200921841 九、發明說明： 【發明所屬之技術領域】 本發明係為一種磁性晶圓夾具，尤指一種可方便使用 者更換晶圓之夾具。 【先前技術】 按，於半導體製程其中的洗淨（CLEANING)製程，需 使用夾具將晶圓（WAFER)固定後，再藉由夾具浸泡於曱 醇、氨水或丙酮去除雜質，再以氫氟酸蝕刻基材表面的氧 化物，經純水沖洗後，置於100~200 τ的環境下去水烘 烤（Dehydration Bake)數分鐘。才能接續下一步驟，但目 前習知固定晶圓夾具之方法係藉由螺絲鎖固上、下夾具以 將晶圓固定於上、下夾具之間’但由於螺絲鎖固的時間較 長，使得每—次更換晶圓的時間過於冗長。且該螺絲使用 一段時間後容易使得螺紋磨損造成螺絲或是下失具之螺 牙部份損壞’故有些會採用陶竟螺絲，使螺絲使用壽命可 ^加但陶究螺絲需特別訂製，故夾具製造成本相對提 高’·且以螺絲鎖固方式須以人工來操作，故不易用於自動 化的系統中’相對也會引料導體之產能；另外，因該晶 圓夾具係以螺絲鎖固，故常因無法確實控制螺絲鎖緊之壓 力如螺絲鎖緊屢力過大，相對上、下爽之挟持力道也增 5 200921841 加，故相對造成晶圓被上、下夾具壓迫而損壞。 故，綜上所述，改進習知晶圓夾具之問題點，以提高 半導體產業之產能，實是刻不容緩。 【發明内容】 基於上述習知晶圓夾具之問題點，本發明人經過研究 改良後，終有確能達成以下發明之目的之發明誕生。 即，本發明首要目的在於，提高半導體之產能。 本發明次要目的在於，使晶圓夾具與自動化機械結 合。 本發明最終目的在於，使上、下夾具之挾持力道受到 控制。 為達上述之目的，本發明之磁性晶圓爽具，係包含： 一下夾具，係呈一環狀體，其設有凸出於外緣之連接 部，該連接部上係設有一固定孔，該固定孔係與自動化機 械連接，該下夾具之一侧係設有若干環狀陣列之定位槽及 第一容置槽，該下夾具之内緣係設有若干環狀陣列之支撐 部，該支撐部上係設有一支撐面； 一上夾具，係設置於該下夾具之上方，係呈一環狀 體，其設有相對該定位槽之定位塊與相對該第一容置槽之 第二容置槽以及相對該支撐部之挾持部，該挾持部上係設 6 200921841 有一挾持面；另設有若干陣列之配合部，該配合部係與自 動化機械連接； 數量相對於該第一容置槽與第二容置槽之磁性體，該 磁性體係各別安裝於該第一容置槽與第二容置槽； 一晶圓，係設置於該支撐面與該挾持面之間。 該磁性晶圓夾具係藉由該上夾具與下夾具所設之磁 性體相互吸附，以達到挾持晶圓之功能，於更換晶圓時只 需藉由外力旋轉該上夾具，即可將兩相互吸附之磁性體分 離，達到快速更換晶圓之目的，以增加生產速度。 為求清楚說明本發明之實施特點，以下說明本發明較 習用進步之處及實用方式： 1. 延長晶圓夾具之使用壽命。 2. 提升半導體產業之產能。 3. 可與自動化機械結合。 4. 使上、下炎具不會因夾持力道過大，造成晶圓損壞。 為了更進一部暸解本發明之特徵及技術内容，請參閱 以下有關本發明之實施方式說明及圖式，然而此實施方式 及圖式僅供說明及參考用，而非用以對本發明做任何限制 200921841 【實施方式j 本發明之實施例請參閱第一圖至第八圖所禾，本發 明係為一種磁性晶圓夾具，係包含·· 一下夾具1，係呈一環狀體，其設有凸出於外緣之連 接邛1 1，该連接部；[1上係設有一固定孔丄丄i，該固 定孔1 1 1係與自動化機械連接，該下夾具丄之一側係設 有若干環狀陣狀定位槽1 3及第-容置槽i 4(該定位 槽與該第-容置槽亦可設置於不同側），該下夾具丄之内 緣係設有若干環狀陣狀支撐部i 2 (該支撐部1 2亦可 為環狀設置，如第七圖所示），該支撐部i 2上係設有一 支撐面1 2 1 ; 一上夾具2，係設置於該下夾具之上方，係呈一環狀 體’其設有相對該定位槽i 3之定位塊2 2與相對該第一 容置槽1 4之第二容置槽2 3以及相對該支撐部丄2之 挾持部2 1 (該挾持部2 1亦可為環狀設置，如第八圖所 示），該挾持部2 1上係設有一挾持面2工i ;另設有若 干陣列之配合部2 4，該配合部2 4係與自動^械: 接； 數量相對於該第一容置槽i 4與第二容置橹2 3之 磁性體X，該磁性體X係各別安裝於該第一容置檜i 4與 第二容置槽2 3 ; ' 200921841 一晶圓3 ’係設置於該支撐面1 2 1與該挾持面2 1 1之間。 以上所述為各元件細部說明及其相互搭配關係，以 下說明本實施例之實施方式： 首先’將該下夹具1之連接部1 1所設之固定孔1 1 1與自動化機械（未顯示）連接’而後將晶圓3放置於下 夾具1之支撐部1 2上’而該上夾具2係藉由配合部2 4 與自動化機械（未顯示）連接，再藉由自動化機械（未顯 不）將該上夾具2與該下夾具丄組合，於組合時藉由該下 夾具1之定位槽13與上夾具2之定位塊22辅助定 位^組合後該自動化機械（未顯示）則與該上夾具2脫離， 使㈣上夾具2、下夾具1所設之磁性體χ相互吸附，且 該定位塊2 2係容置於該定位槽i 3中，進而使晶圓3確 實定位於該支擇面1 2 1與挾持面2 1 1之間； 再者，藉由自動化機械（未顯示）將該晶圓失具移至 工作站’進行加工； 具移至_ ’再_化機械=顯=== 200921841 之配合部2 4連接後，旋轉該上夾具2，使得該上夾具2 之磁性體X與該下夾具i之磁性體）（相互錯位（如第六圖 所示），如此一來，便可將該上夾具2、下夾具丄分離， 再取出晶圓3，即完成晶圓3之部分加工程序。 另，該定位槽1 3與定位塊2 2除具有對位作用外， 尚具有穩定上夾具2、下夾具χ對於晶圓3之挾持力道之 功用，係藉由定位塊2 2之頂部面2 2 1與定位槽i 3之 槽底面1 3 1相互抵頂而穩定挾持力道，以避免磁性體乂 相互吸力過大而炎壞晶圓3。該磁性體㈣可藉由模具埋 入射出方式與該上炎具2、下夾具i—體成形製造，^下 夾具1、上夾具2亦可不設置第一容置槽丄4、第 槽2 3。 综所上述，本發明係藉由磁性體相互吸引使上夾具與 下，具將晶圓挾持，且，該晶圓夾具係與自動化機械結: 。成所有製程’故不需耗費太多人力即可完成晶圓之製 私’相對也降低製造成本，$，提高半導體之產能，所以 切明之『具有越之可利用性』應已毋庸置疑，除此之 夕，在本案實施例所揭露出的特徵技術，於ψ請之前 百見於諸刊物，亦未曾被公開❹4但具有如上所述功 10 200921841 效曰進之事κ，更具有不可輕忽的附加功效，是敌，本發 明的『新穎性』収『進步性』都已符合專縣規，纽 法提出發明專利之申請，菥士主*早愈左、，母 丁。月斫％惠予審查亚早曰賜准專利， 實感德便。 以上所述實施例之揭示係用以說明本發明，並非用以 限制本發明，故舉凡數值之變化與等效元件之置換，仍應 隸屬本發明之範疇。 200921841 【圖式簡單說明】 第一圖為本發明下夾具立體圖。 第二圖為本發明下夾具與晶圓配合立體示意圖。 第二圖為本發明上夾具立體圖。 第四圖為本發明磁性晶圓央具之上視圖。 第五圖為第四圖A — A剖視圖。200921841 IX. Description of the Invention: [Technical Field] The present invention relates to a magnetic wafer jig, and more particularly to a jig for facilitating replacement of a wafer by a user. [Prior Art] According to the CLEANING process in the semiconductor process, the wafer (WAFER) is fixed by a jig, and then immersed in methanol, ammonia or acetone to remove impurities, and then hydrofluoric acid. The oxide on the surface of the substrate is etched, rinsed with pure water, and placed in a 100-200 τ environment for dehydration Bake for several minutes. In order to continue the next step, the conventional method of fixing the wafer fixture is to fix the wafer between the upper and lower clamps by screwing the upper and lower clamps, but the screw is locked for a long time. The time to replace the wafer every time is too long. Moreover, after the screw is used for a period of time, it is easy to cause the thread to be worn to cause damage to the screw or the screw of the lower piece of the screw. Therefore, some of the screws will be used, so that the service life of the screw can be increased, but the screw needs to be specially customized. The manufacturing cost of the jig is relatively improved'· and the screw locking method must be operated manually, so it is not easy to be used in an automated system. 'The relative productivity of the lead conductor is also relatively large; in addition, since the wafer jig is screwed, it is often Because the pressure of the screw locking can not be surely controlled, such as the screw locking force is too large, the relative force of the upper and lower cooling is also increased by 5, 200921841, so the wafer is damaged by the upper and lower clamps. Therefore, in summary, it is imperative to improve the problem of the conventional wafer fixture to increase the production capacity of the semiconductor industry. SUMMARY OF THE INVENTION Based on the above problems of the conventional wafer jig, the inventors of the present invention have succeeded in research and development, and the invention which can achieve the object of the following invention is finally born. That is, the primary object of the present invention is to increase the productivity of semiconductors. A secondary object of the present invention is to combine wafer fixtures with automated machinery. The ultimate goal of the present invention is to control the holding force of the upper and lower clamps. For the above purpose, the magnetic wafer refresher of the present invention comprises: a lower clamp, which is an annular body, and is provided with a connecting portion protruding from the outer edge, and the connecting portion is provided with a fixing hole. The fixing hole is connected to the automatic mechanical device. One side of the lower clamp is provided with a plurality of annular array positioning grooves and a first receiving groove, and the inner edge of the lower clamp is provided with a plurality of annular array supporting portions. A support surface is disposed on the support portion; an upper clamp is disposed above the lower clamp, and is an annular body, and is provided with a positioning block opposite to the positioning groove and a second portion opposite to the first receiving groove The accommodating groove and the holding portion of the supporting portion are provided with a holding surface on the holding portion 6 200921841; and a plurality of matching portions are arranged, the matching portion is connected with the automatic mechanical; the quantity is relative to the first receiving portion The magnetic body of the groove and the second receiving groove are respectively mounted on the first receiving groove and the second receiving groove; a wafer is disposed between the supporting surface and the holding surface. The magnetic wafer holder is adsorbed by the magnetic body provided by the upper clamp and the lower clamp to achieve the function of holding the wafer. When the wafer is replaced, the upper clamp can be rotated by an external force, and the two mutual The adsorbed magnetic body is separated to achieve the purpose of quickly replacing the wafer to increase the production speed. In order to clarify the implementation features of the present invention, the following description of the advantages and practical ways of the present invention will be described: 1. Extend the service life of the wafer fixture. 2. Increase the production capacity of the semiconductor industry. 3. Can be combined with automated machinery. 4. Make the upper and lower wares not cause the wafer to be damaged due to the excessive clamping force. For a better understanding of the features and technical aspects of the present invention, reference should be made to the description of the embodiments of the invention. 200921841 [Embodiment j] Please refer to the first to eighth figures for the embodiment of the present invention. The present invention is a magnetic wafer fixture, which comprises a lower clamp 1 and is provided with an annular body. a connection protruding from the outer edge 邛1, the connecting portion; [1 is provided with a fixing hole 丄丄i, the fixing hole 1 1 1 is connected with an automatic machine, and one side of the lower clamp is provided with a plurality of The annular array positioning groove 13 and the first receiving groove i 4 (the positioning groove and the first receiving groove may be disposed on different sides), and the inner edge of the lower clamp is provided with a plurality of annular arrays a support portion i 2 (the support portion 12 may also be annularly arranged, as shown in the seventh figure), the support portion i 2 is provided with a support surface 1 2 1 ; an upper clamp 2 is disposed under the support portion Above the clamp, an annular body is provided, which is provided with a positioning block 2 2 opposite to the positioning groove i 3 and opposite thereto The second accommodating groove 2 3 of the first accommodating groove 14 and the holding portion 2 1 of the supporting portion ( 2 (the holding portion 2 1 may also be annularly arranged, as shown in the eighth figure), the holding The portion 2 1 is provided with a clamping surface 2; a plurality of arrays of matching portions 24 are provided, and the matching portion 24 is connected to the automatic device; the number is relative to the first receiving groove i 4 and The second magnetic body X is disposed on the first accommodating 桧i 4 and the second accommodating groove 2 3; '200921841 a wafer 3' is disposed on the supporting surface 1 2 1 is between the holding surface 2 1 1 . The above description of each component detail and its mutual relationship, the following describes the embodiment of the present embodiment: First, the fixing hole 1 1 1 of the connecting portion 1 1 of the lower jig 1 and the automated machine (not shown) Connecting 'and then placing the wafer 3 on the support portion 1 2' of the lower jig 1 and the upper jig 2 is connected to the automated machine (not shown) by the mating portion 24, and then by automated machinery (not shown) Combining the upper clamp 2 and the lower clamp ,, when combined, by the positioning groove 13 of the lower clamp 1 and the positioning block 22 of the upper clamp 2 to assist positioning, the automatic machine (not shown) and the upper clamp 2, the magnetic body 设 provided in the upper clamp 2 and the lower clamp 1 is adsorbed to each other, and the positioning block 22 is received in the positioning groove i 3 , so that the wafer 3 is surely positioned on the support surface. 1 2 1 and the holding surface 2 1 1; further, the wafer is lost to the workstation by an automated machine (not shown) for processing; moving to _ 're-chemical machine = display === After the mating portion 24 of 200921841 is connected, the upper clamp 2 is rotated to make the magnetic force of the upper clamp 2 The physical body X and the magnetic body of the lower clamp i) (displaced with each other (as shown in the sixth figure), so that the upper clamp 2 and the lower clamp can be separated, and the wafer 3 can be taken out, that is, the crystal is completed. Part of the processing procedure of the circle 3. In addition, the positioning groove 13 and the positioning block 2 2 have the function of stabilizing the upper clamp 2 and the lower clamp χ for the wafer 3, in addition to the alignment function, by positioning The top surface 2 2 1 of the block 2 2 and the bottom surface 1 3 1 of the positioning groove i 3 abut each other to stabilize the holding force to prevent the magnetic body from being excessively attracted to each other and damaging the wafer 3. The magnetic body (4) can be used The die immersing and immersing mode and the upper ejector 2 and the lower jig are formed by i-body forming, and the lower jig 1 and the upper jig 2 may not be provided with the first accommodating groove 4 and the second groove 23. The present invention is as described above. By holding the magnetic body to each other, the upper clamp and the lower clamp are used to hold the wafer, and the wafer fixture is combined with the automated mechanical knot: into all the processes, so that the wafer fabrication can be completed without much labor. Private 'relatively reduces manufacturing costs, $, increases the productivity of semiconductors, so it is clear that the more The availability of this should be unquestionable. In addition to this, the feature technology revealed in the examples in this case has not been disclosed in the publications before, but has not been disclosed ❹4 but has the above-mentioned work 10 200921841 Into the matter κ, more indispensable additional effects, is the enemy, the "novelty" of the invention, the "progressive" has been in line with the county regulations, New Zealand filed an application for invention patents, the gentleman master * early left , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The replacement of the effect element is still within the scope of the invention. 200921841 [Simplified description of the drawings] The first figure is a perspective view of the lower fixture of the present invention. The second figure is a schematic perspective view of the lower fixture and the wafer according to the present invention. The second figure is a perspective view of the upper clamp of the present invention. The fourth figure is a top view of the magnetic wafer centering device of the present invention. The fifth picture is a cross-sectional view of the fourth figure A - A.
第’、圖為本發明上夾具與下夹具之磁性體錯位示意 圖。 第七圖為本發明下夾具將支撐部設計為環狀之示意 圖。 圖 第八圖為本發明上夾具將挾持部設計為環狀之示咅The figure is a schematic diagram of the magnetic body misalignment of the upper jig and the lower jig of the present invention. The seventh figure is a schematic view of the lower jig of the present invention in which the support portion is designed to be annular. Figure 8 is an illustration of the upper clamp of the present invention designed to hold the gripping portion in a ring shape.
12 200921841 【主要元件符號說明】 1 下夾具 111 固定孔 121 支撐面 131 槽底面 2 上夾具 211 挾持面 2 2 定位塊 2 4 配合部 X 磁性體 / i. 11 連接部 1 2 支撐部 13 定位槽 14 第一容置槽 2 1 挾持部 2 3 第二容置槽 221 頂部面 3 晶圓 1312 200921841 [Description of main component symbols] 1 Lower clamp 111 Fixing hole 121 Supporting surface 131 Groove bottom 2 Upper clamp 211 Holding surface 2 2 Positioning block 2 4 Mating part X Magnetic body / i. 11 Connection part 1 2 Support part 13 Positioning groove 14 first accommodating groove 2 1 holding portion 2 3 second accommodating groove 221 top surface 3 wafer 13