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TW200622491A - Pattern-forming material, pattern-forming device and pattern-forming method - Google Patents

Pattern-forming material, pattern-forming device and pattern-forming method

Info

Publication number
TW200622491A
TW200622491A TW094133534A TW94133534A TW200622491A TW 200622491 A TW200622491 A TW 200622491A TW 094133534 A TW094133534 A TW 094133534A TW 94133534 A TW94133534 A TW 94133534A TW 200622491 A TW200622491 A TW 200622491A
Authority
TW
Taiwan
Prior art keywords
pattern
forming
forming material
photosensitive layer
exposure
Prior art date
Application number
TW094133534A
Other languages
Chinese (zh)
Inventor
Masanobu Takashima
Hirotaka Matsumoto
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200622491A publication Critical patent/TW200622491A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The purpose of the present invention is to provide a pattern-forming material capable of effectively inhibiting the reduction of sensitivity of a photosensitive layer and forming a highly fine pattern, and to provide a pattern-forming device having said pattern-forming material, and a pattern-forming method using the above pattern-forming material. Therefore, provided are a pattern-forming material characterized in that at least a photosensitive layer is provided on a support having a haze value of less than 5.0%, in which the photosensitive layer comprising at lease one sensitizer selected from an acidic nucleus-containing colorant, a basic nucleus-containing colorant and an optical brightening agent: and on the occasion that said photosensitive layer is subject to exposure for development, the minimum energy being used in the said exposure and without changing the thickness of the portion to be exposed of said photosensitive layer before exposure and after development is 0.1 to 20 (mJ/cm<SP>2</SP>); as well as a pattern-forming device having said pattern-forming material and an pattern-forming method using said pattern-forming material and conducting exposure.
TW094133534A 2004-09-28 2005-09-27 Pattern-forming material, pattern-forming device and pattern-forming method TW200622491A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004282707 2004-09-28
JP2004323007 2004-11-05
JP2004323013 2004-11-05

Publications (1)

Publication Number Publication Date
TW200622491A true TW200622491A (en) 2006-07-01

Family

ID=36118953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133534A TW200622491A (en) 2004-09-28 2005-09-27 Pattern-forming material, pattern-forming device and pattern-forming method

Country Status (5)

Country Link
JP (1) JPWO2006035807A1 (en)
KR (1) KR20070057993A (en)
CN (1) CN101124516B (en)
TW (1) TW200622491A (en)
WO (1) WO2006035807A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10104781B2 (en) 2013-12-27 2018-10-16 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
TWI639720B (en) * 2016-04-14 2018-11-01 日商凸版印刷股份有限公司 Substrate for vapor deposition mask, method for producing substrate for vapor deposition mask, and method for producing vapor deposition mask
TWI661063B (en) * 2016-08-05 2019-06-01 日商凸版印刷股份有限公司 Metal mask for vapor deposition, production method for metal mask for vapor deposition, and production method for display device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4942969B2 (en) * 2005-09-16 2012-05-30 富士フイルム株式会社 Pattern forming material and pattern forming method
JP2008116751A (en) * 2006-11-06 2008-05-22 Asahi Kasei Electronics Co Ltd Photosensitive resin composition and laminate
WO2008075575A1 (en) * 2006-12-19 2008-06-26 Hitachi Chemical Company, Ltd. Photosensitive element
JP5147499B2 (en) 2008-02-13 2013-02-20 富士フイルム株式会社 Photosensitive coloring composition, color filter and method for producing the same
JP5155920B2 (en) * 2008-03-31 2013-03-06 富士フイルム株式会社 Photosensitive transparent resin composition, method for producing color filter, and color filter
JP5137662B2 (en) 2008-03-31 2013-02-06 富士フイルム株式会社 Curable composition, color filter and method for producing the same, and solid-state imaging device
WO2012111400A1 (en) * 2011-02-18 2012-08-23 株式会社Adeka Photosensitive coloring composition
TWI546574B (en) * 2011-06-01 2016-08-21 Jsr股份有限公司 Coloring composition, color filter and display element
JPWO2015072388A1 (en) * 2013-11-13 2017-03-16 Ｄｉｃグラフィックス株式会社 UV curable coating varnish composition
CN104892513B (en) * 2015-05-21 2017-05-03 常州强力先端电子材料有限公司 Alkenyl-containing pyrazoline sensitizer as well as preparation method and application thereof
WO2017110352A1 (en) * 2015-12-25 2017-06-29 富士フイルム株式会社 Active light-sensitive or radiation-sensitive resin composition, active light-sensitive or radiation-sensitive film, pattern forming method, and electronic device production method
JP7308014B2 (en) * 2017-02-23 2023-07-13 旭化成株式会社 Photosensitive resin composition and photosensitive resin laminate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3859934B2 (en) * 1999-05-27 2006-12-20 日立化成工業株式会社 Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board
JP4237916B2 (en) * 2000-05-15 2009-03-11 富士フイルム株式会社 Photopolymerizable composition and recording material using the same
JP2002268239A (en) * 2001-03-06 2002-09-18 Fuji Photo Film Co Ltd Method for making printing plate
JP2002308922A (en) * 2001-04-12 2002-10-23 Fuji Photo Film Co Ltd Photopolymerizable composition and recording material obtained by using the same
JP2003057817A (en) * 2001-08-15 2003-02-28 Fuji Photo Film Co Ltd Photopolymerizable composition and recording material using the same
EP1349006B1 (en) * 2002-03-28 2013-09-25 Agfa Graphics N.V. Photopolymerizable composition sensitized for the wavelength range from 300 to 450 nm.
JP2004198446A (en) * 2002-04-24 2004-07-15 Mitsubishi Chemicals Corp Photopolymerizable composition, and image forming material, image forming member and image forming method using the same
JP2003337428A (en) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd Exposure device
JP2003337427A (en) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd Exposure device
CN101135850B (en) * 2002-08-07 2011-02-16 三菱化学株式会社 Image forming member having bluish purple laser photosensitive resist material layer and method for forming resist image
JP2004191938A (en) * 2002-11-27 2004-07-08 Mitsubishi Chemicals Corp Blue-violet laser photosensitive composition, image forming material using the same, imaging material and method for forming image
JP4337485B2 (en) * 2003-09-16 2009-09-30 三菱化学株式会社 Blue-violet laser photosensitive composition, and image forming material, image forming material, and image forming method using the same
JP2005274923A (en) * 2004-03-24 2005-10-06 Fuji Photo Film Co Ltd Photosensitive resin composition and acridone oligomer
JP2005316174A (en) * 2004-04-28 2005-11-10 Fuji Photo Film Co Ltd Photosensitive resin composition and coumarin compound

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10104781B2 (en) 2013-12-27 2018-10-16 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
TWI689783B (en) * 2013-12-27 2020-04-01 日商日立化成股份有限公司 Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed circuit board
TWI639720B (en) * 2016-04-14 2018-11-01 日商凸版印刷股份有限公司 Substrate for vapor deposition mask, method for producing substrate for vapor deposition mask, and method for producing vapor deposition mask
TWI713899B (en) * 2016-04-14 2020-12-21 日商凸版印刷股份有限公司 Base material for vapor deposition mask, method of manufacturing base material for vapor deposition mask, and method of manufacturing vapor deposition mask
TWI661063B (en) * 2016-08-05 2019-06-01 日商凸版印刷股份有限公司 Metal mask for vapor deposition, production method for metal mask for vapor deposition, and production method for display device

Also Published As

Publication number Publication date
KR20070057993A (en) 2007-06-07
JPWO2006035807A1 (en) 2008-05-15
WO2006035807A1 (en) 2006-04-06
CN101124516B (en) 2012-01-18
CN101124516A (en) 2008-02-13

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