30. The upper end electrode 22a extends from the flat surface 21a of the first lead portion 21 and the flat surface 24a of the second lead portion 24 so as to be exposed from both sides of the main body 30 in a fixed manner. 30 94715 201023403 In this case, the upper end electrode 22a is bent downward from the flat faces 21a and 24a so as to be level with the lower surface of the main body 30. As a result, when the lower surface of the main body 30 is mounted on the board (b), the upper end electrode 22a is electrically connected to the board (B). In the present invention, the upper end is mounted to mount the led package on the board in a horizontal direction, and the upper end electrode 22a is electrically connected to the board (B). The bent portion 22b extends from the end portion of the upper end electrode 22a and is curved toward the front side of the main body 30.侧面 The side surface electrode 22c is vertically bent and extended from one side of the curved portion so as to be horizontal to the longer direction side 3〇]3 of the main body 30 and right angle to the shorter direction side 30a. In other words, according to the main body having a rectangular flat hexahedron structure, the upper end electrode 22a and the curved portion 22b are disposed on the short side direction side 3〇a of the left and right sides, and the side surface electrode 22c is disposed on the short side direction side. 3〇&amp; is the right side 30b of the right angle.如此 In this way, the side electrode 22c is electrically connected to the board (B) in the case where the main body 3 of the led package is vertically mounted on the edge type of the board (B). The side electrodes 22c may have various lengths depending on the length of the longer side 3b of the main body 30. That is, as shown in Fig. 1, the side surface electrode 22c may be formed in a portion knife approaching a corner where the shorter direction side 30a and the longer direction side 3〇b meet, or as shown in Figs. 18a and 18b. The side electrodes Me can be formed in an elongated manner such that they become close to each other along the longer side direction 31 94715 201023403 of the body by a length of 3 Gb. In this case, the contact area with the board (8) can be increased by the side electrode 22c in an elongated manner, allowing the LED package to be stably mounted and increasing the effect of releasing heat generated from the wafer}1. In a representative embodiment of the present invention, the side mounting may refer to vertically mounting the LED package on the board (B) such that the side electrode 22c is connected to the board (the phantom electrical connection. The upper end electrode 22a, the curved portion 22b, and the side electrode) 22c can be integrally formed by applying pressure or the like' and the lead frame 2 can be made of a material having good thermal conductivity (for example, copper) to effectively release heat generated from the Up wafer 11. Fig. 19 shows how A partial perspective view of an edge type (side view type) LED package according to a first representative embodiment of the present invention is mounted, a second view is a front view of the LED package of FIG. 19, and a figure 21 is a view showing how to install directly Partial perspective view of a type (top view type) LED package. Referring to Figures 19 and 20, the LED package is electrically mounted on the board (B) through the side electrode 22c connected to the body 3〇. As shown in Fig. 20, the main body 30 and the board (B) are connected such that the LED chip 11 is disposed perpendicular to the board (B). With this configuration, the LED package can be mounted on the light guide plate (not shown). Side. Moreover, the LED package can The board (B) is electrically connected to the upper end electrode 22a in parallel along the lower surface of the main body 30, and the LED wafer 11 can be configured to be directly emitted to the upper portion of the board (B). Thus, according to The LED package of the representative embodiment of the present invention can be 32 94715 201023403 by having the ability to simplify the lead frame 2 . . 圮 圮 、, can reduce the early cost of the manufacturing model, and use the LED seal / il ^ m -hr L· The cow end free package design 223, the curved portion 22b, and the side electrode &amp; are commonly used as both edge-shaped and direct-type LED packages. 22c, the bend i L , the less-prediction portion 22b, and the upper-end electrode 22a are integrally formed, thereby contributing to the manufacture of the LED package. Figure 22 is an LCD package according to a second representative embodiment of the present invention.

A perspective view of the piece, and Fig. 23 is a rear perspective view of the LED package of Fig. 22. The LED package 4A according to the second representative embodiment of the present invention as illustrated in FIGS. 22 and 23 and the LED package according to the first representative embodiment of the present invention illustrated in FIGS. 1 to 11 include substantially The same elements will be omitted, and the detailed description of the elements will be omitted, and the configuration of the contact portions 45 will be mainly explained. The contact portion 45 extending from the flat surface 21a of the first bow line portion 21 passes through the longer direction side 3〇b of the main body to be exposed. In other words, the end portion 22 extending from the flat surface 21a of the first lead portion 21 is exposed from the shorter side 30a of the main body 30 while the contact portion 45 is exposed from the longer side 30b perpendicular to the end portion 22. Like the terminal portion 22, the contact portion 45 may be integrally formed with the first lead portion 21, and as such, the contact portion 45 may be a portion of the lead frame 2''. As illustrated, the contact portion 45 can be disposed on both sides of the body 30, 33 94715 201023403, but the invention is not limited in this case. That is, the contact portion # may be provided only to the body 30, and in this case, the contact portion 45 may be disposed along the side of the (four) pure (8) in the case of the side wire. The end of the contact portion 45 may be curved toward the lower surface, in other words, to the rear surface of the body 30. For example, when the main body 30 is mounted, the contact portion can be installed in the side mounting state, so that the surface 45a at a right angle f is in contact with the plate (8), and in the case of the top surface mounting, the contact can be mounted. The end portion 45b is brought into contact with the plate (B). In this manner, a wider contact area can be obtained by mounting the LED package 4 on the board (8) to provide a stable mounting structure and effective heat release through the contact area with the substrate. In addition, when the heat generated from the (10) crystal can be additionally released through the __ exposed by the body, the release efficiency can be improved. Fig. 24a is a perspective view of a led package according to a third representative embodiment of the present invention, and Fig. 24b is a cross-sectional view of the LED package in accordance with a third representative embodiment of the present invention. Referring to Figures 24a and 24b, the LED package 5A includes an LED wafer 11, a lead frame 51, a body 30, and a contact portion 55. In the third representative embodiment illustrated in Figures 24a and 24b, the elements of the led package are substantially identical to those of the second representative embodiment illustrated in Figures 22 and 23. In this case, the detailed arrangement of the lead frame and the contact portion is different from that of the second representative embodiment. Therefore, the description of the repeater and the above-mentioned representative embodiment will be omitted, and only the lead frame 51 and the contact portion *55 will be described. Configuration. 94715 34 201023403 ' In the present representative embodiment, the contact portion 55 includes a bottom surface 55c on which the LED wafer 10 is mounted, a side wall surface 55b extending obliquely upward from the bottom surface 55c, and a horizontal extension from the side wall surface 55b. Flat face 55a. Further, the contact portion 55 is formed with a recess 56 having a concave structure by the bottom surface 55c and the side wall surface 55b, and the LED chip 11 is housed in the recess 56. The flat face 55a passes through the longer side 30b of the body 30 for exposure, while the exposed end is curved toward the lower surface, in other words, the rear surface of the body 30. The contact portion 55 is disposed at a central portion of the body 30 such that the pocket 54 containing the φ LED wafer 11 is exposed from the opening of the body 30. The lead frame 51 is disposed on both sides of the contact portion 55 and electrically connected to the LED chip 11. The lead frame 51 includes first and second lead portions 52 and 53 spaced apart from the contact portion 55, and the first and second lead portions 52 and 53 are disposed on the shorter direction side 30a of the main body 30. The first and second lead portions 52 and 53 respectively include flat faces 52a and 53a which are spaced apart from the flat face 55a of the contact portion 55, face each other, and are electrically connected to the LED chip by wires, and the terminal portion 54. The curve is curved and extends from each flat surface to be exposed from the shorter side 30a of the body 30. The end portions 54 of the first and second lead portions 52 and 53 may pass through both sides of the main body for being pulled out and exposed, and each end portion 54 may be bent downward so as to be positioned at the same horizontal position as the lower end surface of the main body 30. . The terminal portion 54 may include an upper end electrode 54a, a curved portion 54b, and a side surface electrode 54c. The detailed structure thereof is substantially the same as the representative embodiment exemplified in the foregoing Figs. 1 and 2, and therefore the overlapping description will be omitted. 35 94715 201023403 When the contact portion 55 is formed to be separated from the lead frame 51, the contact portion 55 can assume the same role as the lead frame 51. For example, when the contact portion 55 has a positive electrode, the first lead portion 52 and the second lead portion 53 have negative electrodes, and the LED chip 11 can be mounted on the contact portion 透过 through a conductive adhesive or the like. The contact portion 55 may only allow the LED wafer 11 to be mounted thereon and used as a heat sink for releasing heat 'in this case, the first and second lead portions 52 and 53 have different electrodes, and the LED wafer 11 is non-conductive. An adhesive or the like is attached to the contact portion 55. An LED package in accordance with a fourth representative embodiment of the present invention will now be described with reference to Figs. 25 is a perspective view showing a state of the LED package according to the fourth representative embodiment of the present invention, and FIG. 26 is an enlarged perspective view showing the LED package of FIG. 25, and FIG. 27 is a view showing FIG. A plan view of the lead frame of the LED package. Referring to Figures 25 to 27, the LED package 60 includes a first lead portion 62a that is tightly mounted on the board (B) and extends from the first lead portion 62a.

Light guide plate.

The LED chips 32b of the two lead portions 62b are electrically connected. However, the present invention does not exclude the second lead portion mounted on the lead frame 62. The LED wafer 11 is a flip chip bonded structure, and thus such a wire is not required. If the LED chip 11 is a blue LED, the LED package 6 can include a sealing member 32 formed in the opening to provide white light, and the member 32 can contain yellow phosphor. _ _, the sealing member 32 can be ==, the yellow fine gel-type epoxy resin or the w YAG-based grading gelatin type gel-type resin is in the main body 31, and then It is formed by hardening or heat curing. The sweat is described in detail in the light quality of the sealing member 32, and thus the description thereof will be omitted. In the present representative embodiment, the lead frame of the LED package 60 can be modified in various ways. In this case, the main technology of the present invention is: 行, 行, in the separate backlight unit Plate = flat, tightly and fixedly in the direction of light travel, the water portion ^ extends, so that it is perpendicular to the plate (8). The lead frame 62 according to the present invention additionally comprises a portion 62b outside the side parallel to the younger brother one lead ^ the wide production w4 phase The third lead portion 62c, 4 degrees of redundancy or less than the thickness 62c of the main body 3 () is positioned at the lead of the package master. The step of increasing the number of wafers 11 in the second lead portion is 5 nm', which may be equal to 5 or less. ...width of coffee (8) 94715 37 201023403 In addition, the separate backlight according to the present invention has the advantage of manufacturing a thinner backlight unit. That is, the viewpoint of the structure has a width (W) while reducing the height of the second lead portion 62b 加 = plus the main body 30 of the main body 30 so as to increase the perpendicular to the light: the degree 'special 曰 is '11', thereby Maintaining the same or greater than the related art 'light':::: In addition, 譬: forming the main body such that the width of the first lead of the two (four), the width of the line portion, and the side from the side of the first lead portion 62a The overall width (with (6) is greater than the width (w) of the body 30' is sufficient to further improve the heat dissipation effect.

Through the structure of the first lead portions 62 &amp; having widths w1, W2, and W3, the LED package 60 can be quickly and unsoundably combined by an automatic combining process (for example, SMT) when mounted on the board (B). . Thus, the combined process duration can be shortened to increase throughput. For example, the first lead portion 62a of the lead frame 62 is fixed to the board (B) through the four portions formed to allow the wires to be exposed from the board (B) and the solder to fill the recess. Thus, the second lead portion 62a of the lead frame 62 serves as an electrode to which a voltage is applied, and at the same time, the first lead portion 62a is used to pass through a lower cover (not shown) provided on the lower side by being increased. The unit area of contact with the board (B) releases heat smoothly. An LED package in accordance with a fifth representative embodiment of the present invention will now be described with reference to Figs. 28 to 30. Fig. 28 is a perspective view showing the modification of the LED projecting member of Fig. 26, and Fig. 29 is a plan view showing the modified lead frame of the ED package of Fig. 28. As shown in FIG. 28, in comparison to the LED package illustrated in FIG. 26, the LED package 70 according to the fifth representative embodiment of the present invention is configured such that the first lead of the lead frame 72 is provided. The portion 72a is formed in the opposite direction to the direction in which the light is applied in accordance with the LED chip 11 mounted on the opening of the main body 30 and providing light. In detail, the first lead portion 72a of the lead frame 72 is formed to be curved in a direction opposite to the direction in which the light supplied from the LED chip 11 mounted on the second lead portion 72b perpendicular to the bottom surface of the board is formed. Such a structural modification can be achieved in accordance with the design convenience of the LED package including the lead frame 72, which can be achieved in a convenient assembly process for mounting the LED package 70 on the board (B) Q, or an improved illumination can be achieved by removing components. The element can be introduced into the light guide plate when the first lead portion 623 of the lead frame 62 disposed in the direction in which the light is disposed is supplied from the LED package 60 disposed on one side of the light guide plate. The package according to the fifth representative embodiment is not greatly different from the above except that the first lead portion 72a of the lead frame 72 is formed in the opposite direction to the direction of the light, and thus the detailed description will be made by the above. The contents of the LED package 6〇 are replaced. Further, as shown in Fig. 29, the lead frame 72 includes a first lead portion 72a fixedly attached to the board (B) and a second lead portion 72b extending perpendicularly to the first lead portion 72a. The LED chip 11 is mounted on the first The lead portion 72a may be formed as a pair of lead frames including only two first lead portions 72a. Moreover, in the representative embodiment of the present invention, as shown in FIG. 3, a pair of lead frames 72 may be formed to include only the second lead portion m wafer 11 mounted on the second lead portion 72b, and the first lead A portion of him 94715 39 201023403 is formed perpendicular to the second lead portion 72b and is tightly fixed to the board '(B). In this manner, the LED package in accordance with the representative embodiment of the present invention can be applied to a separate type of backlight unit configured in various forms without departing from the technical idea of the present invention. <Backlight Unit> A backlight unit using the LED package according to the representative embodiment of the present invention as described above will now be explained. Fig. 31a is a perspective view for explaining a backlight unit in accordance with a first representative embodiment of the present invention, and Fig. 31b is an enlarged cross-sectional view showing a mounted state of the LED element in a schematic manner. Referring to FIGS. 31a and 31b, the backlight unit 1A includes a lower cover 110 having a bottom surface, a plurality of light guide plates 120 disposed on the lower cover 11A, and a lower cover disposed on one side of each of the light guide plates 120. The bottom surface is horizontal and includes a board (B) for applying a voltage from an external power source to the board (B), and a plurality of LED packages 130 and optics mounted on one side panel (B) of the light guide plate 12 and providing light Component} (9).背光 The backlight unit 100 may additionally include a liquid crystal panel 180 to display an image by adjusting the light transmittance to be used as a liquid crystal display (LCD). In the present representative embodiment, the backlight unit has a tandem type structure. The string type structure is related to placing a light guide plate on a tue plate and making a uniform light emitting surface. The string type structure that allows the brightness to change partially improves the comparison of the scale consumption. The light guide plate 120 is divided into a plurality of sections, and a plurality of light guide plates - 94715 40 201023403 are slid in parallel in the accommodation space of the lower cover 110. In this regard, eight light guide plates 120 are disposed in a 46 p inch box, and 16 LED packages 130 are mounted in a single module, and each module may be disposed on the side of the light guide plate 12A. However, the number of the light guide plates 12A and the led package 130 may be set differently depending on the size of the liquid crystal panel. The plurality of light guide plates may be disposed separately or may be integrally connected to solve the problem of the boundary between the light guide plates 120 in the light-receiving unit. The lower cover 110 may form a lower frame having a bottom surface containing a material such as iron (pe), galvanized iron (EDI), or the like, or may have a side frame extending from the edge of the bottom surface so as to be perpendicular to the upward direction direction. In this case, the bottom surface of the lower frame may be divided into a plurality of regions forming a column to configure a separate backlight unit. In this case, a plurality of regions may be bordered by, for example, recesses formed in the respective regions. The reflecting member 150 may be attached to the entire bottom surface of the lower cover 11 or may be attached to the plurality of bottom surfaces of the recessed portion in the case where the concave portion is formed. The reflective member 150 is usually formed of a white polyester film or a film coated with metal (Ag or Al). The light reflectance level of visible light of the reflective member 150 is about 90% to 97%, and the reflectance increases as the coated film becomes thicker. A plurality of reflective members 150 disposed on the bottom surface of the lower cover 110 may be formed to extend so as to be disposed between the LED package 130 providing light and the light guide plate 120 positioned adjacent to the rear surface of the LED package 130. In this case, it is possible to reflect the light guided from one side of the light guide plate 120 without being disturbed by the LED package 130 41 94715 201023403 disposed on the other side of the light guide plate 120 to provide the orientation toward the optical member 160. , thus increasing the rate of light reflection. The LED package 130 is disposed in the recess. In this case, the LED package 130 disposed in the recessed portion is horizontal to the bottom surface of the lower cover 11' and the wiring is mounted on the board (B) (ie, a printed circuit board (PCB)). Apply voltage from an external power source. Here, the LED package 130 can be modified in accordance with different representative embodiments of the present invention. And the LED package member 13A can be mounted perpendicular to the board (B) through the side mounting shown in Fig. 19, but the present invention is not limited by this. The board (B) having a plurality of LED packages 130 mounted thereon may be provided with a circuit wiring for providing a driving power received from the LED driving unit to the LED package 130' and the circuit wiring may be designed to be separated or The plurality of LED packages 130 are driven in a collective manner (ie, by groups). The light guide plate 120 is provided on a bottom surface of the lower cover 11 () which is divided into a plurality of regions, and reflection members 150 are respectively provided in the regions. Preferably, the side wall of the light guide plate 120 is tightly attached to the main body 30 to allow the light supplied from the LED chip 11 mounted on the main body 30 to be introduced into the light guide plate 12A without loss. The light guide plate 120 is made of polymethyl methacrylate and has high transparency and is very smooth because the light absorption of polymethyl methacrylate is the smallest in the visible light range in the polymer material. The light guide plates 12A have high mechanical strength&apos; and thus they are not easily broken or deformed. The light guide plate 12 is very light and has good chemical resistance. In addition, the light guide plate 12 having a transparency level of visible light of up to 9〇% to 91 42 94715 201023403% has a very low degree of internal loss' and has strong mechanical properties such as tensile strength, bending strength, and expansion strength ( eXpansi〇n strength), or similar properties, and strong chemical properties and resistance. An optical member 160 is provided to perform light characteristics of light supplied through the light guide plate 12A. In this case, the optical member 16A may include, for example, a diffusion plate including a diffusion pattern to reduce the non-uniformity of light transmitted through the light guide plate 12, and a prism having a light condensing pattern to enhance the positive illumination of the light. A sheet, a protective sheet, or the like. The guiding unit 170 may be disposed along four corners of the lower cover 110, and the LED package 130 is electrically connected to the guiding unit 17A and guides the mounting position. In this way, it is possible to assist in mounting the LED package 130 at the design position. Since the backlight unit according to the present exemplary embodiment uses the string type structure', it is therefore possible to use the local dimming driving method to partially change the brightness, and thus, it is possible to improve the contrast of the screen and reduce the power consumption. Further, since the LED package can use the edge type LED package and the direct type LED package, it is possible to increase the design freedom of the backlight unit. An LED backlight unit including an LED package in accordance with a second embodiment of the present invention will now be described with reference to Figs. 32 and 33. Figure 32 is an exploded perspective view of an LED backlight unit including an LED package in accordance with a second representative embodiment of the present invention, and the first view is a cross-sectional view of the LED backlight unit of the first embodiment. Here, the backlight unit may include a plurality of divided light guide plates, 43 94715 201023403, and only the first and second plurality of light guide plates are illustrated for the sake of brevity. Referring to Figures 32 and 33, the light unit 2A includes a lower cover, a light guide plate 220, a light source unit 230, and a fixing member 240. The lower cover 210 has a housing space. For example, the housing space can be formed by the bottom surface of the lower cover 210 and the side walls bent from the sides of the bottom surface. The light guide plate 220 is divided into a plurality of sections. The divided plurality of light guide plates 220 are disposed in a parallel manner in the accommodation space of the lower cover 21''. The light guide plate 220 is exemplified to have a quadrangular shape, but the present invention is not limited thereto, and the light guide plate may have various other shapes such as a triangle or a hexagon. In order to provide light to the light guide plate 220, the light source unit 230 is disposed on one side of each of the light guide plates 220. Each light source unit 230 includes an LED package for forming light, and a plate 232 having a plurality of circuit patterns for applying a driving voltage of the LED package 231. The light source of the LED package 231 can be an LED that emits light when a current is applied to the LED. Here, the led may include sub-LEDs, each performing blue, green, and red. The blue, green, and red beams emitted from the blue, green, and red sub-LEDs can be mixed to perform white light. The LEDs may comprise phosphorescent materials for converting blue and/or UV light emitted from the blue and/or UV LEDs into blue, green, yellow, and red. In this case 'blue and green, yellow, and red, or blue and yellow can be mixed to perform white light' or UV light can be converted into blue, green, yellow, and red or into blue, green, and red to perform white light . The light formed by the light source unit 230 is incident on the side of the 94715 201023403 of the light guide plate 220 and then transmitted to the upper portion through the total reflection in the light guide plate 220. The fixing member 240 is disposed between the divided light guide plates 220 to prevent the divided light guide plates 220 from moving apart. The fixing member 240 includes an insertion portion 241 and a head portion 242. The insertion portion 241 can be inserted between the individual light guide plates 220 to prevent the divided light guide plate 220 from moving horizontally. In other words, the insertion portion 241 is inserted between the first and second light guide plates 220a and 220b adjacent to each other in the divided light guide plate 220. Here, the insertion portion 241 may include first and second slopes 241a and 241b' extending from the end portions of the insertion jaw portion 241 to both sides to be coupled with the head portion 242. In other words, the section of the insertion portion 241 may have a triangular shape. Thus, the insertion portion 241 can be easily inserted between the divided light guide plates 220. The head 242 may have an area larger than the insertion portion 241. The head 242 may have a width greater than the distance between adjacent light guide plates. Then, the head portion 241 is disposed at the edge of the upper end of each of the divided light guide plates 220. In other words, the head portion 242 is disposed between the upper edges of the light guide plate 220, and the light guide plate 220 faces the insertion portion 241 interposed therebetween to prevent the fixing member 240 from being released to the space between the divided light guide plates 220. Further, the head 242 presses down the divided light guide plate 220 to prevent the divided light guide plate 220 from moving up and down. Since the fixing member 240 including the insertion portion 241 and the head portion 242 is disposed between the divided light guide plates 220, the divided light guide plate 220 can prevent left and right and up and down movement. The fixing member 240 may have a strip shape that traverses the lower cover 210 or a lattice shape that surrounds the periphery of each of the light guide plates 220. 45 94715 201023403 In order to minimize the effect of the fixing member 240 on image quality, the fixing member 240 may be made of a material that can transmit light (for example, a transparent plastic). Further, the fixing member 240 may include a reflective material (for example,

Ti〇2), the light leaking between the light guide plates 220 is reflected to the corresponding light guide plate 220. The reflective member 250 may be disposed under each of the light guide plates 220. The reflective member 250 reflects the output light to the lower portion of the light guide plate 220 to cause the light to be incident on the light guide plate 220, thereby improving the light efficiency of the backlight unit. The backlight unit may additionally include an optical member 260 supported by a fixed 13 member 240 disposed on the light guide plate 220. The optical member 260 may include a diffusion plate, a diffusion sheet, a prism sheet, and a protective sheet which are disposed on the light guide plate 220. The optical member 260 is spaced apart from the light guide plate 220 by a fixing member 240. As such, the light guide plate 220 can uniformly provide light to the optical member 260 in this manner because of having the representative embodiment in accordance with the present invention.

:j is a plurality of areas for separating the driving light guide plate 22, and the backlight unit fixing member 240 is for preventing the movement of the divided light guide plate 220 to smoothly release heat, and is prevented from being moved by the light guide plate 22 Missing. FIG. 3 is a backlight unit according to a third representative embodiment of the present invention. The backlight unit according to the third representative embodiment of the present invention has the same reflection as the second representative of the present invention. The backlight unit of the example is the same as the component of the backlight unit of the embodiment. The reference numeral of the backlight unit will be given the same component symbol, and the repeated description will be omitted. Referring to Fig. 34, a backlight unit according to a third representative embodiment of the present invention includes a lower cover 210, a light guide plate 22, which is divided into a plurality of regions, a light source unit 230, and a fixing member 34A. Each of the light guide plates 22 includes a first surface 221 on which light is incident, a second surface 222 on which light is output, a third surface 223 disposed opposite to the second surface 222 and reflecting light, and a first surface 221 opposite to the first surface 221 A fourth face 224 is provided and coupled to the second and third faces 222 and 223. In this case, the divided light guide plates 22 are configured such that the first surface 221 and the fourth surface 224 are opposed to each other. For example, the first and second light guide plates 22 〇 &amp; and 22 〇 b adjacent to each other in the divided light guide plate 220, the first surface 221 of the first light guide plate 220 a and the second light guide plate The faces 224 are oppositely disposed. The fixing member 340 includes an insertion portion 341 interposed between the plurality of divided light guide plates 22 (for example, the first and second light guide plates 22〇3 and 220b), and is coupled to the insertion portion 341 and The head portion 242 extends to the upper and second light guide plates 22 and 220b. The insertion portion 341 may include first and second slopes 341 &amp; 341 and 341b extending from the end of the insertion portion 341 to the two sides. In order to be connected to the head 342, in other words, the section of the insertion portion 341 may have a triangular shape. Here, the 'first slope 341a or the second slope 341b may be inclined to the first surface 221 of the light guide plate 220 from the light source unit 23〇 The light is incident on the first surface 22, for example, when the first and second light guide plates 22 (^ and 220b in the light guide plate which are adjacent to each other are adjacent to each other, the first surface 221 of the first light guide plate 220a may be The first slopes 341a are disposed opposite each other, and the second 94715 47 20 1023403 The fourth surface 224 of the light guide plate 220b may be disposed opposite to the second inclined surface 341b. Here, the first inclined surface 341a extends to the upper portion of the first surface 221, and the second inclined surface 341b extends to the upper portion of the fourth surface 221. In this case, the reflective film 343 is disposed on the outer surface, that is, the first and second inclined faces 341a and 341b of the insertion portion 341. By the reflective film 343, the light supplied to the first face 221 of the first light guide plate 220a is leaked. A part or all of the light to the fourth surface 224 of the second light guide plate 220b can be supplied to the first light guide plate 220a. Therefore, it is possible to prevent hot spots (hot spots) which are otherwise generated by light leaking between the divided light guide plates 220. Here, the hotspot is a bright spot defect having a illuminance with a higher illumination on the upper periphery of the portion of the screen image. The reflection 343 having an inclination extending toward the upper portion of the first surface 221 can be effectively utilized by the first slope 341a The light is reflected to the first side. Here, according to the illuminance characteristic of the light source unit 230 and the holding of the light guide plate 220, the reflectance of the reflective film 343 and the angles of the first and second slopes 341 and 341b can be changed. Therefore, the backlight unit according to the present invention can solve the hot spot problem, q and improve the movement of the divided light guide plate 220 by having the reflective film 343 partially or entirely reflected and leaked by the fixed member. 35 is a perspective view showing a fixing member in a backlight unit according to a fourth representative embodiment of the present invention. The backlight unit according to the fourth representative embodiment of the present invention has a photocopy The same elements of the backlight unit of the second representative embodiment of the invention. 715 48 201023403 * Yes, the same components as those of the backlight unit according to the second representative embodiment are given the same component symbols, and the overlapping description will be omitted. Referring to Fig. 35, a backlight unit according to a fourth representative embodiment of the present invention includes a lower cover 210, a light guide plate 220 divided into a plurality of sections, a light source unit 230, a fixing member 240, and a fixing frame 470. The fixing member 340 connects the plurality of fixing members 240 to each other. In detail, the fixing frame 470 has a rectangular frame shape with an internal opening, and the fixing member 240 is disposed in the opening of the fixing frame 470. Here, as shown, the fixed 0 member 240 has a strip shape. However, the shape of the fixing member 240 may not be limited thereto and the fixing member 240 may have a lattice shape. The fixing member 240 and the fixing frame 470 may be integrally molded. Alternatively, the fixing member 240 and the fixing frame 470 may be combined by using a connecting unit (for example, an adhesive, a fastening member, or the like). In this way, the plurality of fixing members 240 can be collectively combined with the divided light guide plate 220 by the fixing frame 470 at one time, so that the assembly productivity can be improved as compared with the case where the plurality of fixing members 240 are separated and combined. The fixing frame 470 can be fixed to the lower cover 210, so that the divided light guide plate 220 can be more effectively fixed. As such, the backlight unit according to the fourth representative embodiment of the present invention can improve the assembly productivity and the fixing characteristics by including the fixing frame 470 for connecting the plurality of fixing members 240. A backlight unit having an LED package in accordance with a fifth representative embodiment of the present invention will now be described with reference to Figs. 36 to 40. Figure 36 is an exploded perspective view of a backlight unit including an LED seal 49 94715 201023403 in accordance with a fifth representative embodiment of the present invention, and Figure 37 is a cross-sectional view of the backlight unit of Figure 36. Referring to Figures 36 and 37, the backlight unit 500 includes a lower cover 510, a plurality of light guide plates 520 disposed in parallel on the lower cover, and a light source unit 530 disposed on one side of each of the plurality of light guide plates 520. Here, the backlight unit may include a plurality of light guide plates', but only two light guide plates are exemplified for the sake of brevity. In detail, the lower cover 510 may have a receiving space for accommodating a plurality of light guide plates 520 and a light source unit 530. For example, the containment space can be formed by the bottom surface of the lower crucible 510 and the sidewall curved from the edge of the bottom surface. The light source unit 530 may be disposed at an edge of each of the plurality of light guide plates 52 to provide a separate driving function to the edge type backlight unit. In other words, the light source unit 530 provides light having an adjusted illuminance value to the corresponding light guide plate wo, and the corresponding light guide plate 520 can provide a selected area of the light having the adjusted illuminance value to the liquid crystal panel. The plurality of light guide plates 520 include a face 525 having a receiving recess 521 'the other face 526 faces the one side, the lower face 527 is curved to extend from the edge of the one face 525' and the high face 528 faces the lower face Face 527. The other face 526 can be incident on the incident face with light (formed from the light source unit 53) as the incident surface. A low face 527 can be used as a reflective surface for total reflection of light to the upper side. Here, although not shown, a plurality of optical patterns can be placed on the low face 527. In addition, a high face 528 can be used as an output face. Light is output from this output face to the outside. 94715 50 201023403 A plurality of light guide plates 520 may be disposed such that one face 525 and the other face 526 of the adjacent light guide plates face each other. For example, the plurality of light guide plates 520 may include first and second light guide plates 52A and 520b adjacent to each other. In this case, one face 525 of the first light guide plate 520a and the other face 526 of the second light guide plate 520b may face each other. The light source unit 530 may be disposed between the mutually adjacent light guide plates, for example, between one face of the first light guide plate 520a and the other face of the second light guide plate 520b. The light source unit 530 is housed in a housing recess 521 formed in one face 525 。. In this way, it is not necessary to separate the plurality of light guide plates 520 at a certain interval to position the light source unit 530 between the plurality of light guide plates 52, so that the backlight unit can be formed tightly. Further, since the space between the plurality of light guide plates 520 is accommodated, it is possible to prevent light bubbles from leaking between the plurality of light guide plates 52. The receiving recess 521 can be formed by upwardly bending a first face 522 extending from the edge of the low face 527 and outwardly bending a second face 523 extending from the edge of the first face 522. In this case, when the light source unit 530 causes light to be incident to the other surface 526 of the second light guide plate 520, the first surface 522 faces the rear side of the light source unit 530 and the second surface 523 faces the side of the light source unit 530. Here, the optical characteristics of the housing recess 521, particularly the second surface 523, can be adjusted to prevent hot spots due to light leaking between the plurality of light guide plates 520. For example, the first face 522 can be formed as one of a diffusing face, a reflective face, and an optically polished face. Here, the first face 522 reflects the leaking light to the other face 526 and absorbs or otherwise sends other remaining leaked light. The second face 523 may be formed as a diffusion face. In the case of 94715 51 201023403, the second side 523 may have a reflectance of 40% to 70%. If the reflectance of the second face 523 is 40% or less, it may happen that the boundary between the light guide plates 520 becomes a hot spot that is brighter than the face 528 higher than the respective light guide plates 520. Meanwhile, if the reflectance of the second surface is 70% or more, black spots which are darker than the surface 528 of the light guide plate 520 at the boundary of the light guide plate 520 may occur. One face 525 can include a third face 524 that extends to the receiving recess 521, in other words, an upward bend that extends from the edge of the second face 523. The third face 524 can face the other face 526 of the adjacent light guide plate 520 in parallel. In this case, the third face 524 may be formed as one of a diffusing surface, a reflecting surface, and an optical polishing surface. In other words, the second face 523 of the receiving recess 521 is formed as a diffusing surface, and the optical characteristics of the first face 522 and the third face 524 do not greatly affect the hot spot. However, if one of the first side 522 and the third side 524 has a larger area formed as an optically polished surface, the light transmission will increase to cause a hot spot. Thus, the larger of the first face 522 and the third face 524 must be formed as a diffusing face or a reflecting face rather than an optically polished face. For example, if the area of the third face 524 is greater than the area of one face 525, the first face 522 can be formed as one of an optically polished face, a reflective face, and a diffused face. However, the third face 524 may be formed as one of a reflecting surface and a diffusing surface. Meanwhile, if the area of the third face 524 is smaller than the area of the first face 522, the third face 524 may be formed as one of an optically polished face, a reflective face, and a diffused face. The first face 522 can be formed as one of a reflective face and a diffused face. 52 94715 201023403 ' Here, it is possible to adjust their optical properties by changing the density of the white ink applied to the first, silver, and the two sides of the surface, especially the second. Optical properties of the surface. In the present representative embodiment, the susceptor recess provided in the lead has a rectangular shape, but the present invention is not limited thereto. The various shapes of the recesses formed in the light guide plate in accordance with an exemplary embodiment of the present invention will now be described in detail with reference to Figs. 38a to 38d. 38a to 38d are cross-sectional views showing various types of light guide plates provided in the backlight unit in accordance with a representative embodiment of the present invention. As shown in Fig. 38a, the housing recess 521a of the light guide plate 520a according to the first representative embodiment of the present invention may have a trapezoid formed by the first surface 522a and the second surface 523c inclined upward from the first surface 522a. Profile shape. As shown in Fig. 38b, the receiving recess 52' of the light guide plate 520b according to the second representative embodiment of the present invention may have a first surface 52 which is inclined from the edge of the low surface 527b to the edge of the high surface 528b. The resulting 11 triangular cross-sectional shape. As shown in Fig. 38c, the recessed portion 521c of the light guide plate 520c according to the third representative embodiment of the present invention may have a trapezoid formed by the first surface 52% and the second surface 523c inclined upward from the first surface 522c. Profile shape. Here, the light guide plate 520c according to the third representative embodiment of the present invention may have a third face 524c extending obliquely upward from the second face 523c of the housing recess 521c. As shown in Fig. 38d, the receiving recess 521d of the light guide plate 520d according to the fourth representative embodiment of the present invention may be formed by a linear first surface 522d and a second surface curved upward from the first surface 522d. 523d formed. In this case, a surface 525d on which the containing recess 521d is formed may be used as an incident surface on which light is incident. In other words, the receiving recess 521d for housing the light source unit 530 may be formed on the incident surface. In this case, the other face 526 facing the one face 525d of the light guide plate may have a slope 526d extending upwardly. The slope effectively reflects light leaking from the rear side of the light source unit 530 to more effectively improve heat. Referring to Figures 36 and 37, each of the light guide plates 520 has a flat low surface 527' so that the lower surfaces of the plurality of light guide plates can be disposed on the same straight line. In this way, a plurality of light guide plates 52 can be easily combined to improve the combination characteristics of the backlight unit. Further, when the backlight unit is applied to the large-sized display device, the flatness of the plurality of light guide plates 52 can be easily adjusted. In addition, since the low surface 527 of each of the light guide plates 520 is flat, the cutting process and the optical polishing can be more easily performed on the light guide plate 520. The light source unit 530 may include a light source 531 for emitting light, and a plate 532 including a plurality of circuit patterns for applying a driving voltage of the light source 531. In this case, a plurality of light sources 531 may be mounted on the board 532. The light source 531 may be, for example, an LED that emits light when a voltage is applied thereto. In this case, the LED can take various forms. For example, ίΕΙ) can contain sub-LEDs that perform blue 'green' and red color. In this case, the blue, green, and red light emitted from the sub-LEDs performing the blue, green, and red colors may be mixed to perform white light. The H LED may include a blue LED and convert the portion of the blue light emitted from the blue LED into yellow. Phosphorescence. 54 94715 201023403. In this case, blue and yellow can be mixed to perform white light. In the above representative embodiment of the invention, the light source unit 530 includes an LED as a light source', but the invention is not limited thereto. For example, the light source of the light source unit 530 can be a CCFL or an EEFL. Further, the reflection member 550 may be disposed under the respective light guide plates 520. The reflection member 550 can reflect the light output to the lower portion of the light guide plate 52 so that the light is incident on the light guide plate, thereby improving the light efficiency of the backlight unit. In the above-described representative embodiment of the present invention, the reflecting member 55 is divided into φ into a plurality of sections and disposed at the lower portion of each of the light guide plates 520, but the present invention is not limited thereto. In other words, the reflection member 550 can be integrally disposed under the plurality of light guide plates 520. In this case, since the lower faces of the plurality of light guide plates 520 are disposed on the straight line, the reflection member 550 can be easily attached. The backlight unit may additionally include an optical member 560 disposed on the light guide plate 520. The optical member 560 may include, for example, a diffusion plate, a diffusion sheet, a prism sheet, and a protective sheet which are disposed on the light guide plate. The illuminance characteristics of the backlight unit in accordance with a representative embodiment of the present invention will now be described. Here, the plurality of light guide plates provided in the backlight unit include a receiving recess formed by the first and second faces and the third face extending from the receiving recess. In this case, the first and second faces are formed as a diffusion face, and the third face is formed as a reflection face. The diffuser has a reflectivity of 45% and the reflective surface has a reflectivity of 90%. Figure 39 is a photograph showing illumination of a backlight unit in accordance with a representative embodiment of the present invention. In detail, Fig. 39 shows two of the plurality of light guide plates, 55 94715 201023403 large light guide plate. As shown in Fig. 39, it was confirmed that the two light guide plates including the boundary (C) of the two light guide plates had uniform brightness. Figure 40 is a graphical representation of the illumination distribution of the distance between the two points shown in Figure 39. As shown in Fig. 40, the illumination is checked according to the distance from point A (0 mm) of one light guide plate to point B (110 mm) of the other light guide plate (i.e., illumination (i 11 um i nat i The result of on) or the intensity of illumination (i 11 um i nance) shows a uniform distribution of all illuminance from point A to point B. Further, when the first and third faces are formed as a re-reflecting surface and the second face is formed as a diffusing surface, the same result is obtained, and thus detailed description thereof will be omitted. In the backlight unit including the plurality of light guide plates, when the second surface of the housing recess for receiving the light source unit in each of the light guide plates is formed as a diffusion surface, the upper portion of each of the plurality of light guide plates is The boundary of the plurality of light guide plates obtains uniform illumination. As a result, the backlight unit according to the representative embodiment of the present invention obtains the effect of separate driving (local dimming) by partial driving, and by having a light guide plate divided into a plurality of regions and disposed at the edge of each of the light guide plates The light source unit achieves the effect of the edge type backlight unit. Further, since the housing recess for accommodating the light source unit is provided at the edge of each of the light guide plates, the backlight unit can be formed tight. Moreover, since the optical problem such as the hot spot is improved by adjusting the optical characteristics of the side of each of the light guide plates including the containing recesses, the quality of the backlight unit can be improved. 56 94715 201023403 ' A backlight unit having an LED package in accordance with a sixth embodiment of the present invention will now be described in detail with reference to FIGS. 41 and 42. Figure 41 is an exploded perspective view of a backlight unit including an LED package in accordance with a sixth representative embodiment of the present invention, and Figure 42 is a cross-sectional view of the backlight unit of Figure 42. Referring to FIGS. 41 and 42, the backlight unit includes a lower cover 610, a light guide plate 620 disposed on the lower cover 610 and having a receiving recess 621 thereon, and a light source unit disposed in the housing recess 621 of the light guide plate 620. 〇 630. A backlight unit having an LED package in accordance with a fifth representative embodiment of the present invention as described above with reference to FIGS. 36 and 37, wherein the light guide plate is divided into a plurality of segments, the backlight according to the sixth representative embodiment of the present invention The unit has a feature in which the backlight unit is formed as a single body and includes a housing recess 621 into which the light source unit 630 is inserted or fastened. In this case, the light source unit 630 includes a board 632 and an LED package 631 mounted on the board 632. With this configuration, the illuminance problem occurring in the portion of the light source unit 630 can be improved, and the assembly process of the light guide plate 620 can be simplified. The other details of the backlight unit according to the sixth representative embodiment of the present invention are not greatly different from the backlight unit elements according to the fifth representative embodiment of the present invention, and thus the backlight according to the sixth representative embodiment of the present invention will be omitted. A detailed description of the unit. 43 is an exploded perspective view of a backlight unit including an LED package according to a seventh representative embodiment of the present invention, and FIG. 44 is a cross-sectional view of the backlight 57 94715 201023403 unit of FIG. 43, and FIG. 45 is a view according to FIG. A cross-sectional view of a backlight unit of a different embodiment, Fig. 46 is a side view of the fixing member of Fig. 43, and Fig. 47 is a cross-sectional view of the fixing member according to various embodiments. Here, the backlight unit may include a plurality of light guide plates, and two light guide plates are exemplified for the sake of brevity. Referring to Figures 43 and 44, the backlight unit includes a lower cover 71, a light guide plate 720, a light source unit 730, and a fixing member mo. The lower cover 710 contains a containment space. For example, the receiving space can be formed by the bottom surface of the lower cover 710 and the side walls bent from the edges of the bottom surface. The lower cover 710 may have a fastening portion 711 (which will be described) through which the fixing member 740 is fastened. Here, the fastening portions 711 may be perforations through which the fixing members (to be described) pass, or the recessed holes 'fixing members 740 are inserted into the recessed holes. The light guide plate 720 is divided into a plurality of segments. A plurality of divided light guide plates are disposed in parallel in the housing space of the lower cover 710. Each of the light guide plates 720 includes a through hole 721 penetrating the body. The perforations 721 are disposed at the edges of the light guide plate 702. However, in the present invention, the position and number of the perforations 721 are not limited. The perforation 721 configuration corresponds to the fastening portion 711. The light guide plate 720 has a rectangular shape, but it may have various other shapes such as a triangle or a hexagon, and is not limited thereto. A plurality of light source units 730 that supply light to the light guide plate 72 are disposed on one side of each of the light guide plates 720. Each of the light source units 730 may include a light-emitting source, a source 731, and a printed circuit board (PCB) 732 having a plurality of circuit patterns for applying light source light to drive 94715 58 201023403 '. • Light source 731 can be an LED that emits light when a current is applied thereto. Here, the LEDs may have various shapes, which are substantially the same as those of the above-described representative embodiments, and thus detailed description thereof will be omitted. The light emitted from the light source unit 730 is incident on the side of the light guide plate 720, and is output to the upper portion by total internal reflection of the light guide plate 720. The fixing member 740 is for fixing the light guide plate 720 to the lower cover 71 〇 to prevent the movement of the light guide plate 720. The fixing member 740 is inserted into the 穿孔 hole 721 of the light guide plate 720 to fix the light guide plate 720 to the lower cover 710. Further, the fixing member 740 may pass through the fastening portion 711 (e.g., a through hole) of the light guide plate 720, or may be inserted into the recessed hole by the through hole 721 of the light guide plate 720. The securing member 740 includes a body portion 742 and a head portion 741 extending from the body portion 742. The main body portion 742 is fastened to the fastening portion 711 by a through hole 721 penetrating the light guide plate 720. In other words, the main body portion 742 is connected to the light guide plate 720 and the lower cover 710 to fix the light guide plate 720 to the lower cover 71. The head portion 741 has a larger width than the main body portion 742 in order to prevent the fixing member 740 from being completely released through the through hole 721 of the light guide plate 720. The head 741 can have one of various cross-sectional shapes such as a semicircle, a semi-ellipse, a square, and a triangle. Here, if the head portion 741 has a polygonal cross-sectional shape 'there is a minimum contact between the fixing member 740 and the optical member 760 (to be explained) to minimize the black spots generated by the fixing member 740 . The light guide plate 720 and the optical member 760 have a certain space (also referred to as 94715 59 201023403, that is, a gap) therebetween, so that the light output from the conductive pure 720 can be uniformly provided on the optical member 760. Here, since the head portion 741 supports the optical member, it is used to maintain a space between the light guide plate 72G and the optical member 76q (to be explained). Here, the space between the light guide plate 720 and the optical member 760 can be adjusted by adjusting the height of the head portion 741. In order to minimize the effect of the fixing member 740 on image quality, the fixing member 740 can be made of a material that allows light to be transmitted, for example, a transparent plastic. The fixing member 740 can have various shapes. Various examples of the fixed member will be described later. The reflective member 750 may be disposed under each of the light guide plates 72A. The reflective member 750 reflects the light outputted to the lower portion of the light guide plate 720 so that the light is re-introduced to the light guide plate 720, thereby improving the light efficiency of the backlight unit. The reflecting member 750 may have a through portion 751 and a fastening portion 711 corresponding to the through hole 721. The fixing member 740 can be fastened to the fastening portion 711 by means of the through hole 721 and the through portion 751. As a result, when the reflecting member 750 is divided into a plurality of sections like the light guide plate 72, they can be fixed to the lower cover 710 by the fixing member 740. The backlight unit may further include an optical member 760 disposed on the light guide plate 720. The optical member 760 may include, for example, a diffusion plate, a diffusion sheet, a prism sheet, and a protective sheet disposed on the light guide plate 720. Thus, in the present representative embodiment, since the backlight unit includes the light guide plate divided into a plurality of sections, the effect of the separate drive by the partial drive can be further improved. 60 94715 201023403 In addition, since the light guide plate divided into a plurality of sections is fixed to the lower side by using a fixing member, it is possible to prevent defects caused by the movement of the light guide plate. The manner in which the members maintain the light guide and the optics thus provides uniform light to the liquid crystal surface and because of the spatial uniformity between the fixed members, the plates. However, the LED back male _% early π can smoothly release the heat generated from the light source through the electrode structure to the evening.

❹ Figure 45 is a diagram of the backlight unit of Figure 44 in the same way as the representative of the embodiment. In addition to the support member, it has the same components as the above-mentioned month. - Μ» 仟 the same components. Thus, the same component is assigned the same 70-symbol, #肥肥-^ and the repeated description will be omitted. Referring to the drawing of the brother 45, the backlight unit of the different embodiment of the fixing member includes a lower cover 71 with a fastening portion 71 ί 71 71 , which is disposed in parallel below, and '〃 corresponds to the fastening a plurality of light guide plates ', ▲ of the through holes 721 of the portion 711 are placed on the light source unit 730 of each light guide plate 72Q, and the plurality of light guide plates 72 are fixed through the through holes 721 to be fastened to the fastening portion 711. The lower cover 71 is fixed to the fixing member 74A. In addition, the backlight unit includes an optical member disposed on the light guide plate. Here, the fixing member 740 includes a main body portion 742 for fastening the light guide plate 720 and the lower cover Ή0 to fix the light guide plate 72 and the head portion 741 extending from the main body portion 742. The head portion 741 serves to prevent the fixing member from being released, and maintains a space between the optical member 760 and the light guide plate 72A. The space between the light guide plate 720 and the optical member 76A can be adjusted in accordance with a variable such as a led mode or a characteristic of a portion of the backlight unit 94715 61 201023403. & In this case, the length of the main body of the fixing member 74A inserted into the through hole 721 can be adjusted to selectively adjust the height of the head portion 741 in accordance with the upper surface of the light guide plate 720. In this case, if there is a certain pitch between the light guide plate 720 and the head portion, the fixing member 740 can be moved downward without being fixed to the through hole 721, and the height of the head portion 741 is changed. Thus, the support member 7 is redundantly disposed between the light guide plate 720 and the fixing member 740 to prevent the movement of the fixed structure 740. Here, the branch member 770 can be, for example, a magazine. Depending on the force applied to it, the volume of the spring can be reduced, so that the fastening length of the jaw member 740 is only reduced by the spring sacrificial movement. U 疋 member 740 In addition, the support member 770 can distribute the pressure of the head of the fixed structure 741 杻 疋 740 740 740 740 to the light guide plate 72 〇, which is fixed by the 740 It is fastened and damaged to the light guide plate 720. Ming: m, the branch member 770 is a spring, but the pad), 1 and 77G may be elastic art (elastic) can control its volume according to the fastening force. As such, according to the representative embodiment Support: The unit can selectively control the head of the fixed member: the back of the 70 is a solid member so as to evenly maintain the crucible and the solid chamber. "Essence of the gap between the members" by the support member 770 In this manner, the damage to the light guide plate 94715 62 201023403 720 is minimized, and the fixing member 740 can be fastened to the light guide plate. Various types of fixing members are exemplified as follows. Fig. 46 is a view of the present invention. A cross-sectional view of a fixing member of a first embodiment. Referring to Figure 46, a fixing member 740a according to a first embodiment of the present invention includes a head portion 741a, a body portion 742a, and a terminating portion 743a. One end portion of the body portion 742a Two or more portions are branched so that the diameter of the end portion 主体 of the main body portion 742a can be reduced when the fixing member 740a is inserted, and thus the fixing member 740a can be easily inserted into the light guide plate 720 Further, the terminating portion 743a is provided at the end portion of the main portion of the branch to prevent the fixing member 740a from being released. Fig. 47 is a cross-sectional view showing the fixing member according to the second representative embodiment of the present invention. The fixing member 740b according to the second representative embodiment of the present invention comprises a head portion 741b and a body portion 742b. The body portion 741b includes a thread 743b on an outer surface thereof in such a manner as to be rotatable according to the rotating body portion 742b of the fixing member 740b. The light guide plate 720 is slidably fastened to the fastening portion. Various methods for fixing the plurality of light guide plates to the lower cover will now be described with reference to Figs. 48 to 53. Fig. 48a is a view showing the first according to the present invention. Illustrative embodiment shows a plan view of a lower light guide plate in a lower cover, and FIG. 48b is a plan view showing a fixed light guide plate in a lower cover according to a first representative embodiment of the present invention. As illustrated, the light guide plate 720 includes a central portion. The through hole 721 is used to pass through the main body. The through hole 721 may be provided corresponding to the fastening portion "丨" formed on the lower cover n〇94715 63 201023403. The fixing member 740 of the light plate 720 may be a screw 745 and a nut 746, but the present invention is not limited thereto. Fig. 49a is a cross-sectional view showing the fixing of the light guide plate to the lower cover according to the second representative embodiment of the present invention, Fig. 49b To show a plan view of the lower cover of the light guide plate in accordance with the second representative embodiment of the present invention, and Fig. 49c is a plan view showing a different embodiment of Fig. 49b. As illustrated, the 'fixing member 740 is disposed between the light guide plates 720. To fix the two light guide plates. In this case, the fixing member 740 is positioned between the LED packages 731 of the light source unit 730 so as not to affect the output light. In order to press and fix the light guide plate 720 in an extended manner, the plate unit 747 having a large area is preferably disposed between the head portion mi and the light guide plate 72A. The plate early 747 may have a dish shape having a diameter larger than the head portion 741, or as shown in Fig. 49c, the plate unit may have a rectangle whose size corresponds to the length of the light guide plate (10), the guide wire 720 is disposed along the set light source The unit 730 covers the length direction of the side of the gap between the light guide plates 720. Fig. 50a is a cross-sectional view showing the fixing guide plate in the lower cover according to the third representative embodiment of the present invention, and Fig. 4 is a plan view showing the fixed light guide plate in the lower cover of the third embodiment. t As illustrated in Figures 5 (4) and (8), the fixing member 740 includes a head portion 74 and a body portion 742. The head 741 has such a shape as 1 = each of the head unit 747. In other words, the gap between the light guides is not covered in the f C picture. ^卩(4) has a square cover. The hook member can pass through the body portion 742 and can be formed as a hook member 94715 64 201023403. The fastening portion 711 of the lower cover 710 is fixedly hooked. Figure 51(a) is a cross-sectional view showing the fixing guide plate in the lower cover according to the fourth representative embodiment of the present invention, and Figure 51 (partial perspective view of the light guide plate of Fig. 1) showing the 51st. (4) The protruding portion 722 is formed on some of the side edges of the light guide plate 72 provided with the light source unit 73, and each of the protruding portions 722 includes a through hole 721 through which the fixing member 740 is fixed. As a result, the LED seal (four) 731 of the light source unit 730 can be disposed between the projections 722 such that the gap between the light guide plates 72 is not increased by the projections 722. It is exemplified that the fixing member 740 includes a screw and a nut that passes through the fastening portion 711 of the lower cover 710 to be screwed, but the present invention is not limited thereto, and the fixing member 74 as illustrated in Fig. 44 may be used. Hey. Fig. 52(a) is a cross-sectional view showing the light guide plate fixed to the lower cover according to the fifth representative embodiment of the present invention, and Fig. 52b is a partial perspective view showing the light guide plate of Fig. 52(a). The housing portions 724 are formed in certain intervals such that they are depressed at opposite sides of the side of the light source unit 730 disposed in the light guide plate 720. As a result, the portion forming the containing portion 724 is formed in a stepped configuration having the upper surface of the light guide plate 72A. The housing portions 724 may be formed at positions on both sides of the light guide plate 720 such that they correspond to each other. The LED package 731 is disposed at a surface where the containing portion 724 is not formed, that is, between the housing portions. In this case, the head portion 741 of the fixing member 740 disposed between the light guide plates 720 is grasped by the step surface of the housing portion 724, and the body core 7=2 of the fixing member 740 is fixed in a penetrating manner. The fastening portion 711 of the lower cover (4) thus fixes the light guide plate; in this manner, the 'fixed phosphor member protrudes from the upper surface of the light guide plate 720 and the position is lower than the light guide plate, and does not m', thereby advantageously reducing the backlight The size of the unit. As shown in the 53rd, one of the lower floes / ... city sergeant - 蛊 710 is bent so that the two sides of the light guide plate 720 are in contact with the lower side 〇 71 〇 &gt; 7 , , ^ _ and the end of the side wall according to the guide The side of the light plate 720 (in other words, 'set the light full. 720 席 mat early 70 730 side) and face the light guide plate in this case, can hunch the edge of the two sides of the light guide plate by the side wall of the 卞 盍 盍 盍 71〇 Therefore, the fixing member for fixing the edge portion of the light guide plate can be reduced by the μ m α b. The eighth representative embodiment according to the present invention will now be described with reference to the 54th and μ % nn &amp; l 3b diagrams. A backlight unit having an LED package. Fig. 54 is a view showing a backlight unit according to different representative embodiments of the present statement. First, as shown in Fig. 54 (4), according to the present invention.

The backlight unit of the embodiment is a surface light source device having a plate type light guide plate. In other words, the backlight unit is a string type surface light containing n LED coins and n plate-type light guide plates. Regarding the LED light source, a plurality of LED packages are arranged in a column on the board (8), and thus the configuration &lt;n LED light sources are arranged in a parallel manner. The plate type light guide plates 82Ga and 82Gb are disposed and mounted on one side of the (10) light source. 0 66 94715 201023403 The surface light source device having the plate type light guide plate is disposed under the LED package and the plate type light guide plate 820 and the reflection output is from ! A light reflecting member of the light source (not shown). For example, an optical member for diffusing the light output toward the liquid crystal panel after being reflected by the reflective member and refracting from the plate-shaped light guide plate, or a prism member for collecting light having entered the front view through the diffusion sheet is disposed on the plate Above the light guide plate. In detail, the LED light source includes a plurality of packages, and upper LEDs are respectively mounted in the plurality of LED packages. The plate type light guide plate is disposed in a direction in which light is emitted from the LED light source and is made of a transparent material to pass light. The plate type light guide plate has a simple structure compared to the edge type light guide plate, is easy to mass-produce, and is easily adjusted on the upper portion of the LED light source. The plate-type light guide plates 820a and 820b include: a light input portion into which light emitted from the LED light source lx is incident; and an output surface, light that has been incident from the LED light source is output to the output surface as illumination light to the liquid crystal panel And _ and the front end portion are located on opposite sides of the light input portion and have a thickness smaller than the thickness of the light input portion. The plate type light guide plates 820a and 820b are disposed such that the end portions of the plate t light guide plate 820 cover the upper portion of the LED package 830. That is, the '(n+1)th LED light source is positioned below the front end of the nth plate type light guide plate. The front end of the plate type light guide plate has a prism shape on its lower surface. As shown in Fig. 54(b), the light from the LED package 830 is not directly taken out to the light guide plate 820, but is diffused and distributed by the prism shape provided on the lower surface of the front end portion of the plate type light guide plate. In this way, it is possible to remove the hot spot generated at the light guide plate of the LED light source 94715 67 201023403. Fig. 55 is a schematic perspective view for explaining the plate type light guide plate of Fig. 54. As shown in Fig. 55, the 'plate type light guide plate includes: a light input portion 821, and light from an LED light source including a plurality of LED packages is incident on the light input portion 821; the light output surface 824 has been incident on the light input portion 821 The light is output from the light output surface 824 to the liquid crystal panel as illumination light; and the front end portion 822' is located on the opposite side of the light input portion 821, and has a section whose thickness is smaller than the thickness of the light incident portion of the light input portion 821. The front end portion 822 has a prism shape 823 for distributing light from a portion of the LED package disposed at the lower portion thereof. The prism shape 823 may be one of a triangular prism, a conical prism, and a hemispherical prism capable of distributing and diffusing incident light. The prism shape 823 of the front end portion 822 can be formed along the entire front end portion. Alternatively, the prism shape 823 may be formed only partially on the upper portion of the LED package. Through this prism shape, the hot spot generated in the light guide plate above the LED package can be removed. Thus, in accordance with a representative embodiment of the present invention, a prism shape formed on a lower surface of the front end portion of the light guide plate is formed, and a diffusion sheet or a prism sheet between the LED package and the light guide plate to be removed is removed for distribution due to Part of the light from the led package results from a hot spot on the light guide plate on the LED package. ..., a backlight unit having an LED package and an LCD according to a ninth representative embodiment of the present invention will now be described with reference to Figs. 56 to 60.

Figure 56 shows a backlight unit comprising an LED 68 94715 201023403 'package and liquid crystal display (LCD) in accordance with a ninth representative embodiment of the present invention. Referring to Fig. 56, the LCD includes a liquid crystal panel 900 for displaying an image and a backlight unit 700. Although not shown, the liquid crystal panel 900 includes first and second substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. The first substrate includes a plurality of pixels arranged in a matrix shape. Each of the pixels includes a thin film transistor (TFT) and a pixel electrode electrically connected to the TFT. The first substrate additionally includes a plurality of wires, such as gate wires and data wires, for applying electrical signals to the respective pixels. The second substrate includes a color Q filter layer and a common electrode disposed on the color filter layer. The common electrode forms a liquid crystal driving voltage for driving the liquid crystal of the liquid crystal layer together with the pixel electrode. The liquid crystal panel displays an image by controlling the transparency of the light passing through the liquid crystal in accordance with the liquid crystal driving voltage. In the representative embodiment, the liquid crystal panel has been described as a TN type liquid crystal panel, but the present invention is not limited thereto, and any other type of liquid crystal panel such as an IPS type or VA type liquid crystal panel may be used. The backlight unit 970 includes a light source unit 950 and a light guide plate 940. The light source unit 950 includes a light source 952 that emits light and a plate 954 that includes a plurality of circuit patterns for applying a voltage to the light source 952. The light guide plate 940 may be disposed under the liquid crystal panel 900, and the light source unit 950 may be disposed on each side of the light guide plate 940. In other words, the light source unit 950 is disposed on the side of the liquid crystal panel 900. As a result, the backlight unit 970 can be made thinner. The light guide plate 940 includes an incident surface facing the light source unit 950, a light focusing pattern (ie, a collection pattern) that is bent from the incident surface and faces the output surface of the liquid crystal panel 900 and disposed on the output surface of the output 69 94715 201023403. And facing the output face. The light guide plate 940 can improve the effect, in other words, the effect of contrast value, sexual similarity, and the like is improved by the light focusing pattern in accordance with the local dimming driving method. Further, the backlight unit 970 may additionally include an optical member 910 disposed on the light guide plate 940. The optical member 910 may include, for example, a diffusion sheet 911, a prism sheet 912, and a protective sheet 913 which are disposed on the light guide plate 940. Although not shown, the backlight unit 970 may additionally include a lower cover for housing the light source unit 950, the light guide plate 940, or the like. Here, the backlight unit 970 and the liquid crystal panel 900 may be fixed by a lower cover and an upper cover (not shown) fastened to the lower cover. Fig. 57 is a plan view of the backlight unit of Fig. 56, and Fig. 58 is a cross-sectional view taken along line Ι-Γ of Fig. 57. Referring to FIGS. 57 and 58, the backlight unit 970 includes a light source unit 950 and a light guide plate 940. The light source unit 950 may include first to fourth light source units 950a' 950b, 950c, and 950d disposed on four sides of the light guide plate 940. However, the number of light source units is not limited to those represented by the representative embodiment. The light source 952 may include an LED, a semiconductor device that emits light when a current is applied thereto, and a detailed description thereof will be omitted. However, in the present representative embodiment, the light source is not limited to the LED. In other words, a lamp such as a CCFL can be used as the light source. Plate 954 allows a plurality of light sources 952 to be mounted thereon and includes circuit wiring for providing light source drive 70 94715 201023403, voltage to source 952, which is forwarded from a light source drive unit (not shown). In this case, the circuit wiring can be electrically coupled to a plurality of light sources 952 in a split or group mode such that a plurality of light sources 952 can be driven in a separate or group manner. For example, the second light source unit 950a may include the first to seventh channels chi to ch7 separated by the electrical circuit. Each of the channels may include one or two or more light sources, and the light sources are electrically connected to each other. Similarly, the second light source unit 95〇b includes the eighth to eleventh channels ch8 to ch11, and the third light source unit 95〇c may include the twelfth to eighteenth channels chl2 to chl8, and the fourth light source The unit 950d may include the nineteenth to twenty-second channels 叻19 to ch22. However, in the present representative embodiment, the number of channels of each light source is not limited. Here, if the first area of the liquid crystal panel will display a brighter image, the illumination of the light source disposed in the channel corresponding to the first area is adjusted to provide light having a higher illumination. If the second area of the liquid crystal panel will display a darker image, the illumination of the light source disposed in the channel corresponding to the second area can be adjusted to provide light having a lower illumination. In this manner, when the light source unit 950 includes a plurality of channels that can be driven by the individual force, it can provide light having a range of selectively adjusting the illuminance value to the optical member 910. The light guide plate 940 includes a first light focusing pattern 941 disposed on the wheel exit surface and concentrated in the first direction, and a second light focusing pattern 942 for collecting light in the second direction intersecting the first direction. The first and third light source units 950a and 950c can be disposed in a facing manner at both ends of the first light focusing pattern 941. Moreover, the second and fourth light source units 950b and 950d can be disposed in a facing manner at the two ends of the second light focusing pattern 94715 71 201023403 942. The first and second light focusing patterns 941 and 942 may have some pattern that protrudes from the body 944 of the light guide plate 940. For example, the first and second light focusing patterns 941 and 942 may have a prism pattern shape. In other words, the first light focusing pattern 941 can be set to have a first directivity to traverse the upper surface of the light guide plate 940. The second light focusing pattern 942 may be provided with a second directivity to traverse the upper surface of the light guide plate 940. Here, the first and second optical t-coordinate patterns 941 and 942· may have a hemispherical or triangular cross-sectional shape to receive the light. Further, the light guide plate 940 additionally includes a diffusion portion 943 for diffusing the first and second light focusing patterns 941. And 942 output beam. The diffusing portion 943 may be disposed on the left and right sides of the first light focusing pattern 941, and the second light focusing pattern 942 may be disposed on the upper side and the lower side of the second light focusing pattern 942. In other words, the diffusion portion 943 can be configured in a lattice shape. The diffusing portion 943 may be formed as a recess surrounded by the first and second light focusing patterns &quot;I and 942. The diffusing portion 943 diffuses the light focused by the first and second light focusing patterns 941 and 942. In other words, the light having the illuminance value adjusted by the diffusing portion 9 can be uniformly supplied to the liquid crystal panel 9 〇〇 : the selected area, and therefore, the liquid crystal panel 900 can display the image more smoothly. The light path formed by the first and second light focusing patterns 941 and 942 will now be explained. A light source 952 disposed at the two ends of the first light focusing pattern 941 (for example, the light source 952 disposed at the first channel Chi) is turned on. Then, the first light L1 formed in the first channel Chi is directly output 94715 72 201023403 in the first direction by the first light focusing pattern 941. At this time, the first light is diffused by the diffusion portion 943 disposed on the left and right sides of the first light focusing pattern 941. At the same time, the light source disposed on the two sides of the second light focusing pattern 942 (for example, the light source disposed at the ninth channel Ch9) is turned on. Then, the second light L2 formed on the ninth channel Ch9 is in the second direction by the second light focusing pattern straight wheel. At this time, the second light L2 is dispersed by the diffusing portion 943 disposed above and below the second light focusing pattern 942. When the light sources of the first channel Chi and the ninth channel Ch9 are simultaneously turned on, 0 repeats the first sum. The second source is focused on the intersecting first and second light patterns to output light having a brighter illumination than other regions. In the above description of the representative embodiment of the present invention, only the light sources of the first to fourth light source units are driven, but the present invention is not limited thereto, and the corresponding light source unit can be driven together in accordance with the required amount of light. For example, when the light source disposed in the ninth channel is turned on, the light source corresponding to the ninth channel disposed on the twenty-first channel Ch21 can also be turned on at the same time. In the same case, when the light source disposed in the first channel is turned on, the light source corresponding to the first channel 设置 disposed on the eighteenth channel Ch1 can also be turned on at the same time. In this way, light with better illumination can lift silver in the selected area of the bottom plate. In other words, the brightness of the image can be adjusted by selecting the channel position and controlling the on/off (0N/0FF) operation of the light source of the channel. As a result, since the backlight unit has the first and second light focusing patterns, it is possible to focus the light having the adjusted illuminance value to the selected area instead of being distributed to the entire area of the liquid crystal panel, thereby improving the separation driving, the effect: Contrast value. 94715 73 201023403 Fig. 59 is a screen image displayed when the related art LCD is driven, and Fig. 60 is a screen image displayed when the LCD according to the representative embodiment of the present invention is driven. As shown in Figures 59 and 60, it should be noted that the contrast and image quality characteristics of the LCD comprising the first and second light focusing patterns in accordance with an exemplary embodiment of the present invention are superior to those skilled in the art. Thus, since the backlight unit has the first and second light focusing patterns to provide light having the selectively adjusted illuminance value, although the edge type backlight unit uses the local dimming driving design, it is capable of sufficiently obtaining the local dimming effect. Therefore, the backlight unit according to the representative embodiment of the present invention has an advantage in that it has a local dimming effect, in other words, improved contrast value and low power consumption, and it is formed thinner, resulting in good image quality characteristics of manufacturing. Thinner LCD. A backlight unit having an LED package in accordance with a tenth representative embodiment of the present invention will now be described with reference to Fig. 61. Figure 61 is an exploded cross-sectional view showing a backlight unit including an LED package in accordance with a representative embodiment of the present invention, and Figure 62 is an upper view of the array of the light guide plate and the LED package of Figure 61, and Figure 63 is a view Figure 62 is a top plan view of an array of light guide plates and LED packages representing a modification of the embodiment. Referring to FIG. 61, a backlight unit according to a tenth representative embodiment of the present invention includes an array of a plurality of LED packages that emit light toward a liquid crystal panel 1050 disposed at an upper portion thereof, a light guide plate 1020, a lower cover 1010, an optical member 1060, and Controllers Cl, C2. The controller includes LED block drive control 74 94715 201023403 C1 and panel image signal transfer unit C2. This will be described later in detail with reference to Figure 65'. The lower cover 1010 is generally made of metal for the purpose of diffusing heat, and is provided with other elements such as a board having an LED package mounted thereon and a backlight unit such as a light guide plate 1020 or the like. The light guide plate 1020 is made of a transparent material, allows light emitted from the LED package array 1030 to pass therethrough, and generally has a regular hexagonal structure, but the structure of the light guide plate 1 20 is not limited thereto. The light guide plate 1 〇 2 〇 causes the light emitted from the side direction thereof to be evenly dispersed to maintain the illuminance and color uniformity on the liquid crystal panel 1〇5〇, and allows the incident light to pass uniformly straight. The optical member 1060 is disposed on the upper portion of the light guide plate 1020 by selectively illuminating a diffusion sheet for diffusing light output to the liquid crystal panel 1〇5〇 in various directions or for collecting and outputting to the liquid crystal panel. One of the prism sheets of the light of the viewing angle improves the illumination. The optical member 1 〇6〇 is not a necessary component. © Although not shown, the reflecting member may be additionally disposed between the light guide plate 1020 and the lower cover 1010 when needed. In the present representative embodiment, the LED package array 1030 in which the light guide plate α〇20 and the LED package array 1030, including the plurality of LED blocks Bh and Bv are disposed, is disposed on each of the four sides of the light guide plate 1020. In this case, the light emitted from the array of vertical LED packages in the four LED package arrays 1 to 30 disposed on the side of the light guide plate 1020 may be overlapped with each other after being input to the light guide plate 1A. Further, in the present embodiment, the 'LED package array 1' 30 in the table embodiment is divided into ED blocks Bh and Bv, so the illumination of 75 94715 201023403 is controlled by the block. It should be understood that the area of the light guide plate is vertically divided according to the divided blocks, which are indicated by broken lines. In detail, the LED blocks Bh and Bv include one or more LED packages 1031, and the brightness of each block included in the LED package array can be adjusted by different current injection signals. In the present embodiment, 'the LED block Bh disposed in the horizontal direction according to the side of the light guide plate 1〇2〇 includes three LED packages 1〇31, and the LED block Bv disposed in the vertical direction. The two LED packages 1 〇 31 are included, but the present invention is not limited to this case, and the number of LED packages included in each block can be appropriately selected when necessary. The LED package 1〇31 included in the LED block Bh preferably emits white light to use a dimming unit such as an LCD TV or the like, so that white light can be used to emit white light by itself by incorporating a fluorescent material. . In this manner, the light beams emitted from the horizontal block Bh and the vertical (10) block Bv overlap each other, and in this case, the light guide plate_beam can be uniformly pointed in the straight direction. Thus, since the light beams emitted from the horizontal led block Bh and the vertical LED block ... overlap each other, the edge type backlight unit of the table embodiment performs local dimming. ...generation This will now be done with reference to Figure 64. The 64th shows the principle of performing local dimming of the backlight unit in accordance with the present invention. First, Fig. 64a shows the case of two LED package arrays disposed on the side of the light guide plate in the horizontal and vertical directions, respectively, and in this case, one LED package array has two LED blocks. It is assumed that each LED block operates in a state in which each (10) block does not substantially emit light of 94715 76 201023403 (o), and a state in which each of the LED blocks emits light (〇), regardless of inclusion in each led region. The number of LED packages in the block. The light guide plate b can be cut into four areas and the illumination of each block can be adjusted, as shown in Fig. 64a. In other words, by emitting only one of the two horizontal LED blocks and only one of the two vertical LED blocks, it can be 1/2, 0, 1 (1/2 + 1/2), and 1/2 Indicates the phase contrast value of the four divided areas of the light guide plate. A detailed example will now be described with reference to Figure 64b. ❹ Figure 64b shows the case where four LED package arrays are arranged on the side of the light guide plate 'one in the horizontal direction and two in the vertical direction, in which the array of two LED packages arranged in each direction is arranged and interposed The light guide plates in between face each other. In this case, an array of LED packages contains three LED blocks. Unlike the case of Fig. 64a, each LED block is capable of operating in three modes, substantially not emitting a state of state (0), a state of emission (1), and a state of intermittent emission (1/2). Thus, when the emission states of the four LED package arrays are as shown in Fig. 5b, the light guide plate is divided into nine separate drive regions, and the relative luminance values of the respective regions correspond to 1/2 ( 1/3+1/6), 1/3 (1/6+1/6), 2/3 (1/6+1/6+1/3), 2/3 (1/3+1/3) ), 1/2 (1/3+1/6), 5/6 (1/3+1/6+1/3), 2/3 (1/3+1/6), 1/3 (1) /6+1/6), and 2/3 (1/3+1/6+1/6). In this manner, the backlight unit according to the present exemplary embodiment can individually adjust the illuminance of each of the LED blocks included in the LED package array disposed on the side of the light guide plate, thus enabling local dimming. In particular, the number of split drives 77 94715 201023403 may depend on the number of LED blocks, and the illumination level can be varied in a varying manner depending on the number of conditions in the transmit state and the number of LED package arrays (two or four). In this case, when the number of cases of the emission state and the number of LED package arrays are increased, the local dimming can be finely adjusted. Thus, unlike the configuration shown in Fig. 62, such a configuration whereby only two LED package arrays 1030 may be positioned on the sides of the light guide plate 和2〇 and vertically. Regarding the driving area for local dimming, local dimming is possible even if the number of driving areas is different (for example, a rectangular shape), and the number of driving areas is the same as the horizontal axis and the vertical axis. Further, although it may vary depending on the embodiment, when the liquid crystal panel is 40 inches in size, it can be divided into 64 (8x8) drive regions to be driven. When the liquid crystal panel is 40 pairs of sizes, it is preferably driven to be divided into 80 (10x8) regions to be driven, and when the liquid crystal panel is 52 inches, it is preferably divided into 96 (12x8) regions. driven. As discussed above, the backlight unit according to the present exemplary embodiment is characterized in that the illuminance value is adjusted by the LED block, and the adjusted illuminance value can be performed by adjusting the magnitude of the current signal injected into the LED block. This will now be described in detail with reference to Figure 65. Fig. 65 is a view showing a controller for controlling the illuminance of each LED block of the backlight unit in accordance with a representative embodiment of the present invention in Fig. 61. First, the panel image signal transfer unit (C2 in Fig. 3) includes face 78 94715 201023403 board information transfer circuits 1080 and 1081 and panel information combination circuit 1082. The panel information transfer circuits 1〇8〇 and 1081 receive image signals from the divided driving regions of the liquid crystal panel 1050. In this case, the panel image signal conversion unit includes a vertical axis controller 1〇8〇 and a horizontal axis controller 1081, and the received image signal is driven by the electrical signal applied to the liquid crystal panel and the R, G, and β color driving signals. Corresponds to the aperture ratio of the panel (the tilt of the liquid crystal changes). The image signal is integrated in the matrix form of the panel information group combining circuit 1082 of the horizontal axis and the vertical axis. The output power of each LED block Bh and Βν is determined by the panel information combining circuit 1〇82, and is controlled by the LED block driving. The device (not shown, C1 in Figure 3) is indicated by the arrow in Figure 65. In this case, detailed circuit configurations such as an LED block drive controller for the panel image signal transfer unit and the fabric controller, and a known circuit configuration for connecting the liquid crystal panel and the led can be used. In Fig. 65, the respective four horizontal and vertical drive regions, in other words, represent 16 LED blocks Bh and Βν for short purposes, and a relative number of transfer circuit units in order to control the entire drive region. And combined circuit units. Fig. 66 is a top view of a light guide plate of a different representative embodiment of the present invention which can be used in the nth figure, and Fig. 67 shows an embodiment in which the light guide plate of Fig. 66 can be used. The light guide plate 1〇2〇 according to the present representative embodiment as shown in Fig. 66 has four optically recognizable regions. Unlike the light guide plate which is actually divided into the drive regions in the representative of Fig. 61, the light guide plate 94715 79 201023403 1020' is divided into physically (optically) recognized regions. The light guide plate 1020' includes four regions which are disposed in the horizontal and vertical directions by the separation structure (D) which performs light control (for example, blocking light). Therefore, the light guide plates 1 〇 2 分割 divided by the separation structure (D) can be driven in a separated manner without interfering with each other, and this can be combined with each of the LED blocks as described above in the representative embodiment. Control the combination to effectively perform local dimming.

In the present representative embodiment, the separation structure is a reflection structure made of a material having a high light reflectivity or may be an irregular (depression) portion formed by forming a depression at a boundary point of each separation region as shown in FIG. 67 ( E). Further, a structure in which the light guide plate 1020 is itself separated is also possible. As described above, with respect to the backlight unit according to the representative embodiment of the present invention, since the direct type backlight unit of the backlight unit afterimage related art has a large thickness (in other words, in the present invention, light is transmitted by using a light guide plate) To the liquid aa panel) Therefore 9 is sufficient to implement partial driving and the backlight unit can be made thinner. In this way, according to the effect of partial driving (for example, increasing the material value according to the local dimming method), the image product can be made thinner. (IV) As suggested above, in accordance with a representative embodiment of the present invention, the LED package (10) may be formed by a side-type (four) package and a direct-type LED package by including a side electrode, a bent portion, and an upper electrode: The plate electrode or the upper electrode is a narrow LED package. , contact area, so it can be more stable 94715 80 201023403 ' In addition, because the LED package contains the contact portion, its substrate mounting structure achieves a larger mounting area to ensure a stable structure, and because of the heat release from the contact area Externally, it is therefore possible to increase heat release efficiency. As a result, the backlight unit using the string type structure can use the local dimming method, whereby the brightness can be partially changed to improve the brightness of the screen image and reduce power consumption. However, since the backlight unit can use the edge type LED package and the direct type LED package in a compatible (widely expanded) manner, the degree of freedom in designing the backlight unit can be improved. Although the present invention has been shown and described with respect to the embodiments of the present invention, it is to be understood by those skilled in the art that modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims. . BRIEF DESCRIPTION OF THE DRAWINGS The above and other aspects, features, and other advantages of the present invention will become more apparent from the aspects of the appended claims. 1 is a perspective view showing the surface of the LED package of FIG. 1; FIG. 3 is a cross-sectional view of the LED package of FIG. 1; FIG. 4a is a view showing formation A schematic cross-sectional view of a V-shaped bend structure of an LED within an LED wafer. Figure 4b is a cross-sectional photograph of a real object. Figure 4c shows a flat photo image. 81 94715 201023403 Fig. 5 (a) shows the emission spectrum; $5 (b) of the representative LED of the present invention according to the present invention has a 5(a)_&lt;', by using blue The green and red filters are divided into the spectrum obtained by the white light of the acoustic spectrum; the color dance of the LCD is displayed, the white LED component is used as the LCD backlight, and the seventh diagram shows the chromaticity diagram. The emission spectrum of the device; 4 another representative embodiment of the present invention, the white LED element, Fig. 8 (a) The sling white LED element is schematically illustrated in accordance with the representative embodiment of the present invention (Fig. 8(b). Figure 9 is a diagram of a light source for backlighting. Figure 10 is a schematic embodiment for backlighting. Figure 11 is a diagram; 'Another representative embodiment of the present invention is shown in accordance with the present invention. A side cross-sectional view of the embodiment and the foot; M 7r ^ , . , for example, a cross-sectional view of another representative optical light module according to the present invention; θ showing the color coordinate area of the red and green phosphors is displayed According to a representative embodiment of the present invention, obtained by a white light source module A CIE 1976 chromaticity diagram of a color coordinate range and a CIE 1976 chromaticity diagram of a comparative example; FIG. 13 is a schematic illustration of a white light emitting device according to another representative embodiment of the present invention and having the white light emission A cross-sectional view of a white light source of the device; 82 94715 201023403 Figure 14 is a plan view showing, in a schematic manner, a white light emitting device according to another embodiment of the present invention and a white light source having the white light emitting device; Fig. 15 is a view Fig. 3 is a schematic view showing the optical characteristics of the lead frame; Fig. 16 is an enlarged sectional view showing the design of the lead frame; and Fig. 17 is a view showing the result of the high temperature load reliability test performed on the LED package in accordance with the formed lead frame. Figure 18 shows a modification of the side electrode in a schematic manner; ❹ Figure 19 is a partial perspective view showing how to mount the edge type (side view type) LED package according to the first representative embodiment of the present invention; 19 is a front view of the LED package; FIG. 21 is a partial perspective view showing how to install a direct type (top view type) LED package; FIG. 22 is a view according to the present invention. 2 is a perspective view of the LCD package of the embodiment; ❹ FIG. 23 is a perspective view of the rear side of the LED package of FIG. 22; and FIG. 24(a) is a diagram of the third representative embodiment according to the present invention. A perspective view of the package; Fig. 24(b) is a cross-sectional view of the L-rib package according to the third representative embodiment of the present invention; and Fig. 25 is a view showing the state of the package according to the fourth representative embodiment of the present invention. Fig. 26 is an enlarged perspective view showing the LED package of Fig. 25; Fig. 27 is a plan showing the plane of the lead frame of the LED package of Fig. 26, 94715 83 201023403; Fig. 28 is the 26th drawing Fig. 29 is a plan view showing a lead frame modified by the LED package of Fig. 28; Fig. 30 is a plan view showing the modification of the lead frame in Fig. 28; Fig. 31a is for explaining A perspective view of a backlight unit in accordance with a first representative embodiment of the present invention; FIG. 31b is an enlarged cross-sectional view showing a mounted state of an LED element in a schematic manner; and FIG. 32 is a view showing an LED package in accordance with a second representative embodiment of the present invention. Exploded perspective view of the LED backlight unit Figure 33 is a cross-sectional view of the LED backlight unit of Figure 32; Figure 34 is a cross-sectional view of the backlight unit in accordance with a third representative embodiment of the present invention; and Figure 35 is a view showing a fourth representative embodiment in accordance with the present invention A perspective view of a fixing member provided in a backlight unit; Fig. 36 is an exploded perspective view of a backlight unit including an LED package in accordance with a fifth representative embodiment of the present invention; and Fig. 37 is a sectional view of the backlight unit of Fig. 36 38a to 38d are cross-sectional views showing various types of light guide plates provided in a backlight unit in accordance with a representative embodiment of the present invention; and Fig. 39 is a photograph showing illumination of a backlight unit in accordance with a representative embodiment of the present invention; The figure shows the illumination of the distance between the two points shown in Fig. 39. 84 94715 201023403. The figure is an exploded perspective view of the first package including the LED package according to the sixth representative embodiment of the present invention; 42 is a picture of Fig. 42 of the apricot Yangyi, Fig. 43 is a second, early paste map; ^,, the seventh representative embodiment of the present invention comprises an exploded perspective view of the LED package of the LED package; Backlighting for Figure 43 A cross-sectional view of a unit according to a different embodiment of Fig. 44, and Fig. 46 is a cross-sectional view of Fig. 47, which is fixed according to Fig. 44; Fig. 48, Fig. U) A cross-sectional view of a fixing member of the example; a cross section of the light guide plate at the lower cover = fixed according to the first representative embodiment of the present invention

The light guide of the present invention - the representative embodiment is fixed. Fig. 49a is a view showing the scraping of the B light plate on the lower cover, and the second representative embodiment of the present invention; the first figure is the visible light plate under the cover The second representative embodiment of the present invention, the fixed guide, Fig. 49c is a plan view of Fig. 50 (4) showing a different embodiment of the 49β map; the guide is in the lower cover, = according to the third representative of the present invention The embodiment is fixed in Fig. 50(b) to show that the V-light plate is in the lower cover &lt;Fig., and the third representative embodiment of the present invention is fixed 94715 85 201023403. Figure 51 (a) is the county g

This gentleman's goods ', *, is shown in the fourth representative embodiment in accordance with the present invention. The guide plate is fixed on the lower side, Fig. 51 (b) is the batch _ ' μ Γ. a partial perspective view of the light guide plate of the door 颂 751a; Fig. 52 (a) is a cross-sectional view of the lower cover of the light guide plate not fixed according to the fifth representative embodiment of the present invention; Fig. 52 (b) Ags _ 4 shows a partial perspective view of the light guide plate of Fig. 52a; Fig. 53 shows a schematic view, the light guide plate is fixed to the lower cover; FIG. 54 is a sectional view of the backlight unit according to different representative embodiments of the present invention. Figure 55 is a schematic perspective view for explaining the plate-type light guide plate of Figure 54;

Figure 56 is a view showing a backlight unit including an LED liquid crystal display (10) according to a ninth representative embodiment of the present invention; Fig. 57 is a plan view of the backlight unit of Fig. 56, and Fig. 58 is a line I along the line 57- Ι, the cross-sectional view; Fig. 59 is a screen image displayed when driving the related art LCD; $60 is a screen image displayed when driving the LCD according to the representative embodiment of the present invention; λ -| A cross-sectional view of a light unit including a LED package in accordance with a representative embodiment of the present invention; and a front view of an array of the light guide plate and the LED package of FIG. 61; A top view of an array of modified light guide plates; 86 94715 201023403. Fig. 64 shows the principle of performing local dimming in a backlight unit in accordance with a representative embodiment of the present invention; Fig. 65 is a view showing the according to Fig. 6 BRIEF DESCRIPTION OF THE DRAWINGS A schematic diagram of a controller for controlling the illumination of each LED block of a backlight unit; FIG. 66 is a top view of a light guide plate of a different representative embodiment of the present invention which can be used in FIG. 61; Figure 67 An embodiment in which the light guide plate of Fig. 66 can be used is shown. [Main component symbol description]

◎ . 10, 40, 50, 60, 70, 130, 231, 631, 830, 1〇31 LED package 10' White LED package 11 LED chip 12 Red phosphor (red phosphor film) 14 Green phosphor ( Green phosphor film) 20, 51, 62, 72 lead frame 21, 52, 62a, 72a first lead portion 21a, 24a, 52a, 53a, 55a flat surface 21b, 55b side wall surface 21c, 55xu bottom surface 22, 54 terminal Portions 22a, 54a upper end electrodes '22b, 54b curved portions 22c, 54c side electrodes 24, 53, 62b, 72b second lead portions 30, 944 main 25, 56 recesses longer side. 30b 30a shorter direction side 31 opening 94715 87 201023403 32 Resin encapsulant (sealing member) 45, 55 contact portion 45a face 45b end portion 62c third lead portion 100, 200, 500, 970 backlight unit 110, 210, 510, 610, 710, 1〇1〇 Lower cover 120, 220, 520, 620, 720, 940, 1020, 1020, light guide plate 122 phosphor 150, 250, 550, 750 reflective member 160, 260, 560, 760, 910, 1060 optical member 170 guiding unit 180 Liquid crystal panel 220a, 520a first light guide plate 220b, 520b second light guide 22b 522, 522a, 522b, 522c, 522d first face 222, 523, 523a, 523c, 523d second face 223, 524, 524c, 524d third face 224 fourth face 230, 530, 630, 730, 950 light source Units 232, 532, 632, 954, B plates 240, 340, 740, 740a, 740b fixing members 241, 341 insertion portions 241a, 341a first slopes 241b, 341b second slopes 242, 342, 74 741a, 741b head 343 reflective film 470 fixing frame 520c third light guiding plate 520d fourth light guiding plate 52 521a, 521b, 521c, 521d receiving concave portion 88 94715 201023403

525 One face 526 Another face 527, 527b Low face 528, 528b South face 531, 952 Light source 600 White light source module 621 accommodating recess 711 Fastening portion 721 Perforation 722 Projection portion 724 accommodating portion 731 Light source (LED package 732 Printed Circuit Board (PCB) 742, 742a, 742b Main Body Section 743a Terminating Section 743b Thread 745 Screw 746 and Nut 747 Plate Unit 751 Through Section 770 Support Member 820, 820a, &gt; 820b Plate Type Light Guide 821 Light Input Portion 822 Front end portion 823 Prism shape 824 Light output surface 900 Liquid crystal panel (white light source module) 911 Diffusion sheet 912 Prism sheet 913 Protective sheet 941 First light focusing pattern 942 Second light focusing pattern 943 Diffusion portions 950a, 950t |, 950c 950d first to fourth light source unit 1030 LED package array 1050 liquid crystal panel 1080 panel information transfer circuit (vertical axis controller) 1081 panel information transfer circuit (horizontal axis controller) 89 94715 201023403 1082 panel information combination circuit Bh, Bv LED block

Cl controller (LED block drive controller) C 2 controller (panel image signal conversion unit) chi to ch7 first to seventh channels ch8 to chll eighth to third channel - channel chl2 to chl8 twelfth to tenth Eight channels chl9 to ch22 Nineteenth to twenty-second channels D Separation structure E Irregular (recessed) portion F Center L1 First light L2 Second light 51 LED package 52 with recessed lead frame Has a flat lead frame LED package 90 94715

Claims (1)

201023403 VII. Patent application scope: 1. A light-emitting diode (LED) package comprising: a body mounted on a substrate; a light-emitting diode mounted in the body and emitting light; and an exposed lead frame, such that The body can be selectively mounted from the top or side. 2. The LED package of claim 1, wherein the lead frame comprises: _ a top electrode electrically connected to the substrate such that the LED can face the front surface of the substrate; and the top electrode is integrally formed with a curved portion bent from the top electrode toward the different sides; and an end portion formed at the bent portion and electrically connected to the substrate such that the LED can be vertically mounted to the side electrode of the substrate. 3. The LED package of claim 2, wherein the side electrode is mounted on one side of the body. 4. The LED package of claim 3, wherein the top electrode is formed in a narrow manner on a lower surface of the body. 5. The LED package of claim 2, wherein the top electrode is mounted to one side of the body. 6. The LED package of claim 5, wherein the side electrode is formed on the other side of the body in a narrow manner. 7. A light emitting diode (LED) package comprising: a body mounted on a substrate; 91 94715 201023403 an LED mounted in the body, a lead frame electrically connected to the LED; and formed in the body The surface is provided with a contact portion to be mounted to a mounting area of the substrate. 8. The LED package of claim 7, wherein the lead frame is exposed such that the body can be mounted from the side or the top. 9. The LED package of claim 8, wherein the lead frame comprises: a top electrode electrically connected to the substrate, such that the LED can face the front surface of the substrate; and the top electrode is integrally formed with a curved portion bent from the top electrode toward the different sides; and an end portion formed at the bent portion and electrically connected to the substrate to enable the LED to be vertically mounted to the side electrode of the substrate. 10. The LED package of claim 9, wherein the side electrode is mounted to one side of the body. 11. The LED package of claim 10, wherein the top ® electrode is formed in a narrow manner on a lower surface of the body. 12. The LED package of claim 9, wherein the top electrode is mounted to one side of the body. 13. The LED package of claim 12, wherein the side electrode is formed on the other side of the body in a slit manner. 14. The LED package of claim 7, wherein the contact portion is formed in a central portion of the body. The LED package of claim 7, wherein the contact portion is mounted on a side of the body and has an end that is curved toward the substrate. 16. The LED package of claim 7, wherein the contact portion and the lead frame are integrally formed. 17. The LED package of claim 7, wherein the lead frame is bent inwardly recessed and has a receiving portion for receiving the LED chip therein. ❹ 18. A backlight unit comprising: a light guide plate configured to allow a light source to travel to a liquid crystal panel; a light emitting diode (LED) mounted in the body of the device and generating a light source; and an LED package, An exposed lead frame is provided to selectively mount the body on a top or side side, the LED package being mounted to the light guide plate. 19. The backlight unit of claim 18, wherein the lead frame comprises: a top electrode electrically connected to the substrate, such that the LED faces the front surface of the substrate; integrally formed with the top electrode and The top electrode is bent toward the curved portion of the different sides; and is formed at an end of the curved portion and electrically connected to the substrate to enable the LED to be vertically mounted to the side electrode of the substrate. 20. The backlight unit of claim 18, comprising: 93 94715 201023403 formed on the surface of the body and provided with a contact portion to be mounted to a mounting area of the substrate. 21. The backlight unit of claim 20, wherein the contact portion and the lead frame are integrally formed. 22. The backlight unit of claim 20, wherein the contact portion is formed at a central portion of the body. 23. The backlight unit of claim 20, wherein the contact portion is formed on a side of the body and has an end that is curved toward the substrate. 24. The backlight unit of claim 18, wherein the plurality of light guide plates are integrally formed. 25. The backlight unit of claim 18, comprising: a reflector disposed at a lower portion of the light guide plate. 26. The backlight unit of claim 18, comprising: an optical sheet disposed on an upper portion of the light guide plate. 94 94715