TW200628542A - Epoxy resin compositions, methods of preparing, and articles made therefrom - Google Patents
Epoxy resin compositions, methods of preparing, and articles made therefromInfo
- Publication number
- TW200628542A TW200628542A TW094144957A TW94144957A TW200628542A TW 200628542 A TW200628542 A TW 200628542A TW 094144957 A TW094144957 A TW 094144957A TW 94144957 A TW94144957 A TW 94144957A TW 200628542 A TW200628542 A TW 200628542A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- epoxy resin
- preparing
- methods
- resin compositions
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title 1
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 125000003118 aryl group Chemical group 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/015,536 US20060135710A1 (en) | 2004-12-17 | 2004-12-17 | Epoxy resin compositions, methods of preparing and articles made therefrom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200628542A true TW200628542A (en) | 2006-08-16 |
Family
ID=36588568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094144957A TW200628542A (en) | 2004-12-17 | 2005-12-16 | Epoxy resin compositions, methods of preparing, and articles made therefrom |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20060135710A1 (zh) |
| TW (1) | TW200628542A (zh) |
| WO (1) | WO2006066021A2 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI571478B (zh) * | 2009-01-09 | 2017-02-21 | Nagase Chemtex Corp | A method for producing a thermosetting epoxy resin hardening material having transparency for visible light and a thermoplastic elastomer composition |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101679610B (zh) * | 2007-06-15 | 2012-11-21 | 陶氏环球技术公司 | 用于使用环氧树脂组合物制备复合材料的方法 |
| US9745412B2 (en) | 2009-01-09 | 2017-08-29 | Nagase Chemtex Corporation | Process for production of thermoplastic cured epoxy resin with transparency to visible light, and thermoplastic epoxy resin composition |
| US8173745B2 (en) * | 2009-12-16 | 2012-05-08 | Momentive Specialty Chemicals Inc. | Compositions useful for preparing composites and composites produced therewith |
| CN101942180B (zh) * | 2010-09-08 | 2012-05-30 | 广东生益科技股份有限公司 | 环氧树脂组合物及使用其制作的覆铜板 |
| WO2013061932A1 (ja) * | 2011-10-25 | 2013-05-02 | 大日本印刷株式会社 | 電気化学セル用包装材料 |
| US20150109674A1 (en) * | 2013-10-23 | 2015-04-23 | Ronald Steven Cok | Imprinted micro-louver structure |
| JP6718562B1 (ja) * | 2018-07-24 | 2020-07-08 | 日本化薬株式会社 | エポキシ樹脂、エポキシ樹脂組成物、炭素繊維強化複合材料用エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料 |
| US11613618B2 (en) * | 2019-03-04 | 2023-03-28 | Emaus Kyoto, Inc. | Porous body, and method for producing porous body |
| CN115850909B (zh) * | 2022-08-04 | 2024-01-30 | 上海道宜半导体材料有限公司 | 一种狭窄间隙填充用环氧树脂组合物及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0008048B1 (en) * | 1978-07-31 | 1984-01-18 | Sumitomo Bakelite Company Limited | A method of manufacturing an electrical article |
| US4501787A (en) * | 1983-04-29 | 1985-02-26 | Westinghouse Electric Corp. | Flame retardant B-staged epoxy resin prepregs and laminates made therefrom |
| US4792479A (en) * | 1986-07-30 | 1988-12-20 | Westinghouse Electric Corp. | Punchable epoxy based laminating compositions |
| JP3447015B2 (ja) * | 1993-04-23 | 2003-09-16 | 三井化学株式会社 | エポキシ樹脂組成物 |
| JPH09278867A (ja) * | 1996-04-10 | 1997-10-28 | Toto Kasei Co Ltd | エポキシ樹脂組成物 |
| JP3789603B2 (ja) * | 1997-06-30 | 2006-06-28 | 三井化学株式会社 | 多層プリント配線板用熱硬化性樹脂組成物 |
| JPH1121422A (ja) * | 1997-06-30 | 1999-01-26 | Mitsui Chem Inc | 熱硬化性樹脂組成物 |
| JPH11209456A (ja) * | 1998-01-29 | 1999-08-03 | Hitachi Chem Co Ltd | 印刷配線板用難燃性エポキシ樹脂組成物及びこれを用いたプリプレグ、金属箔張り積層板 |
| JP2001206931A (ja) * | 2000-01-27 | 2001-07-31 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
-
2004
- 2004-12-17 US US11/015,536 patent/US20060135710A1/en not_active Abandoned
-
2005
- 2005-12-13 WO PCT/US2005/045468 patent/WO2006066021A2/en active Application Filing
- 2005-12-16 TW TW094144957A patent/TW200628542A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI571478B (zh) * | 2009-01-09 | 2017-02-21 | Nagase Chemtex Corp | A method for producing a thermosetting epoxy resin hardening material having transparency for visible light and a thermoplastic elastomer composition |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006066021A2 (en) | 2006-06-22 |
| WO2006066021A3 (en) | 2006-10-26 |
| US20060135710A1 (en) | 2006-06-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2011133317A3 (en) | One part epoxy resin including a low profile additive | |
| MY148272A (en) | Curable silicone composition | |
| TW200732366A (en) | Thermosetting resin composition | |
| MX2007005600A (es) | Resinas epoxicas endurecidas con copolimero de bloque anfifilico y revestimientos con un alto contenido de solidos de curacion ambiental hechos a partir de las mismas. | |
| MX2014010744A (es) | Composiciones de revestimiento de epoxi siloxano. | |
| WO2008097877A3 (en) | Heteroelement siloxane compounds and polymers | |
| TW200628542A (en) | Epoxy resin compositions, methods of preparing, and articles made therefrom | |
| TW200617099A (en) | Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin | |
| BRPI0809638A2 (pt) | Materiais compósitos pré-impregnados com aprimorada performance | |
| TWI366575B (en) | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin | |
| WO2009041172A3 (en) | Stator structure | |
| WO2003076507A3 (en) | High fracture toughness hydrosilyation cured silicone resin | |
| WO2012050756A3 (en) | Solvent resistant thermoplastic toughened epoxy | |
| EP2033985A3 (en) | Heat-curable polyimide silicone resin composition | |
| WO2014020072A3 (de) | Flüssige härter zur härtung von epoxidharzen (ii) | |
| HK1151810A1 (en) | Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins | |
| DE60017631D1 (de) | Wärmehärtende Epoxydpulverbeschichtungen die verbesserte Entgasungseigenschaften aufweisen | |
| WO2010024642A3 (en) | Phenol novolac resin, phenol novolac epoxy resin and epoxy resin composition | |
| TW200609279A (en) | Self-adhesive prepreg | |
| TW200710125A (en) | Polyamide resin, epoxy resin composition and cured product thereof | |
| TW200732362A (en) | Phenol resin composition, cured article, resin composition for copper-clad laminate, copper-clad laminate, and novel phenol resin | |
| MX367174B (es) | Revestimiento de gel a base de resina epoxi para acabado de superficie de componentes hechos de plasticos reforzados con fibras. | |
| TW200745194A (en) | Epoxy resin hardener and epoxy resin composition | |
| EP1454937A3 (en) | Epoxy resin curing agent, curable epoxy resin composition and cured products | |
| DE602004030281D1 (de) | Neue phenolharze |