TW200616062A - Method of dicing wafer - Google Patents
Method of dicing waferInfo
- Publication number
- TW200616062A TW200616062A TW093134939A TW93134939A TW200616062A TW 200616062 A TW200616062 A TW 200616062A TW 093134939 A TW093134939 A TW 093134939A TW 93134939 A TW93134939 A TW 93134939A TW 200616062 A TW200616062 A TW 200616062A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- chips
- active surface
- dicing
- cutting
- Prior art date
Links
Landscapes
- Dicing (AREA)
Abstract
A method of dicing wafer is disclosed. At first, a wafer having an active surface is provided. Each chip region on the active surface defines a plurality of chamfered corners. When a first wafer cutting step is performed, a laser beam moves along a plurality of scribe lines of the wafer and the chamfered corners to cut the wafer to form a plurality of half-cut grooves in the active surface. Then a second wafer cutting step is performed, the chips are singulated from the wafer by cutting the wafer along the half-cut grooves using water-jet cutting. Thus a rapid wafer dicing is effectively achieved. The method also can avoid the chips overheating and delamination on corners of the chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93134939A TWI317972B (en) | 2004-11-15 | 2004-11-15 | Method of dicing wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW93134939A TWI317972B (en) | 2004-11-15 | 2004-11-15 | Method of dicing wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200616062A true TW200616062A (en) | 2006-05-16 |
| TWI317972B TWI317972B (en) | 2009-12-01 |
Family
ID=45073439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW93134939A TWI317972B (en) | 2004-11-15 | 2004-11-15 | Method of dicing wafer |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI317972B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI493611B (en) * | 2011-05-11 | 2015-07-21 | 隆達電子股份有限公司 | Methods of laser cutting |
| US10070536B2 (en) | 2016-07-05 | 2018-09-04 | Unimicron Technology Corp. | Manufacturing method of circuit board structure |
| TWI766271B (en) * | 2020-04-30 | 2022-06-01 | 矽品精密工業股份有限公司 | Electronic package and method for fabricating the same |
| CN115870641A (en) * | 2023-02-20 | 2023-03-31 | 湖北三维半导体集成创新中心有限责任公司 | Chip, manufacturing method thereof and packaging structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103345018B (en) * | 2013-06-28 | 2017-04-26 | 武汉光迅科技股份有限公司 | Cutting method of curve-type array waveguide optical grating chip and clamp for cutting same |
-
2004
- 2004-11-15 TW TW93134939A patent/TWI317972B/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI493611B (en) * | 2011-05-11 | 2015-07-21 | 隆達電子股份有限公司 | Methods of laser cutting |
| US10070536B2 (en) | 2016-07-05 | 2018-09-04 | Unimicron Technology Corp. | Manufacturing method of circuit board structure |
| TWI766271B (en) * | 2020-04-30 | 2022-06-01 | 矽品精密工業股份有限公司 | Electronic package and method for fabricating the same |
| CN115870641A (en) * | 2023-02-20 | 2023-03-31 | 湖北三维半导体集成创新中心有限责任公司 | Chip, manufacturing method thereof and packaging structure |
| CN115870641B (en) * | 2023-02-20 | 2023-05-23 | 湖北三维半导体集成创新中心有限责任公司 | Chip, manufacturing method thereof and packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI317972B (en) | 2009-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |