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TW200722768A - Quality measurement method of electrical connection between surface-mounted components and circuit boards - Google Patents

Quality measurement method of electrical connection between surface-mounted components and circuit boards

Info

Publication number
TW200722768A
TW200722768A TW094142730A TW94142730A TW200722768A TW 200722768 A TW200722768 A TW 200722768A TW 094142730 A TW094142730 A TW 094142730A TW 94142730 A TW94142730 A TW 94142730A TW 200722768 A TW200722768 A TW 200722768A
Authority
TW
Taiwan
Prior art keywords
electrical connection
measurement method
circuit boards
quality measurement
mounted components
Prior art date
Application number
TW094142730A
Other languages
Chinese (zh)
Other versions
TWI273255B (en
Inventor
Yuan Zhang
Yan-Mou Huang
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW94142730A priority Critical patent/TWI273255B/en
Application granted granted Critical
Publication of TWI273255B publication Critical patent/TWI273255B/en
Publication of TW200722768A publication Critical patent/TW200722768A/en

Links

Landscapes

  • Measurement Of Resistance Or Impedance (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

A quality measurement method of electrical connection between surface-mounted components and circuit boards uses the capacitance test device to measure the actual capacitance between two corresponding points of the surface-mounted component and the circuit board; uses the actual capacitance that is measured to determine the electrical connection quality between the surface-mounted component and the circuit board. The method avoids the conventional problem of being unable to measure the electrical connection quality between the surface-mounted component and the circuit board that leads to poor electrical connection, thereby promoting the yield rate.
TW94142730A 2005-12-05 2005-12-05 Quality measurement method of electrical connection between surface-mounted components and circuit boards TWI273255B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94142730A TWI273255B (en) 2005-12-05 2005-12-05 Quality measurement method of electrical connection between surface-mounted components and circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94142730A TWI273255B (en) 2005-12-05 2005-12-05 Quality measurement method of electrical connection between surface-mounted components and circuit boards

Publications (2)

Publication Number Publication Date
TWI273255B TWI273255B (en) 2007-02-11
TW200722768A true TW200722768A (en) 2007-06-16

Family

ID=38621446

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94142730A TWI273255B (en) 2005-12-05 2005-12-05 Quality measurement method of electrical connection between surface-mounted components and circuit boards

Country Status (1)

Country Link
TW (1) TWI273255B (en)

Also Published As

Publication number Publication date
TWI273255B (en) 2007-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees