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TW200703428A - Stacked wafer structure and forming method thereof - Google Patents

Stacked wafer structure and forming method thereof

Info

Publication number
TW200703428A
TW200703428A TW094122437A TW94122437A TW200703428A TW 200703428 A TW200703428 A TW 200703428A TW 094122437 A TW094122437 A TW 094122437A TW 94122437 A TW94122437 A TW 94122437A TW 200703428 A TW200703428 A TW 200703428A
Authority
TW
Taiwan
Prior art keywords
wafer structure
stacked wafer
forming method
stacked
wafer
Prior art date
Application number
TW094122437A
Other languages
Chinese (zh)
Other versions
TWI274373B (en
Inventor
Chia-Chieh Hu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94122437A priority Critical patent/TWI274373B/en
Publication of TW200703428A publication Critical patent/TW200703428A/en
Application granted granted Critical
Publication of TWI274373B publication Critical patent/TWI274373B/en

Links

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A stacked wafer structure and the forming method thereof. A second wafer includes a second redistribution layer (RDL) that located on a first wafer having a first redistribution layer. Then, the stack wafer structure is drilled by using laser drilling method to form a plurality of through holes within the stacked wafer structure. Next, the electric circuit of the stacked wafer structure is conducted by using electroplating the conductor to fill the plurality of through holes.
TW94122437A 2005-07-01 2005-07-01 Stacked wafer structure and forming method thereof TWI274373B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94122437A TWI274373B (en) 2005-07-01 2005-07-01 Stacked wafer structure and forming method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94122437A TWI274373B (en) 2005-07-01 2005-07-01 Stacked wafer structure and forming method thereof

Publications (2)

Publication Number Publication Date
TW200703428A true TW200703428A (en) 2007-01-16
TWI274373B TWI274373B (en) 2007-02-21

Family

ID=38623141

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94122437A TWI274373B (en) 2005-07-01 2005-07-01 Stacked wafer structure and forming method thereof

Country Status (1)

Country Link
TW (1) TWI274373B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479637B (en) * 2007-07-20 2015-04-01 Shinko Electric Ind Co Semiconductor apparatus and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101615990B1 (en) * 2008-09-18 2016-04-28 고쿠리츠다이가쿠호우진 도쿄다이가쿠 Method for manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479637B (en) * 2007-07-20 2015-04-01 Shinko Electric Ind Co Semiconductor apparatus and manufacturing method thereof

Also Published As

Publication number Publication date
TWI274373B (en) 2007-02-21

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