TW200602501A - Titanium copper having excellent strength, conductivity, and bending workability, and its production method - Google Patents
Titanium copper having excellent strength, conductivity, and bending workability, and its production methodInfo
- Publication number
- TW200602501A TW200602501A TW094115481A TW94115481A TW200602501A TW 200602501 A TW200602501 A TW 200602501A TW 094115481 A TW094115481 A TW 094115481A TW 94115481 A TW94115481 A TW 94115481A TW 200602501 A TW200602501 A TW 200602501A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductivity
- titanium copper
- excellent strength
- bending workability
- production method
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
This invention is to provide titanium copper having excellent strength, conductivity, and bending workability. The titanium copper is composed of a copper alloy comprising, by mass, 1.5 to 2.3% Ti, and the balance Cu with inevitable impurities, and has a 0.2% proof stress (YS) of ≥ 750 MPa, and an conductivity (EC) of ≥ 17%IACS. Also, when W-bend tests prescribed in JIS H3130 are carried out in a direction perpendicular to the rolling direction, the ratio (MBR/t) between the minimum bend radius (MBR; mm) at which no cracking is brought about and the sheet thickness (t; mm) has the relation of MBR/t ≤ 0.04*YS-30 with the 0.2% proof stress (YS; MPa).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004162934A JP4210239B2 (en) | 2004-06-01 | 2004-06-01 | Titanium copper excellent in strength, conductivity and bending workability, and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200602501A true TW200602501A (en) | 2006-01-16 |
TWI294465B TWI294465B (en) | 2008-03-11 |
Family
ID=35496792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094115481A TW200602501A (en) | 2004-06-01 | 2005-05-13 | Titanium copper having excellent strength, conductivity, and bending workability, and its production method |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060011275A1 (en) |
JP (1) | JP4210239B2 (en) |
KR (1) | KR20060046273A (en) |
CN (1) | CN100467637C (en) |
TW (1) | TW200602501A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI577810B (en) * | 2013-03-25 | 2017-04-11 | 同和金屬股份有限公司 | Cu-ti based copper alloy plate, manufacture method thereof and conductive component |
TWI692535B (en) * | 2018-08-30 | 2020-05-01 | 日商Jx金屬股份有限公司 | Titanium copper plate, pressed processed product and method for manufacturing pressed processed product |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101301495B (en) * | 2008-06-03 | 2012-07-25 | 陕西科技大学 | Method for preparing bone screw biological compound material |
JP5426936B2 (en) * | 2009-06-18 | 2014-02-26 | 株式会社Shカッパープロダクツ | Copper alloy manufacturing method and copper alloy |
CN105296793A (en) * | 2009-11-25 | 2016-02-03 | Jx日矿日石金属株式会社 | Titanium-copper for electric component |
JP4683669B1 (en) * | 2010-03-19 | 2011-05-18 | Jx日鉱日石金属株式会社 | Titanium copper excellent in strength, electrical conductivity and bending workability and its manufacturing method |
JP5214701B2 (en) * | 2010-10-18 | 2013-06-19 | Jx日鉱日石金属株式会社 | Titanium copper excellent in strength, electrical conductivity and bending workability and its manufacturing method |
DE102011002953A1 (en) * | 2011-01-21 | 2012-07-26 | Carl Zeiss Smt Gmbh | Substrate for mirror for extreme ultraviolet lithography, comprises base body which is alloy system that is made of intermetallic phase having crystalline component, where intermetallic phase has bravais lattice |
JP5461467B2 (en) * | 2011-03-29 | 2014-04-02 | Jx日鉱日石金属株式会社 | Titanium copper excellent in strength, electrical conductivity and bending workability and its manufacturing method |
CN105039775B (en) * | 2015-06-02 | 2017-04-05 | 苏州晓锋知识产权运营管理有限公司 | The manufacture method of electric conductivity latch plate |
JP6629401B1 (en) * | 2018-08-30 | 2020-01-15 | Jx金属株式会社 | Titanium copper plate before aging treatment, pressed product and method for producing pressed product |
CN113088754A (en) * | 2021-04-01 | 2021-07-09 | 江西中晟金属有限公司 | High-flexibility copper rod and preparation method thereof |
CN115927985A (en) * | 2022-12-24 | 2023-04-07 | 安徽鑫科铜业有限公司 | Titanium copper with excellent bending workability and manufacturing method thereof |
CN116121584A (en) * | 2023-03-16 | 2023-05-16 | 云南红塔特铜新材料股份有限公司 | High-strength high-conductivity titanium bronze ultrathin belt and preparation method thereof |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3740474B2 (en) * | 2003-03-20 | 2006-02-01 | 日鉱金属加工株式会社 | Titanium copper excellent in conductivity and method for producing the same |
-
2004
- 2004-06-01 JP JP2004162934A patent/JP4210239B2/en not_active Expired - Fee Related
-
2005
- 2005-05-13 TW TW094115481A patent/TW200602501A/en not_active IP Right Cessation
- 2005-05-27 US US11/140,425 patent/US20060011275A1/en not_active Abandoned
- 2005-05-30 KR KR1020050045530A patent/KR20060046273A/en active Search and Examination
- 2005-06-01 CN CNB2005100759107A patent/CN100467637C/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI577810B (en) * | 2013-03-25 | 2017-04-11 | 同和金屬股份有限公司 | Cu-ti based copper alloy plate, manufacture method thereof and conductive component |
TWI692535B (en) * | 2018-08-30 | 2020-05-01 | 日商Jx金屬股份有限公司 | Titanium copper plate, pressed processed product and method for manufacturing pressed processed product |
Also Published As
Publication number | Publication date |
---|---|
TWI294465B (en) | 2008-03-11 |
US20060011275A1 (en) | 2006-01-19 |
JP2005344143A (en) | 2005-12-15 |
CN100467637C (en) | 2009-03-11 |
KR20060046273A (en) | 2006-05-17 |
CN1704492A (en) | 2005-12-07 |
JP4210239B2 (en) | 2009-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |