TW200609562A - Treatment liquid supply apparatus - Google Patents
Treatment liquid supply apparatusInfo
- Publication number
- TW200609562A TW200609562A TW094110730A TW94110730A TW200609562A TW 200609562 A TW200609562 A TW 200609562A TW 094110730 A TW094110730 A TW 094110730A TW 94110730 A TW94110730 A TW 94110730A TW 200609562 A TW200609562 A TW 200609562A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- treatment
- treatment liquid
- support rolls
- recesses
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 abstract 5
- 239000002245 particle Substances 0.000 abstract 2
- 238000005452 bending Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T7/00—Details of radiation-measuring instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/161—Applications in the field of nuclear medicine, e.g. in vivo counting
-
- H01L31/085—
Landscapes
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Molecular Biology (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Medical Informatics (AREA)
- Optics & Photonics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- General Health & Medical Sciences (AREA)
- Biomedical Technology (AREA)
- Engineering & Computer Science (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Liquid Crystal (AREA)
- Chemically Coating (AREA)
Abstract
To suitably perform the treatment of a substrate by forming a drain passage to the bottom parts of recesses, in which support rolls are attached, to draw out particles internally formed along with a treatment liquid or the like. The treatment liquid supply apparatus is composed of an upper treatment part (10) and a lower treat part (20), and the treatment liquid is supplied to the substrate fed to the gap between both treatment parts from both sides of the substrate. A required number of recessed parts are formed to the upper surface of a ceiling plate (22) of the lower treatment part and support rolls (30) are arranged in the recesses so that the upper ends of them are exposed from the ceiling plate to regulate the downward bending of the fed-in substrate due to the own weight of the substrate. The drain holes communicating with the outside are provided to the bottom parts of the recesses, in which the support rolls (30) are mounted, to discharge the particles formed accompanying the rotation of the support rolls (30) to the outside.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004131037A JP4206359B2 (en) | 2004-04-27 | 2004-04-27 | Treatment liquid supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200609562A true TW200609562A (en) | 2006-03-16 |
| TWI306960B TWI306960B (en) | 2009-03-01 |
Family
ID=35441015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094110730A TW200609562A (en) | 2004-04-27 | 2005-04-04 | Treatment liquid supply apparatus |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4206359B2 (en) |
| KR (1) | KR100670630B1 (en) |
| TW (1) | TW200609562A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100753498B1 (en) | 2005-08-02 | 2007-08-31 | 가부시키가이샤 퓨쳐비전 | Processing solution supplying apparatus |
| KR100785403B1 (en) * | 2006-11-27 | 2007-12-13 | 세메스 주식회사 | Apparatus and method for treating substrates |
| KR100873236B1 (en) * | 2007-06-14 | 2008-12-10 | 주식회사 실트론 | Apparatus for treating wafer |
| JP5372695B2 (en) * | 2009-10-19 | 2013-12-18 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| KR101307006B1 (en) * | 2012-03-14 | 2013-09-26 | 주식회사 디엠에스 | Apparatus for treating substrate |
| CN116175869B (en) * | 2022-10-31 | 2023-07-25 | 江苏正力新能电池技术有限公司 | Surface treatment device for battery top cover |
-
2004
- 2004-04-27 JP JP2004131037A patent/JP4206359B2/en not_active Expired - Fee Related
-
2005
- 2005-04-04 TW TW094110730A patent/TW200609562A/en not_active IP Right Cessation
- 2005-04-26 KR KR1020050034450A patent/KR100670630B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060046703A (en) | 2006-05-17 |
| KR100670630B1 (en) | 2007-01-17 |
| JP4206359B2 (en) | 2009-01-07 |
| TWI306960B (en) | 2009-03-01 |
| JP2005313014A (en) | 2005-11-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |