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TW200735315A - Package substrate and the manufacturing method making the same - Google Patents

Package substrate and the manufacturing method making the same

Info

Publication number
TW200735315A
TW200735315A TW095107615A TW95107615A TW200735315A TW 200735315 A TW200735315 A TW 200735315A TW 095107615 A TW095107615 A TW 095107615A TW 95107615 A TW95107615 A TW 95107615A TW 200735315 A TW200735315 A TW 200735315A
Authority
TW
Taiwan
Prior art keywords
manufacturing
package substrate
substrate
same
method making
Prior art date
Application number
TW095107615A
Other languages
Chinese (zh)
Other versions
TWI301662B (en
Inventor
Pao-Hung Chou
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW95107615A priority Critical patent/TWI301662B/en
Publication of TW200735315A publication Critical patent/TW200735315A/en
Application granted granted Critical
Publication of TWI301662B publication Critical patent/TWI301662B/en

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A package substrate and the manufacturing method of the substrate are disclosed. The disclosed method applies conductive layers on the top surface and the bottom surface of a substrate as an electrically conductive path and forms electrical pads on the top surface and the bottom surface individually through plating. Therefore, the manufacturing of the layout on the surface can be proceeded without any conductive wires. The disclosed method can increase the circuit layout area of the circuit, improving the electrical quality of the connection between the chip and the package substrate, or between the circuit board and the package substrate, and further reduce the manufacturing cost.
TW95107615A 2006-03-07 2006-03-07 Package substrate and the manufacturing method making the same TWI301662B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95107615A TWI301662B (en) 2006-03-07 2006-03-07 Package substrate and the manufacturing method making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95107615A TWI301662B (en) 2006-03-07 2006-03-07 Package substrate and the manufacturing method making the same

Publications (2)

Publication Number Publication Date
TW200735315A true TW200735315A (en) 2007-09-16
TWI301662B TWI301662B (en) 2008-10-01

Family

ID=45070294

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95107615A TWI301662B (en) 2006-03-07 2006-03-07 Package substrate and the manufacturing method making the same

Country Status (1)

Country Link
TW (1) TWI301662B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385765B (en) * 2008-07-15 2013-02-11 Unimicron Technology Corp Method for manufacturing structure with embedded circuit
TWI511209B (en) * 2009-04-01 2015-12-01 Kulicke & Soffa Ind Inc Conductive bumps, wire loops, and methods of forming the same
TWI576033B (en) * 2016-05-06 2017-03-21 旭德科技股份有限公司 Circuit substrate and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106486382B (en) * 2015-08-28 2019-06-18 碁鼎科技秦皇岛有限公司 Package substrate, encapsulating structure and preparation method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385765B (en) * 2008-07-15 2013-02-11 Unimicron Technology Corp Method for manufacturing structure with embedded circuit
TWI511209B (en) * 2009-04-01 2015-12-01 Kulicke & Soffa Ind Inc Conductive bumps, wire loops, and methods of forming the same
TWI576033B (en) * 2016-05-06 2017-03-21 旭德科技股份有限公司 Circuit substrate and manufacturing method thereof

Also Published As

Publication number Publication date
TWI301662B (en) 2008-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees