TW200735315A - Package substrate and the manufacturing method making the same - Google Patents
Package substrate and the manufacturing method making the sameInfo
- Publication number
- TW200735315A TW200735315A TW095107615A TW95107615A TW200735315A TW 200735315 A TW200735315 A TW 200735315A TW 095107615 A TW095107615 A TW 095107615A TW 95107615 A TW95107615 A TW 95107615A TW 200735315 A TW200735315 A TW 200735315A
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- package substrate
- substrate
- same
- method making
- Prior art date
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A package substrate and the manufacturing method of the substrate are disclosed. The disclosed method applies conductive layers on the top surface and the bottom surface of a substrate as an electrically conductive path and forms electrical pads on the top surface and the bottom surface individually through plating. Therefore, the manufacturing of the layout on the surface can be proceeded without any conductive wires. The disclosed method can increase the circuit layout area of the circuit, improving the electrical quality of the connection between the chip and the package substrate, or between the circuit board and the package substrate, and further reduce the manufacturing cost.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95107615A TWI301662B (en) | 2006-03-07 | 2006-03-07 | Package substrate and the manufacturing method making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95107615A TWI301662B (en) | 2006-03-07 | 2006-03-07 | Package substrate and the manufacturing method making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200735315A true TW200735315A (en) | 2007-09-16 |
TWI301662B TWI301662B (en) | 2008-10-01 |
Family
ID=45070294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95107615A TWI301662B (en) | 2006-03-07 | 2006-03-07 | Package substrate and the manufacturing method making the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI301662B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI385765B (en) * | 2008-07-15 | 2013-02-11 | Unimicron Technology Corp | Method for manufacturing structure with embedded circuit |
TWI511209B (en) * | 2009-04-01 | 2015-12-01 | Kulicke & Soffa Ind Inc | Conductive bumps, wire loops, and methods of forming the same |
TWI576033B (en) * | 2016-05-06 | 2017-03-21 | 旭德科技股份有限公司 | Circuit substrate and manufacturing method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106486382B (en) * | 2015-08-28 | 2019-06-18 | 碁鼎科技秦皇岛有限公司 | Package substrate, encapsulating structure and preparation method thereof |
-
2006
- 2006-03-07 TW TW95107615A patent/TWI301662B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI385765B (en) * | 2008-07-15 | 2013-02-11 | Unimicron Technology Corp | Method for manufacturing structure with embedded circuit |
TWI511209B (en) * | 2009-04-01 | 2015-12-01 | Kulicke & Soffa Ind Inc | Conductive bumps, wire loops, and methods of forming the same |
TWI576033B (en) * | 2016-05-06 | 2017-03-21 | 旭德科技股份有限公司 | Circuit substrate and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI301662B (en) | 2008-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |