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TW200634966A - Common change kit in test handler for bga packages - Google Patents

Common change kit in test handler for bga packages

Info

Publication number
TW200634966A
TW200634966A TW094109879A TW94109879A TW200634966A TW 200634966 A TW200634966 A TW 200634966A TW 094109879 A TW094109879 A TW 094109879A TW 94109879 A TW94109879 A TW 94109879A TW 200634966 A TW200634966 A TW 200634966A
Authority
TW
Taiwan
Prior art keywords
common change
change kit
bga packages
ball
test handler
Prior art date
Application number
TW094109879A
Other languages
Chinese (zh)
Other versions
TWI253705B (en
Inventor
Ming-Yen Wu
Pao-Chen Lin
Chen-Shan Lee
Original Assignee
Powertech Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Powertech Technology Inc filed Critical Powertech Technology Inc
Priority to TW94109879A priority Critical patent/TWI253705B/en
Application granted granted Critical
Publication of TWI253705B publication Critical patent/TWI253705B/en
Publication of TW200634966A publication Critical patent/TW200634966A/en

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A common change kit in test handler for BGA (Ball Grid Array) packages is disclosed, which can align a plurality of BGA packages with various substrate sizes respectively, wherein a plurality of solder balls of each package are disposed on lower surfaces of corresponding substrates with a fixed arrangement. The common change kit includes at least an insert having a contact surface and a ball-limiting aperture. The ball-limiting aperture has a dimension less than that of substrates of the BGA packages and not less than a region defined the most boundary of the solder balls, such that all of solder balls from each package can be framed in the ball-limiting aperture. Without change of the common change kit, BGA packages with various substrate sizes can be tested well.
TW94109879A 2005-03-29 2005-03-29 Common change kit in test dandler for BGA packages TWI253705B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94109879A TWI253705B (en) 2005-03-29 2005-03-29 Common change kit in test dandler for BGA packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94109879A TWI253705B (en) 2005-03-29 2005-03-29 Common change kit in test dandler for BGA packages

Publications (2)

Publication Number Publication Date
TWI253705B TWI253705B (en) 2006-04-21
TW200634966A true TW200634966A (en) 2006-10-01

Family

ID=37586688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94109879A TWI253705B (en) 2005-03-29 2005-03-29 Common change kit in test dandler for BGA packages

Country Status (1)

Country Link
TW (1) TWI253705B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7477063B1 (en) 2007-08-17 2009-01-13 Powertech Technologies, Inc. Universal insert tool for fixing a BGA package under test

Also Published As

Publication number Publication date
TWI253705B (en) 2006-04-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees