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TW200606513A - A wiring substrate and method using the same - Google Patents

A wiring substrate and method using the same

Info

Publication number
TW200606513A
TW200606513A TW094117605A TW94117605A TW200606513A TW 200606513 A TW200606513 A TW 200606513A TW 094117605 A TW094117605 A TW 094117605A TW 94117605 A TW94117605 A TW 94117605A TW 200606513 A TW200606513 A TW 200606513A
Authority
TW
Taiwan
Prior art keywords
wiring substrate
same
copper
substrate
layer
Prior art date
Application number
TW094117605A
Other languages
Chinese (zh)
Inventor
Yusuke Yoshimura
Toshikazu Fujimoto
Toshiaki Arai
Original Assignee
Chi Mei Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi Mei Optoelectronics Corp filed Critical Chi Mei Optoelectronics Corp
Publication of TW200606513A publication Critical patent/TW200606513A/en

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
  • Physical Vapour Deposition (AREA)
  • Weting (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)

Abstract

The present invention provides a wiring substrate and method using the same. The wiring substrate comprising a substrate. A first nitriding metal layer is on the substrate, a copper layer is provided on the first nitriding metal layer and the copper layer made of copper or a material containing copper as a principal component. A second nitriding metal layer is on the copper layer.
TW094117605A 2004-01-29 2005-01-26 A wiring substrate and method using the same TW200606513A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004020683A JP2005217088A (en) 2004-01-29 2004-01-29 Wiring on circuit board and wiring forming method

Publications (1)

Publication Number Publication Date
TW200606513A true TW200606513A (en) 2006-02-16

Family

ID=34904532

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117605A TW200606513A (en) 2004-01-29 2005-01-26 A wiring substrate and method using the same

Country Status (2)

Country Link
JP (1) JP2005217088A (en)
TW (1) TW200606513A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101369864B1 (en) 2005-08-12 2014-03-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
JP5019821B2 (en) * 2005-08-12 2012-09-05 株式会社半導体エネルギー研究所 Semiconductor device
JP5559956B2 (en) * 2007-03-15 2014-07-23 東進セミケム株式会社 Etching solution composition for thin film transistor liquid crystal display device
KR101507592B1 (en) * 2008-09-12 2015-04-06 주식회사 동진쎄미켐 Etchant composition of organic light emitting diode display
KR101256276B1 (en) * 2010-08-25 2013-04-18 플란제 에스이 Etchant composition for etching a conductive multi-layer film and etching method using the same
KR102069158B1 (en) * 2012-05-10 2020-01-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Method for forming wiring, semiconductor device, and method for manufacturing semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2613803B2 (en) * 1989-03-30 1997-05-28 日本電信電話株式会社 Copper thin film etching method
JP3916334B2 (en) * 1999-01-13 2007-05-16 シャープ株式会社 Thin film transistor
US6111619A (en) * 1999-05-27 2000-08-29 Sharp Laboratories Of America, Inc. Method of forming polycrystalline silicon TFTs with TiN/Cu/TiN interconnections for a liquid crystal display pixel array
US7023021B2 (en) * 2000-02-22 2006-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
JP2005217088A (en) 2005-08-11

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