TW200827963A - An interface for operating and monitoring abatement systems - Google Patents
An interface for operating and monitoring abatement systems Download PDFInfo
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- TW200827963A TW200827963A TW96131306A TW96131306A TW200827963A TW 200827963 A TW200827963 A TW 200827963A TW 96131306 A TW96131306 A TW 96131306A TW 96131306 A TW96131306 A TW 96131306A TW 200827963 A TW200827963 A TW 200827963A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0635—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
- G05D7/0641—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
- G05D7/0658—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged for the control of a single flow from a plurality of converging flows
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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Abstract
Description
200827963 九、处 ^ 發明說明: 聲明所屬之技術領域】 本發明係關於半導體元件之製造 '^測多重減弱系統之方法與系統。 更具體地係關 於用 η ι前技術】 從半導體材料、元件、產品與記憶體物件之製造 的翁 ^懸流,包含在製程設備中所使用以及產生的各種 這些化合物包含了無機與有機化合物、光阻與其 劑分 解的產物,以及其他各種的氣體,在經由製程設 〇 大氣之前,都必須由廢氣中移除。 半導體製造過程中使用了各種化合物,其中多種 人體容許劑量(human tolerance level)極低。於 過 rU 技中(例如物理氣相沉積、擴散、蝕刻 PFC製程、 ' )’所使用的部分工具(例如化學氣相沉積室、化學 嗯至、擴散室等)以及製程可能會產生不想要的副產 例如 全氟化物(perfluorocompounds,PFCs)或可能分 C s之副產物。P F C s乃已被認定是造成溫室效應的 Ά 〇 藉由一減弱系統,可將這些不想要的副產物從流 中& 砂除。基材與平面顯示器/LCD之製程所產生的氣儀 $我弱系統轉換成對環境較少衝擊的形式,再排放 中。、、 減弱系統可與半導體製程工具輕合,並典型地可 展生時,減弱由工具而來的製程氣體。據此,仍待200827963 IX. Department of the Invention: Field of the Invention The present invention relates to a method and system for manufacturing a semiconductor device. More specifically, with respect to the use of η ι prior art] from the fabrication of semiconductor materials, components, products, and memory articles, the various compounds included in the process equipment and produced include inorganic and organic compounds, The photoresist and its decomposition products, as well as various other gases, must be removed from the exhaust gas before it is placed in the atmosphere via the process. Various compounds are used in the semiconductor manufacturing process, and many of them have extremely low human tolerance levels. Some of the tools used in rU technology (such as physical vapor deposition, diffusion, etching PFC processes, ' )) (such as chemical vapor deposition chambers, chemical vapor deposition chambers, diffusion chambers, etc.) and processes may produce unwanted By-products such as perfluorocompounds (PFCs) or by-products of Cs. P F C s has been identified as causing a greenhouse effect 藉 By a weakening system, these unwanted by-products can be removed from the stream & The gas meter generated by the substrate and the flat panel display / LCD process is converted into a form that has less impact on the environment and is discharged. The abatement system can be lightly coupled to the semiconductor process tool and is typically extensible to attenuate process gases from the tool. According to this, still waiting
PP 而來 化合 他試 備排 化合 製程 蠢晶 機械 物, 解成 極大 出物 ,可 環境 在氣 開發 5 200827963 出一種介面,用以操作且監測減弱系統。 【發明内容】 於本發明之一態樣中,提供一種監測及控制一或多個 減弱系統之方法。該方法包含下列步驟(1)在一顯示器上呈 現一或多個減弱系統;(2)在該顯示器上呈現從製程工具而 來的一或多個流出物流;(3)在該顯示器上呈現複數個流出 物流配置之選擇;(4)接收一所選擇的流出物流配置;以及 (5)控制一界面歧管,以執行該所選的流出物流配置。 於本發明之另一態樣中,提供一種監測及控制一或多 個減弱系統之方法。該方法包含下列步驟(1)在一顯示器上 呈現一或多個減弱系統;(2)在該顯示器上呈現從製程工具 而來的一或多個流出物流;(3)接受一選擇,該選擇係指示 一備用流出物流配置,其中該一或多個減弱系統之一第一 子集,係選作為一主要減弱系統,而該一或多個減弱系統 之一第二子集,則選作為一備用減弱系統;(4)將該一或多 個流出物流導入該一或多個主要減弱系統;(5 )將一或多個 被用減弱系統設定成一備用模式;以及(6)配置一界面歧 管,以依據該主要減弱系統的一狀態,將流出物流從該一 或多個主要減弱系統,重新導入該一或多個備用減弱系統。 於本發明之又一態樣中,提供一種監測及控制一或多 個減弱系統之方法,該方法包含步驟(1)在一顯示器上呈現 一或多個減弱系統;(2)在該顯示器上呈現從製程工具而來 的一或多個流出物流;(3)接受一選擇,該選擇係指示一冗 6 200827963 餘流出物流配置,其中該一或多個減弱系統之至少一第一 減弱系統,則接收從製程工具而來的一或多個流出物流, 以及該一或多個減弱系統之至少一第二減弱系統,則接收 從製程工具而來的一或多個流出物流;以及(4)配置一界面 歧管,以依據一斷線減弱系統的狀態,將該一或多個流出 物流從該斷線減弱系統,重新導入一操作中的減弱系統。He came to combine and he tried to prepare a process for the production of a stupid crystal machine, which was solved by a large amount of material, and the environment was developed in the gas. 5 200827963 An interface was used to operate and monitor the weakening system. SUMMARY OF THE INVENTION In one aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises the steps of (1) presenting one or more attenuation systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) presenting a plurality of effluent streams on the display Selection of an effluent stream configuration; (4) receiving a selected effluent stream configuration; and (5) controlling an interface manifold to perform the selected effluent stream configuration. In another aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises the steps of (1) presenting one or more abatement systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) accepting a selection, the selection Instructing an alternate outflow logistics configuration, wherein the first subset of the one or more attenuation systems is selected as a primary attenuation system and the second subset of the one or more attenuation systems is selected as a a standby abatement system; (4) introducing the one or more effluent streams into the one or more primary abatement systems; (5) setting one or more of the abatement systems to be in a standby mode; and (6) configuring an interface disparity And re-importing the effluent stream from the one or more primary abatement systems to the one or more alternate abatement systems in accordance with a state of the primary abatement system. In yet another aspect of the present invention, a method of monitoring and controlling one or more attenuation systems is provided, the method comprising the steps of (1) presenting one or more attenuation systems on a display; (2) on the display Presenting one or more outflow streams from the process tool; (3) accepting a selection indicating a redundant 6200827963 remaining outflow configuration, wherein the at least one first abatement system of the one or more attenuation systems, Receiving one or more effluent streams from the process tool, and at least one second abatement system of the one or more abatement systems, receiving one or more effluent streams from the process tool; and (4) An interface manifold is configured to re-introduce the one or more effluent streams from the disconnection abatement system into an operational abatement system in accordance with a disconnection attenuating system condition.
於本發明之另一態樣中,提供一種監測及控制一或多 個減弱系統之方法。該方法包含(1)在一顯示器上呈現一或 多個減弱系統;(2)在該顯示器上呈現從製程工具而來的一 或多個流出物流;(3)接受一選擇,該選擇係指示一載量平 衡流出物流配置;以及(4)配置一界面歧管,以依據至少一 效率標準,將該流出物流導入該一或多個減弱系統。 於本發明之又一態樣中,提供一種監測及控制一或多 個減弱系統之方法。該方法包含(1)在一顯示器上呈現一或 多個減弱系統;(2)在該顯示器上呈現從製程工具而來的一 或多個流出物流;(3)接受一選擇,該選擇係指示一特定應 用流出物流配置;(4)配置一界面歧管,以將一第一流出 物流導入一第一減弱系統,其中該第一流出物流係從一第 一製程而來;以及(5)配置一界面歧管,以將一第二流出物 流導入一第二減弱系統,其中該第二流出物流係從一第二 製程而來。 依據下述之實施方式、申請專利範圍與所附圖示,可 使本發明其他特徵與態樣更為清楚。 7 200827963 【實施方式】 本發明係提供一種監測與控制一或多個減弱系統之系 統與方法,以將減弱系統整為單一整合系統。本發明能夠 自動監測、追蹤以及操作減弱系統和從電子元件製程工具 至減弱系統間的流出物流。舉例而言,在具有兩個操作之 減弱系統的系統中,操作者可藉由一軟體介面至一系統控 制器,檢閱流入每一減弱系統的流出物,並決定僅其中一 個減弱系統要在此時容納這些流出物流。之後,操作者可 利用介面將合適的轉換輸入系統中,以將第二減弱系統設 定成備用模式,而原本流入第二減弱系統的流出物則被導 入第一減弱系統。另外,可將系統控制器建構成能自動地 使用減弱系統,例如可以最有效率的方式使用。 於部份實施例中,本發明能使操作者經由界面歧管, 將流出物流導至減弱系統,這些岐管可包含一系列的電子 控制閥,用以開啟、關閉、及/或轉換一或多個電子元件製 程工具與一或多個減弱系統間的通道。界面岐管可與一控 制器耦合,並被控制器操作,該控制器係用以接收從界面 歧管、操作者、製程工具與減弱系統來的訊息。於部份實 施例中,操作者可檢閱這些訊息,之後可將指示經由控制 器傳送至界面歧管。另外,控制器可依據從界面歧管、操 作者、製程工具與減弱系統所接收到的訊息,自動地操作 界面歧管。 系統控制器可允許一些已預設或操作者設定之流出物 流配置的簡易選擇與施行。舉例而言,預設流出物流配置 8 200827963 可包含備用配置、冗餘配置、載量平衡配置與特定應用配 置。這些流配置類型將於下文中詳述。 參照第1圖,其係繪示使用者介面100之示意圖。使 用者介面可由使用標準操作系統之標準個人電腦(PC)執 行。另外,可於控制器上執行使用者介面,此係揭露於2 0 0 6 年8月23日所申請之美國專利申請號60/82 3,292,標題為 「具有備用功能之減弱系統及其使用方法(ABATEMENT SYSTEM WITH BACK-UP FUNCTIONALITY AND METHOD OF USING THE SAME)」(代理人案號 1 1 469), 其全部揭示内容以引用方式併入本文。使用者介面100在 顯示器1 0 4上,可包含一或多個選擇地互動的減弱系統1 0 2 之圖像。於此則繪示了三個減弱系統 1 0 2,然而此僅為示 例之用,其可顯示所檢測之任意數目的減弱系統 1 02。每 一減弱系統可具有一特定(例如靜態)IP位址,並可經由一 集線器,連接至例如個人電腦或伺服器等的單一整合系統。 使用者介面1 〇 〇亦可包含一或多個流出物流配置1 〇 6 之圖像,該些流出物流配置可施用於每一減弱系統 102。 舉例而言,流出物流配置可包含一備用流出物流配置、一 特定應用流出物流配置、一載量平衡流出物流配置、一冗 餘留出物流配置以及一使用者設定流出物流配置。施用於 所顯示之減弱系統1 02A-C的流出物流配置1 06,可以其他 方式標記或指示。於下文中將對流出物流配置有更詳盡描 述。 操作者(未繪示)可利用使用者介面100遙控安裝在製 9In another aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises (1) presenting one or more attenuation systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) accepting a selection, the selection is indicative a load balancing effluent stream configuration; and (4) configuring an interface manifold to direct the effluent stream to the one or more abatement systems in accordance with at least one efficiency criterion. In yet another aspect of the invention, a method of monitoring and controlling one or more attenuation systems is provided. The method comprises (1) presenting one or more attenuation systems on a display; (2) presenting one or more effluent streams from the process tool on the display; (3) accepting a selection, the selection is indicative a specific application effluent stream configuration; (4) configuring an interface manifold to direct a first effluent stream to a first abatement system, wherein the first effluent stream is from a first process; and (5) configuring An interface manifold for introducing a second effluent stream into a second abatement system, wherein the second effluent stream is from a second process. Further features and aspects of the present invention will become apparent from the Detailed Description, the appended claims and appended claims. 7 200827963 [Embodiment] The present invention provides a system and method for monitoring and controlling one or more abatement systems to integrate the attenuating system into a single integrated system. The present invention is capable of automatically monitoring, tracking, and operating the abatement system and the effluent stream from the electronic component process tool to the weakened system. For example, in a system with two operational abatement systems, the operator can review the effluent flowing into each of the abatement systems via a software interface to a system controller and decide that only one of the abatement systems is to be These effluent streams are accommodated. Thereafter, the operator can use the interface to input the appropriate transitions into the system to set the second abatement system to the standby mode, while the effluent originally flowing into the second abatement system is directed to the first abatement system. In addition, the system controller can be constructed to automatically use the abatement system, for example, in the most efficient manner. In some embodiments, the present invention enables an operator to direct an effluent stream to an abatement system via an interface manifold, which may include a series of electronically controlled valves for opening, closing, and/or switching one or A channel between a plurality of electronic component processing tools and one or more abatement systems. The interface manifold can be coupled to a controller and operated by a controller for receiving messages from the interface manifold, the operator, the process tool, and the abatement system. In some embodiments, the operator can review the messages and then communicate the instructions to the interface manifold via the controller. In addition, the controller can automatically operate the interface manifold based on messages received from interface manifolds, operators, process tools, and abatement systems. The system controller allows for easy selection and execution of effluent flow configurations that have been preset or set by the operator. For example, the default outbound logistics configuration 8 200827963 can include alternate configurations, redundant configurations, load balancing configurations, and application specific configurations. These flow configuration types are detailed below. Referring to Figure 1, a schematic diagram of a user interface 100 is shown. The user interface can be executed by a standard personal computer (PC) using a standard operating system. In addition, a user interface can be implemented on the controller, which is disclosed in U.S. Patent Application Serial No. 60/82, filed on Jan. 23, the entire disclosure of (ABATEMENT SYSTEM WITH BACK-UP FUNCTIONALITY AND METHOD OF USING THE SAME)" (Attorney Docket No. 1 1 469), the entire disclosure of which is incorporated herein by reference. The user interface 100, on the display 104, may include images of one or more selectively interacting attenuation systems 102. Here, three attenuation systems 102 are shown, however this is for illustrative purposes only and can show any number of attenuation systems 102 detected. Each attenuating system can have a specific (e. g., static) IP address and can be connected via a hub to a single integrated system such as a personal computer or server. The user interface 1 〇 〇 may also contain images of one or more effluent streams 1 〇 6 that may be applied to each abatement system 102. For example, the effluent stream configuration can include a standby effluent stream configuration, a specific application effluent stream configuration, a load balance effluent stream configuration, a redundant settling stream configuration, and a user set effluent stream configuration. The effluent configuration 106 applied to the attenuating system 102A-C shown may be otherwise marked or indicated. The effluent configuration will be described in more detail below. The operator (not shown) can be remotely installed using the user interface 100.
程系統中的每一減弱系統102’該製程系統係鱼系統 地耦合。操作者可監測與追蹤每—減弱系統1〇2之、’、 數(如第2圖所示)’亦可操作參數。於部份實施例: 操作者選擇第一減弱系統102八,則顯示器會顯示關於 系統1 02A之特定訊息,如第2圖所示。 ; 參照第2圖’其係緣示顯示器2〇〇之示意圖,領 呈現於第i圖中所選之第—減弱系統1〇2八。LEach of the abatement systems 102' in the process system is systemically coupled. The operator can monitor and track the per-attenuation system 1〇2, the number (as shown in Figure 2) can also operate parameters. In some embodiments: The operator selects the first weakening system 102, and the display will display a specific message about the system 102A, as shown in FIG. Referring to Fig. 2, the schematic diagram of the display 2 is shown in Fig. 2, and the first weakening system 1〇8 selected in Fig. i is shown. L
Ci 200827963 不,減弱系統202A則以圖示方式呈現。亦可使用复 呈現方式。可顯示與減弱系'統2〇2A相關的數個參數 2〇4。參數訊息204可包含例如蜮弱系統2〇2a每—入 壓力、CDA流速、燃料流速、槽溫度、每一入口的壓 化、槽高度(tank level)、洗滌器排氣壓力等。操作者 擇地操作數個參數,以改變減弱系統2〇2A之功能。 顯示器200亦可包含一警報指示器2〇6。藉由選 報指示器206,操作者可檢視與所選之減弱系統2〇2A 的所有警報與警告。操作者可依據類型(例如警報、警. 或依據減弱系統2 0 2 A檢視警報。操作者亦.可檢視一 減弱系統2 0 2 A之警報歷史。警報、警告或其他相關 可局部地儲存於PC(例如以文字檔形式)中、自動存於 端伺服器或控制器中。 顯示器200亦可包含趨勢指標208。藉由選擇趨 標2 0 8,操作者可檢視減弱系統2 0 2 A的歷史趨勢。舉 言,由位於減弱系統102A-C(202A-C?)之感測器而來 有類似數值,可記入一特定速率。操作者可選擇單獨 通聯 同參 ,若 減弱 示器 圖所 他的 訊息 口的 力變 可選 擇警 相關 卜等) 指定 事件 -遠 勢指 例而 的所 的感 10Ci 200827963 No, the attenuation system 202A is presented graphically. You can also use the complex presentation method. Several parameters related to the weakening system 2〇2A can be displayed 2〇4. The parameter message 204 can include, for example, a weak system 2〇2a per-input pressure, a CDA flow rate, a fuel flow rate, a bath temperature, a pressure at each inlet, a tank level, a scrubber exhaust pressure, and the like. The operator selectively operates several parameters to change the function of the weakening system 2〇2A. Display 200 can also include an alarm indicator 2〇6. With the optional indicator 206, the operator can view all alarms and warnings associated with the selected attenuating system 2〇2A. The operator can view the alarm depending on the type (eg alarm, alarm. or according to the attenuation system 2 0 2 A. The operator can also view the alarm history of the weakened system 2 0 2 A. Alarms, warnings or other related information can be stored locally The PC (for example, in the form of a text file) is automatically stored in the server or controller. The display 200 can also include a trend indicator 208. By selecting the trend 2 0 8, the operator can view the attenuation system 2 0 2 A. Historical trends. It is stated that there are similar values from the sensors located in the attenuation system 102A-C (202A-C?), which can be recorded at a specific rate. The operator can choose to use the same reference separately, if the indicator is weakened The strength of his message mouth can be selected from police related, etc.) Specify the event - the feeling of the remote example
200827963 測器,並調整感測器最小值與最大值兩者的範圍, 例將該趨勢繪入一趨勢顯示中。 此外,每一減弱系統202A之資料可以逗號分 槽(common separated value file)(例如 CSV 等)的 出,其可與耦合至系統的其他工具(例如Excel檔等 參照第3圖,其係繪示用以監測及控制一或多 系統之一示例方法的流程圖。於步驟 S 1 0 0中,在 上呈現一或多個減弱系統。在步驟 S 102中,則在 上呈現一或多個從製程工具而來的流出物流。此外 顯示器上呈現一或多個通道,該通道係用以將一或 出物流傳送至一或多個減弱系統。於步驟 S 1 04中 示器上呈現數個流出物流配置的選擇。流出物流配 含一使用者設定配置、一備用配置、一冗餘配置、 平衡配置以及一特定應用流出物流配置。之後,4 中,則接收了指示流出物流配置的選擇。可選地, 示器上呈現用以將一或多個流出物流傳送至一或多 系統的一或多個通道,進而反映出所選的流出物流 於步驟S 1 0 8中,控制位在界面歧管中的數個閥, 所選的流出物流配置。 參照第4圖,其係繪示用以監測及控制一或多 系統之一示例方法的流程圖。於步驟 S 2 0 0中,在 上呈現一或多個減弱系統。在步驟 S202中,則在 上呈現一或多個從製程工具而來的流出物流。此外 顯示器上呈現一或多個通道,該通道係用以將一或 以按比 隔文字 形式匯 )相容。 個減弱 顯示器 顯示器 ,可在 多個流 ,在顯 置可包 一載量 L S106 可在顯 個減弱 配置。 以執行 個減弱 顯示器 顯示器 ,可在 多個流 11 200827963 出物流傳送至一或多個減弱系統。於步驟 S204中,則接 受了指示一備用流出物流配置的選擇。一或多個減弱系統 係選作為主要減弱系統,而一或多個減弱系統則選作為備 用減弱系統。可依據數個參數,來選擇一或多個減弱系統 以作為主要或備用系統。該些主要與備用減弱系統亦可呈 現在顯示器上。可選地,可在顯示器上呈現用以將一或多 個流出物流傳送至一或多個減弱系統的一或多個通道,進 而反映出所選的流出物流配置。於步驟 S 2 0 6中,將一或 多個流出物流導至一或多個主要減弱系統。於步驟 S 2 0 8 中,則將一或多個備用減弱系統設為備用模式。之後在步 驟S 2 1 0中,配置界面歧管,以依據主要減弱系統的狀態, 將流出物流從一或多個主要減弱系統重新導入一或多個備 用減弱系統。前述狀態可指出主要減弱系統已斷線。亦可 於顯示器上呈現主要與被用減弱系統的更新狀態。 參照第5圖,其係繪示用以監測及控制一或多個減弱 系統之一示例方法的流程圖。於步驟 S 3 0 0中,在顯示器 上呈現一或多個減弱系統。在步驟 S 3 0 2中,則在顯示器 上呈現一或多個從製程工具而來的流出物流。此外,可在 顯示器上呈現一或多個通道,該通道係用以將一或多個流 出物流傳送至一或多個減弱系統。於步驟 S 3 04中,接受 了指示冗餘流出物流配置之選擇。可選地,可在顯示器上 呈現用以將一或多個流出物流傳送至一或多個減弱系統的 一或多個通道,進而反映出所選的流出物流配置。一或多 個減弱系統之至少一第一減弱系統則接收從製程工具而來 12 200827963 的一或多個流出物流,而一或多個減弱系統之至少一第二 減弱系統則接收從製程工具而來的一或多個流出物流。該 第一或第二減弱系統其中至少之一者可為斷線。可於顯示 器上呈現操作中的與斷線之減弱系統的更新狀態。於步驟 S 3 0 6中,依據斷線減弱系統的狀態,配置界面歧管,以將 一或多個流出物流從一斷線減弱系統重新導入一操作中的 減弱系統。200827963 Detector, and adjust the range of the sensor minimum and maximum, for example, the trend is drawn into a trend display. In addition, the data of each weakening system 202A may be a comma separated value file (eg, CSV, etc.), which may be coupled to other tools coupled to the system (eg, Excel file, etc., refer to FIG. 3, which is illustrated A flowchart for monitoring and controlling one of the one or more system examples. In step S100, one or more attenuation systems are presented thereon. In step S102, one or more slaves are presented An effluent stream from the process tool. In addition, one or more channels are present on the display for communicating one or more streams to one or more abatement systems. Several outflows are present on the display in step S104. Selection of logistics configuration. The outbound logistics is provided with a user setting configuration, a standby configuration, a redundant configuration, a balanced configuration, and a specific application outflow logistics configuration. Thereafter, in 4, a selection indicating the outflow logistics configuration is received. Alternatively, the presenter presents one or more channels for delivering one or more effluent streams to one or more systems, thereby reflecting the selected effluent stream in step S108, with control Several valves in the interface manifold, selected effluent flow configuration. Referring to Figure 4, there is shown a flow chart for an example method for monitoring and controlling one or more systems. In step S200, One or more attenuation systems are presented thereon. In step S202, one or more effluent streams from the process tool are presented thereon. In addition, one or more channels are presented on the display, the channels being used to Compatible with a letter format. Attenuated display monitors are available in multiple streams, and can be packaged in a single load. The L S106 can be configured in a weakened configuration. To perform a reduced display display, the flow can be sent to one or more abatement systems in multiple streams 11 200827963. In step S204, a selection is received indicating an alternate outflow configuration. One or more abatement systems are selected as the primary abatement system, and one or more abatement systems are selected as the backup abatement system. One or more weakening systems can be selected as primary or backup systems based on a number of parameters. These primary and alternate abatement systems can also be presented on the display. Alternatively, one or more channels for delivering one or more effluent streams to one or more abatement systems may be presented on the display to reflect the selected effluent stream configuration. In step S206, one or more effluent streams are directed to one or more primary abatement systems. In step S 2 0 8 , one or more standby weakening systems are set to the standby mode. Thereafter, in step S2 1 0, an interface manifold is configured to reintroduce the effluent stream from one or more primary abatement systems to one or more spare abatement systems depending on the state of the primary abatement system. The foregoing state may indicate that the primary weakening system has been disconnected. It is also possible to present the updated status of the primary and the abatement system on the display. Referring to Figure 5, there is shown a flow chart of an exemplary method for monitoring and controlling one or more of the attenuation systems. In step S300, one or more attenuation systems are presented on the display. In step S302, one or more effluent streams from the process tool are presented on the display. In addition, one or more channels may be presented on the display for communicating one or more outgoing streams to one or more abatement systems. In step S 3 04, the selection indicating the redundant outflow logistics configuration is accepted. Alternatively, one or more channels for delivering one or more effluent streams to one or more abatement systems may be presented on the display to reflect the selected effluent stream configuration. At least one first abatement system of the one or more attenuation systems receives one or more effluent streams from the process tool 12 200827963, and at least one second abatement system of the one or more attenuation systems receives the slave process tool One or more effluent streams coming. At least one of the first or second attenuation systems can be broken. The updated state of the system and the weakened system in the operation can be presented on the display. In step S306, an interface manifold is configured to re-introduce one or more effluent streams from a disconnection abatement system into an operational abatement system in accordance with the state of the disconnection abatement system.
參照第6圖,其係繪示用以監測及控制一或多個減弱 系統之一示例方法的流程圖。於步驟 S 4 0 0 中,在顯示器 上呈現一或多個減弱系統。在步驟 S402中,則在顯示器 上呈現一或多個從製程工具而來的流出物流。此外,可在 顯示器上呈現一或多個通道,該通道係用以將一或多個流 出物流傳送至一或多個減弱系統。於步驟 S404中,接收 了指示載量平衡流出物流配置之選擇。可選地,可在顯示 器上呈現用以將一或多個流出物流傳送至一或多個減弱系 統的一或多個通道,進而反映出所選的流出物流配置。之 後,於步驟 S4 06中,則依據效率標準,配置界面歧管, 以將流出物流導入一或多個減弱系統。每一減弱系統可具 有一相關的操作成本,而效率標準可包含例如減弱一特定 流出物流之最少成本,減弱一特定流出物流之物力的最少 量,減弱一特定流出物流之最少時間。可於顯示器上呈現 用以接收流出物流之一或多個減弱系統。 參照第7圖,其係繪示用以監測及控制一或多個減弱 系統之一示例方法的流程圖。於步驟 S 5 00中,在顯示器 13 200827963 上呈現一或多個減弱系統。在步驟 S 5 02中,則在顯 上呈現一或多個從製程工具而來的流出物流。此外, 顯示器上呈現一或多個通道,該通道係用以將一或多 出物流傳送至一或多個減弱系統。於步驟 S 5 0 4中, 了指示特定應用流出物流配置之選擇。在步驟 S 5 0 6 配置界面歧管,以將第一流出物流導入一第一減弱系 第一流出物流係從第一製程而來。之後,於步驟S 5 0 8 配置界面歧管,以將第二流出物流導入一第二減弱系 第二流出物流係從第二製程而來。第一與第二製程可 似或不同。舉例而言,第一製程可為基材製造製程,然 第二製程可為處理室清潔製程。可選地,可在顯示器 現用以將一或多個流出物流傳送至一或多個減弱系統 或多個通道,進而反映出所選的流出物流配置。 上述内容僅揭示本發明之例示。任何熟習技藝者 速理解落入本發明之範圍内的系統與方法的修飾。於 實施例中,本發明之系統與方法可應用於半導體元件 及/或電子元件製程。 據此,雖然本發明已以實施例揭露如上,然其他 動與潤飾仍不脫離本發明之精神和範圍,因此本發明 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係繪示依照本發明之一實施例,一種用以 及控制一或多個減弱系統之系統的示意圖。 示器 可在 個流 接收 中, 統。 中, 統。 為相 而, 上呈 的一 可迅 部分 製程 之更 之保 監測 14 200827963 第2圖係繪示依照本發明之一實施例,一種用以監測 及控制一或多個減弱系統之系統的示意圖。 第3圖係繪示依照本發明之一實施例,一種用以監測 及控制一或多個減弱系統之示例方法的流程圖。 第4圖係繪示依照本發明之一實施例,一種用以監測 及控制一或多個減弱系統之示例方法的流程圖。 第5圖係繪示依照本發明之一實施例,一種用以監測 及控制一或多個減弱系統之示例方法的流程圖。 第6圖係繪示依照本發明之一實施例,一種用以監測 及控制一或多個減弱系統之示例方法的流程圖。 第7圖係繪示依照本發明之一實施例,一種用以監測 及控制一或多個減弱系統之示例方法的流程圖。 【主要元件符號說明】 100 使用者介面 102減弱系 統 104 顯示器 106流出物 流配置 200 顯示器 202A減弱 系統 204 參數訊息 206警報指 示器 208 趨勢指標 S100步驟 S102步驟 S 1 04步驟 S106 步驟 S 1 0 8步驟 S200 步驟 S202步驟 S204步驟 S206步驟 S208步驟 S210步驟 15 200827963 S300步驟 S3 02步驟 S304步驟 S306步驟 S400步驟 S402步驟 S404步驟 S406步驟 S 5 0 0步驟 S502步驟 S504步驟 S 5 0 6步驟 S508步驟Referring to Figure 6, a flow diagram of an exemplary method for monitoring and controlling one or more of the attenuation systems is shown. In step S400, one or more attenuation systems are presented on the display. In step S402, one or more effluent streams from the process tool are presented on the display. In addition, one or more channels may be presented on the display for communicating one or more outgoing streams to one or more abatement systems. In step S404, a selection is received indicating the load balancing outflow configuration. Alternatively, one or more channels for delivering one or more effluent streams to one or more of the abatement systems may be presented on the display to reflect the selected effluent stream configuration. Thereafter, in step S106, an interface manifold is configured to introduce the effluent stream into one or more abatement systems in accordance with efficiency criteria. Each abatement system may have an associated operating cost, and the efficiency criteria may include, for example, a minimum cost of attenuating a particular effluent stream, a minimum amount of material that reduces a particular effluent stream, and a minimum time to a particular effluent stream. One or more abatement systems can be presented on the display for receiving the effluent stream. Referring to Figure 7, a flow diagram of an exemplary method for monitoring and controlling one or more of the attenuation systems is shown. In step S5 00, one or more attenuation systems are presented on display 13 200827963. In step S502, one or more effluent streams from the process tool are presented. In addition, one or more channels are presented on the display for communicating one or more streams to one or more abatement systems. In step S504, a selection of a particular application effluent configuration is indicated. The interface manifold is configured in step S506 to direct the first effluent stream to a first weakening system. The first effluent stream is from the first process. Thereafter, the interface manifold is configured in step S508 to introduce the second effluent stream into a second weakening system and the second effluent stream is from the second process. The first and second processes may be similar or different. For example, the first process can be a substrate manufacturing process, and the second process can be a process chamber cleaning process. Alternatively, the display can be used to deliver one or more effluent streams to one or more abatement systems or channels, thereby reflecting the selected effluent stream configuration. The foregoing merely discloses examples of the invention. Any skilled artisan will readily appreciate modifications of the systems and methods that fall within the scope of the invention. In an embodiment, the system and method of the present invention is applicable to semiconductor component and/or electronic component processing. Accordingly, the present invention has been described by way of example only, and the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing a system for controlling one or more attenuation systems in accordance with an embodiment of the present invention. The indicator can be used in stream reception. Medium, unified. For the sake of the above, a further partial process is further monitored. 14 200827963 FIG. 2 is a schematic diagram of a system for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention. 3 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention. 4 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention. Figure 5 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention. Figure 6 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention. Figure 7 is a flow chart showing an exemplary method for monitoring and controlling one or more attenuation systems in accordance with an embodiment of the present invention. [Main Component Symbol Description] 100 User Interface 102 Attenuation System 104 Display 106 Outflow Logistics Configuration 200 Display 202A Attenuation System 204 Parameter Message 206 Alarm Indicator 208 Trend Indicator S100 Step S102 Step S 1 04 Step S106 Step S 1 0 8 Step S200 Step S202 Step S204 Step S206 Step S208 Step S210 Step 15 200827963 S300 Step S3 02 Step S304 Step S306 Step S400 Step S402 Step S404 Step S406 Step S 5 0 0 Step S502 Step S504 Step S 5 0 6 Step S508 Step
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