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TW200600464A - Method for recovering highly pure oxalic acid aqueous solution - Google Patents

Method for recovering highly pure oxalic acid aqueous solution

Info

Publication number
TW200600464A
TW200600464A TW094115241A TW94115241A TW200600464A TW 200600464 A TW200600464 A TW 200600464A TW 094115241 A TW094115241 A TW 094115241A TW 94115241 A TW94115241 A TW 94115241A TW 200600464 A TW200600464 A TW 200600464A
Authority
TW
Taiwan
Prior art keywords
oxalic acid
aqueous solution
highly pure
acid aqueous
recovering
Prior art date
Application number
TW094115241A
Other languages
Chinese (zh)
Other versions
TWI380953B (en
Inventor
Keiichiro Hirakawa
Hiroaki Terayama
Original Assignee
Nippon Rensui Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Rensui Kk filed Critical Nippon Rensui Kk
Publication of TW200600464A publication Critical patent/TW200600464A/en
Application granted granted Critical
Publication of TWI380953B publication Critical patent/TWI380953B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D15/00—Separating processes involving the treatment of liquids with solid sorbents; Apparatus therefor
    • B01D15/08—Selective adsorption, e.g. chromatography
    • B01D15/26—Selective adsorption, e.g. chromatography characterised by the separation mechanism
    • B01D15/36—Selective adsorption, e.g. chromatography characterised by the separation mechanism involving ionic interaction, e.g. ion-exchange, ion-pair, ion-suppression or ion-exclusion
    • B01D15/361—Ion-exchange
    • B01D15/363—Anion-exchange
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Treatment Of Water By Ion Exchange (AREA)
  • ing And Chemical Polishing (AREA)
  • Liquid Crystal (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

The present invention is to provide a method for recovering a highly pure oxalic acid aqueous solution from an oxalic acid etching waste liquid left after the treatment of an indium-containing material to be etched. This method for recovering the highly pure oxalic acid aqueous solution, comprising separating a dissolved metal component from an oxalic acid etching waste liquid left after the treatment of an indium-containing material to be etched, is characterized by bringing the oxalic acid etching waste liquid into contact with an anion exchange resin. By the recovering method, the highly pure oxalic acid aqueous solution can be recovered, and then recycled as an etching liquid. Thereby, the amount of the oxalic acid used in the etching treatment can be reduced. Consequently, a cost for making a transparent electrode can be reduced.
TW94115241A 2004-05-17 2005-05-11 Recovery of High Purity Oxalic Acid Aqueous Solution TWI380953B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004146086A JP4534591B2 (en) 2004-05-17 2004-05-17 Recovery method of high purity oxalic acid aqueous solution

Publications (2)

Publication Number Publication Date
TW200600464A true TW200600464A (en) 2006-01-01
TWI380953B TWI380953B (en) 2013-01-01

Family

ID=35471719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94115241A TWI380953B (en) 2004-05-17 2005-05-11 Recovery of High Purity Oxalic Acid Aqueous Solution

Country Status (3)

Country Link
JP (1) JP4534591B2 (en)
KR (1) KR101206174B1 (en)
TW (1) TWI380953B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4643541B2 (en) * 2006-10-17 2011-03-02 東亞合成株式会社 Method for producing indium compound from ferrous chloride solution
JP5817123B2 (en) * 2011-01-18 2015-11-18 栗田工業株式会社 Apparatus for recovering oxalate ions from indium oxalate aqueous solution, and method for recovering oxalate ions from indium oxalate aqueous solution
CN102703699B (en) * 2012-06-26 2013-12-04 西部鑫兴金属材料有限公司 Recycling method of acid waste liquid after treatment of high-lead rhenium-containing molybdenum concentrate
CN102935298A (en) * 2012-11-28 2013-02-20 湖北益泰药业有限公司 Method for recovering refined oxalate mother liquor
CN113929226A (en) * 2021-10-29 2022-01-14 西安泰金工业电化学技术有限公司 Oxalic acid waste liquid recovery system and recovery method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535962B2 (en) * 1987-10-15 1996-09-18 住友化学工業株式会社 Organic acid recovery method
JPH05339197A (en) * 1992-06-10 1993-12-21 Asahi Glass Co Ltd Separation and recovery of oxalic acid
JP3323585B2 (en) * 1993-05-10 2002-09-09 鶴見曹達株式会社 Etching waste liquid treatment method
JPH07141932A (en) * 1993-11-18 1995-06-02 Kanto Chem Co Inc Etching liquid composition for transparent conductive film
JPH1192840A (en) * 1997-09-22 1999-04-06 Daiichi Kigensokagaku Kogyo Co Ltd Refining of zirconium
JP4277375B2 (en) * 1999-07-29 2009-06-10 住友化学株式会社 Indium recovery and purification
JP3589937B2 (en) 2000-04-21 2004-11-17 シャープ株式会社 Waste LCD panel treatment method
JP3445570B2 (en) * 2000-10-12 2003-09-08 株式会社東芝 Etching solution for indium tin oxide film and etching method
JP4027184B2 (en) * 2001-08-28 2007-12-26 Ａｇｃエンジニアリング株式会社 Method for producing anion exchange membrane
JP4069291B2 (en) * 2002-10-09 2008-04-02 三菱マテリアル株式会社 Method for separating metal ions from metal complex solution

Also Published As

Publication number Publication date
KR101206174B1 (en) 2012-11-28
JP4534591B2 (en) 2010-09-01
JP2005325082A (en) 2005-11-24
KR20060047945A (en) 2006-05-18
TWI380953B (en) 2013-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees