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TW200833187A - Method for producing structured electrically conductive surfaces - Google Patents

Method for producing structured electrically conductive surfaces Download PDF

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Publication number
TW200833187A
TW200833187A TW96137901A TW96137901A TW200833187A TW 200833187 A TW200833187 A TW 200833187A TW 96137901 A TW96137901 A TW 96137901A TW 96137901 A TW96137901 A TW 96137901A TW 200833187 A TW200833187 A TW 200833187A
Authority
TW
Taiwan
Prior art keywords
electroless
layer
particles
electrolytically coatable
adhesive layer
Prior art date
Application number
TW96137901A
Other languages
Chinese (zh)
Inventor
Rene Lochtman
Juergen Kaczun
Norbert Schneider
Juergen Pfister
Norbert Wagner
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Publication of TW200833187A publication Critical patent/TW200833187A/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0347Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0522Using an adhesive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0528Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a method for producing structured or full-surface electrically conductive surfaces on an electrically nonconductive support (1), which comprises the following steps: (a) applying an adhesive layer (3) onto the electrically nonconductive support (1), the adhesive layer (3) having the structure of the electrically conductive surface, (b) transferring electrolessly and/or electrolytically coatable particles (41) from a transfer medium (5) onto the adhesive layer (3), the electrolessly and/or electrolytically coatable particles (41) being applied as a layer on the transfer medium (5), (c) removing the transfer medium (5), (d) at least partially drying and/or at least partially curing the adhesive of the adhesive layer (3), so that the electrolessly and/or electrolytically coatable particles (41) become bound to the adhesive layer (3) and a base layer (31) is thus formed, (e) applying a metal layer onto the electrolessly and/or electrolytically coatable particles (41), adhering on the electrically nonconductive support (1) by means of the adhesive layer (3), by electroless and/or electrolytic coating.

Description

200833187 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種用以在一非導電支撐件上產生結構性 及/或全表面導電表面之方法。200833187 IX. DESCRIPTION OF THE INVENTION: Field of the Invention The present invention relates to a method for producing a structural and/or full surface conductive surface on a non-conductive support.

本發明之方法適用於(例如)生產印刷電路板上之導體執 道、RFID天線、轉發器天線或其他天線結構、晶片卡模 組、扁平電纜、座椅加熱器、箔導體、太陽能電池中或 /電水螢幕中之導體軌道或任何形式之電解塗佈產品。 b方法亦適用於在產品上產生裝飾性或功能性表面,該等 表面用於(例如)屏蔽電磁輻射、用於熱傳導或用作封裝。 【先前技術】 一般而言,為產生該等結構性或全表面導電表面,首先 將、、’d構性或全表面黏結層施加至非導電支樓件上。將金 屬/或金屬粉末固定於此黏結層上。或者,亦已知將金屬 泊或金屬層全表面地施加至由塑膠材料製成之支撐體上, 精助於-結構性、經加熱印模將其壓抵支撐體且藉由隨後 使其固化來將其藉由機械移除未連接至黏結層或支 撐體之金屬癌或金屬粉末之區域而使金屬層結構化。該方 法描述於(例如)DE-A 101 45 749中。此方法之—缺點在 於,在塗覆基層H,必須再次移除此外有時不能再使用 之大量材料。在金屬羯之狀況下’不可能產生銳利邊緣, 此係由於該箱不能被適當轉移 '然而,此等銳利邊緣用於 (例如)產生(例如)供印刷電路板或RFID天線用之導體軌 道。未完全切割之羯(例如)將引起短路。在機械移除過量 125205.doc 200833187 金屬粉末或過量箔之狀況下,可能會繼而同樣地部分移除 導體軌道結構,使得此等導體軌道不再具功能性。 自EP-A 0 130 462已知,對於其中含有金屬粒子之熱固 化樹脂層而言,至少一些由貴金屬組成之粒子將以結構化 方式塗覆於一轉移表面上。隨後使轉移介質與支撐體經由 施加有樹脂及含金屬粒子之層之側面接觸。在此狀況下, 以使得以待產生之結構性表面之形式將含有金屬粒子之層 自轉移介質轉移至支撐體上之方式,另字一黏接層施加至: 有金屬粒子之層上或支撐體上。 該方法之一缺點在於,介於15〇0111至42〇|11111範圍内之所 使用之金屬粒子尺寸不可能產生超細導體軌道結構,亦 即,小於100 μιη之導體軌道結構。此外,所提議之方法需 要大量昂貴貴金屬,諸如銀。另一缺點在於,使用以大比 例金屬填充之墨水很難以高解析度印刷。此外,在此狀況 下,多餘大量金屬被轉移,此係由於即使在剩餘處理中在 表面上僅需一薄金屬層,整個金屬填充墨水層亦自中間載 體轉移至基板上。當使含有金屬之結構性墨水自中間支撐 件轉移至基板上時,薄導體軌道結構不會共同轉移且由此 將在導體軌道中產生缺陷之風險出現。該方法之另一缺點 在於在轉移含有金屬之結構性層之前,在將金屬層轉移至 基板上之前需要一額外接觸步驟以達成用於隨後電鍍之足 夠傳導率。 & 此外,所述化學金屬化在電鍍系統中需要長滞留時間, 且由此導致低生產率以及高成本。 125205.doc 200833187 【發明内容】 本發明之一目的為提供不具有自先前技術已知之方法 缺點的方法。 該目的係藉由用以在一非導電支撐件上產生結構性或全 區域導電表面之方法來達成,該方法包含以下步驟: (4將一黏接層施加至該非導電支撐件上,該黏接芦呈 該導電表面之結構;The method of the present invention is applicable, for example, to the production of conductor tracks on printed circuit boards, RFID antennas, repeater antennas or other antenna structures, wafer card modules, flat cables, seat heaters, foil conductors, solar cells, or Conductor track in electric water screen or any form of electrolytic coating product. The b method is also suitable for producing decorative or functional surfaces on a product that are used, for example, to shield electromagnetic radiation, for heat conduction, or for use as a package. [Prior Art] In general, to produce such structural or full-surface conductive surfaces, a 'd-structured or full-surface bonding layer is first applied to the non-conductive branch. A metal/or metal powder is fixed to the bonding layer. Alternatively, it is also known to apply a metal mooring or metal layer to the support made of plastic material over the entire surface, to assist the structurally, heated stamp to press it against the support and subsequently cure it. The metal layer is structured by mechanically removing areas of the metal cancer or metal powder that are not attached to the bonding layer or support. This method is described, for example, in DE-A 101 45 749. The disadvantage of this method is that, in the coating of the substrate H, a large amount of material which is sometimes not reusable must be removed. In the case of a metal crucible, it is impossible to produce a sharp edge because the box cannot be properly transferred. However, such sharp edges are used, for example, to produce, for example, conductor tracks for printed circuit boards or RFID antennas. A flaw that is not completely cut (for example) will cause a short circuit. In the case of mechanical removal of excess metal or excess foil, the conductor track structure may be removed in part, such that the conductor tracks are no longer functional. It is known from EP-A 0 130 462 that for a layer of a thermosetting resin containing metal particles therein, at least some particles composed of a noble metal will be applied in a structured manner to a transfer surface. The transfer medium is then brought into contact with the support via the side to which the resin and the metal-containing particles are applied. In this case, in a manner such that the layer containing the metal particles is transferred from the transfer medium to the support in the form of a structural surface to be produced, a different adhesive layer is applied to: a layer having metal particles or supporting Physically. One disadvantage of this method is that the size of the metal particles used in the range of 15〇0111 to 42〇|11111 is unlikely to result in an ultrafine conductor track structure, i.e., a conductor track structure of less than 100 μηη. In addition, the proposed method requires a large amount of expensive precious metals such as silver. Another disadvantage is that it is difficult to print with high resolution using ink filled with a large proportion of metal. Further, in this case, a large amount of metal is transferred, because even if only a thin metal layer is required on the surface in the remaining process, the entire metal-filled ink layer is transferred from the intermediate carrier to the substrate. When the structural ink containing metal is transferred from the intermediate support to the substrate, the thin conductor track structures do not collectively transfer and thus the risk of defects occurring in the conductor tracks occurs. Another disadvantage of this method is that an additional contact step is required to achieve sufficient conductivity for subsequent plating before transferring the metal layer onto the substrate prior to transferring the structural layer containing the metal. & Furthermore, the chemical metallization requires a long residence time in the electroplating system, and thus results in low productivity and high cost. 125205.doc 200833187 SUMMARY OF THE INVENTION One object of the present invention is to provide a method that does not have the disadvantages of the methods known from the prior art. The object is achieved by a method for producing a structural or full-area conductive surface on a non-conductive support member, the method comprising the steps of: (4 applying an adhesive layer to the non-conductive support, the adhesive The connection of the reed to the conductive surface;

㈨將無電及/或電解可塗粒子自轉移介f轉移至黏接層 上,該等無電及/或電解可塗粒子以一層形式、較佳二 一單層形式而施加至該轉移介質上; 0)移除轉移介質; (d) ^少部分乾燥及/或至少冑分固化黏接層之勸接劑,使 得無電及/或電解可塗粒子變得黏合至黏接層且由此形 成一基層; ^ 一金屬層施加至該等無電 於黏接層黏附$非導電支 (e)藉由無電及/或電解塗佈,將 及/或電解可塗粒子上,藉助 撐件上。 。舉例而a ’⑨質或可撓性支撐件適用作導電結構性或入 區域表面可施加於其上之支撐件。該支撐件較佳為非導; 〖生的。此忍明電阻率大於1〇9 Qxcm。合適之支撐件為(例 ,)力強或未加強聚合物,諸如習知地用於印刷電路板之 /等聚3物5適之聚合物為環氧樹脂或經改質之環氧樹 月士曰(,如,雙官能或多官能雙盼A或雙紛F樹脂、環氧,酸 樹月曰/臭化ί衣氧樹脂、芳族聚醯胺加強或玻璃、纖維加強或 125205.doc 200833187 紙加強之環氧樹脂(例如,FR4))、玻璃纖維加強之塑膠、 液晶聚合物(LCP)、聚苯硫醚(PPS)、聚甲醛(POM)、聚芳 基醚酮(PAEK)、聚醚醚酮(PEEK)、聚醯胺(PA)、聚碳酸酯 (PC)、聚對苯二甲酸丁二醇酯(PBT)、聚對苯二甲酸乙二 醇酯(PET)、聚醯亞胺(PI)、聚醯亞胺樹脂、氰酸酯、雙馬 來醯亞胺-三嗓樹脂、耐綸(nylon)、乙烯酯樹脂、聚酯、 聚酯樹脂、聚醯胺、聚苯胺(polyaniline)、盼樹脂、聚吼 咯、聚萘二甲酸乙二酯(PEN)、聚甲基丙烯酸甲酯、聚乙 烯二氧噻吩、酚系樹脂塗佈之芳族聚醯胺紙、聚四氟乙烯 (PTFE)、三聚氰胺樹脂、聚矽氧樹脂、氟樹脂、烯丙基化 聚苯醚(APPE)、聚醚醯亞胺(PEI)、聚苯醚(PPO)、聚丙烯 (PP)、聚乙烯(PE)、聚砜(PSU)、聚醚砜(PES)、聚芳基醯 胺(PAA)、聚氯乙烯(PVC)、聚苯乙烯(PS)、丙烯腈-丁二 烯-苯乙烯(ABS)、丙烯腈-苯乙烯丙烯酸酯(ASA)、苯乙烯 丙烯腈(SAN)及前述聚合物中之兩者或兩者以上之混合物 (摻合物),其可以多種形式存在。基板可包含熟習此項技 術者已知之添加劑,例如阻燃劑。 印刷電路工業中習知之其他基板亦適合。 此外,複合材料、泡沫狀聚合物、Styropor⑧、 Styrodur⑧、聚胺基曱酸酯(PU)、陶瓷表面、紡織品、紙 漿、木板、紙張、聚合物塗佈之紙、木材、礦物材料、 矽、玻璃、植物組織及動物組織為合適之基板。 基板可為硬質或可撓性的。 在第一步驟中,將一具有結構性或全表面基層之形狀之 I25205.doc -10- 200833187 黏接層施加至非導電支撐件上。 舉例而$ ’天然及合成人 / 及八㈣Ht" 物及其诃生物、天然樹脂以 及合成樹脂及其衍生物、 天然橡膠、合成橡膠、蛋白質等 適用作用於黏接層之材料,σ 、 卄,、要其黏附至支撐材料上即 可。其可(但無需)經化學或物 ^予忒物理固化,例如空氣固化、 射固化或溫度固化。 用於黏接層之材料較佳為聚合物或聚合物摻合物。(9) transferring electroless and/or electrolytically coatable particles from the transfer medium f to the adhesive layer, wherein the electroless and/or electrolytically coatable particles are applied to the transfer medium in a layer form, preferably a two-layer form; 0) removing the transfer medium; (d) ^ a small portion of the drying agent and/or at least the curing agent of the cured adhesive layer, such that the electroless and/or electrolytically coatable particles become bonded to the adhesive layer and thereby form a The base layer; ^ a metal layer applied to the non-electrical adhesion layer of the non-conductive layer (e) by electroless and/or electrolytic coating, and/or electrolysis of the coatable particles, by means of the support. . For example, a'9 or flexible support is suitable for use as a conductive structural or support member to which the surface of the region can be applied. The support member is preferably non-conductive; This fortune resistivity is greater than 1〇9 Qxcm. Suitable supports are, for example, strong or unreinforced polymers, such as are conventionally used in printed circuit boards/isomeric materials. 5 Suitable polymers are epoxy resins or modified epoxy trees. Gentry (eg, bifunctional or polyfunctional double-anti-A or double-F resin, epoxy, acid tree sorghum/smelly oxime, aromatic polyamine reinforced or glass, fiber reinforced or 125205.doc 200833187 Paper reinforced epoxy resin (eg FR4)), glass fiber reinforced plastic, liquid crystal polymer (LCP), polyphenylene sulfide (PPS), polyoxymethylene (POM), polyaryl ether ketone (PAEK), Polyetheretherketone (PEEK), polydecylamine (PA), polycarbonate (PC), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyfluorene Imine (PI), polyimine resin, cyanate ester, bismaleimide-triterpene resin, nylon, vinyl ester resin, polyester, polyester resin, polyamide, polyaniline (polyaniline), expectant resin, polypyrrole, polyethylene naphthalate (PEN), polymethyl methacrylate, polyethylene dioxythiophene, phenolic resin coated aromatic polyamide paper Polytetrafluoroethylene (PTFE), melamine resin, polyoxyn epoxide, fluororesin, allylated polyphenylene ether (APPE), polyether phthalimide (PEI), polyphenylene ether (PPO), polypropylene (PP) ), polyethylene (PE), polysulfone (PSU), polyethersulfone (PES), polyarylamine (PAA), polyvinyl chloride (PVC), polystyrene (PS), acrylonitrile-butadiene a mixture (blend) of styrene (ABS), acrylonitrile-styrene acrylate (ASA), styrene acrylonitrile (SAN), and two or more of the foregoing polymers, which may exist in various forms . The substrate may comprise additives known to those skilled in the art, such as flame retardants. Other substrates known in the printed circuit industry are also suitable. In addition, composites, foamed polymers, Styropor 8, Styrodur 8, polyurethane (PU), ceramic surfaces, textiles, pulp, wood, paper, polymer coated paper, wood, mineral materials, tantalum, glass , plant tissue and animal tissue are suitable substrates. The substrate can be rigid or flexible. In a first step, an I25205.doc -10- 200833187 adhesive layer having the shape of a structural or full surface base layer is applied to the non-conductive support. For example, $ 'natural and synthetic human / and eight (four) Ht " and its biological, natural resin and synthetic resin and its derivatives, natural rubber, synthetic rubber, protein and other materials suitable for the adhesive layer, σ, 卄, Just attach it to the support material. It may, but need not, be chemically or chemically cured, such as air curing, radiation curing or temperature curing. The material used for the adhesive layer is preferably a polymer or polymer blend.

較佳作為用於黏接層之材料之聚合物為(例如)丙稀酸系 丙烯酸酿;醇酸樹脂;絲乙酸乙烯醋;院基乙酸乙烯醋 ’、聚物;t其亞甲基乙酸乙烯酯、乙稀乙酸乙烯酯、丁烯 乙酸乙烯醋;伸烷基氯乙烯共聚物;絲樹脂;醛及酮樹 脂;環氧丙烯酸醋;環氧樹脂;、經改質之環氧樹脂,例如 雙官能或多官能雙酚A或雙酚F樹脂、環氧-酚醛樹脂、溴 化環氧樹脂、環脂族環氧樹脂;脂族環氧樹脂、環氧丙基 醚、乙烯基醚、乙烯_丙烯酸共聚物;烴樹脂;三聚氰胺 樹脂、順丁烯二酸酐共聚物;甲基丙烯酸酯;天然橡膠; 合成橡膠;氯橡膠;天然樹脂;松香樹脂;酚系樹脂;聚 酉旨,聚自旨樹脂,諸如苯酯樹脂;聚硬;聚鱗硬;聚醯胺; 聚丁 一稀;聚碳酸酯,·聚酯丙烯酸酯;聚峻丙浠酸酯;聚 乙烯;聚乙烯噻吩;聚萘二甲酸乙二酯;聚對苯二甲酸乙 二醇酯(PET);聚對苯二曱酸乙二醇酯(PETG);聚丙烯; 聚甲基丙烯酸甲酯(PMMA);聚苯醚(PPO);聚苯乙歸 (PS)、聚四氫呋喃;聚醚(例如,聚乙二醇、聚丙二醇); 聚乙烯基化合物,尤其聚氯乙烯(PVC)、PVC共聚物、 I25205.doc 11 200833187 PVdC、聚乙酸乙烯酯以及其共聚物,視情況部分水解之 聚乙烯醇、聚乙烯縮酸、聚乙酸乙婦酯、聚乙烯吼U各啶 酮、I乙烯_、於溶液中及以分散液形式之聚丙稀酸乙烯 醋及甲基丙烯酸酯以及其共聚物、聚丙烯酸酯與聚苯乙烯 共聚物;未交聯或與異氰酸酯交聯之聚胺基甲酸酯;聚胺 基甲酸酯丙烯酸酯;苯乙烯丙烯酸系共聚物;苯乙烯丁二 烯嵌段共聚物(例如,購自BASF AG之styroflex®或 Styrolux®、購自cpC之K_ResinTM);蛋白質,例如酪蛋 白,苯乙烯異戊二烯嵌段共聚物;三嗪樹脂、雙馬來醯亞 胺三嗓樹脂(BT)、氰酸酯樹脂(CE)、烯丙基化聚苯醚 (APPE)。兩種或兩種以上聚合物之混合物亦可形成用於黏 接層之材料。 尤其較佳作為用於黏接層之材料之聚合物為丙烯酸酯、 丙烯酸系樹脂、甲基丙烯酸酯、甲基丙烯酸系樹脂、三聚 氰胺及胺基樹脂、聚烯烴、聚醯亞胺、環氧樹脂、經改質 之環氧樹脂(例如,雙官能或多官能雙酚A或雙酚F樹脂、 環氧-酚醛樹脂、溴化環氧樹脂、環脂族環氧樹脂);脂族 環氧樹脂、環氧丙基醚、乙烯基醚及酚系樹脂、聚胺基甲 酸醋、聚,、聚乙稀縮醛、$乙酸乙烯肩、聚苯乙烯共聚 物、聚苯乙烯丙烯酸酯、苯乙烯丁二烯嵌段共聚物、烯基 乙酸乙烯酯與氯乙烯共聚物、聚醯胺及其共聚物。 作為在生產印刷電路板時用於黏接層之材料,較佳使用 熱固化或輻射固化樹脂,例如經改質之環氧樹脂,諸如雙 官能或多官能雙酚A或雙酚F樹脂、環氧_酚醛樹脂、溴化 125205.doc -12- 200833187 環氧樹脂、環脂族環氧樹脂;脂族環氧樹脂、環氧丙基 喊:氰酸輯、乙埽基越、紛系樹脂、三聚氰胺樹脂及胺基 树月曰、聚胺基甲酸酯及聚酯。 為能將用於黏接層之材料塗覆至非導電支#件上,此外 可添加溶劑或溶劑混合物以調整適用於個別塗覆方法之黏 度0 合適之溶劑為(例如)脂族及芳族烴(例如,正辛烷、環己 烧、曱笨、二甲苯)、醇(例如,甲醇、乙醇、卜丙醇、2· 丙醇、1-丁醇、2-丁醇、戊醇)、多價醇(諸如,丙三醇、 乙二醇、丙二醇、新戊二醇)、烷酯(例如,乙酸甲酯、乙 酸乙酯、乙酸丙酯、乙酸丁酯、乙酸異丁酯、乙酸異丙 酯、3-甲基丁醇)、烷氧基醇(例如,甲氧基丙醇、甲氧基 丁醇、乙氧基丙醇)、烧基苯(例如,乙苯、異丙基苯)、丁 基乙二醇、二丁基乙二醇(dibutyl glycol)、烷基乙二醇乙 酸酯(alkyl glycol acetate)(例如,丁基乙二醇乙酸酿、二 丁基乙一醇乙酸|旨)、一丙酮醇、二乙二醇二烧基鱗、二 乙一醇单烧基鱗、二丙二醇二烧基峻、二丙二醇單烧基 醚、二乙二醇烷基醚乙酸酯、二丙二醇烷基醚乙酸g旨、二 11惡燒、二丙二醇及醚、二乙二醇及鱗、二元酯(DBJE)、醚 (例如,二乙醚、四氫呋喃)、氯乙烯、乙二醇、乙二醇乙 酸酯、乙二醇二曱酯、甲酚、内酯(例如,丁内酯)、酮(例 如,丙酮、2- 丁酮、環己酮、甲基乙基酮(MEK)、甲基異 丁基酮(MIBK))、乙二醇二甲醚、二氯甲烷、甲烯乙二醇 (methylene glycol)、甲烯乙二醇乙酸酯、甲紛(鄰曱紛、間 125205.doc -13- 200833187 甲酚、對曱酚)、响咯啶酮(例如,N_甲茂 丙二醇、碳酸丙二醋、四氯化 …比州)、 叫芳族煙及混合物、脂族煙及::合物三:甲㈣ 糊如,松脂醇)、水及此等溶劑中之:早松烯 混合物。 者或兩者以上之 較佳溶劑為醇(例如,乙醇、 烧氧基醇(例如,甲氧基丙 :2·丙醇、丁醇)、 醇、二丁基乙二醇) 乳基兩醇、丁基乙 二醇單烷基醚、二丙 酯(例如,乙酸乙酯 丁基乙二醇乙酸酯、 基_乙酸g旨、DBE) 如,丙三醇、乙二醇 丁内S曰、二乙二醇二烷基醚、二乙 -醇一烷基_、二丙二醇單烷基醚、 乙酸丁酯、丁基乙二醇乙酸酯、二 _乙二醇烷基醚乙酸酯、二丙二醇烷 鱗(例如’四氫呋喃)、多價醇(諸 _、田丙二醇、新戊二醇)、酮(例如,丙 甲基乙基®g、甲基異丁基 己院、乙苯、甲苯、二甲苯/N衣己⑹、煙(例如,環 其混合物。 ·甲基-2-吡咯啶酮、水及 若使用喷墨法將黏接層施加至切件上,則烧氧基醇 (例如,乙氧基丙醇)、丁基乙二醇、二丁基乙二醇及多價 醉(諸如丙三醇)、醋(例如,二丁基乙二醇乙酸酯、丁基乙 二醇乙酸醋、二丙二醇甲基趟乙酸輯)、水、環己酮、丁 内醋、N·甲基-吼》各相、DM及其混合物作為溶劑尤其 較佳。 在用於黏接層之液態材料(例如,液態環氧樹脂、丙烯 酸酯)之狀況下,各別黏度可替代地經由塗覆期間之溫 125205.doc -14- 200833187 度’或經由溶劑與溫度之組合來調整。 在第二步驟中,將無電及/或電解可塗粒子自轉移介質 轉移至黏接層±,該等無電及/或電解可塗粒+以一層形 式、較佳以一單層形式施加至該轉移介質上。 一皁層無電及/或電解可塗粒子之優勢在於,在目標基 板之黏接層之表面上僅存在無電及/或電解可塗粒子之: 薄層。一單層亦較為經濟’此係由於消耗較少無電及/或 電解可塗材料。此等粒子黏附至黏接層上同樣較佳,此係 由於每個轉移粒子與黏接劑直接接觸。 無電及/或電解可塗粒子可塗覆於其上之任何硬質或可 挽性支撐件適用作轉移介質。用於轉移介質之合適材料為 (例如)金屬、玻璃、陶瓷、塑膠或任何複合材料。 在第-實施例中’將具有少量黏合劑及視情況其他添加 州(例如,分政劑、流動控制劑、腐餘抑制劑等)之無電及/ 或電解可塗粒子分散於溶劑中或(例如)藉由印刷n 輥軋、刀片刮抹或喷霧方法塗覆至轉移介質上。與用於隨 後黏接層相同之材料較佳用作黏合劑。 遇 為使無電及/或電解可塗粒子在轉移至非導電支撐件上 之後可易於舆轉移介質分離’無電及/或電解可塗粒子藉 以黏附至轉移介質上之黏合劑的量及類型經選擇使得該等 3 無電及/或電解可塗粒子僅較弱地黏附至轉移介質上◊轉 移後,無電及/或電解可塗粒子由此比在轉移介質上更強 地黏附至支撐件之黏接層上,使得可在不會自支揮件之黏 接層連同轉#介質一起帶走無電及/或電解可塗粒子的情 125205.doc -15· 200833187 況下移除該轉移介質。 在一較佳實施例令,繞兩個機械軸運轉之至少一環形帶 子或至少-滾筒用作轉移介質。藉由(例如)印刷、澆鑄贡 輥乳、刀片刮抹或噴霧方法將無電及/或電解可塗^子及 黏合劑之分散液塗覆至環形帶子或滾筒上。所塗覆之分 2乾燥層厚度經選擇使得其大致對應於導電粒子之直 2。由其所達成之效果為,僅將—單層粒子塗覆至轉移介 貝上即使層厚度大於粒子直徑L粒子層内之少旦 =,無電及/或電解可塗粒子之内聚力很低,使得在 曰至基板上之隨後轉移期間僅轉移—單層粒子。 ^覆及至少部分乾燥分散液後,使環形帶子或滾筒較 二:一碌光滾筒與結構性或全表面黏接層施加於其上之 =支撐件接觸。在此狀況下,非導電支撐件較佳以與 二筒相同之速度移動。在其上施加有黏接層之 非¥電支撐件與塗覆右 伋有…電及/或電解可塗粒子之環形帶 ^r湾接觸期間’將該等無電及/或電解可塗粒子自該 子或該滾筒轉移至該非導電支樓件上。環形帶子或 展缚亦可用作用於支撐 外傳m 牛之傳^構件,但亦可能使用-額 經同:上或在多侧上進行’在此狀況下’兩側係 ^錢經複數個^相繼㈣,或轉 上 側與下侧上同時發生。 移除仍Γ/p1貝及非導電支撐件已再次分離後,自轉移介質 ㈣Μ轉移介質上之至少部分乾燥分散液之殘餘 125205.doc -16- 200833187 物,例如黏合劑及無電及/或電解可塗粒子。可(例如)以磁 性方式、以機械方式或藉由洗滌來進行清潔。 對於機械清潔而言,例如,自轉移介質到去至少部分乾 燥分散液之殘餘物之刮刀在該轉移介質之上導引。所刮去 之分散液殘餘物隨後可(例如)直接或在清潔及/或分離無電 及/或電解可塗粒子之後再使用,作為用於製備分散液之 <始物f。^可藉由(例如)黏合劑溶解於其中之溶劑來 • 騎。上文已描述之所有溶劑皆適用於此目的,但分散液 之溶劑較佳使得(例如)分散液殘餘物可再循環。較佳選擇 與非導電支擇件上之黏接劑相容或混溶或在固化時可與黏 接劑反應之黏合劑。 -較佳藉由(例如)印刷、洗鑄、輥軋、刀片刮抹或噴霧, 藉由(例如)連續塗佈將具有無電及/或電解可塗粒子、黏合 劑及/或溶劑之分散液塗覆至轉移介質上。 作為%形帶子或滾筒之一替代物,亦可能提供一硬質支 • 撐件作為轉移介質。當硬質支撐件用作轉移介質時,首先 將包含無電及/或電解可塗粒子之分散液塗覆至其上,且 ^後使用經界定之施加壓力使該硬質支撐件與非導電支撐 • 件接觸。在轉移無電及/或電解可塗粒子之後,將用作轉 移介質之硬質支撐件與非導電支撐件分離,使得該等無電 及/或電解可塗粒子保持黏附至該非導電支撐件上之黏接 劑。當使用硬質支撐件作為轉移介質時,亦必須在轉移無 電及/或電解可塗粒子之後、在將硬質支撐件再次以黏接 劑及無電及/或電解可塗粒子塗佈之前,移除未轉移至非 125205.doc -17- 200833187 撐件及黏接層上之粒子。同樣,如在環 同之狀,下’例如,作為轉移介質之硬質切件藉由f 刷、澆鑄、輥軋、刀片刮抹或噴霧來塗佈。 ρ 轉移介質亦可能為已塗佈—層、較佳係—單層益 電及/或電解可塗粒子且自落卷(f〇il st〇re)展開 最 初亦可能未經塗佈,且無電及/或電解可立 :最 箔展開後塗覆至箔上。如先t ,、了此在 …4 , 无刖用於㈣帶子、滾筒或硬質 支撐件,粒子可(例如)以分散液形式塗覆 貝、 電解可塗粒子轉移至非導電支 、”、、、及/或 將其捲攏且隨後處理來收集。件之後1係(例如)藉 而:另一實施例中’無電及/或電解可塗粒子藉助於磁力 =附至轉移介質上。在此狀況下,一方面,轉移介質二 jc久:除材料製成’但另一方面’亦可能沿著磁鐵(例如 水久磁鐵或電磁鐵)饋入轉移介f,使❹ 塗粒子固持於轉移介質上。 S電解可 在此狀況下’磁力將經選擇使得在與非導電支揮件 =接劑接觸期間’粒子保持黏附至黏接層且自轉移介質脫 在-實施例中,將無電及/或電解可塗磁性粒子於溶劑 =刀政液塗覆至-硬f或可撓性磁性支撐件(例如,磁 上,但不添加聚合黏合劑。在此狀況下,塗佈可(例 —精〜由印刷、洗鑄、親乳、刀片刮抹或喷霧來進行。在 療發洛劑之後’獲得一層粒子,其藉助於磁力黏附至磁性 支#件上所塗覆之分散液之乾燥層厚度係經選擇使得其 125205.doc -18- 200833187 大致對應於無電及/或電解可塗磁性粒子之直徑。隨後使 磁性轉移層與非導電支撐件上之黏接層接觸。無電及/或 電解可塗粒子接著黏附至黏接層上。在此實施例中,由於 黏性支撐件上之粒子層未藉由黏合劑而内聚性地固持在一 起,因此僅一單層無電及/或電解可塗粒子可轉移至非導 電支撐件上之黏接層上。繼續處理時,在已塗佈黏接層 後,(例如)藉助於施加AC場之磁鐵或藉由切斷及/或移除Preferred as the material for the adhesive layer is, for example, acrylic acid acrylic; alkyd resin; silk vinyl acetate; hospital based vinyl acetate vinegar, polymer; t its methylene vinyl acetate Ester, ethylene vinyl acetate, butylene vinyl acetate; alkyl chloride copolymer; silk resin; aldehyde and ketone resin; epoxy acrylate vinegar; epoxy resin; modified epoxy resin, such as double Functional or polyfunctional bisphenol A or bisphenol F resin, epoxy-phenolic resin, brominated epoxy resin, cycloaliphatic epoxy resin; aliphatic epoxy resin, epoxy propyl ether, vinyl ether, ethylene _ Acrylic copolymer; hydrocarbon resin; melamine resin, maleic anhydride copolymer; methacrylate; natural rubber; synthetic rubber; chlorine rubber; natural resin; rosin resin; phenolic resin; , such as phenyl ester resin; polyhard; polyscale hard; polyamide; polybutadiene; polycarbonate, · polyester acrylate; poly phthalate; polyethylene; polyethylene thiophene; Ethylene glycol; polyethylene terephthalate PET); polyethylene terephthalate (PETG); polypropylene; polymethyl methacrylate (PMMA); polyphenylene ether (PPO); polystyrene (PS), polytetrahydrofuran; polyether (eg, polyethylene glycol, polypropylene glycol); polyvinyl compounds, especially polyvinyl chloride (PVC), PVC copolymer, I25205.doc 11 200833187 PVdC, polyvinyl acetate and copolymers thereof, partially hydrolyzed Polyvinyl alcohol, polyvinyl acid, polyethylene acetate, polyethylene sulfonate, I ethylene _, polyacrylic acid vinyl vinegar and methacrylate in solution and in the form of a dispersion and copolymers thereof , polyacrylate and polystyrene copolymer; polyurethane which is not crosslinked or crosslinked with isocyanate; polyurethane acrylate; styrene acrylic copolymer; styrene butadiene block Copolymers (for example, styroflex® or Styrolux® from BASF AG, K_ResinTM from cpC); proteins such as casein, styrene isoprene block copolymers; triazine resins, bismaleimide Triterpenoid resin (BT), cyanate resin (CE), allylated polyphenylene Ether (APPE). Mixtures of two or more polymers may also form a material for the adhesive layer. Particularly preferred as the material for the adhesive layer are acrylate, acrylic resin, methacrylate, methacrylic resin, melamine and amine based resin, polyolefin, polyimine, epoxy resin. Modified epoxy resin (for example, difunctional or polyfunctional bisphenol A or bisphenol F resin, epoxy-phenolic resin, brominated epoxy resin, cycloaliphatic epoxy resin); aliphatic epoxy resin , epoxidized propyl ether, vinyl ether and phenolic resin, polyurethane urethane, poly, polyacetal acetal, vinyl acetate shoulder, polystyrene copolymer, polystyrene acrylate, styrene A diene block copolymer, an alkenyl vinyl acetate and a vinyl chloride copolymer, a polydecylamine, and a copolymer thereof. As a material for the adhesive layer in the production of a printed circuit board, it is preferred to use a heat curing or radiation curing resin such as a modified epoxy resin such as a bifunctional or polyfunctional bisphenol A or bisphenol F resin, a ring. Oxygen phenolic resin, bromine 125205.doc -12- 200833187 epoxy resin, cycloaliphatic epoxy resin; aliphatic epoxy resin, epoxy propyl shrine: cyanate series, acetamidine, variegated resin, Melamine resin and amine tree sorghum, polyurethane and polyester. In order to apply the material for the adhesive layer to the non-conductive support member, a solvent or a solvent mixture may be added to adjust the viscosity suitable for the individual coating method. Suitable solvents are, for example, aliphatic and aromatic. Hydrocarbons (eg, n-octane, cyclohexane, oxime, xylene), alcohols (eg, methanol, ethanol, propanol, 2-propanol, 1-butanol, 2-butanol, pentanol), Polyvalent alcohols (such as glycerol, ethylene glycol, propylene glycol, neopentyl glycol), alkyl esters (eg, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, isobutyl acetate, acetic acid) Propyl ester, 3-methylbutanol), alkoxy alcohol (eg, methoxypropanol, methoxybutanol, ethoxypropanol), alkylbenzene (eg, ethylbenzene, cumene) ), butyl glycol, dibutyl glycol, alkyl glycol acetate (eg, butyl glycol acetate, dibutyl glycol acetate | Purpose), monoacetone alcohol, diethylene glycol dialkyl squama, diethylene glycol monoalkyl sulphate, dipropylene glycol dialkyl sulphate, dipropylene glycol monoalkyl ether, Ethylene glycol alkyl ether acetate, dipropylene glycol alkyl ether acetic acid g, di 11 methane, dipropylene glycol and ether, diethylene glycol and squama, dibasic ester (DBJE), ether (for example, diethyl ether, Tetrahydrofuran), vinyl chloride, ethylene glycol, ethylene glycol acetate, ethylene glycol diester, cresol, lactone (eg, butyrolactone), ketone (eg, acetone, 2-butanone, cyclohexane) Ketone, methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), ethylene glycol dimethyl ether, dichloromethane, methamethylene glycol, methyl glycol glycol Ester, a categorical (neighbor, arsenic, 125205.doc -13- 200833187 cresol, p-nonylphenol), copradinone (for example, N-methyl propylene glycol, propylene carbonate, tetrachlorinated ... than the state) , called aromatic smoke and mixture, aliphatic smoke and:: compound three: a (four) paste, rosin alcohol), water and these solvents: early pine mixture. Preferred solvents for the two or more are alcohols (for example, ethanol, an alkoxy alcohol (for example, methoxypropyl: 2. propanol, butanol), an alcohol, a dibutyl glycol), a lactyl alcohol Butyl glycol monoalkyl ether, dipropyl ester (for example, ethyl acetate butyl glycol acetate, base - acetic acid g, DBE), such as glycerol, ethylene glycol butane S , diethylene glycol dialkyl ether, diethyl alcohol monoalkyl _, dipropylene glycol monoalkyl ether, butyl acetate, butyl glycol acetate, di-glycol alkyl ether acetate , dipropylene glycol alkane scales (eg 'tetrahydrofuran'), polyvalent alcohols (such as _, propylene glycol, neopentyl glycol), ketones (eg, propylmethylethyl® g, methyl isobutyl hexyl, ethylbenzene, Toluene, xylene/N hexose (6), smoke (for example, a mixture of rings), methyl-2-pyrrolidone, water, and if an adhesive layer is applied to the cut member by an inkjet method, the oxyalcohol (eg, ethoxypropanol), butyl glycol, dibutyl glycol, and polyvalent drunk (such as glycerol), vinegar (eg, dibutyl glycol acetate, butyl b) Glycol acetate vinegar, dipropylene It is especially preferred to use a solvent such as diol methyl hydrazine acetate, water, cyclohexanone, butane vinegar, N-methyl-hydrazine, DM and mixtures thereof as a solvent. In the case of liquid epoxy resin, acrylate, the respective viscosity may alternatively be adjusted via the temperature during the coating period of 125205.doc -14 - 200833187 degrees or via a combination of solvent and temperature. In the second step, The electroless and/or electrolytically coatable particles are transferred from the transfer medium to the adhesive layer ±, and the electroless and/or electrolytically coatable + is applied to the transfer medium in the form of a layer, preferably in a single layer. The advantage of the layer of electroless and/or electrolytically coatable particles is that there are only electroless and/or electrolytically coatable particles on the surface of the adhesive layer of the target substrate: a thin layer. A single layer is also economical. Less electroless and/or electrolytically coatable materials. It is also preferred that these particles adhere to the adhesive layer because each transfer particle is in direct contact with the adhesive. Electroless and/or electrolytically coatable particles can be applied to it. Any hard or pullable support on the top Transfer medium. Suitable materials for the transfer medium are, for example, metal, glass, ceramic, plastic or any composite material. In the first embodiment, 'there will be a small amount of binder and, depending on the situation, other added states (eg, sub-governing agents) The electroless and/or electrolytically coatable particles of the flow control agent, the residual inhibitor, etc. are dispersed in the solvent or applied to the transfer medium, for example, by printing n-rolling, blade scraping or spraying. The material used for the subsequent adhesive layer is preferably used as a binder. In case the electroless and/or electrolytically coatable particles are transferred to the non-conductive support, the transfer medium can be easily separated. 'No electricity and/or electrolytic coating. The amount and type of binder by which the particles adhere to the transfer medium are selected such that the three electroless and/or electrolytically coatable particles adhere only weakly to the transfer medium and are transferred, and the electroless and/or electrolytically coatable particles are This is stronger than adhering to the adhesive layer of the support member on the transfer medium, so that the adhesive layer without the self-supporting member can be taken away together with the transfer medium to remove the electroless and/or electrolytically coatable particles. .doc -1 5· 200833187 Remove the transfer media. In a preferred embodiment, at least one endless belt or at least a drum running around two mechanical shafts is used as the transfer medium. The electroless and/or electrolytic coating and the dispersion of the adhesive are applied to the endless belt or drum by, for example, printing, casting tribute, blade scraping or spraying. The coated dry layer thickness is selected such that it substantially corresponds to the straight 2 of the conductive particles. The effect achieved by the method is that only the single layer particles are coated onto the transfer shell, even if the layer thickness is larger than the particle diameter L, the denier of the particle layer is low, and the cohesion of the electroless and/or electrolytically coatable particles is low, so that Only the single layer of particles is transferred during the subsequent transfer onto the substrate. After covering at least a portion of the dry dispersion, the endless belt or roller is brought into contact with the support member to which the structural or full surface adhesive layer is applied. In this case, the non-conductive support member preferably moves at the same speed as the two cylinders. The non-electrical support member on which the adhesive layer is applied is coated with the right-handed ... electric and/or electrolyzable coated particles. The sub or the drum is transferred to the non-conductive branch member. The endless belt or the anchorage can also be used as a means for supporting the transmission of the externally transmitted m cattle, but it is also possible to use the same amount of the same or on the side of the 'in this case' (d), or turn to the upper side and the lower side simultaneously. After removing the still Γ/p1 shell and the non-conductive support that has been separated again, the self-transfer medium (4) 残余 transfer medium remains at least partially dry dispersion of 125205.doc -16-200833187, such as binder and no electricity and / or electrolysis Can be coated with particles. Cleaning can be performed, for example, magnetically, mechanically, or by washing. For mechanical cleaning, for example, a doctor blade from a transfer medium to a residue that at least partially drys the dispersion is directed over the transfer medium. The scraped dispersion residue can then be used, for example, directly or after cleaning and/or separating the electroless and/or electrolytically coatable particles, as the <starter f for preparing the dispersion. ^ can be carried by, for example, a solvent in which the binder is dissolved. All of the solvents described above are suitable for this purpose, but the solvent of the dispersion is preferably such that, for example, the dispersion residue can be recycled. It is preferred to use an adhesive which is compatible or miscible with the adhesive on the non-conductive support member or which reacts with the adhesive upon curing. - preferably by means of, for example, printing, washing, rolling, blade scraping or spraying, by means of, for example, continuous coating, dispersions having electroless and/or electrolytically coatable particles, binders and/or solvents Apply to the transfer medium. As an alternative to the % belt or roller, it is also possible to provide a rigid support as a transfer medium. When the rigid support member is used as a transfer medium, a dispersion containing electroless and/or electrolytically coatable particles is first applied thereto, and the hard support member and the non-conductive support member are then used using a defined applied pressure. contact. After transferring the electroless and/or electrolytically coatable particles, the rigid support used as the transfer medium is separated from the non-conductive support such that the electroless and/or electrolytically coatable particles remain adhered to the non-conductive support. Agent. When a rigid support is used as the transfer medium, it must also be removed after the transfer of the electroless and/or electrolytically coatable particles, before the hard support is again coated with the adhesive and the electroless and/or electrolytically coatable particles. Transfer to non-125205.doc -17- 200833187 struts and particles on the bonding layer. Also, as in the case of the same, the lower cut, for example, as a transfer medium, is applied by f brushing, casting, rolling, blade scraping or spraying. The ρ transfer medium may also be a coated layer, a preferred system, a single layer of power and/or electrolytically coatable particles, and may be uncoated or uncoated from the unrolled (f〇il st〇re). And / or electrolysis can be: the most foil is uncoated and applied to the foil. If t is the first, and this is used in 4, the crucible is used for (4) tape, roller or hard support. The particles can be coated, for example, in the form of a dispersion, and the electrolyzable particles can be transferred to a non-conductive branch, ", And/or roll it up and then process it for collection. The piece is then, for example, borrowed: in another embodiment, 'electroless and/or electrolytically coatable particles are attached to the transfer medium by means of magnetic force. Under the circumstance, on the one hand, the transfer medium is long: in addition to the material made of 'but on the other hand', it is also possible to feed the transfer medium f along the magnet (for example, a water magnet or an electromagnet) to hold the smear particles on the transfer medium. S. Electrolysis may be in this condition 'the magnetic force will be selected such that during contact with the non-conductive support member = the particles remain adhered to the adhesive layer and are removed from the transfer medium - in the embodiment, there will be no electricity and / Or electrolytically coatable magnetic particles in solvent = knife solution applied to - hard f or flexible magnetic support (for example, magnetic, but without the addition of polymeric binder. In this case, coating can be (example - fine ~ by printing, washing, breast-feeding, blade scraping or spraying After the therapeutic agent, a layer of particles is obtained, and the thickness of the dried layer of the dispersion applied by magnetic bonding to the magnetic support member is selected such that its 125205.doc -18-200833187 substantially corresponds to no electricity and / or electrolytically coating the diameter of the magnetic particles. The magnetic transfer layer is then brought into contact with the adhesive layer on the non-conductive support. The electroless and/or electrolytically coatable particles are then adhered to the adhesive layer. In this embodiment, The layer of particles on the viscous support is not cohesively held together by the binder, so that only a single layer of electroless and/or electrolytically coatable particles can be transferred to the adhesive layer on the non-conductive support. When processed, after the adhesive layer has been applied, for example by means of a magnet applying an AC field or by cutting and/or removing

電磁鐵,自支撐件表面移除仍黏附至磁性支撐件上之無電 及/或電解可塗粒子。該等無電及/或電解可塗粒子隨後可 再使用。 在另一實施例中,轉移介質為一磁性滾筒。磁性滾筒之 内部含有至少一不移動之磁鐵,而該滾筒繞該等磁鐵旋 轉。亦可安裝兩個或多個(例如)具有不同磁場強度之磁 鐵。含於滾筒中之磁鐵中之第一者為(例如)一接納磁鐵。 無電及/或電解可塗磁性或可磁化粒子係受接納磁鐵吸 引,且由此黏附於滾筒表面上。視所設定之磁場強度而 定,可達成之效果為大致僅-單層,粒子轉移至滚筒上。藉 助於(例如)光學監視,必要時可能檢查無電及/或電解可塗 磁性或可磁化粒子是單層形式存在於滚筒表面上。 舉例而言’雷射光學裝置係適用於光學監視。當滾筒繼續 旋轉時,視情況亦使用-產生比接納磁鐵弱之磁場的下游 轉移磁鐵使藉助於接納磁鐵而黏附至滾筒表面上之無電及/ 或電解可塗磁性或可磁化粒子沈積於非導電支撐件上之黏 接層上。為此’沿著滾筒表面導引其上施加有黏接層之非 125205.doc -19- 200833187 導電支撐件。在此實施例中,由於滾筒上之粒子層未藉由 黏合劑内聚性地固持於一起,因此僅一單層無電及心電 解可塗磁性或可磁化粒子可轉移至非導電支撐件上之黏接 層上。繼續處理時,在已塗佈黏接層後,(例如)藉助於施 加AC場之磁鐵或藉由使用一到刀,自滾筒表面移除仍黏An electromagnet that removes electroless and/or electrolytically coatable particles that are still adhered to the magnetic support from the surface of the support. The electroless and/or electrolytically coatable particles can then be reused. In another embodiment, the transfer medium is a magnetic roller. The inside of the magnetic roller contains at least one magnet that does not move, and the roller rotates around the magnets. It is also possible to install two or more magnets having different magnetic field strengths, for example. The first of the magnets contained in the drum is, for example, a receiving magnet. The electroless and/or electrolytically coatable magnetic or magnetizable particles are attracted by the receiving magnet and thereby adhere to the surface of the drum. Depending on the strength of the magnetic field to be set, the effect achieved is approximately only a single layer, and the particles are transferred to the drum. By means of, for example, optical monitoring, it is possible to check for electromagnetism if necessary and/or to electrolyze the magnetizable or magnetizable particles in a single layer on the surface of the drum. For example, 'laser optics are suitable for optical monitoring. When the drum continues to rotate, it is also used as appropriate - a downstream transfer magnet that produces a weaker magnetic field than the receiving magnet causes the electroless and/or electrolytically coatable magnetic or magnetizable particles deposited on the surface of the drum by means of the receiving magnet to be deposited on the non-conductive On the adhesive layer on the support. For this purpose, a non-125205.doc -19-200833187 conductive support to which an adhesive layer is applied is guided along the surface of the drum. In this embodiment, since the particle layers on the drum are not cohesively held together by the binder, only a single layer of electroless and electrolysis-coated magnetic or magnetizable particles can be transferred to the non-conductive support. On the adhesive layer. When the treatment is continued, the adhesive layer is applied, for example, by applying a magnet of the AC field or by using a knife to the surface of the roller.

附至磁性滾筒上之無電及/或電解可塗磁性或可磁化粒 子。所时之無電及/或電解可塗粒子可(例如)翻作起始 物質。亦可藉由用溶劑洗㈣進行清潔,較佳用與用於塗 覆無電及/或電解可塗磁性或可磁化粒子之溶劑相同之溶 劑。在-實施例中,特定言之,在先前已(例如)藉由泵送 電路中之過濾器分離無電及/或電解可塗磁性或可磁化粒 子之後,直接自儲存容器獲取溶劑。或者,新溶劑亦可用 於清潔,在此狀況下,可繼而將如此獲得之無電及/或電 解可塗磁性或可磁化粒子與溶劑之混合物饋人儲存容器中 作為起始物質。必要時可補足無電及/或電解可塗磁性或 可磁化粒子之可能不足以調整所要混合物。 在一較佳實施例中,在至少一接納磁鐵下游存在至少一 轉移磁鐵。該轉移磁鐵具有比接納磁鐵低之磁場,使得無 電及/或電解τ塗磁#1±或可磁化粒子可易於自滾筒表面轉 塗至非‘電支撐件上之黏接劑上。為使滾筒表面在接納磁 鐵之區域中以無電及/或電解可塗磁性或可磁化粒子分別 塗佈,較佳將磁性滾筒浸入含有無電及/或電解可塗磁性 或可磁化粒子或該等粒子於溶劑中之分散液的儲存容器 中。為此,例如,磁性滾筒經浮動式安裝使得其不對儲存 125205.doc 200833187 容器之底部㈣。藉由(例如)攪拌或系送使儲存容器中之 至少無電及/或電解可塗粒子與溶劑之混合物保持運動。 若已使第二層中或介於兩個緊密位於一起之黏接表面之 間的粒子沈積,則可視情況藉助於磁性清潔自非導電支撐 #移除&等粒子。磁性清潔係(例如)藉助於繞磁鐵運轉之 非編織物來進行。不當之粒子藉由磁鐵之磁力而沈積至非 • 編織物上,且由此自非導電支撐件移除。 • 自轉移介質轉移至非導電支揮件上之後,無電及/或電 解可塗粒子亦可能藉由外力作用而在基層不同於非導電支 撐件之另一側上移動。 猎以使無電及/或電解可塗粒子沿轉移介質之方向移動 或在基層不同於非導電支樓件之另一侧上移動的外力為 (例如)重力或磁力。藉以使無電及/或電解可塗磁性或可磁 化粒子移動之力較佳為磁力。由於磁力之大小可調整,藉 此可能確保所有無電及/或電解可塗磁性或可磁化粒^ • ⑨上在轉移介質之方向上移動或移動至基層之不同於非導 電支撐件之另一侧上。 非導 . 無電及/或電解可塗粒子可為由任何無電及/或電解可塗 材料、不同無電及/或電解可塗材料之混合物或無電及/或 電解可塗材料與非無電及/或電解可塗材料之混合物製1 的任何幾何形狀之粒子。合適之無電及/或電解可塗^料 為(例如)碳,例如碳黑、石墨、碳奈米管;Electroless and/or electrolytically coated magnetic or magnetizable particles attached to the magnetic cylinder. The electroless and/or electrolytically coatable particles can be turned, for example, into starting materials. It can also be cleaned by washing with a solvent, preferably using the same solvent as that used to coat the electroless and/or electrolytically coatable magnetic or magnetizable particles. In the embodiment, in particular, the solvent is obtained directly from the storage container after the electrolessly and/or electrolytically coatable magnetic or magnetizable particles have been previously separated, for example, by a filter in the pumping circuit. Alternatively, the new solvent can also be used for cleaning, in which case the thus obtained electroless and/or electrolyzed magnetically or magnetizable particles and solvent mixture can be fed to a storage container as a starting material. It may not be sufficient to adjust the desired mixture if it is necessary to make up the absence of electricity and/or electrolytically coatable magnetic or magnetizable particles. In a preferred embodiment, at least one transfer magnet is present downstream of at least one of the receiving magnets. The transfer magnet has a lower magnetic field than the receiving magnet such that the electroless and/or electrolyzed magnetized #1 ± or magnetizable particles can be easily transferred from the surface of the drum to the adhesive on the non-electrical support. In order to coat the surface of the drum in the region of the receiving magnet with electroless and/or electrolytically coatable magnetic or magnetizable particles, it is preferred to immerse the magnetic cylinder in the presence of electroless and/or electrolytically coatable magnetic or magnetizable particles or such particles. In a storage container for the dispersion in a solvent. For this purpose, for example, the magnetic roller is mounted in a floating manner such that it does not store the bottom (four) of the 125205.doc 200833187 container. The mixture of at least electroless and/or electrolytically coatable particles and solvent in the storage vessel is maintained in motion by, for example, agitation or wicking. If the particles in the second layer or between the two closely-bonded bonding surfaces have been deposited, it is possible to remove the particles by non-conductive support from the non-conductive support by magnetic cleaning. The magnetic cleaning system is performed, for example, by means of a non-woven fabric that runs around the magnet. Improper particles are deposited onto the non-woven fabric by the magnetic force of the magnet and are thereby removed from the non-conductive support. • After the transfer medium is transferred to the non-conductive support, the electroless and/or electrolytically coatable particles may also move on the other side of the substrate different from the non-conductive support by an external force. The external force that moves to cause the electroless and/or electrolytically coatable particles to move in the direction of the transfer medium or to move on the other side of the base layer different from the non-conductive support member is, for example, gravity or magnetic force. The force by which the electroless and/or electrolytically coatable magnetic or magnetizable particles are moved is preferably a magnetic force. Since the magnitude of the magnetic force can be adjusted, it is possible to ensure that all of the electroless and/or electrolytically coatable magnetic or magnetizable particles are moved or moved in the direction of the transfer medium to the other side of the non-conductive support member. on. Non-conductive. Electroless and/or electrolytically coatable particles may be any non-electric and/or electrolytically coatable material, a mixture of different electroless and/or electrolytically coatable materials or electroless and/or electrolytically coatable materials with and without electricity and/or Any geometrically shaped particle of a mixture of electrolytically coatable materials. Suitable electroless and/or electrolytically coatable materials are, for example, carbon, such as carbon black, graphite, carbon nanotubes;

Vi屬錯合 物;導電有機化合物或導電聚合物或金屬,較佳為辞 鎳、銅、锡、鈷、錳、鐵、鎂、鉛、鉻、鉍、銀、八 、 金、 125205.doc -21 - 200833187 鋁、鈦、鈀、鉑、钽及其合金,或含有此等金屬中之至少 一者之金屬混合物。合適之合金為(例如)CuZn、CuSn、Vi is a complex; a conductive organic compound or a conductive polymer or metal, preferably nickel, copper, tin, cobalt, manganese, iron, magnesium, lead, chromium, strontium, silver, octagonal, gold, 125205.doc - 21 - 200833187 Aluminum, titanium, palladium, platinum, rhodium and its alloys, or metal mixtures containing at least one of these metals. Suitable alloys are, for example, CuZn, CuSn,

CuNi、SnPb、SnBi、SnCo、NiPb、ZnFe、ZnNi、ZnCo及CuNi, SnPb, SnBi, SnCo, NiPb, ZnFe, ZnNi, ZnCo and

ZnMn。鋁、鐵、銅、鎳、辞、碳及其混合物作為用於無 電及/或電解可塗粒子之材料尤其較佳。 無電及/或電解可塗粒子較佳具有0·0〇1 ^⑺至…^ μιη、 較佳0.005 μιη至50 μπι且尤其較佳〇·01 μηι之平均 粒子直徑。該平均粒子直徑可藉助於雷射繞射量測來測 定’例如使用Microtrac Χ100裝置。粒子直徑的分布視其 生產方法而定。直徑分布通常僅包含一個最大值,但複數 個最大值亦為可能的。 無電及/或電解可塗粒子之表面可至少部分具備一塗 層。合適之塗層在性質上可為無機(例如,Si〇2、磷酸鹽) 或有機的。當然,無電及/或電解可塗粒子亦可以金屬或 金屬氧化物塗佈。金屬同樣可以至少部分氧化之形式存 在。 工子 若意欲使用兩種或兩種以上不同類型的無電及/或電解 可塗粒子,則此可使用此等類型之混合物來完成。該等類 型尤其較佳地選自由鋁、鐵、銅、鎳、鋅及碳組成之群。 然而,無電及/或電解可塗粒子亦可含有第一金屬及第 二金屬,其中該第二金屬以合金(與第一金屬或一或多種 其他金屬)形式存在,或該等無電及/或電解可塗粒子可含 有兩種不同合金。 5 若無電及/或電解可塗粒子藉助於磁力而黏附至轉移介 125205.doc -22- 200833187 貝 則製成該等無電及/或電解可塗粒子之材料必須為 磁性或可磁化的。合適之材料為(例如)金屬,諸如鐵、 鎳鈷,或合金,諸如 NiFe、NiCuC〇、AiNic〇、SmC〇。 無電及/或電解可塗粒子可以其粉末形式添加至分散液 中該等粉末(例如,金屬粉末)為市售商品或可易於藉助 於已知方法來生產,例如藉由自金屬鹽之溶液電解沈積或 Φ Φ Γ學ί原或藉由(例如)藉助於氫氣還原氧化粉末、藉由噴 務或,化金屬熔融物(尤其)於冷卻劑(例如,氣體或水) 中氣體及水務化及金屬氧化物還原為較佳的。具有較佳 粒,之金屬粉末亦可藉由研磨較粗金屬粉末而產生。舉例 而言’球磨機適用於此目的。 除氣體及水霧化以外,在鐵之狀況下,用於產生幾基_ 鐵秦末之叛基_鐵粉末製程為較佳的。此可藉由五幾基鐵 之熱分解來完成。此描述於(例如)ullman,s Eneyel。㈣ of —al Chemistry,第 5版,第 A14卷第 599頁中。 软叛基鐵刀解可(例如)在高溫及高壓下在一包含較佳處於 豎直位置之諸如石英玻璃或V2A鋼之耐火材料管之可加熱 分解器中發生,該分解器由(例如)由加熱槽、加熱絲或加、 熱介質流經其中之加熱封套組成之加熱器具封閉。 幾基·鐵粉末更尤其較佳經㈣。此塗層❹1基-鐵粉 末黏附至轉移介質上。此外,無粉塵形成。 附,經塗佈之羰基-鐵粉末可在不遺留殘餘物的情況4加 以移除。當碳基-鐵粉末藉助於磁鐵而固持於轉移介質上 時,此尤其重要。塗層可為無機及/或有機的 :、、 牧有機塗 I25205.doc -23- 200833187 層之狀況下,聚合物為較佳的。合適之聚合物為(例如)聚 烯烴(諸如,聚乙烯及聚丙烯)、聚醯胺、聚四說乙歸产 S曰、聚醚、聚笨乙烯、苯乙烯丁二烯嵌段共聚物(例如, 購自BASF之Styroflex®或Styrolux®)及聚石夕氧聚合物。聚 乙烯、聚丙烯、聚四氟乙烯為較佳的。在無機塗層之狀況 下,金屬氧化物(諸如,氧化鐵)、磷酸鹽及矽酸鹽為較仵 . 的。 土 • 除選擇無電及/或電解可塗粒子以外,無電及/或電解可 塗粒子之形狀對塗佈後分散液之特性亦具有影響。就形狀 而言,熟習此項技術者已知之眾多變形皆為可能的。無電 及/或電解可塗粒子之形狀可為(例如)針形、圓柱形、板形 或球形。此等粒子形狀表示理想形狀,且實際形狀(例如) 歸因於生產而可或多或少與其相同。舉例而言,滴形粒子 與本發明之範疇内之理想球形形狀具實際偏差。 具有各種粒子形狀之無電及/或電解可塗粒子市售可 _ 得。 +當使用&電及/或電解可塗粒子之混合物時,個別混合 搭配物亦可具有不同粒子形狀及/或粒徑。亦可能使用具 有不同粒徑及/或粒子形狀之僅一種類型的無電及/或電解 可塗粒子之混合物。在不同粒子形狀及/或粒徑之狀況 下金屬銘、鐵、銅、錄及辞以及碳同樣較佳。在不同粒 子形狀之狀況下,小片及球體之組合為較佳的。 為在非導電支撐件上獲得一機械穩定結構性或全表面基 層,無電及/或電解可塗粒子黏附於其上之黏接層較佳在 125205.doc -24- 200833187 施加後至少部分經乾燥及/或至少部分經固化。視用於黏 接層之材料而定,固化及/或乾燥可(例如)藉由熱、光(υν) 及/或韓射(例如’紅外輻射、電子輻射、γ韓射、χ·輕射、 微波)作用來進行。為引發固化反應,可能有時必須添加 纟適之活化劑或固化劑。固化亦可藉由不同方法之組合 (例如’#由υν輻射與熱之組合)來達成。可將固化方法同 - _或相繼地組合。舉例而言’可首先藉由υν輻射使層僅 • 部分固化,使得所形成之結構不再流動分開。隨後可藉由 熱作用使層固化。在此狀況下’加熱可直接在υν固化之 後及/或在電解金屬化之後發生。 基層中無電及/或電解可塗粒子之比例較佳處於75至99 9 重量%之範圍β,尤其較佳處於85至99 9重量%之範圍 内。 為產生連續導電表面’藉由無電及/或電解塗佈於結構 性或全表面基層上而形成至少一金屬層。在此狀況下,塗 • 佈可使用热習此項技術者已知之任何方法來進行。此外, 任何習知金屬塗層皆可使用塗佈方法來施加。在此狀況 . 下,用於塗佈之電解質溶液之組合物視意欲以其塗佈基板 ι之導電結構之金屬而原則上,比分散液之最低廉金 屬更昂貴或與其同樣昂貴之所有金屬可用於無電及/或電 解塗佈。藉由無電及/或電解塗佈而沈積於導電表面上之 習知金屬為(例如)金、鎳、鈀、鉑、銀、錫、銅或鉻。一 或多個沈積層之厚度處於熟習此項技術者已知之習知範圍 内,且對於本發明並不重要。 125205.doc -25- 200833187 用於塗佈導電結構之合適電解質溶液為熟習此項技術者 所知(例如,自 Wemer Jillek,Gustl Keller,Handbuch der Leiterplattentechnik [Handbook of printed circuit technology].ZnMn. Aluminum, iron, copper, nickel, rhodium, carbon and mixtures thereof are especially preferred as materials for electroless and/or electrolytically coatable particles. The electroless and/or electrolytically coatable particles preferably have an average particle diameter of from 0. 0 〇 1 ^ (7) to π μιη, preferably from 0.005 μηη to 50 μπι, and particularly preferably 〇 01 μηι. The average particle diameter can be determined by means of laser diffraction measurements', e.g., using a Microtrac(R) 100 device. The distribution of particle diameters depends on the method of production. The diameter distribution usually contains only one maximum value, but multiple maximum values are also possible. The surface of the electroless and/or electrolytically coatable particles may be at least partially provided with a coating. Suitable coatings can be inorganic (e.g., Si 〇 2, phosphate) or organic in nature. Of course, the electroless and/or electrolytically coatable particles can also be coated with a metal or metal oxide. The metal can also be present in at least partially oxidized form. Workers If two or more different types of electroless and/or electrolytically coatable particles are intended, this can be done using a mixture of these types. These types are particularly preferably selected from the group consisting of aluminum, iron, copper, nickel, zinc and carbon. However, the electroless and/or electrolytically coatable particles may also comprise a first metal and a second metal, wherein the second metal is in the form of an alloy (with the first metal or one or more other metals), or the electroless and/or Electrolytic coated particles can contain two different alloys. 5 If the electroless and/or electrolytically coatable particles are adhered to the transfer medium by means of a magnetic force, the material from which the electroless and/or electrolytically coatable particles are made must be magnetic or magnetizable. Suitable materials are, for example, metals such as iron, nickel cobalt, or alloys such as NiFe, NiCuC〇, AiNic®, SmC〇. The electroless and/or electrolytically coatable particles may be added to the dispersion in the form of a powder thereof. The powders (for example, metal powders) are commercially available or can be easily produced by known methods, for example, by solution electrolysis from a metal salt. Deposition or Φ Φ Γ 或 or by, for example, reducing the oxidized powder by means of hydrogen, by spraying or by chemically melting the metal (especially) in a coolant (for example, gas or water) and Metal oxide reduction is preferred. Metal powders having preferred granules can also be produced by grinding coarser metal powders. For example, a ball mill is suitable for this purpose. In addition to gas and water atomization, in the case of iron, a repellent-iron powder process for producing a few bases is preferred. This can be done by thermal decomposition of five or more base irons. This is described, for example, in ullman, s Eneyel. (iv) of —al Chemistry, 5th edition, volume A14, page 599. Soft repellent iron knives can occur, for example, at high temperatures and pressures in a heatable decomposer comprising a refractory tube such as quartz glass or V2A steel, preferably in a vertical position, for example by (for example) The heating device consisting of a heating bath, a heating wire or a heating envelope through which the heating medium flows is closed. A few base iron powders are more particularly preferred (4). This coated 基1 base-iron powder adheres to the transfer medium. In addition, no dust is formed. Attached, the coated carbonyl-iron powder can be removed without leaving a residue. This is especially important when the carbon-iron powder is held on the transfer medium by means of a magnet. The coating may be inorganic and/or organic: ,, and organically coated. I25205.doc -23- 200833187 In the case of a layer, a polymer is preferred. Suitable polymers are, for example, polyolefins (such as polyethylene and polypropylene), polyamines, polytetraethylene, polyether, polystyrene, styrene butadiene block copolymers (for example). For example, Styroflex® or Styrolux® from BASF and polyoxin polymers. Polyethylene, polypropylene, and polytetrafluoroethylene are preferred. In the case of inorganic coatings, metal oxides (such as iron oxide), phosphates and silicates are relatively rare. Soil • In addition to the selection of electroless and/or electrolytically coatable particles, the shape of the electroless and/or electrolytically coatable particles also has an effect on the properties of the dispersed dispersion. Many variations known to those skilled in the art are possible in terms of shape. The shape of the electroless and/or electrolytically coatable particles may be, for example, a needle shape, a cylindrical shape, a plate shape or a spherical shape. These particle shapes represent ideal shapes, and the actual shape, for example, may be more or less the same as it is due to production. For example, the drop shaped particles have a practical deviation from the ideal spherical shape within the scope of the present invention. Electroless and/or electrolytically coatable particles having various particle shapes are commercially available. + When using a mixture of & electric and/or electrolyzable particles, the individual mixed mate may also have different particle shapes and/or particle sizes. It is also possible to use a mixture of only one type of electroless and/or electrolytically coatable particles having different particle sizes and/or particle shapes. Metals, iron, copper, recorded words and carbon are also preferred in the case of different particle shapes and/or particle sizes. Combinations of small pieces and spheres are preferred in the case of different particle shapes. In order to obtain a mechanically stable structural or full-surface base layer on the non-conductive support member, the adhesive layer to which the electroless and/or electrolytically coatable particles adhere is preferably at least partially dried after application of 125205.doc -24-200833187 And/or at least partially cured. Depending on the material used for the bonding layer, curing and/or drying can be performed, for example, by heat, light (υν) and/or Han (eg 'infrared radiation, electron radiation, gamma-Han, χ·light shots , microwave) action to carry out. In order to initiate the curing reaction, it may sometimes be necessary to add a suitable activator or curing agent. Curing can also be achieved by a combination of different methods (e.g., '# combination of υν radiation and heat). The curing method can be combined with - _ or successively. For example, the layer can be first partially cured only by υν radiation, so that the formed structure is no longer flow separated. The layer can then be cured by thermal action. In this case, heating can occur directly after υν curing and/or after electrolytic metallization. The proportion of electroless and/or electrolytically coatable particles in the base layer is preferably in the range of from 75 to 99% by weight, particularly preferably from 85 to 99% by weight. To produce a continuous conductive surface, at least one metal layer is formed by electroless and/or electrolytic coating on a structural or full surface substrate. In this case, the coating can be carried out using any method known to those skilled in the art. In addition, any conventional metal coating can be applied using a coating method. In this case, the composition of the electrolyte solution for coating is intended to be coated with the metal of the conductive structure of the substrate ι, and in principle all metals which are more expensive or less expensive than the cheapest metal of the dispersion are available. No electricity and / or electrolytic coating. A conventional metal deposited on a conductive surface by electroless and/or electrolytic coating is, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium. The thickness of one or more of the deposited layers is within the known ranges known to those skilled in the art and is not critical to the invention. 125205.doc -25- 200833187 Suitable electrolyte solutions for coating conductive structures are known to those skilled in the art (for example, from Wemer Jillek, Gustl Keller, Handbuch der Leiterplattentechnik [Handbook of printed circuit technology].

EugenG.LeuzeVerlag,2003,第 4卷,第 332-352頁)〇 熟習此項技術者已知之所有電解方法在此皆可用於電解 ^ 塗佈。 * 具有不同電解質溶液之複數個槽可能串聯連接以使複數 馨 種不同金屬沈積於待塗佈之基層上。此外,亦可能使金屬 首先無電沈積且接著電解沈積於基層上。在此狀況下,不 同金屬或相同金屬可藉由無電及電解沈積而沈積。 藉由本發明之方法而沈積於導電結構上之金屬層之層厚 度視由基板穿過裝置之速度及串聯定位之陰極數目所限定 之接觸時間以及裝置操作之電流強度而定。較長接觸時間 可(例如)藉由在至少一槽中串聯連接複數個本發明之裝置 來達成。 籲 除將具有無電及’或電解可塗粒子之黏接層施加至非導 電支撐件之一側上以外,藉由本發明之方法,亦可能提供 • 在其上侧及其下側具有無電及/或電解可塗結構性及/或全 表面基層之非導電支撐件。藉助於穿透觸點,支撐件之上 側及下側上之結構性或全表面無電及/或電解可塗基層可 彼此電連接。為產生穿透觸點,例如,在無電及/或電解 塗佈孔之前或之後,可能在支撐件上形成孔,藉由熟習此 項技術者已知之方法將一導電層施加至該等孔之壁上。對 於一足夠薄之支撐件而言,無須個別地塗佈孔壁,此係由 125205.doc -26- 200833187 於以足夠長之塗佈時間,金屬層亦在無電及/或電解塗佈 期間因金屬層自支撐件之上側及下側—起生長至孔中而在 »亥孔内部形成,以在支撐件之上侧及下側上產生導電結構 性或全區域表面之電連接。除本發明之方法以外,亦可能 使用自先前技術已知之其他方法用於使孔及/或盲孔金屬 在至少部分乾燥或固化之後,在本發明之一實施例中, 3於分散液中之無電及/或電解可塗粒子至少部分經暴 露’使得已獲得無電及/或電解可塗晶核部位,在隨:: 電及/或電解金屬㈣間可使金屬粒子沈積於該等晶核部 ^上以形成金屬層。若粒子由已經氧化之材料組成,則有 時亦必須預先至少部分移除氧化層。視方法所進行之方式 (例如’藉由使用酸性電解質溶液)而定,移除氧化層可^ 進行金屬化同時已發生,無需一額外處理步驟。 在無電及/或電解金屬化之前暴露粒子之一優勢在於, 為獲得一連續導電表面,藉由暴露粒子,塗層僅需含有比 粒子未經暴露之狀況低約5至10重量%之無電及/或電解可 塗粒子之比例。其他優勢為所產生之塗層之均質性及連續 性及高處理可靠性。 無電及/或電解可塗粒子可經機械暴露(例如,藉由刷 磨、研磨、碾磨、噴砂或以超臨界二氧化碳噴擊)、物理 暴露(例如,藉由加熱、雷射、UV光、電暈或電漿放電)或 經化學暴露。在化學暴露之狀況下,較佳使用與基質材料 相谷之化學品或化學品混合物。在化學暴露之狀沉下,義 125205.doc -27- 200833187 2材料可(例如)藉由溶劑而至少部分溶解於表面上且洗 或基貝材料之化學結構可藉助於合適試劑而至少部分Eugen G. Leuze Verlag, 2003, Vol. 4, pp. 332-352.) All electrolysis methods known to those skilled in the art can be used herein for electrolysis. * A plurality of grooves having different electrolyte solutions may be connected in series to deposit a plurality of different metals on the substrate to be coated. Alternatively, the metal may be first electrolessly deposited and then electrolytically deposited on the substrate. In this case, different metals or the same metal can be deposited by electroless and electrolytic deposition. The layer thickness of the metal layer deposited on the conductive structure by the method of the present invention depends on the contact time defined by the speed at which the substrate passes through the device and the number of cathodes positioned in series, and the current strength at which the device operates. Longer contact times can be achieved, for example, by connecting a plurality of devices of the present invention in series in at least one tank. In addition to applying an adhesive layer having no electricity and/or electrolytically coatable particles to one side of the non-conductive support member, it is also possible to provide by the method of the present invention. • There is no electricity on the upper side and the lower side thereof. Or electrolessly coatable non-conductive supports of structural and/or full surface substrates. By means of the penetration contacts, the structural or full surface electroless and/or electrolytically coatable substrates on the upper and lower sides of the support can be electrically connected to each other. To create a penetrating contact, for example, before or after the electroless and/or electrolytically coated aperture, holes may be formed in the support, and a conductive layer is applied to the apertures by methods known to those skilled in the art. On the wall. For a sufficiently thin support, it is not necessary to apply the hole wall individually, which is from 125205.doc -26- 200833187 for a sufficiently long coating time, and the metal layer is also in the absence of electricity and/or electrolytic coating. The metal layer is grown from the upper side and the lower side of the support member into the hole and formed inside the hole to create an electrical connection of the conductive structure or the full area surface on the upper side and the lower side of the support member. In addition to the method of the present invention, it is also possible to use other methods known from the prior art for after the pores and/or the blind via metal are at least partially dried or cured, in one embodiment of the invention, 3 in the dispersion. The electroless and/or electrolyzable coated particles are at least partially exposed such that the electroless and/or electrolytically coatable nuclei are obtained, and metal particles can be deposited between the nuclei and the electromagnet and/or the electrolyzed metal (d). ^ to form a metal layer. If the particles consist of materials that have been oxidized, then sometimes the oxide layer must be at least partially removed in advance. Depending on the method (e.g., by using an acidic electrolyte solution), removal of the oxide layer can occur while metallization has occurred without an additional processing step. One of the advantages of exposing the particles prior to electroless and/or electrolytic metallization is that, in order to obtain a continuous conductive surface, by exposing the particles, the coating need only contain about 5 to 10% by weight less than the unexposed state of the particles. / or the proportion of electrolyzable particles. Other advantages are the homogeneity and continuity of the resulting coating and high processing reliability. Electroless and/or electrolytically coatable particles can be mechanically exposed (eg, by brushing, grinding, milling, sandblasting or spraying with supercritical carbon dioxide), physical exposure (eg, by heating, laser, UV light, Corona or plasma discharge) or chemical exposure. In the case of chemical exposure, it is preferred to use a chemical or chemical mixture with the matrix material. Under the condition of chemical exposure, the material 12525.doc -27-200833187 2 can be at least partially dissolved on the surface by, for example, a solvent and the chemical structure of the material or the shellfish can be at least partially supported by means of a suitable reagent.

被破壞以暴露無電及/ A 解了塗粒?。使基質材料膨脹 用於暴露無電及/或電解可塗粒子。膨脹產生 (沈積金屬粒子可自電解質溶液進入之空穴,使得更多盔 電及/或電解可塗粒子可得以金屬化。隨後無電及/或電解 沈積之金屬層之黏結性、均質性及連續性比先前技術中所 述之方法顯著更伟。I Μ l 、 文仏孟屬化之處理速率因經暴露之無電及/ 或電解可塗粒子之較大數目而亦實質上更高,使得可達 額外成本優勢。 若基質材料為€例如)環氧樹脂、經改質之環氧樹脂、環 氧'聚㈣酸g|、剔、苯乙稀-丁二婦共聚物 或聚δέ ’則無電及/或電解可塗粒子較佳藉由使用氧化劑 而«。氧化劑破壞基質材料之黏結,使得黏合劑可溶解 且藉此可使粒子暴露。合適之氧化劑為(❹你酸鹽,諸 如回!孟酉夂If猛酉夂鉀、而链酸納、猛酸鈉;過氧化氫;氧 氣’在諸如猛鹽、錮鹽、絲鹽、鶴鹽及録鹽之催化劑存在 下之氧氣;臭氧;五氧化二飢;二氧化石西;多硫化銨溶 液’在氨或胺存在下之硫;二氧化猛;高鐵酸钾;重鉻酸 鹽/硫酸·,於硫酸或於乙酸或於乙酸酐中之鉻酸;硝酸; 氫碘酸;氫溴酸·,重鉻酸吡錠;鉻酸_吡啶複合物;鉻酸 酐’氧化鉻(VI);過蛾酸;四乙酸錯;g昆;甲基酿;蒽 鼢,溴,氯,氟;鐵(III)鹽溶液;二硫酸鹽溶液;過碳酸 鈉,合氧鹵酸(oxohalic acid)之鹽,諸如氯酸鹽或溴酸鹽 125205.doc -28 - 200833187 或碘酸鹽;過_酸之鹽,諸如過碘酸鈉或過氯酸鈉;過硼 酸鈉;重鉻酸鹽,諸如重鉻酸鈉;過硫酸之鹽,諸如過氧 二硫酸鉀、過氧單硫酸舒;氯鉻酸U比錠(pyridinium chlorochfomate);次鹵酸之鹽,例如,次氯酸鈉;在親電 子試劑存在下之二甲亞颯;第三丁基氫過氧化物;3_氣過 笨甲酸鹽,2,2-二甲基丙酸;Des-Martin高破烧;乙二醯 氣;過氧化氫脲加成物;過氧化氫脲(urea hydr〇genWas destroyed to expose no electricity and / A solved the granules? . The matrix material is expanded to expose electroless and/or electrolytically coatable particles. The expansion produces (the deposited metal particles can enter the cavity from the electrolyte solution, so that more helmet electrical and/or electrolytically coatable particles can be metallized. The subsequent adhesion, homogeneity and continuity of the metal layer without electricity and/or electrolytic deposition Sexually superior to the methods described in the prior art. The treatment rate of I Μ l and 仏 仏 属 is also substantially higher due to the greater number of exposed electroless and/or electrolytically coatable particles. Additional cost advantage. If the matrix material is €, for example, epoxy resin, modified epoxy resin, epoxy 'poly(tetra) acid g|, tick, styrene-butadiene copolymer or poly-δέ', no electricity And/or electrolytically coatable particles are preferably used by using an oxidizing agent. The oxidant destroys the bond of the matrix material so that the binder dissolves and thereby exposes the particles. The appropriate oxidant is (❹ 酸盐 酸 酸, such as back! Meng 酉夂 If Meng 酉夂 potassium, while sodium silicate, sodium hydride; hydrogen peroxide; oxygen 'in such as Meng salt, strontium salt, silk salt, crane salt Oxygen in the presence of a catalyst for salt; ozone; bismuth pentoxide; sulphur dioxide west; ammonium sulphate solution 'sulphur in the presence of ammonia or amine; oxidized violent; potassium ferrate; dichromate/sulphuric acid · Chromic acid in sulfuric acid or in acetic acid or acetic anhydride; nitric acid; hydroiodic acid; hydrobromic acid · pyridinium dichromate; chromic acid pyridine complex; chromic anhydride 'chromium oxide (VI); Moth acid; tetraacetic acid wrong; g-kun; methyl-brewed; hydrazine, bromine, chlorine, fluorine; iron (III) salt solution; disulfate solution; sodium percarbonate, oxohalic acid salt, Such as chlorate or bromate 125205.doc -28 - 200833187 or iodate; salt of per-acid, such as sodium periodate or sodium perchlorate; sodium perborate; dichromate, such as dichromate Sodium; salts of persulfate, such as potassium peroxydisulfate, peroxymonosulphate; pyridinium chlorochfomate; salt of hypohalous acid For example, sodium hypochlorite; dimethyl hydrazine in the presence of an electrophile; third butyl hydroperoxide; 3 _ gas over-formate, 2,2-dimethylpropionic acid; Des-Martin high-break ; ethylene dioxime; hydrogen peroxide urea adduct; urea hydrogen peroxide (urea hydr〇gen

peroxide),2-二氧碘基苯甲酸;過氧單硫酸鉀;間氯過苯 曱酸,N-甲基嗎啉_N_氧化物;2_甲基丙_2_基氫過氧化 物,過氧乙酸;特戊醛;四氧化鐵;過硫酸氫鉀;釕(iii) 鹽及釕(IV)鹽;在2,2,6,6-四曱基哌啶基氧化物存在下 之氧氣;三乙醯氧基高碘烷;三氟過氧乙酸;三曱基乙 醛;硝酸銨。可視情況增加處理期間之溫度以改良暴露處 理〇 以以下各物為較佳:锰酸鹽,例如,高猛酸卸、猛酸 鉀、高猛酸納、鐘酸納;過氧化氫;N-甲基嗎琳召·氧化 物;過碳酸鹽’例如’過碳酸納或過碳酸卸;過爛酸鹽, :㈣酸納或過侧酸卸;過硫酸鹽,例如,過硫酸納 ㈣硫酸:;過氧二硫酸納、過氧二硫酸卸及過氧二硫酸 =過乳早硫酸納、過氧單硫酸卸及過氧單硫酸銨;氮氯 化鈉;過氧化氫脲加成物;含氧_酸之戈 溪酸鹽或蛾酸鹽;嶽之 如认鹽或 鈉;過氧渚如,過碘酸鈉或過氣酸 l鐵_鹽溶液 飢;重絡酸讀;鹽酸;漠;氯;重鉻酸鹽。 125205.doc -29- 200833187 以下各物尤其較佳:高錳酸鉀、錳酸鉀、高錳酸鈉、錳 酉文鈉、過氧化氫及其加成物、過硼酸鹽、過碳酸鹽、過硫 酉文鹽、過氧二硫酸鹽、次氣酸鈉及過氣酸鈉。 為將無電及/或電解可塗粒子暴露於含有(例如)酯結構 (諸如,聚酯樹脂、聚酯丙烯酸酯、聚醚丙烯酸酯、聚酯 胺基甲酸酉旨)之基質材肖中,較佳(例如)使用酸性或驗性化 予口卩及/或化學品混合物。較佳之酸性化學品及/或化學品 混合物為(例如)濃酸或稀酸,諸如鹽酸、硫酸、磷酸或硝 酸。視基質材料而定,諸如甲酸或乙酸之有機酸亦適用。 合適之鹼性化學品及/或化學品混合物為(例如)鹼,諸如氳 氧化鈉、氫氧化鉀、氫氧化銨;或碳酸鹽,例如碳酸納或 碳酸鈣。可視情況增加處理期間之溫度以改良暴露處理。 /谷劑亦可用於將無電及/或電解可塗粒子暴露於基質材 料中。溶劑必須適於基質材料,此係由於基質材料必須溶 解於溶劑中或因溶劑而膨脹。當使用基質材料溶解於其中 之溶劑時,使基層與溶劑僅接觸短暫時間,以使得基質材 料之上層溶劑化且藉此溶解。較佳之溶劑為二甲苯、曱 苯、鹵化烴、丙酮、甲基乙基酮(MEK)、曱基異丁基酮 (MIBK)、二乙二醇單丁基醚。可視情況增加溶解處理期間 之溫度以改良溶解行為。 此外,亦可能藉由使用機械方法暴露無電及/或電解可 塗粒子。合適之機械方法為(例如)碾碎、研磨、用研磨劑 研磨或用射水機壓力噴擊、喷砂或以超臨界二氧化碳喷 擊。藉由該機械方法分別移除經固化、經印刷之結構性義 125205.doc -30- 200833187 層之頂層 塗粒子。 。藉此暴露含於基質材料 中之無電及/或電解可 熟習此項技術者已知之所有研磨劑皆可用作用於研磨之 研磨劑。合適之研磨劑為(例如)浮石粉。為藉由 麼力喷擊來移除經固化分散液之頂層,該射水機較佳含: 小固體粒子,例如具有40_至12〇陶、較佳6〇_請Peroxide), 2-dioxyiodobenzoic acid; potassium peroxymonosulfate; m-chloroperbenzoic acid, N-methylmorpholine_N_oxide; 2-methylpropan-2-yl hydroperoxide , peracetic acid; pivalaldehyde; iron tetrachloride; potassium hydrogen persulfate; cerium (iii) salt and cerium (IV) salt; in the presence of 2,2,6,6-tetradecylpiperidinyl oxide Oxygen; triethoxy methoxy high iodine; trifluoroperacetic acid; trimethyl acetaldehyde; ammonium nitrate. It is preferred to increase the temperature during the treatment to improve the exposure treatment. The following are preferred: manganate, for example, high-acid acid unloading, potassium citrate, sodium perchlorate, sodium chlorate; hydrogen peroxide; N- Methyl 琳 · · oxide; percarbonate 'such as 'percarbonate or percarbonate unloading; permanate, : (4) sodium or over-acid acid removal; persulfate, for example, sodium (tetra)sulfate: ; sodium peroxodisulfate, peroxydisulfuric acid and peroxydisulfate = over-milk early sodium sulfate, peroxymonosulfuric acid and ammonium peroxymonosulfate; sodium sulphide; hydrogen peroxide urea adduct; Oxygen-acid oxidate or moth acid salt; Yuezhiru salt or sodium; peroxygenate, sodium periodate or peroxyacid l iron salt solution; heavy acid reading; hydrochloric acid; Chlorine; dichromate. 125205.doc -29- 200833187 The following are particularly preferred: potassium permanganate, potassium manganate, sodium permanganate, manganese strontium, hydrogen peroxide and its adducts, perborate, percarbonate, Persulfate salt, peroxodisulfate, sodium hypocarbonate and sodium percarbonate. In order to expose electroless and/or electrolytically coatable particles to a matrix material containing, for example, an ester structure such as polyester resin, polyester acrylate, polyether acrylate, polyester urethane, Preferably, for example, an acid or an assay is used for the oral and/or chemical mixture. Preferred acidic chemicals and/or chemical mixtures are, for example, concentrated or dilute acids such as hydrochloric acid, sulfuric acid, phosphoric acid or nitric acid. Depending on the matrix material, organic acids such as formic acid or acetic acid are also suitable. Suitable alkaline chemicals and/or chemical mixtures are, for example, bases such as sodium bismuth oxide, potassium hydroxide, ammonium hydroxide; or carbonates such as sodium carbonate or calcium carbonate. The temperature during the treatment may be increased as appropriate to improve the exposure treatment. The granules can also be used to expose electroless and/or electrolytically coatable particles to a matrix material. The solvent must be suitable for the matrix material since the matrix material must be dissolved in the solvent or expanded by the solvent. When a solvent in which the matrix material is dissolved is used, the base layer is only contacted with the solvent for a short period of time so that the upper layer of the matrix material is solvated and thereby dissolved. Preferred solvents are xylene, toluene, halogenated hydrocarbons, acetone, methyl ethyl ketone (MEK), mercaptoisobutyl ketone (MIBK), diethylene glycol monobutyl ether. The temperature during the dissolution treatment may be increased as appropriate to improve the dissolution behavior. In addition, it is also possible to expose electroless and/or electrolytically coatable particles by using mechanical means. Suitable mechanical methods are, for example, milling, grinding, grinding with an abrasive or pressure jetting with a water jet, sand blasting or spraying with supercritical carbon dioxide. The top layer coated particles of the cured, printed structural 125205.doc -30-200833187 layer were separately removed by this mechanical method. . Thereby, all of the abrasives known to those skilled in the art can be used as an abrasive for grinding by exposing the electroless and/or electrolytically contained in the matrix material. Suitable abrasives are, for example, pumice powder. In order to remove the top layer of the solidified dispersion by force spraying, the water jet preferably comprises: small solid particles, for example, having 40_ to 12 〇 陶, preferably 6 〇 _

障之平均粒徑分布之浮石粉(Al2〇3)以及具有大於 粒徑之石英粉(Si〇2)。 若無電及/或電解可塗粒子含有易於氧化之材料,則在 一較佳方法變形例中,名厶厘 ,文/妁甲在孟屬層形成於結構性或全區域基 層上之前至少部分移除氧化層。在此狀況下,氧化層可經 (例如)化學及/或機械方式移除。可處理基層以自益電及/ 或電解可塗粒子化學移除氧化層之合適物質為(例如)酸, 諸如濃硫酸或稀硫酸或濃鹽酸或稀鹽酸、捧檬酸、填酸、 胺石黃酸、甲酸、乙酸。The average particle size distribution of the barrier is pumice powder (Al2〇3) and the quartz powder (Si〇2) having a larger particle size. If the electroless and/or electrolytically coatable particles contain a material that is susceptible to oxidation, in a preferred method variant, the name/妁 armor is at least partially moved before the México layer is formed on the structural or full-area substrate. In addition to the oxide layer. In this case, the oxide layer can be removed, for example, by chemical and/or mechanical means. A suitable material for chemically removing the oxide layer from the self-energizing and/or electrolytically coatable particles is, for example, an acid such as concentrated sulfuric acid or dilute sulfuric acid or concentrated hydrochloric acid or dilute hydrochloric acid, citric acid, acid, amine stone. Flavinic acid, formic acid, acetic acid.

用於自無電及/或電解可塗粒子移除氧化層之合適機械 方法般與用於暴露粒子之機械方法相同。 用於在支撐件上產生導電結構性或全區域表面之本發明 方法可以連續、半連續或分減式操作。該方法亦可能僅 個別步驟連續進行,而其他步驟以分批模式進行。 本發明之方法係適用於(例如)在印刷電路版上產生導體 轨道。該等印刷電路板為(例如)具有多層内及外層級、微 通道、板上晶片之印刷電路板、可撓性及硬質印刷電路 板且(例如)女裝於諸如電腦、電話、電視、電動汽車組 125205.doc -31 - 200833187 件、鍵盤、收音機、錄影機卜丨心0)、^、00_以0^1及]^;〇 播放機、遊戲操作台、量測及調節設備、感測器、廚房電 器、電動玩具等之產品中。 可撓性電路支撐件上之導電結構亦可以本發明之方法來 塗佈。該等可撓性電路支撐件為(例如)由關於導電結構印 刷於其上之支撐件所提及之前述材料製成之塑膠薄膜。此 外,本發明之方法適用於生產RFID天線、轉發器天線或其A suitable mechanical method for removing the oxide layer from the electroless and/or electrolytically coatable particles is the same as the mechanical method for exposing the particles. The inventive method for producing a conductive structural or full-area surface on a support can be operated continuously, semi-continuously or in a reduced manner. This method may also be performed continuously in individual steps, while the other steps are performed in batch mode. The method of the present invention is suitable, for example, for producing conductor tracks on a printed circuit board. The printed circuit boards are, for example, printed circuit boards having multiple layers of inner and outer layers, microchannels, on-board wafers, flexible and rigid printed circuit boards and, for example, women's clothing such as computers, telephones, televisions, electric Car group 125205.doc -31 - 200833187 pieces, keyboard, radio, video recorder Bu Xin 0), ^, 00_ to 0 ^ 1 and ] ^; 〇 player, game console, measurement and adjustment equipment, sense In the products of measuring instruments, kitchen appliances, electric toys, etc. The electrically conductive structure on the flexible circuit support can also be applied by the method of the present invention. The flexible circuit support members are, for example, plastic films made of the aforementioned materials mentioned with respect to the support member to which the conductive structure is printed. Moreover, the method of the present invention is suitable for use in the production of RFID antennas, repeater antennas or

他天線結構、晶片卡模組、扁平電纜、座椅加熱器、箔導 體、太陽能電池中或LCD/電漿螢幕中之導體軌道、電容 器、箔電容器、電阻器、對流器、電熔絲。舉例而言,二 維或二維模製互連裝置亦可由本發明之方法來生產。 此外,可能生產具有用於有機電子組件之觸點之天線, 以及由用於電磁屏蔽之非導電材料組成之表面上之塗層。 此外,可旎在應用於燃料電池之雙極板之流場之情形中 使用。 本發明之方法之應用範圍允許低廉地生產金屬化、本身 非導電之基板(尤其用作交換器及感測器、用於電磁輕射 或氣體障壁之m或裝飾性部件(尤其用於機動車 輛、公共廁所、玩具、家庭及辦公部門之裝飾性部件)), 及封裝以及荡。本發明亦可應用於鈔票、信用卡、身份證 件等之防偽印刷領域。紡織品可藉助於本發明之方法而電 性及磁性功能化(天線、傳輸器、RFm及轉發器天線、感 測益、加熱元件、抗靜電(甚至對於塑膠)、屏蔽等) 此外,可能在-整合式電子組件上產生接觸點或接觸焊 125205.doc -32- 200833187 塾或互連。 本發明之方法可同樣用於使(例如)印刷電路板、RFID天 線或轉發器天線、扁平電纜》、岛導體中之孔、通道、盲孔 等金屬化,目的在於穿透接觸上側與下側。當使用其他基 板時,此方法亦適用。 若根據本發明所生產之金屬化物件包含可磁化金屬,則 * 其亦可在諸如磁性台、磁性遊戲、(例如)冰箱門上之磁性 ⑩ 表面之可磁化功能部件之領域中使用。其亦可在良好熱導 率為有利之領域中使用,例如在用於座椅加熱器之箔、地 板加熱及絕緣材料中使用。 根據本發明而金屬化之表面之較佳用途在於以此方式所 生產之產品用作印刷電路板、RFID天線、轉發器天線、座 椅加熱器、扁平電纜、無觸點晶片卡、包層於一或兩側上 之薄金屬箔或聚合物支撐件、箔導體、太陽能電池中或 LCD/電漿螢幕中之導體軌道或用作裝飾性應用(例如,用 φ 於封裝材料)之用途。 本發明之方法之一優勢在於,甚至當對於無電或電解可 • 塗粒子使用易於氧化之材料時,充分塗佈仍為可能的。 本發明將藉助於圖式在下文更詳細地說明。諸圖分別以 實例展示僅一個可能實施例。除所提及之實施例以外,本 發月自。亦了在其他實施例中或在此等實施例之組合中實 施。 【實施方式】 圖及圖1.2展示在第一實施例中無電及/或電解可塗粒 125205.doc -33- 200833187 子轉移至一具備一黏接層之非導電支撐件上。 將黏接層3施加至非導電支揮们上。黏接層3具有意欲 產生之導電表面之結構。此外,將含有無電及/或電解可 塗粒子之層7施加至轉移介質5上,該等無電及/或電解可 . 塗粒子較佳以一單層形式含於層7中。為在非導電支撐件! 上獲得-導電表面’使具有黏接層3之非導電支擇们愈且 有含有無電及/或電解可塗粒子之層7之轉移介質5彼此接 •冑’使得含有無電及/或電解可塗粒子之層7接觸黏接層 3。猎由使含有無電及/或電解可塗粒子之層7與黏接们接 觸’無電及/或電解可塗粒子自層7轉移至黏接層3上。為 此,黏接層3之黏附力必須大於層7之黏附力。 層7中之無電及/或電解可塗粒子可藉助於不完全固化及/ ^乾燥之聚合物層而黏附。無電及/或電解可塗粒子亦可 旎如同層7—樣藉由磁力黏附至轉移介質5上。 為使黏接層3與含有無電及/或電解可塗粒子之層7接 • 觸,將非導電支樓件與轉移介質5遷抵彼此,使非導曰電支 樓件1與轉移介質5對準,使得黏接層3與含有無電及/或電 . 解可塗粒子之層7面向彼此。支料1與轉移介質5朝向彼 此之移動由箭頭9及11表示。 當將非導電支撐件丨與轉移介質5壓抵彼此時’黏接層3 之黏接劑可能被固化及/或乾燥。以此方式,來自層7之曰無 電及/或電解可塗粒子變得黏合至黏接層3。然而,亦可能 在固化黏接層3之黏接劑之前,自非導電支撐件丨移除轉移 介質5。在此狀況下,黏接層3之黏附甚至在未固化狀態下 125205.doc -34- 200833187 仍須比轉移介質5上之黏附力大。 圖1.2呈現在已使含有無電及/或電解可塗粒子之層7轉移 至非導電支撐件1之黏接層3上之後,自該非導電支撐件移 除轉移介質5之方法步驟。非導電支撐件丨及轉移介質5的 • ㈣由箭頭13及15表示。在圖1.2中可見,在黏接層3施加 至非導電支標件1上之位置處,層7已自轉移介質5脫離且 . 黏附絲接層3上。以此方式,含有無電及/或電解可塗粒 φ 子且可經無電及/或電解塗佈之基層在非導電支撐件丨上產 生。 圖2呈現在第二實施例中使無電及/或電解可塗粒子自轉 移介質轉移至非導電支撐件上之方法步驟。 在圖2中所呈現之實施例中,轉移介質5組態成環形帶子 :;。在此處所呈現之實施例中,環形帶子叫 17、19運轉。為使環形帶子⑽動,驅動機械軸17、19中 之至少一者。然而’亦可能驅動兩個機械軸17、19。除在 瞻 此處所呈現之實施例(盆中 ,、 ’ 例。、中糸形,子b繞兩個機械軸17、 運轉)以外’亦可能提供-充當轉移介質之單一機械絲 來替代繞機械軸17、^ π迷轉之%形贡子15。同樣地, 個個別機械轴可串聯配置。 10 卜替代兩個機械軸17、 19,亦可能使用環形帶子15 軸。 之任忍大數目之機械 為使無電及/或電解可塗粒子 接層3上,將含有較佳以一單層形式二電Π件1之黏 4¾ ^ j® 7 s ^ 、<,、、、電及/或電解可塗 ’θ ^、在—位置處施加至環形帶子上。在已施加 125205.doc •35- 200833187 #&使#電及/或電解可塗粒子自層7轉移至黏接層3 上。環形帶子15較佳以與非導電支擇们相同之His antenna structure, chip card module, flat cable, seat heater, foil conductor, conductor track in solar cell or LCD/plasma screen, capacitor, foil capacitor, resistor, convector, electric fuse. For example, a two dimensional or two dimensional molded interconnect device can also be produced by the method of the present invention. Furthermore, it is possible to produce an antenna having contacts for organic electronic components, and a coating on a surface composed of a non-conductive material for electromagnetic shielding. In addition, it can be used in the case of a flow field applied to a bipolar plate of a fuel cell. The scope of application of the method according to the invention allows the low-cost production of metallized, non-conducting substrates themselves (especially for use as exchangers and sensors, for electromagnetic light or gas barriers or for decorative components (especially for motor vehicles) , public toilets, toys, decorative parts of the home and office departments)), and packaging and swaying. The present invention can also be applied to the field of security printing of banknotes, credit cards, identification cards, and the like. Textiles can be electrically and magnetically functionalized by means of the method of the invention (antennas, transmitters, RFm and transponder antennas, sensing benefits, heating elements, antistatic (even for plastics), shielding, etc.) Contact points or contact welds 125205.doc -32- 200833187 塾 or interconnects are created on the integrated electronic components. The method of the present invention can also be used to metallize, for example, printed circuit boards, RFID antenna or transponder antennas, flat cables, holes in island conductors, channels, blind holes, etc., in order to penetrate the upper and lower sides of the contact. . This method also applies when other substrates are used. If the metallization member produced in accordance with the present invention comprises a magnetizable metal, it can also be used in the field of magnetizable functional components such as magnetic tables, magnetic games, magnetic surfaces on, for example, refrigerator doors. It can also be used in areas where good thermal conductivity is advantageous, for example in foils for seat heaters, floor heating and insulation. A preferred use of a metallized surface in accordance with the present invention is that the product produced in this manner is used as a printed circuit board, RFID antenna, repeater antenna, seat heater, flat cable, contactless wafer card, cladding Thin metal foil or polymer support on one or both sides, foil conductors, conductor tracks in solar cells or LCD/plasma screens or for decorative applications (for example, with φ for packaging materials). One of the advantages of the method of the present invention is that sufficient coating is possible even when materials that are susceptible to oxidation are used for electroless or electrolytically coatable particles. The invention will be explained in more detail below with the aid of the drawings. The figures show only one possible embodiment by way of example. In addition to the examples mentioned, this month comes from. It is also practiced in other embodiments or in combinations of such embodiments. [Embodiment] FIG. 1 and FIG. 1.2 show that in the first embodiment, the electroless and/or electrolytically smeared 125205.doc-33-200833187 sub-transfer to a non-conductive support member having an adhesive layer. The adhesive layer 3 is applied to the non-conductive members. The adhesive layer 3 has a structure of a conductive surface to be produced. Furthermore, a layer 7 containing electroless and/or electrolytically coatable particles is applied to the transfer medium 5, such electroless and/or electrolyzable particles are preferably contained in layer 7 in a single layer. For the non-conductive support! The upper-conducting surface is obtained such that the non-conductive support having the adhesive layer 3 and the transfer medium 5 having the layer 7 containing no electroless and/or electrolytically coatable particles are connected to each other to make it contain no electricity and/or electrolysis. The layer 7 of coated particles contacts the adhesive layer 3. Hunting is carried out by contacting the layer 7 containing the electroless and/or electrolytically coatable particles with the adhesives. The electrolessly and/or electrolytically coatable particles are transferred from the layer 7 to the adhesive layer 3. For this reason, the adhesion of the adhesive layer 3 must be greater than the adhesion of the layer 7. The electroless and/or electrolytically coatable particles in layer 7 can be adhered by means of a polymer layer which is not fully cured and/or dried. The electroless and/or electrolytically coatable particles may also be adhered to the transfer medium 5 by magnetic force like the layer 7. In order to make the adhesive layer 3 contact with the layer 7 containing the electroless and/or electrolytically coatable particles, the non-conductive branch member and the transfer medium 5 are moved to each other, so that the non-conductive electric branch member 1 and the transfer medium 5 are The alignment is such that the adhesive layer 3 and the layer 7 containing the electroless and/or electrically detachable particles face each other. The movement of the support 1 and the transfer medium 5 toward each other is indicated by arrows 9 and 11. When the non-conductive support member 丨 and the transfer medium 5 are pressed against each other, the adhesive of the adhesive layer 3 may be cured and/or dried. In this way, the ruthenium-free and/or electrolytically coatable particles from layer 7 become bonded to the adhesive layer 3. However, it is also possible to remove the transfer medium 5 from the non-conductive support member before curing the adhesive of the adhesive layer 3. Under this condition, the adhesion of the adhesive layer 3 is still greater than that of the transfer medium 5 even in the uncured state. 125205.doc -34-200833187. Figure 1.2 shows the method steps of removing the transfer medium 5 from the non-conductive support member after the layer 7 containing the electroless and/or electrolytically coatable particles has been transferred to the adhesive layer 3 of the non-conductive support member 1. The non-conductive support member and the transfer medium 5 are represented by arrows 13 and 15. As can be seen in Figure 1.2, at the location where the adhesive layer 3 is applied to the non-conductive support member 1, the layer 7 has been detached from the transfer medium 5 and adhered to the wire bond layer 3. In this manner, a substrate containing electroless and/or electrolytically coatable φ and which can be electrolessly and/or electrolytically coated is produced on the non-conductive support member. Figure 2 presents the method steps of transferring electroless and/or electrolytically coatable particles from a transfer medium to a non-conductive support in a second embodiment. In the embodiment presented in Figure 2, the transfer medium 5 is configured as an endless belt:;. In the embodiment presented herein, the endless belts are called 17, 19 operating. At least one of the mechanical shafts 17, 19 is driven to move the endless belt (10). However, it is also possible to drive two mechanical shafts 17, 19. In addition to the embodiments presented herein (in the basin, 'in the case, in the middle, the sub-b is wound around two mechanical shafts 17, operating), it is also possible to provide a single mechanical wire acting as a transfer medium instead of a mechanical winding. The shaft 17 and ^ π are swayed by the %-shaped tribute 15 . Likewise, individual mechanical axes can be arranged in series. Instead of two mechanical shafts 17, 19, it is also possible to use a circular belt 15 shaft. For the purpose of making the electroless and/or electrolytically coatable particle layer 3, it is preferable to contain the adhesive of the second electrode member 1 in a single layer, 43⁄4^j® 7 s ^ , <, , electricity and/or electrolysis can be applied to the endless belt at the 'θ ^ position. After the application of 125205.doc •35-200833187 #&# electric and/or electrolytically coatable particles are transferred from layer 7 to the adhesive layer 3. The endless belt 15 is preferably identical to the non-conductive ones.

動。環形帶子15的移動由箭頭21表示,且非導電支撐件i 的移動由箭頭23表示。移除其上施加有含有無電及/或電 解:塗粒子之層7之環形帶子15係藉由經由機械軸Μ使環 形帶子15偏離,同時非導電支替Η例如)繼續在與在與環 形帶子15接觸期間相同之方向上移動來進行。在已使環形 帶子15與非導電支撐们分離後,含有無電及/或電料塗 粒子之層7在施加黏接層3之位置處黏附。以此方式,黏接 層3具備一可經無電及/或電解塗佈之表面。在已自非導電 支撐件i移除環形帶子15之後,自環形帶子15移除仍黏附 至環形帶子15上之層7部分。舉例而言,此藉助於一在環 形帶子15之上刮擦之刮刀25來完成。然而,亦可能使用熟 習此項技術者已知之任何合適裝置,以該裝置可自環形帶 子15移除層7。必須自環形帶子移除層7之殘餘物,以使得 當將層7再施加至環形帶子上時形成僅一層含有較佳以單 層形式之無電及/或電解可塗粒子7。若在與非導電支撐件 1分離之後未自環形帶子15移除層7之殘餘物,則新施加之 層7可覆蓋先前週期之殘餘物,且由此產生一含有無電及/ 或電解可塗粒子之不均勻多層級層。 一其上形成有一基層之非導電支撐件呈現於圖3中。 為此’將具有待產生之導電表面之結構之黏接層3施加 125205.doc -36- 200833187 至非導電支撐件1上。含有無電及/或電解可塗粒子之層33 黏附至黏接層3上。此層具有與黏接層相同之結構。黏接 層3與黏附至其上之含有無電及/或電解可塗粒子之層μ — 起形成基層3 1。為使基層3 1可經無電及/或電解塗佈,較 佳使無電及/或電解可塗粒子固持於層3 3中,使得其位於 基層31之不同於非導電支撐件1之另一側上。該等無電及/ 或電解可塗粒子較佳含於基層3 1中,使得其在基層3丨之表 面35上可見。 若無電及/或電解可塗粒子不可見或僅在很小程度上可 見,則可能使其暴露。暴露可(例如)以機械方式、物理方 式或化學方式進行。 在第三實施例中用以將無電及/或電解可塗粒子塗覆至 非導電支撐件上之方法呈現於圖4·ι至圖4.3中。 在圖4.1至圖4.3所呈現之方法中,首先將無電及/或電解 可塗粒子41以一層形式、較佳以一單層形式施加至轉移介 質5上。為此,將無電及/或電解可塗粒子“固持於儲存容 器43中自該儲存容器43將該等粒子41供應至轉移介質 5。或者,可藉助於印刷、堯鑄、刀片刮抹或噴霧方法將 粒子41塗覆至該轉移介質上。為使無電及/或電解可塗粒 子41黏附至轉移介質5上,將磁鐵45配置於轉移介質5之不 同於無電及/或電解可塗粒子41之另一側上。該磁鐵可為 欠久磁鐵或電磁鐵。藉由磁鐵45之磁力將無電及/或電解 可塗粒子41固持於轉移介質5上。為此’無電及/或電解可 塗粒子41須由磁性或可磁化材料形成。 125205.doc -37- 200833187 在已將無電及/或電解可塗粒子41塗覆至轉移介質5上之 後,使後者與具備黏接層3之非導電支撐件1接觸。圖4·2 展不在使其上施加有黏揍層3之非導電支撐件〗與轉移介質 5上之無電及/或電解可塗粒子41接觸之前的短暫時間。為 使與黏接層3接觸之無電及/或電解可塗粒子41自轉移介質 5脫離,磁鐵45之磁力經選擇以小於黏接層3之黏附力。黏 接層3之黏接劑亦可能在與無電及/或電解可塗粒子“接觸 之後首先至少部分經固化及/或至少部分經乾燥,隨後自 轉移介質5移除非導電支撐件丨連同黏接層3及黏附至其上 之無電及/或電解可塗粒子41。圖4·3展示在自轉移介質5移 除其上施加有黏接層3且黏附無電及/或電解可塗粒子4 i之 非導電支撐件1之後的短暫時間。 在圖4·1至圖4.3所呈現之實施例中,例如,轉移介質5可 組態成一與非導電支撐件!接觸之板,或組態成如圖2中之 裱形帶子。若將轉移介質5組態成環形帶子,則磁鐵仏較 佳配置於環形帶子15繞其運轉之機械軸17、19之間。 …、電及/或電解可塗粒子藉助於磁力而固持於轉移介質5 上之第四實施例呈現於圖5中。 在圖5中所呈現之實施例中,轉移介質5設計為中空機械 軸1之开y式。接納磁鐵5 3及轉移磁鐵5 5容納於中空機械軸 51内邛。藉助於接納磁鐵53,將無電及/或電解可塗粒子 41吸引至中空機械軸51上且黏附至其上。藉由轉移磁鐵55 之磁%使無電及/或電解可塗粒子4丨固持於中空機械軸5夏 上。然而,轉移磁鐵55之磁場經選擇使得與非導電支撐件 125205.doc -38- 200833187 1上之黏接層3接觸之無電及/或電解可塗粒子41保持點附 至黏接層3上而不會因轉移磁鐵55之強磁場而再次自黏接 層3移除,且繼續黏附至中空機械軸51上。替代如圖$中所 呈現之實施例(具有接納磁鐵53及轉移磁鐵55),亦可能提 供僅一個磁鐵或甚至兩個以上磁鐵。在該等狀況下,必須 確保在無電及/或電解可塗粒子41自中空機械軸51轉移至 非導電支撑件1上之黏接層3上之區域中之磁力小於點接層 3之黏附力。在黏附至中空機械軸51上之無電及/或電解可 塗粒子41與非導電支撐件1上之黏接層3接觸之後,仍黏附 至中空機械軸51上之無電及/或電解可塗粒子“在重新接 納於中空機械軸51上之前較佳首先自中空機械糾移除。 舉例而言,此可藉助於施加Ac場之線圈57來完成。由八匚 場57使中空機械軸51消磁。以此方式,使先前黏附至中空 機械軸5】上之無電及/或電解可塗粒子“自中空機械㈣ 脫離或者’黏附至中空機械軸51上之無電及,或電解可 塗粒子亦可藉由刮刀或藉由重力移除。 上為:無電及/或電解可塗粒子41轉移至中空機械轴η 持心 所呈現之實施例中’將中空機械軸51浸入固move. The movement of the endless belt 15 is indicated by arrow 21 and the movement of the non-conductive support i is indicated by arrow 23. Removing the endless belt 15 on which the layer 7 containing the electroless and/or electrolyzed: coated particles is applied by deviating the endless belt 15 via a mechanical shaft, while the non-conductive support, for example, continues to be in and out of the endless belt 15 moves in the same direction during contact. After the endless belt 15 has been separated from the non-conductive support, the layer 7 containing the electroless and/or electrocoat particles is adhered at the position where the adhesive layer 3 is applied. In this way, the adhesive layer 3 is provided with a surface which can be electrolessly and/or electrolytically coated. After the endless belt 15 has been removed from the non-conductive support i, the portion of the layer 7 still adhering to the endless belt 15 is removed from the endless belt 15. This is done, for example, by means of a doctor blade 25 which is scraped over the endless belt 15. However, it is also possible to use any suitable device known to those skilled in the art that can remove layer 7 from endless belt 15. The residue of layer 7 must be removed from the endless belt so that when layer 7 is reapplied to the endless belt, only one layer contains electroless and/or electrolytically coatable particles 7 preferably in the form of a single layer. If the residue of layer 7 is not removed from the endless belt 15 after separation from the non-conductive support 1, the newly applied layer 7 can cover the residue of the previous cycle and thereby produce a charge-free and/or electrolytically coatable Uneven multi-layered layers of particles. A non-conductive support member having a base layer formed thereon is shown in FIG. To this end, the adhesive layer 3 having the structure of the conductive surface to be produced is applied to 125205.doc -36-200833187 to the non-conductive support member 1. A layer 33 containing electroless and/or electrolytically coatable particles is adhered to the adhesive layer 3. This layer has the same structure as the adhesive layer. The adhesive layer 3 forms a base layer 31 with a layer μ containing electroless and/or electrolytically coatable particles adhered thereto. In order to allow the base layer 31 to be electrolessly and/or electrolytically coated, it is preferred that the electroless and/or electrolytically coatable particles are held in the layer 33 such that it is located on the other side of the base layer 31 different from the non-conductive support member 1. on. Preferably, the electroless and/or electrolytically coatable particles are contained in the base layer 31 such that they are visible on the surface 35 of the base layer. If the electroless and/or electrolytically coatable particles are not visible or only visible to a small extent, they may be exposed. Exposure can be performed, for example, mechanically, physically, or chemically. The method for applying electroless and/or electrolytically coatable particles to a non-conductive support in the third embodiment is presented in Figures 4 to 3.4. In the method presented in Figures 4.1 to 4.3, the electroless and/or electrolytically coatable particles 41 are first applied to the transfer medium 5 in the form of a layer, preferably in a single layer. To this end, the electroless and/or electrolytically coatable particles are "held in the storage container 43 from the storage container 43 to supply the particles 41 to the transfer medium 5. Alternatively, it may be by means of printing, casting, blade scraping or spraying The method applies the particles 41 to the transfer medium. In order to adhere the electroless and/or electrolytically coatable particles 41 to the transfer medium 5, the magnets 45 are disposed on the transfer medium 5 differently from the electroless and/or electrolytically coatable particles 41. On the other side, the magnet may be a less permanent magnet or an electromagnet. The electroless and/or electrolytically coatable particles 41 are held on the transfer medium 5 by the magnetic force of the magnet 45. For this purpose, 'no electricity and/or electrolysis can be coated. The particles 41 must be formed of a magnetic or magnetizable material. 125205.doc -37- 200833187 After the electroless and/or electrolytically coatable particles 41 have been applied to the transfer medium 5, the latter is rendered non-conductive with the adhesive layer 3. The support member 1 is in contact. Fig. 4·2 shows a short time before the non-conductive support member on which the adhesive layer 3 is applied is contacted with the electroless and/or electrolytically coatable particles 41 on the transfer medium 5. Electroless and/or electrolytically coatable particles in contact with the adhesive layer 3 41, the self-transfer medium 5 is detached, and the magnetic force of the magnet 45 is selected to be smaller than the adhesion force of the adhesive layer 3. The adhesive of the adhesive layer 3 may also be at least partially passed after being contacted with the electroless and/or electrolytically coatable particles. Curing and/or at least partially drying, then removing the non-conductive support from the transfer medium 5 together with the adhesive layer 3 and the electroless and/or electrolytically coatable particles 41 adhered thereto. Figure 4.3 shows the short time after the transfer medium 5 has been removed from the non-conductive support 1 to which the adhesive layer 3 has been applied and to which the electroless and/or electrolytically coatable particles 4 i have been adhered. In the embodiment presented in Figures 4.1 to 4.3, for example, the transfer medium 5 can be configured as a non-conductive support! Contact the board, or configured as a braided strap as shown in Figure 2. If the transfer medium 5 is configured as an endless belt, the magnets are preferably disposed between the mechanical shafts 17, 19 around which the endless belt 15 runs. The fourth embodiment in which ..., electricity and/or electrolyzable particles are held on the transfer medium 5 by means of magnetic force is presented in FIG. In the embodiment presented in Figure 5, the transfer medium 5 is designed as an open y of the hollow mechanical shaft 1. The receiving magnet 53 and the transfer magnet 55 are housed in the hollow mechanical shaft 51. The electroless and/or electrolytically coatable particles 41 are attracted to the hollow mechanical shaft 51 and adhered thereto by means of the receiving magnets 53. The electroless and/or electrolytically coatable particles 4丨 are held on the hollow mechanical shaft 5 in summer by the magnetic % of the transfer magnet 55. However, the magnetic field of the transfer magnet 55 is selected such that the electroless and/or electrolytically coatable particles 41 in contact with the adhesive layer 3 on the non-conductive support member 125205.doc-38-200833187 1 remain attached to the adhesive layer 3 while It is not removed from the adhesive layer 3 again due to the strong magnetic field of the transfer magnet 55, and continues to adhere to the hollow mechanical shaft 51. Instead of the embodiment shown in Figure $ (with receiving magnet 53 and transfer magnet 55), it is also possible to provide only one magnet or even two or more magnets. Under such conditions, it must be ensured that the magnetic force in the region where the electroless and/or electrolytically coatable particles 41 are transferred from the hollow mechanical shaft 51 to the adhesive layer 3 on the non-conductive support member 1 is less than the adhesion of the contact layer 3. . After the electroless and/or electrolytically coatable particles 41 adhered to the hollow mechanical shaft 51 are in contact with the adhesive layer 3 on the non-conductive support member 1, the electroless and/or electrolytically coatable particles still adhere to the hollow mechanical shaft 51 "It is preferred to first remove the hollow mechanical shaft before re-accommodating on the hollow mechanical shaft 51. For example, this can be done by means of a coil 57 applying an Ac field. The hollow mechanical shaft 51 is demagnetized by the gossip field 57. In this way, the electroless and/or electrolytically coatable particles previously adhered to the hollow mechanical shaft 5" are detached from the hollow mechanical (four) or 'adhered to the hollow mechanical shaft 51 without electricity, or the electrolyzable particles can also be borrowed Removed by a scraper or by gravity. The above is: the electroless and/or electrolyzable coated particles 41 are transferred to the hollow mechanical axis η. In the embodiment presented, the hollow mechanical shaft 51 is immersed in the solid

持無電及/或電解可塗粒子41之儲存容器 Z 納磁鐵53,验么兩竹, 稽助於接 5 , 、…、電及或電解可塗粒子41自儲存容器59吸 引至中空機械軸51上。 “59及 無電及/或電解可塗粒子 式存t 末形式U分散液形 :存在於儲存容器中。在分散液之 在儲存容器中攪拌及献姻—+ ^佳將刀政液 ㈣&熱調^在無電及/或電解可塗粒子 125205.doc • 39 - 200833187 41已由接納磁鐵53接納之後且在使其轉移至黏接層3上之 前,可(例如)藉由一乾燥步驟至少部分移除分散液之揮發 性成份(圖5中未展示)。 無電及/或電解可塗粒子41接納於中空機械軸51上可(例 . 藉助於雷射光學裝置(圖5中未展示)來進行光學監視。 藉由所施加之磁場強纟,可調整粒子之層,以使得僅 • 轉移一單一粒子層。 • 纟已使無電及/或電解可塗粒子41轉移至非導電支撐件! 之黏接層3上之後(如圖5中所呈現),在未施加黏接層〕之區 域中’黏附至非導電支撐件1 电又仿仟i上之粒子可能猎助於機械或 磁性清潔或藉由以合適液體洗滌而移除。磁性清潔呈現於 圖中纟此期間,具有非編織物之中空機械轴繞磁鐵 63運轉。未黏附至黏接層3上之無電及/或電解可塗粒子由 磁鐵6 3吸引且隨後藉助於中空機械軸6!之非編織物而移 、除使用具有内部置放之磁鐵53、55、57之中线械轴Η :::,:可能自磁性材料製造中空機械轴51或將其用一磁 /覆盍’無電及/或電解可塗粒子黏附至該中空機械轴 上在轉移至非導電支樓件1之黏接層3上之後,該中空 機械軸5 1較佳以機械方々 ^ 俄硪方式(例如,糟助於刮刀)清潔。 輪:絲圖3呈現在第五實施例中使無電及/或電解可塗 粒子轉移至㈣電支撐件上之方法步驟。 形弋轅銘百先使無電及’或電解可塗粒子41以分散液71之 移至轉移介質5上以形成層〜藉助於磁鐵75使含 125205.doc 200833187 於分散液71中之無電及/或電解可塗粒子41在轉移介質5之 方向上移動。藉此形成一層無電及/或電解可塗粒子4 i, 其中無電及/或電解可塗粒子41觸碰轉移介質5。 在第二步驟中,使其上施加有黏接層3之非導電支撐件i 與層73接觸。此步驟呈現於圖6·2中。在使含有無電及/或 ‘ 電解可塗粒子41之層73與黏接層3接觸之前,層73及/或黏 • 接層3可至少部分經固化及/或至少部分經乾燥,但此並非 φ 必須的。為使具有無電及/或電解可塗粒子41之層73僅轉 移至在非導電支撐件1上黏接層3所處之位置上,具有無電 及/或電解可塗粒子41之層73在轉移介質5上之黏附性必須 小於具有無電及/或電解可塗粒子4丨之層7 3在黏接層3上之 黏附性。其效果在於,當移除轉移介質5時,如圖6·3中所 呈現,具有無電及/或電解可塗粒子41之層73在黏接層3施 加至非導電支撐件1上之位置處保持黏附至黏接層3上,且 在無黏接層3施加至非導電支撐件丨上之位置處,具有無電 • 及/或電解可塗粒子4丨之層73保持黏附至轉移介質5上。以 此方式,產生基層31,其具有與先前施加至非導電支撐件 • 1上之黏接層3相同之結構。 在已移除轉移介質5之後,其上點附有層73且具有無電 及/或電解可塗粒子4丨之黏接層3至少部分經固化及/或至少 部分經乾燥。由於無電及/或電解可塗粒子41在將層乃施 加至轉移介質5上期間已藉助於磁鐵75之磁力而在轉移介 質5之方向上移動,因此根據本發明,在具有無電及/或電 解可塗粒子41之層73已轉移至非導電支擇们之黏接層3上 125205.doc -41 · 200833187 於基層31之不同於非 電及/或電解可塗粒子 之後,無電及/或電解可塗粒子41位 導電支撐件1之另一側上。由此,無 41可易於以金屬層無電或電解塗佈。 【圖式簡單說明】 圖U及圖1.2展示在第一實施例中無電及/或電解可塗粒 子轉移至―具備―黏接層之非導電支撐件上;Holding the storage container Z nanomagnet 53 of the electroless and/or electrolytically coatable particles 41, the two bamboos are inspected, and the coated, coated, and/or electrolytically coated particles 41 are attracted from the storage container 59 to the hollow mechanical shaft 51. on. "59 and no electricity and / or electrolyzable particles can be stored in the form of a final form of U dispersion: in the storage container. Stirring and marriage in the storage container in the dispersion - + ^ Jia Jiang Kung Kong (four) & heat Adjusting the electroless and/or electrolytically coatable particles 125205.doc • 39 - 200833187 41 after being received by the receiving magnet 53 and before being transferred to the bonding layer 3, may be at least partially performed, for example, by a drying step The volatile component of the dispersion is removed (not shown in Figure 5). The electroless and/or electrolytically coatable particles 41 are received on the hollow mechanical shaft 51 (for example by means of a laser optics (not shown in Figure 5)) Optical monitoring is performed. By applying a strong magnetic field, the layers of particles can be adjusted so that only a single particle layer is transferred. • The electroless and/or electrolyzable coated particles 41 have been transferred to a non-conductive support! After the adhesive layer 3 (as shown in FIG. 5), in the region where the adhesive layer is not applied, the particles adhered to the non-conductive support member 1 and may be assisted by mechanical or magnetic cleaning or Removed by washing with a suitable liquid. Magnetic cleaning is In the meantime, the hollow mechanical shaft with non-woven fabric is wound around the magnet 63. The electroless and/or electrolytically coatable particles that are not adhered to the adhesive layer 3 are attracted by the magnet 63 and then by means of a hollow mechanical shaft. 6! Non-woven material is moved, except for the mechanical axis 之中 of the magnets 53, 55, 57 with internal placement :::,: It is possible to manufacture the hollow mechanical shaft 51 from a magnetic material or use a magnetic/covering 盍After the electroless and/or electrolytically coatable particles are adhered to the hollow mechanical shaft, after transfer to the adhesive layer 3 of the non-conductive branch member 1, the hollow mechanical shaft 51 is preferably in a mechanical manner (for example, Fig. 3 shows the method steps for transferring electroless and/or electrolytically coatable particles onto the (four) electrical support in the fifth embodiment. Or the electrocoatable particles 41 are transferred from the dispersion 71 to the transfer medium 5 to form a layer. The electrolessly and/or electrolyzable particles 41 containing the 125205.doc 200833187 in the dispersion 71 are transferred to the transfer medium 5 by means of the magnet 75. Moving in the direction of the layer, thereby forming a layer of electroless and/or electrolytically coatable 4 i, wherein the electroless and/or electrolytically coatable particles 41 touch the transfer medium 5. In the second step, the non-conductive support i on which the adhesive layer 3 is applied is brought into contact with the layer 73. This step is presented in the figure In layer 2. 2, the layer 73 and/or the adhesive layer 3 may be at least partially cured and/or at least partially passed prior to contacting the layer 73 containing the electroless and/or electrolyzable particles 41 with the adhesive layer 3. Drying, but this is not necessary for φ. In order to transfer the layer 73 having electroless and/or electrolytically coatable particles 41 only to the position where the adhesive layer 3 is located on the non-conductive support member 1, there is no electricity and/or electrolysis. The adhesion of the layer 73 of the coatable particles 41 to the transfer medium 5 must be less than the adhesion of the layer 73 having the electroless and/or electrolytically coatable particles 4 to the adhesive layer 3. The effect is that when the transfer medium 5 is removed, as shown in Fig. 6.3, the layer 73 having the electroless and/or electrolytically coatable particles 41 is applied to the non-conductive support 1 at the position where the adhesive layer 3 is applied. Staying adhered to the adhesive layer 3, and at a position where the non-adhesive layer 3 is applied to the non-conductive support member, the layer 73 having no electricity and/or electrolytically coatable particles remains adhered to the transfer medium 5. . In this manner, the base layer 31 is produced having the same structure as the adhesive layer 3 previously applied to the non-conductive support member 1. After the transfer medium 5 has been removed, the adhesive layer 3 to which the layer 73 is attached and which has no electricity and/or electrolytically coatable particles 4 is at least partially cured and/or at least partially dried. Since the electroless and/or electrolytically coatable particles 41 have moved in the direction of the transfer medium 5 by means of the magnetic force of the magnet 75 during application of the layer to the transfer medium 5, according to the invention, there is no electricity and/or electrolysis The layer 73 of the coatable particles 41 has been transferred to the adhesive layer 3 of the non-conductive support. 125205.doc -41 · 200833187 After the base layer 31 is different from the non-electrical and/or electrolytically coatable particles, there is no electricity and/or electrolysis The coated particles can be coated on the other side of the 41-position conductive support member 1. Thus, no 41 can be easily electrolessly or electrolytically coated with a metal layer. BRIEF DESCRIPTION OF THE DRAWINGS FIG. U and FIG. 1.2 show that in the first embodiment, the electroless and/or electrolytically coatable particles are transferred to a non-conductive support member having an adhesive layer;

圖展不在第一只施例中無電及/或電解可塗粒子轉移至 一具備一黏接層之非導電支撐件上; 圖3展不一其上施加有一基層之非導電支撐件; 圖4·1至圖4·3展示在第三實施例中無電及/或電解可塗粒 子塗覆至-具備—黏接層之非導電支撐件上; 圖展示在第四只施例中無電及/或電解可塗粒子塗覆至 一具備一黏接層之非導電支撐件上; 圖至圖6·3展示在第五實施例中無電及/或電解可塗粒 子土覆至-具備—黏接層之非導電支撐件上。 【主要元件符號說明】 1 非導電支撐件 3 黏接層 5 轉移介質 7 層 9 支撐件1之移動 11 轉移介質5之移動 15 環形帶子 17 機械轴 125205.doc -42- 機械軸 環形帶子之移動 支撐件1之移動 刮刀 基層 含有無電及/或電解可塗粒子之層 基層3 1之表面 無電及/或電解可塗粒子 儲存容器 磁鐵 中空機械軸 接納磁鐵 轉移磁鐵 線圈 儲存容器 具備非編織物之中空機械軸 磁鐵 聚合物 聚合物層 磁鐵 -43-In the first example, the electroless and/or electrolytically coatable particles are transferred to a non-conductive support member having an adhesive layer; FIG. 3 shows a non-conductive support member on which a base layer is applied; 1 to 4·3 show that in the third embodiment, the electroless and/or electrolytically coatable particles are applied to the non-conductive support member having the adhesive layer; the figure shows that in the fourth embodiment, there is no electricity and/or Or electrolyzable coated particles are coated onto a non-conductive support member having an adhesive layer; FIG. 6.3 shows that in the fifth embodiment, the electroless and/or electrolytically coatable particles are coated to have-bonded On the non-conductive support of the layer. [Main component symbol description] 1 Non-conductive support member 3 Adhesive layer 5 Transfer medium 7 Layer 9 Movement of support member 11 Movement of transfer medium 5 15 Endless belt 17 Mechanical shaft 125205.doc -42- Movement of mechanical shaft endless belt The moving blade base layer of the support member 1 contains the layer of the electrolessly and/or electrolytically coatable particles. The surface of the base layer 31 is electrically non-charged and/or the electrolyzable coated particle storage container magnet hollow mechanical shaft receives the magnet transfer magnet coil storage container with non-woven hollow Mechanical shaft magnet polymer polymer layer magnet-43-

Claims (1)

200833187 十、申請專利範圍: 1·,種用以在一非導電支撐件⑴上產生結構性或全表面導 電表面之方法,其包含以下步驟: ⑷將一黏接層(3)施加至該非導電支撐件⑴上,該黏接 層(3)具有該導電表面之結構; (b) 將無電及/或電解可塗粒子⑼自一轉移介質⑺轉移 至該黏接層(3)上,該等無電及/或電解可塗粒子(41) 係以層之形式施加至該轉移介質(5)上; (c) 移除該轉移介質(5); ⑷至少部分乾燥及/或至少部分固化該黏接層⑺之黏接 ^,使得該等無電及/或電解可塗粒子(41)變得黏合 至該黏接層(3)且由此形成一基層(31); ⑷藉由無電及/或電解塗佈,將一金屬層施加至該等無 電及/或電解可塗粒子⑼上’藉助於該黏接層⑺黏 附至該非導電支撐件(1)上。 2·如請又項1之方法,其中該等無電及/或電解可塗粒子 (41)係藉由合劑(7ι)而緊固至該轉移介 3· 如請求項I夕古、、土 β丄 ' 、 、,,、中该基層(3 1)含有75至99.9重量% 之無電及/或電解可塗粒子(41)。 ί4Π Α求項1之方法,其中該等無電及7或電解可塗粒子 (41)為磁性的。 5.如請求項4之方法, 、T亥#無電及/或電解可塗粒子 )係猎由磁力而點附至該轉移介質(5)上。 6·如請求項U t, 、法,,、令在自該轉移介質(5)轉移至該非 I25205.doc 200833187 ‘=支撐件(1)上之後,該等無電及/或電解可塗粒子⑷) 係藉由一外力之作用而在該基層(31)不同於該非導電支 撐件(1)之另一側上移動。 7·如請求項6之方法,其中該外力為一磁力。 ^ '求員1之方法,其中該等無電及/或電解可塗粒子 ()3有Fe、Zn、Cu、Ni、A卜碳或其混合物。 9·如⑼纟項1之方法,其中該等無電及/或電解可塗粒子 _ (41)為幾基_鐵粉末。 1。·如睛求項9之方法,其中該羰基_鐵粉末塗佈有一無機及/ 或有機層。 Π.如請求項1〇之方法,其中該羰基-鐵粉末之該塗層含有聚 乙烯、聚丙烯或聚四氤乙烯。 12·如請求項1之方法’其中該支撐件⑴上之該黏接層(3)及/ 或該轉移介質(5)上之無電及/或電解可塗粒子層係藉由 -印刷、澆鑄、輥軋、浸潰或噴霧方法來施加。 籲13.如請求項1之方法,其中將該等結構性導電表面施加至 ㈣導f支撐件⑴之上側及下側上。 . 月求員13之方法,其中在該非導電支撐件(1)之該上側 及該下側上之該等結構性導電表面係藉由至少一穿透觸 點而彼此連接。 15::f :M之方法,其中在,非導電支撐件中之至少- 孔之一壁係藉由無電及/或電解塗佈該穿透觸點而具備- 金屬層。 16 ·如請求項1之t、、i_ ^ , t _ 去,,、中生產該非導電支撐件(1)之材料 125205.doc 200833187 為一經壓製而形成板或 膜。 滾请之樹脂浸潰織 品或一塑膠薄 ’其係用以生產印刷電路板上之導體 轉發器天線或其他天線結構、晶片卡 座椅加熱器、荡導體、太陽能電池中 之‘體軌道或用以生產任何形式之電200833187 X. Patent Application Range: 1. A method for producing a structural or full-surface conductive surface on a non-conductive support member (1), comprising the steps of: (4) applying an adhesive layer (3) to the non-conductive layer On the support member (1), the adhesive layer (3) has the structure of the conductive surface; (b) transferring the electroless and/or electrolytically coatable particles (9) from a transfer medium (7) to the adhesive layer (3), The electroless and/or electrolytically coatable particles (41) are applied to the transfer medium (5) in the form of a layer; (c) the transfer medium (5) is removed; (4) at least partially dried and/or at least partially cured. Bonding of the layer (7), such that the electroless and/or electrolytically coatable particles (41) become bonded to the adhesive layer (3) and thereby form a base layer (31); (4) by no electricity and/or Electrolytic coating, a metal layer is applied to the electroless and/or electrolytically coatable particles (9) by means of which the adhesive layer (7) is adhered to the non-conductive support (1). 2. The method of claim 1, wherein the electroless and/or electrolytically coatable particles (41) are fastened to the transfer medium by a mixture (7), such as the request item I, the earth, the soil β The base layer (31) contains 75 to 99.9% by weight of electroless and/or electrolytically coatable particles (41). Π4Π The method of claim 1, wherein the electroless and 7 or electrolytically coatable particles (41) are magnetic. 5. The method of claim 4, T Hai #无电, and/or electrolytically coatable particles) is attached to the transfer medium (5) by magnetic force. 6. If the request item U t , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ) is moved on the other side of the base layer (31) different from the non-conductive support member (1) by an external force. 7. The method of claim 6, wherein the external force is a magnetic force. ^ 'A method of claim 1, wherein the electroless and/or electrolytically coatable particles (3) have Fe, Zn, Cu, Ni, Ab carbon or a mixture thereof. 9. The method of item 1, wherein the electroless and/or electrolytically coatable particles _ (41) are a few base-iron powder. 1. The method of claim 9, wherein the carbonyl-iron powder is coated with an inorganic and/or organic layer. The method of claim 1 wherein the coating of the carbonyl-iron powder comprises polyethylene, polypropylene or polytetramethylene. 12. The method of claim 1 wherein the adhesive layer (3) on the support member (1) and/or the electroless and/or electrolytically coatable particle layer on the transfer medium (5) is printed and cast by printing Apply by rolling, dipping or spraying. The method of claim 1, wherein the structural conductive surfaces are applied to the upper and lower sides of the (four) guide f support (1). The method of claim 13, wherein the structural conductive surfaces on the upper side and the lower side of the non-conductive support member (1) are connected to each other by at least one penetration contact. 15::f: The method of M, wherein at least one of the walls of the non-conductive support has a metal layer by electrolessly and/or electrolytically coating the through contact. 16 · The material of the non-conductive support (1) is produced as in t, i_^, t _ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , . Rolled resin impregnated fabric or a thin plastic 'used to produce conductor transponder antennas or other antenna structures on printed circuit boards, wafer card seat heaters, sway conductors, 'body tracks in solar cells or To produce electricity in any form 1 7·如請求項1之方法 軌道、RFID天線、 模組、扁平電纜、 或LCD/電漿螢幕中 解塗佈產品。 18 ·如請求項1之方、、土 、 / ’,、係用以在產品上產生裝飾性或功 月匕性表面,該笼表 寻表面係用於屏蔽電磁輻射、用於熱傳導 或用作封裝。 19 ·如請求工苜;夕士 . v 、 万法’其係用以生產一或兩側經金屬包層 之薄金屬箔或聚合物支撐件。1 7. Method of claim 1 Orbital, RFID antenna, module, flat cable, or LCD/plasma screen to decoat the product. 18 · As in the case of claim 1, the soil, / ', is used to produce a decorative or functional moon-like surface on the product, the cage surface is used to shield electromagnetic radiation, for heat conduction or for use as Package. 19 • Request for work; Xi Shi. v, Wanfa's are used to produce thin metal foil or polymer supports on one or both sides of metal clad. 125205.doc125205.doc
TW96137901A 2006-11-06 2007-10-09 Method for producing structured electrically conductive surfaces TW200833187A (en)

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