200846649 九、發明說明 【發明所屬之技術領域】 本發明，係有關於圖案之檢查裝置以及圖案之檢查方 法，特別是，係有關於在檢測出被形成於TAB ( Tape Antomated Bonding)帶等之基板上的配線圖案之表面的凹 坑（孔）之有無的同時，能夠對圖案之線寬幅作測定的圖 案檢查裝置以及圖案檢查方法。 【先前技術】 在配線圖案之檢查中，作爲對付著在基板表面又或是 背面之垃圾（異物）與配線圖案之缺陷作區別，而防止誤 檢測之方法以及裝置，例如係在專利文獻1或專利文獻2 中被提案。 在上述公報中，係記載有：將被形成有配線圖案之基 板的受像反射照明光所得到之反射照明畫像與受像透過照 明光所得到之透過照明畫像作比較，並將在雙方之畫像共 通出現的不良處，作爲配線圖案之缺陷。 [專利文獻1]日本特開2004-61491號公報 [專利文獻2]日本特開2005-24386號公報 【發明內容】 [發明所欲解決之課題] 在聚醯亞胺等之基板上被形成之由銅等的金屬所致之 配線圖案，其表面通常係爲平滑。但是，依情況，會有如 •5- 200846649 圖11所示一般，在配線圖案51之表面產生有突起（同圖 (b ))或是被稱爲凹坑（同圖（a ))之凹陷（孔）（以 下，稱爲凹坑）的情況。另外，同圖係爲了作說明，故將 相對於基板52之圖案的大小極端地放大而顯示。 當在配線圖案5 1之表面產生有凹坑時，係有必要在 檢查工程中將其作爲不良而檢測出來。此係因爲，由於僅 有該部分處配線會變細，而會有產生斷線的可能性之故。 特別是，在被形成於被使用在進行折曲之場所的可撓性基 板處之圖案的情況時，若是反覆進行折曲，則凹坑的部分 會有產生斷線的情形之故。另一方面，關於突起，由於就 算是被折曲亦不會有斷線的憂慮，因此並不需要作爲不良 而檢測出來。 但是，在配線圖案檢查裝置中，會產生無法對發生在 圖案之表面的凹坑與突起作區別的問題。使用圖1 1來作 說明。 當進行配線圖案51之檢查時，係在進行基板5 2之場 所從照明手段1 2而照射照明光，並將該照明光之反射光 又或是透過光所致之配線圖案像，以攝像手段1 1或目視 來受像’並將其與良品之圖案等的範本（Master data)作 比較，而判定良好與否。 如圖11所示一般’當作爲照明光而使用反射照明光 的情況時，對於基板52，照明手段1 2係被配置在被形成 有配線圖案51之側’而對圖案5 1作攝像之攝像手段1 1 亦位於相同側。 -6 - 200846649 另外’在同圖中’作爲照明手段12之光源，雖係使 用LED 1 2 a ’但是’此係亦可使用鹵素燈管或是金屬鹵素 燈管之類的燈管。 若是對配線圖案51照射照明光，則被照射至圖案5】 之表面的照明光，若是表面係爲平坦，則照射光係被反射 ，並射入攝像手段1 1處。被照射至圖案5 1以外之部分的 照明光，係透過基板5 2，又或是被基板5 2所吸收，而並 不射入攝像手段U處。故而，在攝像手段1 1中，配線圖 案5 1之表面係被明亮的攝像，而基板5 2之部分係被攝像 爲灰暗。 另外，在此例中，作爲攝像手段1 1，雖係使用CCD 線狀感測器，但是，亦可使用CCD區域攝像機。 如圖11(a)所示一般，若是在表面存在有凹坑，則 被照射至該凹坑部分之照明光，係在孔之中反覆進行反射 並逐漸變弱，而在攝像手段11處光係並不會射入。故而 ，產生有凹坑之部分係會變暗。 但是，如圖11(b)所示一般，就算是在表面產生有 突起的情況時，其部分係亦會變暗。此係因爲，被照明在 突起處之照明光，係在突起之外壁（斜面）被反射，而在 攝像手段1 1處光係並不會射入之故。 故而，在攝像手段11處，凹坑之部分與突起之部分 係同樣的變爲被攝像得較暗，而兩者之間係無法區分。 另外，在配線圖案51之檢查中，作爲照明光，係有 使用透過照明光的情形。此時，照明手段12，係相對於基[Technical Field] The present invention relates to a pattern inspection apparatus and a pattern inspection method, and more particularly to detecting a substrate formed on a TAB (Tape Antomated Bonding) tape or the like. A pattern inspection device and a pattern inspection method capable of measuring the width of the pattern line while having the presence or absence of pits (holes) on the surface of the wiring pattern. [Prior Art] In the inspection of the wiring pattern, a method and apparatus for preventing erroneous detection as a difference between the garbage (foreign matter) on the surface of the substrate or the back surface and the wiring pattern are prevented, for example, in Patent Document 1 or Patent Document 2 is proposed. In the above publication, it is described that the reflected illumination image obtained by the image-received illumination light of the substrate on which the wiring pattern is formed is compared with the transmitted illumination image obtained by transmitting the illumination light, and the image is common to both images. The disadvantage is that it is a defect in the wiring pattern. [Patent Document 1] JP-A-2004-61491 [Patent Document 2] JP-A-2005-24386 (Summary of the Invention) [Problems to be Solved by the Invention] It is formed on a substrate such as polyimide or the like. A wiring pattern made of a metal such as copper is usually smooth on the surface. However, depending on the situation, as shown in Fig. 11 of Fig. 11, generally, a protrusion (the same figure (b)) or a depression called a pit (the same figure (a)) is formed on the surface of the wiring pattern 51 ( Hole) (hereinafter, referred to as a pit). Further, in the same drawing, for the sake of explanation, the size of the pattern with respect to the substrate 52 is extremely enlarged and displayed. When pits are formed on the surface of the wiring pattern 51, it is necessary to detect it as a defect in the inspection process. This is because, since only the wiring at this portion is thinned, there is a possibility that a wire breakage occurs. In particular, in the case of a pattern formed on a flexible substrate used in a place where bending is performed, if the bending is repeated, the portion of the pit may be broken. On the other hand, since the projections are not bent even if they are bent, they do not need to be detected as defects. However, in the wiring pattern inspection device, there is a problem that pits and projections which occur on the surface of the pattern cannot be distinguished. Use Figure 11 for illustration. When the inspection of the wiring pattern 51 is performed, the illumination light is irradiated from the illumination means 12 at the place where the substrate 52 is performed, and the reflected light of the illumination light or the wiring pattern image by the transmitted light is used as an imaging means. 1 1 or visually accept the image and compare it with the master data such as the pattern of the good product, and judge whether it is good or not. As shown in FIG. 11 , when the reflected illumination light is used as the illumination light, the illumination means 12 is disposed on the side of the substrate 52 on which the wiring pattern 51 is formed and the image of the pattern 5 1 is imaged. Means 1 1 are also located on the same side. -6 - 200846649 In addition, in the same figure, as the light source of the illumination means 12, although the LED 1 2 a ' is used, it is also possible to use a halogen tube or a metal halide tube. When the illumination pattern is applied to the wiring pattern 51, the illumination light that is irradiated onto the surface of the pattern 5 is flat, and the illumination light is reflected and incident on the imaging means 11. The illumination light that is irradiated to a portion other than the pattern 51 is transmitted through the substrate 52 or absorbed by the substrate 52, and is not incident on the imaging means U. Therefore, in the imaging device 1 1, the surface of the wiring pattern 51 is brightly imaged, and the portion of the substrate 52 is imaged to be dark. Further, in this example, a CCD line sensor is used as the imaging means 1 1, but a CCD area camera can also be used. As shown in Fig. 11(a), generally, if there is a pit on the surface, the illumination light that is irradiated to the pit portion is reflected and gradually weakened in the hole, and is lighted at the image pickup means 11. The system does not shoot. Therefore, the portion where the pit is generated may become dark. However, as shown in Fig. 11 (b), even in the case where a projection is formed on the surface, the portion thereof is also darkened. This is because the illumination light that is illuminated at the protrusion is reflected on the outer wall (bevel) of the protrusion, and the light system is not incident at the imaging means 11. Therefore, in the image pickup means 11, the portion of the pit and the portion of the projection are imaged to be darker, and the two are indistinguishable. Further, in the inspection of the wiring pattern 51, as the illumination light, the case where the illumination light is transmitted is used. At this time, the illumination means 12 is relative to the base
200846649 板52而被設置在與被形成有配線圖3 並將透過基板52之照明光’以設置1 配線圖案51之側的攝像手段11來受 過照射光之檢查中，雖然能夠檢測出 於圖案之表面係成爲陰影，因此並無 如上述一般，於先前技術中，雖 表面之產生有凹坑又或是突起的部分 面之突起與凹坑係無法作區別。 而，如上述一般，雖然應將凹坑 起的情況時卻並非如此。假設，若是 部分者，全部作爲凹坑而視爲不良， 爲不良之突起亦是爲不良的情況，而 進而，在圖案之檢查裝置中，不 起作區別而檢測出來，而亦有對圖寒 要。爲了在短時間內進行圖案之檢査 區別而檢測出來的同時，亦有對圖_ 要’但是，此種圖案檢查裝置以及圈 被確立。 本發明，係爲有鑑於此種事態 題’係在配線圖案之檢查裝置以及 對產生於圖案之表面的凹坑與突起 測出凹坑的同時，亦進行線寬幅之 [用以解決課題之手段] I 51之側的相反側， E基板52之被形成有 像。但是，在使用透 圖案之寬幅，但是由 法作檢查。 然能夠檢測出在圖案 ，但是對於產生在表 視爲不良，但是在突 將在表面產生有灰暗 則會發生將原本並非 使生產性降低。 僅是必須將凹坑與突 ;之線寬幅作測定的必 :，在將凹坑與突起作 [之線寬幅作測定的必 丨案檢查方法，係尙未 ί進行者，本發明之課 f法中，使其成爲能夠 e區別，而能夠在僅檢 丨定。 -8- 200846649 發明者們，係使用反射照明光而對產也在圖案上之凹 坑或突起作了觀察。其結果，如後述一般，發現了 ：藉由 將反射照明光之對檢查區域的射入角度設爲3〇°〜65°之範 圍，較理想爲設爲40°〜55 °C之範圍，能夠從所攝像之畫 像中將突起與凹坑作區別而檢測出來，若是存在有凹坑， 則該部分係在攝像手段中被攝像爲明亮。另一方面，若是 使用透過照明光，則雖然無法檢測出凹坑或突起之存在， 但是可以檢測出被形成在基板上之配線圖案之寬幅。 由上述可以得知，藉由將上述反射照明與透過照明作 組合，能夠在僅將凹坑檢測出來的同時，對線寬幅作測定 〇 亦即是，在本發明中，對於光透過性基板，係從此基 板之被形成有圖案之側，而藉由第1照明手段來對檢查區 域以斜射入的方式而照射照明光，同時，從與此基板之被 形成有圖案之側的相反側，藉由第2照明手段來照射照明 光，再藉由被設置在與以上述第1照明手段所致之照明光 的照射方向相同之方向的攝像手段，來對藉由第1照明手 段與上述第2照明手段所照明之圖案作攝像。 若是在基板上之配線圖案之表面存在有凹坑，則反射 光係射入攝像手段，並將該部分攝像爲明亮。另一方面， 從第2照明手段而來之照明光，由於係從基板之被形成有 圖案之側的相反側而射入檢查區域，故而被形成有圖案之 部分在攝像手段中係被攝像爲較暗，而未被形成有圖案之 部分係被形成爲較亮。 -9- 200846649 故而，若是如上述一般而藉由第1、第2照明手段來 照明，則當在圖案表面產生有凹坑的情況時，該部分係在 暗的圖案中作爲明亮之部分而被攝像，而被形成在基板上 之圖案的寬幅、亦即是線寬幅，看起來係成爲變得較狹窄 。亦即是，當在圖案上存在有凹坑的情況時，係可藉由其 之線寬幅變得較狹窄而檢測出來。 [發明之效果] 在本發明中，可得到以下之效果。 (1 )對於基板之檢查區域，由於係進行從斜方向而 來之反射照明與透過照明，並藉由攝像手段來對藉由反射 照明與透過照明所照明之圖案作攝像，因此，在能夠將凹 坑與突起作區別並檢測出的同時，亦能夠檢測出圖案之線 寬幅。 (2 )藉由同時進行反射照明與透過照明，能夠在一 次之攝像畫像中，同時進行反射照明所致之凹坑的檢測、 以及透過照明所致之圖案的線寬幅之檢測。故而，成爲能 夠在短時間內進行凹坑之有無與圖案之線寬幅的檢查。 【實施方式】 圖1，係爲本發明之實施例的配線圖案檢查裝置之區 塊圖。另外，以下之實施例，雖係針對基板爲TAB帶或 COF之類的薄膜狀工件的情況作說明，但是，本發明，係 亦可適用在其他之基板的圖案檢查中。 -10- 200846649 本竇施例之圖案檢查裝置，係如同圖中所示一般，具 備有··將TAB帶作搬送之送出捲盤21或捲取捲盤22等 所成之帶搬送機構20、對從送出捲盤21所送出之TAB帶 5照射透過照明光、反射照明光並對檢查圖案作攝像之檢 查部1、使檢查部1在TAB帶8之檢查圖案6上作掃瞄之 掃瞄手段2、在不良之圖案上附加記號的記號部3。 在記號部3處，係施加對被判定爲不良之圖案所進行 的衝床穿孔、或是能夠以目視來立即確認出該部分係爲不 良品之塗色等的記號。 又，圖案檢查裝置係具備有控制部4。控制部4，係 在從所檢測出之凹坑的大小或明亮杜、以及圖案之線寬幅 ’而對圖案之良否作判定的同時，對檢查部1、記號部3 、以及帶搬送機構20之動作作控制。 檢查部1，係具備有：對於TAB帶5，從被形成有圖 案之側而對檢查區域從斜方向而照射照明光之第1照明手 段（反射照明手段）1 2、對檢查區域而從TAB帶之與被 形成有圖案之側的相反側照射照明光之第2照明手段（透 過照明手段）1 3、和相對於TAB帶而爲與反射照明手段 1 2相同之側，並被設置在檢查區域之正上方的攝像手段 1 1 〇 反射照明手段1 2與透過照明手段1 3之光原，在本實 施例中係使用LED (發光二極體），從反射照明手段j 2 之LED所射出之照明光的對檢查區域之射入角，例如係 被設定爲50°，從透過照明手段13之LED所射出之照明 •11 - 200846649 光的對檢查區域之射入角，例如係被設定爲0 ° (垂直入射 )° 另外，照明手段之光源，代替LED，亦可使用鹵素燈 管。當將鹵素燈管作爲光源而使用時，係將從燈管而來之 光藉由導光光纖而作導引’而將從光纖所射出之光的對檢 查區域之射入角度分別設爲50°又或是〇°。 藉由與從斜方向而來之反射照明同時地而進行透過照 明，配線圖案之輪廓亦變爲明確，而成爲能夠對其之寬幅 作測定。 攝像手段11，係爲在上述照明光之波長處具備有受光 感度的例如CCD感測器又或是區域感測器。在攝像手段 1 1之光射入側，係被設置有將TAB帶5之進行檢查的區 域作擴大並投影的鏡頭（未圖示）。鏡頭，係爲將複數之 透鏡作組合並收容在鏡筒中者。 控制部4，係對反射照明手段12與透過照明手段13 之照明光的點燈或關燈、以及攝像手段1 1之攝像作控制 〇 又，控制部4，係從所檢測出之凹坑的大小或明亮度 、以及圖案之線寬幅，來判定圖案之良否。例如，若是相 對於圖案之線寬幅所檢測出之凹坑係爲非常小者，則會有 將其認定爲不具有斷線之可能性，而並不判定爲不良的情 形。凹坑之大小，係從所檢測出之凹坑的明亮度或大小而 求取。 故而，控制部4，係事先將用以判斷是否將其作爲不 -12- 200846649 良之圖案線寬幅等的基準參數作輸入。控制部4，係將圖 案線寬幅之資料、或是所檢測出之凹坑的明亮度或大小等 ，與此基準參數作比較，並判定其是否爲不良。 藉由圖1，針對將檢查圖案6作攝像之動作作說明。 _ 在TAB帶5中，係複數且連續地製作有相同之配線 '圖案，控制部4，係驅動帶搬送機構20，並將TAB帶5 搬送至檢查部1。 # TAB5之成爲檢查對象的檢查圖案6，若是藉由前述 帶搬送機構20而被搬送至檢查部1之特定位置，則在該 位置，TAB帶5係停止。 控制部4，係將反射照明手段1 2與透過照明手段1 3 之LED點燈，並對於進行檢查之配線圖案，從兩照明手 段1 2、1 3而同時照射照明光。攝像手段1 1，係受像經由 反射照明手段1 2與透過照明手段1 3而同時被照明之圖案 像，並在控制部4中將該畫像作記憶。 β 從反射照明手段1 2而來之照明光，係對於檢查區域 而以射入角度5 〇 °作照射。如上述一般，僅有在圖案之表 面存在有凹坑時，反射光係射入攝像手段11，而將該部分 攝像爲明亮。 又，從透過照明手段13而來之照明光，係從TAB帶 5之與被形成有圖案之側的相反側，而對於檢查區域以射 入角度0°來照射。未被形成有圖案之部分的透過光係射入 攝像手段1 1，而將該部分攝像爲明亮。被形成有圖案之部 分，在攝像手段1 1中係被攝像爲灰暗。故而，若是在圖 -13- 200846649 案之表面產生有凹坑，則該部分，在灰暗的圖案中，係成 爲明亮之部分而被攝像。 控制部4，係將圖案之線寬幅的資料（當有凹坑時， 由於該部分看起來係較爲明亮，故線寬幅看來係變得較細 )，與基準參數作比較，並判定其是否爲不良。 當所檢測出之凹坑爲大並被判定爲不良時，在控制部 4中，係被記憶有不良之圖案的位置，當該當圖案藉由帶 搬送機構10而被搬送至記號部3處時，進行穿孔或是塗 色等之記號附加。 若是檢查圖案6之檢查結束，則藉由帶搬送機構20， TAB帶5係被搬送，而成爲下一個檢查對象之檢查圖案， 係被搬送至檢查部1之特定位置。 接下來，針對進行反射照明時之照明光的射入角度與 藉由攝像手段所攝像之畫像間的關係作說明。 如圖2 ( a )所示一般，針對在圖案之正上方配置攝像 手段1 1，並將進行反射照明之照明光的射入角度，從0 ° 而逐漸的將傾斜度增大的情況作考慮。 如上述一般，當照明光之射入角度爲0°時，在攝像手 段11中，表面之平坦部分係爲明亮，而產生有凹坑又或 是突起之部分係被攝像爲灰暗。 另一方面，若是照明光傾斜，則如圖2 ( a )中所示一 般，在表面之平坦部分所反射之光，係變得不會射入至攝 像手段Η中。故而，圖案表面之平坦部分，在攝像手段 1 1中係成爲被攝像爲灰暗。 -14 - 200846649 另一方面，產生有突起或凹坑之部分，係如圖2 ( b ) 中所示一般，於其之斜面所反射之光，係變爲會射入至攝 像手段中，而成爲在攝像手段中被攝像爲明亮。 發明者們，係進行了如上述一般而將進行反射照明時 '之照明光的射入角度作改變之實驗。其結果，發現了：若 ‘是進而將照明光之射入角度設得更大，則凹坑之部分雖爲 明壳，但是突起之部分係會變暗。 # 另外，於此，所謂照明光之射入角度，係指如圖2 ( a )所示一般，相對於檢查區域之法線的照明手段所被配置 之方向的角度0。 又，在本實施例中，攝像手段，係爲具備有預先所設 定之長度的CCD線狀感測器，將此CCD線狀感測器，在 相對於線感測器所延伸之方向而垂直交會的方向上，與照 明手段而一同移動，並對特定之區域作攝像。 圖3，係爲展示進行反射照明之照明手段1 2的具體之 • ί冓成例的圖。 圖3(a) ’係爲作爲照明手段之光源而使用LED12a 者。LED 12a，係爲將複數之在線上並排者傾斜配置，並對 於檢查區域而將照明光以射入角度0來射入之構成的例子 〇 圖3 ( b )，係爲作爲照明手段之光源而使用鹵素燈管 者。在鹵素燈管的情況時，係將藉由反射鏡1 2e而集光之 從燈管12d而來的光，藉由導光光纖12f而導引，並將從 光纖1 2f之射出端所射出的光照射至檢查區域。 -15- 200846649 導光光纖12f之射出端係被集束於線上，並以使照明 光在對應於CCD線狀感測器之長度的檢查區域中之任一 位置均以射入角度0來射入的方式而被傾斜配置。 於圖4、圖5、圖6中，展示相對於反射照明光之射 入角度的凹坑以及突起之部分的畫像。左側之圖係爲凹坑 之部分’右側之圖係爲突起之部分的畫像。另外，本畫像 係將黑白反轉。亦即是，被攝像爲白色之部分係爲光未被 射入至攝像手段之部分，被攝像爲黑色之部分係爲光有射 入之部分。 圖4 ( a )，係爲照明光之對於基板的射入角度爲0時 的情況，以下，圖 4 ( b )爲 2 0。、（ c ) 2 5 °、 （ d ) 3 0。、 (e)35°、 （f)40。、 （g)45。、 （h)50。、 （i)55。、 （j )60°，圖 6(k)爲 65°、 （1)70。、 （m)75。。 另外，在圖4、圖5、圖6中，作爲照明手段，係使 用在圖3(a)中所示者，並藉由改變反射照明手段12與 檢查區域間之法線方向的距離，而改變照明光之相對於基 板的射入角度。 當圖4(a)之射入角度爲〇°的情況時，凹坑之部分與 突起之部分看起來均相同的爲白色（亦即是，在攝像手段 中未被射入有光），而無法對兩者作區別。 在圖4 ( b )之射入角度爲20°的情況時，由於照明光 係變傾斜，因此圖案之平坦部分的反射光係成爲不會射入 至攝像手段中，而該部分看起來係變白。另一方面，凹坑 之部分或突起之部分，由於在其之斜面所反射之光係射入 -16- 200846649 至攝像手段中，因此看起來係變黑。但是，在本圖中，兩 者看起來均同樣爲黑色，而無法作區別。 以下’凹坑之部分，就算是照明光的射入角度變大， 看起來亦幾乎沒有改變。但是，突起之部分，若是射入角 度成爲3 0 ° ’則如圖4 ( d )所示一般，黑色係變淡，而若 爲此狀態，則成爲能夠將凹坑與突起作區別並檢測出來。 之後，隨著照明光之射入角度的變大，從突起而來之反射 光係變少。 右是射入角度成爲3 5 ’則如圖4 ( e )所不一*般，突 起之顏色係更爲變淡，而成爲與周圍之平坦部分幾乎相同 的白色，成爲能夠容易地僅將凹坑檢測出來。 之後，直到成爲圖5 ( h)之射入角度爲50°爲止，凹 坑的模樣均幾乎不會改變，而能夠容易地僅將凹坑檢測出 來。 若是射入角度成爲55° (圖5 ( i))，則凹坑之像雖 然變得稍小，但是仍然可充分的僅將凹坑檢測出來。 當射入角度變爲60° (圖5 ( j ))，則顏色開始變淡 ，若是變爲65° (圖6(k))，則係變得相當淡，若是此 種程度，則仍可藉由畫像處理之設定而使檢測成爲可能。 但是，若是射入角度成爲7〇° (圖6 (1))以上，則 凹坑係變的幾乎看不出來，而使檢測成爲困難。 故而，藉由將反射照明光之對檢查區域的射入角度設 在30。以上65。以下之範圍，最適當係爲以上55°以下 之範圍，則不會檢測出突起，在所攝像之畫像中，只要檢 -17- 200846649 測出明亮之部分，則根據其之大小或是明亮度，則可判斷 係存在有凹坑。 突起，係如圖7 ( a )所示一般，其斜面爲較平緩，若 是射入至斜面之照明光的射入角度爲較30°更小，則在斜 面所反射之光會射入至攝像手段中。但是，若是射入角度 爲30°以上，則可以想見反射光係並不會射入至攝像手段 中。相對於此，凹坑，係如圖7(b所示一般，其斜面的 凹凸爲較急遽，所射入之照明光係產生亂反射，故可以想 見，就算是照明光之射入角度傾斜至65°左右，散亂之光 的成分亦會射入至攝像手段中。但是，若是射入角成爲70 °以上，則射入至凹坑中之照明光的成分係變少，而可以 想見反射光係變少。 於圖8中，展示從對產生有凹坑之圖案作攝像後的畫 像中所得到的亮度分布之圖表。 圖8 ( a )，係爲僅進行有從斜方向之反射照明的情況 ’圖8 ( b )，係爲同時進行有反射照明與透過照明之本實 施例的情況。圖8 ( a ) 、（ b )，其橫軸係爲檢查區域之 寬幅方向的距離，縱軸係爲所攝像之畫像的亮度之相對値 〇 在圖8 ( a )中，由於僅有反射照明，而凹坑之部分係 爲明亮發光，因此圖中央附近之亮度高的部分，係爲凹坑 。亮度之相對値爲1 〇左右而較小之部分，係爲配線圖案 ’亮度低之谷間部分，係相當於基板之部分。 在同圖中，代表配線圖案之山峰部分分成2個的原因 -18- 200846649 ，係因爲，如圖ίο所示一般，雖然射 緣的光係作亂反射並射入至攝像手段而 是射入至圖案上部之平坦部分的光，係 段中之故。 如圖8 ( a )所示一般，當僅有從斜 情況時，凹坑之亮度係爲高，而可容易 是，在配線圖案與基板的部分之間，係 而圖案之線寬幅的測定係爲困難。 圖8 ( b )，係展示：同時進行有反 ，透過基板之透過光，係射入攝像手段 作爲陰影而被映出的情況。故而，此情 圖表中，亮度較低之谷的部分，係爲配 山峰部分，係相當於基板之部分。 如同圖中所示一般，配先圖案之部 其亮度差係變大，線寬幅之測定係成爲 少。 又，凹坑之部分，係藉由反射照明 因此凹坑之檢測亦成爲可能。故而，藉 明與透過照明，凹坑之部分，在作爲陰 圖案中，係作爲明亮部分而被攝像。因 像中，進行凹坑之檢測與圖案之線寬幅 若是具體舉例，則從圖8 ( b )中所 ，前述控制部4，係如下述所示一般而 之不良。 入至配線圖案之邊 被攝像爲明亮，但 不會射入至攝像手 方向之反射照明的 地被檢測出來。但 幾乎沒有亮度差， 射照明與透過照明 中，而配線圖案係 況，在亮度分布之 線圖案，亮度高之 分與基板之部分， 容易，而誤差亦變 光而使亮度變高， 由同時進行反射照 影而被映出之配線 此，可在1次之攝 的測定。 :示之亮度分布圖表 自動地判定出圖案 -19- 200846649 如圖9所示一般，將在上述亮度分布圖表中之亮度， 與身爲預先所設定之判定準位的準位A作比較。 由於亮度低之谷部係爲配線圖案，因此，例如在將較 判定準位A而亮度爲更小之部分的寬幅與預先所設定之基 準參數作比較時，若是此寬幅係較基準參數爲更小，則可 以判定其係並未滿足配線圖案之寬幅的基準。 另一方面，雖然若是在圖案表面上不存在有凹坑，則 如同圖之虛線所示一般，配線圖案之部分的亮度係變低， 但是若是在圖案表面產生有凹坑，則該部分係在暗的圖案 部分中作爲明亮之部分而被攝像，並如同圖之實線所示一 般，亮度變高。 故而，若是在圖案之表面上存在有凹坑，則藉由判定 準位A所得之亮度較小的部分之寬幅，係如同圖所示一般 而變小。 亦即是，在將較判定準位A而亮度爲更小之部分的寬 幅與預先所設定之基準參數作比較時，若是此寬幅係較基 準參數爲更小，則可以判定其之實際上的線寬幅爲狹窄， 或是在配線圖案上存在有凹坑。 另外，若是凹坑爲小，則線寬幅之變化係爲小，而不 會有因爲線寬幅過爲狹窄而被判斷爲異常的情況。 如以上一般’藉由同時進行反射照明與透過照明，並 使基板之透過光以及反射光射入至攝像手段中而作攝像， 能夠從藉由攝像手段所攝像之畫像的亮度分布圖案中，而 判斷線寬幅以及具有會成爲問題之大小的凹坑之有無，且 -20- 200846649 能夠在1次的攝像畫像中，進行凹坑之檢測以及圖案之線 寬幅的測定。故而，成爲能夠在短時間內進行凹坑之有無 與圖案之線寬幅的檢查。 '【圖式簡單說明】 '[圖1]本發明之實施例的配線圖案檢查裝置之區塊圖 〇 Φ [圖2]對照明光之射入角與射入至攝像手段中之光的 關係作說明之圖。 [圖3]展示進行反射照明之照明手段的構成例的圖。 [圖4]展示相對於反射照明光之射入角度的凹坑以及 突起之部分的畫像（1)之圖。 [圖5]展示相對於反射照明光之射入角度的凹坑以及 突起之部分的畫像（2)之圖。 [圖6]展示相對於反射照明光之射入角度的凹坑以及 ® 突起之部分的畫像（3)之圖。 [圖7]對射入至凹坑又或是突起之光與射入至攝像手 段中之光的關係作說明之圖。 [圖8]從具有凹坑之圖案的攝像畫像中所得到之亮度 分布的圖表。 [圖9]對藉由亮度分布圖表而判定圖案之不良的方法 作說明之圖。 [圖1 0 ]對光射入至配線圖案之邊緣的情況作說明之圖 -21 - 200846649 [圖η ]對光射入至具有凹坑與突起之配線圖案的情況 作說明之圖。 【主要元件符號說明】 _ 1 :檢查部 _ 2 _·掃瞄手段 3 :記號部 _ 4 :控制部 5 : TAB 帶 5 1 :配線圖案 52 :基板 6 :檢查圖案 11 :攝像手段 1 2 :第1照明手段（反射照明手段） 1 3 :第2照明手段（透過照明手段） • 20 :帶搬送機構 2 1 :送出捲盤 22 :捲取捲盤 -22-200846649 The plate 52 is placed in the inspection of the illumination light that is formed on the side of the wiring pattern 51 on which the wiring pattern 3 is formed and the illumination light transmitted through the substrate 52 is disposed on the side of the wiring pattern 51. The surface system is shaded, so that it is not as described above. In the prior art, although the surface is formed with pits or protrusions, the protrusions of the partial faces cannot be distinguished from the pits. However, as described above, this is not the case when the pits should be used. It is assumed that if it is part, all of it is regarded as a pit as a defect, and a defective protrusion is also a bad condition, and further, in the pattern inspection device, it is not detected and is detected, but also Want. In order to perform the inspection of the pattern in a short period of time and to detect it, there is also a pair of drawings. However, such a pattern inspection device and a circle are established. According to the present invention, in view of such a problem, the inspection device for the wiring pattern and the pits and the protrusions generated on the surface of the pattern are measured, and the line width is also applied [to solve the problem] On the opposite side of the side of the device I, the E substrate 52 is formed with an image. However, the width of the transmissive pattern is used, but it is checked by law. However, it is possible to detect the pattern, but it is considered to be bad in the case, but it will appear to be dull on the surface, which would otherwise not reduce productivity. It is only necessary to measure the width of the pit and the protrusion; the width of the line must be measured: in the method of inspecting the width and width of the pit and the protrusion, the method of the invention is not carried out. In class f, it makes it possible to distinguish between e and can only be checked. -8- 200846649 The inventors observed the pits or protrusions that were also on the pattern using reflected illumination light. As a result, as will be described later, it has been found that the incident angle of the reflected illumination light to the inspection region is in the range of 3 〇 to 65 °, and preferably in the range of 40 ° to 55 ° C. The projection is detected by distinguishing the projection from the pit, and if there is a pit, the portion is imaged bright in the imaging means. On the other hand, if the transmitted illumination light is used, the presence of pits or protrusions cannot be detected, but the width of the wiring pattern formed on the substrate can be detected. As described above, by combining the above-described reflected illumination and transmitted illumination, it is possible to measure the line width while detecting only the pits. In the present invention, the light transmissive substrate is used. From the side on which the substrate is formed with the pattern, the illumination light is irradiated obliquely to the inspection region by the first illumination means, and from the side opposite to the side on which the pattern is formed, The illumination means is irradiated by the second illumination means, and the first illumination means and the first means are provided by the imaging means provided in the same direction as the illumination direction of the illumination light by the first illumination means. 2 The pattern illuminated by the illumination means is used for imaging. When there is a pit on the surface of the wiring pattern on the substrate, the reflected light is incident on the imaging means, and the portion is imaged to be bright. On the other hand, since the illumination light from the second illumination means is incident on the inspection region from the side opposite to the side on which the pattern is formed on the substrate, the portion in which the pattern is formed is imaged by the imaging means. The portion that is darker and not patterned is formed to be brighter. -9- 200846649 Therefore, if the illumination is performed by the first and second illumination means as described above, when a pit is formed on the surface of the pattern, the portion is colored as a bright portion in the dark pattern. The width of the pattern formed on the substrate, that is, the line width, appears to be narrower. That is, when there is a pit on the pattern, it can be detected by the narrowness of the line width. [Effects of the Invention] In the present invention, the following effects can be obtained. (1) In the inspection area of the substrate, since the reflected illumination and the transmitted illumination are performed from the oblique direction, and the image illuminated by the reflected illumination and the transmitted illumination is imaged by the imaging means, it is possible to When the pit is distinguished from the protrusion and detected, the line width of the pattern can also be detected. (2) By performing both the reflection illumination and the transmission illumination, it is possible to simultaneously detect the pits caused by the reflection illumination and the line width of the pattern by the illumination by the illumination image in one shot. Therefore, it is possible to inspect the presence or absence of the pits and the width of the pattern line in a short time. [Embodiment] Fig. 1 is a block diagram of a wiring pattern inspection device according to an embodiment of the present invention. Further, in the following embodiments, the case where the substrate is a film-like workpiece such as a TAB tape or a COF is described. However, the present invention can also be applied to pattern inspection of other substrates. -10- 200846649 The pattern inspection device of the sinus embodiment is provided with a belt transport mechanism 20 such as a take-up reel 21 or a take-up reel 22 that transports TAB tapes, as shown in the figure. The TAB tape 5 sent from the delivery reel 21 is irradiated with the illumination unit, the illumination light is reflected, and the inspection pattern is imaged. The inspection unit 1 scans the inspection pattern 6 of the TAB tape 8 by scanning. The means 2 adds a symbol portion 3 to the defective pattern. At the symbol portion 3, punch punching for the pattern determined to be defective or a mark for immediately confirming the coloring of the portion as a defective product by visual inspection is applied. Further, the pattern inspection device is provided with a control unit 4. The control unit 4 determines the quality of the pattern from the size of the pit to be detected, the brightness of the pit, and the line width of the pattern, and the inspection unit 1, the symbol unit 3, and the tape transport mechanism 20 The action is controlled. The inspection unit 1 is provided with a first illumination means (reflection illumination means) for irradiating illumination light from the oblique direction to the inspection area from the side on which the pattern is formed, 2, and from the TAB to the inspection area. The second illumination means (transmission illumination means) 13 for illuminating the illumination light on the side opposite to the side on which the pattern is formed, and the side opposite to the reflection illumination means 12 with respect to the TAB tape, are provided for inspection. The imaging means 1 1 directly above the area, the reflected illumination means 1 2 and the light source transmitted through the illumination means 13 are, in the present embodiment, LEDs (light-emitting diodes) are used, and are emitted from the LEDs of the reflection illumination means j 2 The incident angle of the illumination light to the inspection area is set to, for example, 50°, and the angle of incidence of the illumination from the LED that is transmitted through the illumination means 13 to the inspection area is, for example, set to 0 ° (normal incidence) ° In addition, the light source of the illumination means, instead of the LED, a halogen tube can also be used. When a halogen lamp is used as a light source, the light from the lamp is guided by the light guiding fiber, and the angle of incidence of the light emitted from the fiber to the inspection region is set to 50, respectively. ° or 〇°. By performing the transmission illumination simultaneously with the reflected illumination from the oblique direction, the outline of the wiring pattern is also made clear, and the width can be measured. The imaging means 11 is, for example, a CCD sensor or an area sensor having a light receiving sensitivity at the wavelength of the illumination light. On the light incident side of the imaging means 1, a lens (not shown) for expanding and projecting the area where the TAB tape 5 is inspected is provided. The lens is a combination of a plurality of lenses and housed in a lens barrel. The control unit 4 controls the lighting or turning off of the illumination light from the reflected illumination means 12 and the illumination means 13, and the imaging of the imaging means 11, and the control unit 4 is from the detected pits. The size or brightness, and the width of the line of the pattern, to determine the quality of the pattern. For example, if the pit detected by the width of the line relative to the pattern is very small, it may be considered as having no possibility of disconnection, and it is not determined to be a bad situation. The size of the pit is determined from the brightness or size of the pit detected. Therefore, the control unit 4 inputs in advance a reference parameter for judging whether or not it is a pattern line width or the like which is not -12-200846649. The control unit 4 compares the width of the pattern line or the brightness or size of the detected pit with the reference parameter and determines whether it is defective. The operation of imaging the inspection pattern 6 will be described with reference to Fig. 1 . In the TAB tape 5, the same wiring pattern is produced continuously and plurally, and the control unit 4 drives the tape transport mechanism 20 to transport the TAB tape 5 to the inspection unit 1. The inspection pattern 6 to be inspected by #TAB5 is transported to the specific position of the inspection unit 1 by the belt conveyance mechanism 20, and the TAB belt 5 is stopped at this position. The control unit 4 lights the reflected illumination means 1 2 and the LEDs that have passed through the illumination means 13 and simultaneously illuminates the illumination light from the two illumination means 1 2, 13 for the wiring pattern to be inspected. The imaging means 1 1 receives a pattern image that is simultaneously illuminated by the reflection illumination means 1 2 and the transmission illumination means 13 and stores the image in the control unit 4. The illumination light from the reflected illumination means 1 2 is irradiated with an incident angle of 5 〇 ° for the inspection area. As described above, when there is a pit on the surface of the pattern, the reflected light is incident on the imaging means 11, and the portion is imaged bright. Further, the illumination light transmitted from the illumination means 13 is irradiated from the opposite side of the TAB tape 5 to the side on which the pattern is formed, and the inspection area is incident at an angle of 0°. The transmitted light that is not formed in the pattern is incident on the imaging means 1 1, and the portion is imaged to be bright. The portion in which the pattern is formed is imaged to be dark in the imaging device 1 1. Therefore, if a pit is formed on the surface of the case of Fig. -13-200846649, the portion is photographed as a bright portion in a dark pattern. The control unit 4 is a method for widening the width of the pattern (when there is a pit, since the portion appears to be brighter, the line width appears to be thinner), compared with the reference parameter, and Determine if it is bad. When the detected pit is large and is judged to be defective, the control unit 4 stores the position of the defective pattern, and when the pattern is transported to the mark unit 3 by the tape transport mechanism 10 , attaching a mark such as perforation or coloring. When the inspection of the inspection pattern 6 is completed, the TAB belt 5 is conveyed by the belt conveyance mechanism 20, and the inspection pattern to be the next inspection target is conveyed to a specific position of the inspection unit 1. Next, the relationship between the incident angle of the illumination light when the reflected illumination is performed and the image captured by the imaging means will be described. As shown in Fig. 2 (a), in general, the imaging means 1 is disposed directly above the pattern, and the angle of incidence of the illumination light for reflecting illumination is gradually increased from 0 °. . As described above, when the incident angle of the illumination light is 0, in the image pickup section 11, the flat portion of the surface is bright, and the portion where the pit or the projection is generated is photographed as gray. On the other hand, if the illumination light is tilted, as shown in Fig. 2 (a), the light reflected on the flat portion of the surface does not enter the image pickup means. Therefore, the flat portion of the pattern surface is captured as dark in the imaging means 1 1. -14 - 200846649 On the other hand, the part with protrusions or pits is generated as shown in Fig. 2(b), and the light reflected on the slope of the line is incident into the image pickup means. It is captured as bright in the imaging means. The inventors conducted an experiment of changing the angle of incidence of illumination light when performing reflection illumination as described above. As a result, it was found that if the angle of incidence of the illumination light is set to be larger, the portion of the pit is a bright shell, but the portion of the projection is darkened. Further, the angle of incidence of the illumination light refers to an angle 0 in the direction in which the illumination means of the normal to the inspection area is arranged as shown in Fig. 2(a). Further, in the present embodiment, the imaging means is a CCD linear sensor having a length set in advance, and the CCD linear sensor is perpendicular to the direction in which the line sensor extends. In the direction of the meeting, move along with the lighting means and make a picture of the specific area. Fig. 3 is a view showing a specific example of the illumination means 1 2 for performing the reflection illumination. Fig. 3(a)' is an LED 12a used as a light source for illumination means. The LED 12a is an example in which a plurality of on-line side-by-side persons are arranged side by side, and illumination light is incident at an entrance angle of 0 for an inspection area. FIG. 3(b) is a light source as an illumination means. Use halogen lamps. In the case of a halogen lamp, the light from the lamp tube 12d collected by the mirror 12e is guided by the light guiding fiber 12f, and is emitted from the emitting end of the fiber 12f. The light is illuminated to the inspection area. -15- 200846649 The emission end of the light guiding fiber 12f is bundled on the line, and is incident at an incident angle of 0 at any position in the inspection region corresponding to the length of the CCD line sensor. The way is configured obliquely. In Figs. 4, 5, and 6, an image of a portion of the pit and the projection with respect to the angle of incidence of the reflected illumination light is shown. The image on the left side is the portion of the pit. The image on the right side is an image of the portion of the protrusion. In addition, this image is reversed in black and white. That is, the portion photographed in white is a portion where light is not incident on the image pickup means, and the portion photographed as black is a portion where light is incident. Fig. 4 (a) shows a case where the incident angle of the illumination light to the substrate is 0, and Fig. 4 (b) is 20 below. , (c) 2 5 °, (d) 3 0. , (e) 35°, (f) 40. , (g) 45. , (h) 50. , (i) 55. (j) 60°, Fig. 6(k) is 65°, (1) 70. , (m) 75. . In addition, in FIGS. 4, 5, and 6, as the illumination means, the distance shown in FIG. 3(a) is used, and by changing the distance between the reflected illumination means 12 and the normal direction between the inspection areas, The angle of incidence of the illumination light relative to the substrate is varied. When the angle of incidence of FIG. 4(a) is 〇°, the portion of the pit and the portion of the protrusion appear to be the same white (that is, the light is not incident in the imaging means), and Can't make a difference between the two. When the incident angle of FIG. 4(b) is 20°, since the illumination light is tilted, the reflected light of the flat portion of the pattern is not incident on the imaging means, and the portion appears to be changed. White. On the other hand, the portion of the pit or the portion of the projection, since the light reflected on the slope of the pit is incident from -16 to 200846649 to the image pickup means, it appears to be black. However, in this picture, both appear to be equally black, and cannot be distinguished. In the following section of the pit, even if the angle of incidence of the illumination light becomes larger, it seems to have hardly changed. However, if the incident angle is 30 ° ', the black color is light as shown in Fig. 4 (d), and if it is in this state, the pit and the protrusion can be distinguished and detected. . Thereafter, as the angle of incidence of the illumination light increases, the amount of reflected light from the protrusions decreases. On the right, the angle of incidence becomes 3 5 ', as shown in Fig. 4 (e), the color of the protrusion is more faded, and it becomes almost the same white as the surrounding flat portion, so that it can be easily concave only. The pit is detected. Thereafter, until the incident angle of Fig. 5 (h) is 50, the pattern of the pits hardly changes, and only the pits can be easily detected. If the angle of incidence is 55° (Fig. 5 (i)), the image of the pit becomes slightly smaller, but the pit can be sufficiently detected. When the angle of incidence becomes 60° (Fig. 5 ( j )), the color starts to fade, and if it changes to 65° (Fig. 6(k)), it becomes quite light. If it is, it can still be Detection is made possible by the setting of image processing. However, if the angle of incidence is 7 〇 (Fig. 6 (1)) or more, the pits become almost invisible, making detection difficult. Therefore, the incident angle of the reflected illumination light to the inspection region is set to 30. Above 65. In the following range, the most appropriate range is 55° or less, and no protrusion is detected. In the imaged image, if it is detected in -17-200846649, the brightness is measured according to its size or brightness. , it can be judged that there is a pit. The protrusion is generally flat as shown in Fig. 7 (a), and if the angle of incidence of the illumination light incident on the slope is smaller than 30°, the light reflected on the slope will be incident on the camera. Means. However, if the incident angle is 30 or more, it is conceivable that the reflected light system is not incident on the imaging means. On the other hand, the pit is generally as shown in Fig. 7 (b), the unevenness of the slope is relatively sharp, and the illumination light that is incident is disorderly reflected. Therefore, it is conceivable that even the angle of incidence of the illumination light is inclined. When the incident angle is 70° or more, the component of the illumination light that is incident on the pit is reduced, and the composition of the scattered light is reduced to about 65°. See Fig. 8 for a graph showing the luminance distribution obtained from an image obtained by imaging a pattern having pits. Fig. 8 (a) shows that only the oblique direction is performed. Fig. 8(b) shows the case where the reflected illumination and the transmitted illumination are simultaneously performed. Fig. 8 (a) and (b), the horizontal axis of the inspection area is the width direction of the inspection area. The distance, the vertical axis is the relative brightness of the image captured. In Fig. 8 (a), since only the reflected illumination is used, and the portion of the pit is brightly lit, the portion with high brightness near the center of the figure is It is a pit. The relative brightness of the brightness is about 1 而 and the smaller part. In the same figure, the portion of the peak representing the wiring pattern is divided into two, -18-200846649, because The light of the edge is reflected and incident on the imaging means but is incident on the flat portion of the upper portion of the pattern, as shown in Fig. 8 (a). Generally, when only the oblique condition is present, the concave The brightness of the pit is high, and it is easy to determine the line width of the pattern between the wiring pattern and the portion of the substrate. Figure 8 (b) shows: simultaneous reverse, through The transmitted light of the substrate is reflected by the imaging means as a shadow. Therefore, in the present diagram, the portion of the valley where the brightness is low is the portion corresponding to the peak, which corresponds to the portion of the substrate. Generally, the difference in luminance between the portions of the pattern is increased, and the measurement of the line width is small. Moreover, the portion of the pit is detected by reflection illumination, so that the detection of the pit is also possible. With illumination through, concave The portion is imaged as a bright portion in the negative pattern. In the image, the width of the line for detecting the pit and the pattern is specifically exemplified, and the control unit 4 is shown in Fig. 8(b). It is generally not as good as shown below. The image that is captured to the side of the wiring pattern is bright, but the ground that does not enter the direction of the camera's reflection is detected. However, there is almost no difference in brightness, illumination and transmission. In the illumination, the wiring pattern is the line pattern in the luminance distribution, the portion where the brightness is high and the portion of the substrate are easy, and the error is also changed to light, so that the brightness is increased, and the wiring is reflected by the reflection at the same time. Therefore, the measurement can be performed once. The brightness distribution chart shown automatically determines the pattern -19- 200846649. As shown in Fig. 9, the brightness in the above-mentioned brightness distribution chart is set in advance. The level A of the determination level is compared. Since the valley portion having a low luminance is a wiring pattern, for example, when the width of the portion where the brightness is smaller than the determination level A is compared with the reference parameter set in advance, if the width is compared with the reference parameter If it is smaller, it can be judged that it does not satisfy the standard of the width of the wiring pattern. On the other hand, if there is no pit on the surface of the pattern, as shown by the dotted line in the figure, the brightness of the portion of the wiring pattern becomes low, but if a pit is formed on the surface of the pattern, the portion is tied to The dark pattern portion is imaged as a bright portion, and as shown by the solid line in the figure, the brightness becomes high. Therefore, if there is a pit on the surface of the pattern, the width of the portion having a small luminance obtained by judging the level A is reduced as shown in the figure. That is, when comparing the width of the portion which is smaller than the determination level A and the brightness is smaller than the previously set reference parameter, if the width is smaller than the reference parameter, the actual value can be determined. The upper line width is narrow, or there are pits on the wiring pattern. Further, if the pit is small, the change in the line width is small, and it is not considered to be abnormal because the line width is too narrow. As described above, by performing the reflection illumination and the transmission illumination simultaneously, and transmitting the transmitted light and the reflected light of the substrate into the imaging means, the image can be captured from the luminance distribution pattern of the image captured by the imaging means. It is judged whether the line width and the number of pits which are the size of the problem are present, and -20-200846649 can detect the pit and measure the line width of the pattern in the image of the first shot. Therefore, it is possible to inspect the presence or absence of pits and the width of the pattern line in a short time. '[Simple diagram of the drawing] '[Fig. 1] Block diagram Φ of the wiring pattern inspection apparatus of the embodiment of the present invention [Fig. 2] The relationship between the incident angle of the illumination light and the light incident into the imaging means Description of the map. FIG. 3 is a view showing a configuration example of an illumination means for performing reflection illumination. Fig. 4 is a view showing a portrait (1) of a pit and a portion of a projection with respect to an angle of incidence of reflected illumination light. Fig. 5 is a view showing a portrait (2) of a pit and a portion of a projection with respect to an angle of incidence of reflected illumination light. Fig. 6 is a view showing a portrait (3) of a pit and a portion of the protrusion with respect to the angle of incidence of the reflected illumination light. Fig. 7 is a view for explaining the relationship between the light incident on the pit or the protrusion and the light incident on the image pickup unit. Fig. 8 is a graph showing the luminance distribution obtained from an image pickup image having a pattern of pits. Fig. 9 is a view for explaining a method of determining a defect of a pattern by a luminance distribution map. [Fig. 10] A diagram for explaining the case where light is incident on the edge of the wiring pattern - 21 - 200846649 [Fig. η] A diagram for explaining a case where light is incident on a wiring pattern having pits and protrusions. [Description of main component symbols] _ 1 : Inspection unit _ 2 _ Scan device 3 : Symbol portion _ 4 : Control unit 5 : TAB tape 5 1 : Wiring pattern 52 : Substrate 6 : Inspection pattern 11 : Imaging means 1 2 : First illumination means (reflective illumination means) 1 3 : Second illumination means (light transmission means) • 20 : Belt conveyance mechanism 2 1 : Delivery reel 22 : Reel reel 22-