TW200605407A - Method for fabricating semiconductor devices having a substrate which includes group Ⅲ-nitride material - Google Patents
Method for fabricating semiconductor devices having a substrate which includes group Ⅲ-nitride materialInfo
- Publication number
- TW200605407A TW200605407A TW094114927A TW94114927A TW200605407A TW 200605407 A TW200605407 A TW 200605407A TW 094114927 A TW094114927 A TW 094114927A TW 94114927 A TW94114927 A TW 94114927A TW 200605407 A TW200605407 A TW 200605407A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- group iii
- iii
- semiconductor devices
- nitride material
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 239000000463 material Substances 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 229910002601 GaN Inorganic materials 0.000 abstract 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 abstract 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/848,036 US20050258459A1 (en) | 2004-05-18 | 2004-05-18 | Method for fabricating semiconductor devices having a substrate which includes group III-nitride material |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200605407A true TW200605407A (en) | 2006-02-01 |
Family
ID=34967205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094114927A TW200605407A (en) | 2004-05-18 | 2005-05-09 | Method for fabricating semiconductor devices having a substrate which includes group Ⅲ-nitride material |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050258459A1 (zh) |
TW (1) | TW200605407A (zh) |
WO (1) | WO2005117091A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101390425B1 (ko) | 2006-11-22 | 2014-05-19 | 소이텍 | 화학기상증착 챔버용 온도제어 퍼지 게이트 밸브 |
US9580836B2 (en) * | 2006-11-22 | 2017-02-28 | Soitec | Equipment for high volume manufacture of group III-V semiconductor materials |
US9481944B2 (en) | 2006-11-22 | 2016-11-01 | Soitec | Gas injectors including a funnel- or wedge-shaped channel for chemical vapor deposition (CVD) systems and CVD systems with the same |
WO2008064080A1 (en) * | 2006-11-22 | 2008-05-29 | S.O.I.Tec Silicon On Insulator Technologies | High volume delivery system for gallium trichloride |
US9481943B2 (en) | 2006-11-22 | 2016-11-01 | Soitec | Gallium trichloride injection scheme |
KR101330156B1 (ko) | 2006-11-22 | 2013-12-20 | 소이텍 | 삼염화 갈륨 주입 구조 |
US8382898B2 (en) | 2006-11-22 | 2013-02-26 | Soitec | Methods for high volume manufacture of group III-V semiconductor materials |
KR101353334B1 (ko) | 2006-11-22 | 2014-02-18 | 소이텍 | 갈륨 질화물 증착에서의 반응 가스 감소 |
DE102007029829A1 (de) * | 2007-06-28 | 2009-01-02 | Infineon Technologies Austria Ag | Halbleiterbauelement mit einem ohmschen Kontakt |
US20100244105A1 (en) * | 2009-03-31 | 2010-09-30 | Kiuchul Hwang | Transistors having temperature stable schottky contact metals |
US8133806B1 (en) | 2010-09-30 | 2012-03-13 | S.O.I.Tec Silicon On Insulator Technologies | Systems and methods for forming semiconductor materials by atomic layer deposition |
US8486192B2 (en) | 2010-09-30 | 2013-07-16 | Soitec | Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods |
CN113394214B (zh) * | 2021-05-11 | 2024-06-07 | 上海华力集成电路制造有限公司 | 半导体器件的集成制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3951743B2 (ja) * | 2002-02-28 | 2007-08-01 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
JP4209136B2 (ja) * | 2002-05-30 | 2009-01-14 | パナソニック株式会社 | 半導体装置及びその製造方法 |
TW200529464A (en) * | 2004-02-27 | 2005-09-01 | Super Nova Optoelectronics Corp | Gallium nitride based light-emitting diode structure and manufacturing method thereof |
-
2004
- 2004-05-18 US US10/848,036 patent/US20050258459A1/en not_active Abandoned
-
2005
- 2005-04-25 WO PCT/US2005/013957 patent/WO2005117091A1/en active Application Filing
- 2005-05-09 TW TW094114927A patent/TW200605407A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2005117091A1 (en) | 2005-12-08 |
US20050258459A1 (en) | 2005-11-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9608100B2 (en) | High electron mobility transistor and method of manufacturing the same | |
WO2009019837A1 (ja) | 炭化珪素半導体素子およびその製造方法 | |
KR101922120B1 (ko) | 고전자이동도 트랜지스터 및 그 제조방법 | |
EP2602827A3 (en) | Enhancement mode III-nitride device and method for manufacturing thereof | |
EP2009688A3 (en) | Semiconductor device and method of manufacturing the same | |
EP2040301A3 (en) | Semiconductor device and method of manufacturing the same | |
TW200605407A (en) | Method for fabricating semiconductor devices having a substrate which includes group Ⅲ-nitride material | |
TW200633125A (en) | Semiconductor device and method of semiconductor device | |
TW200707728A (en) | Semiconductor device and method of fabricating the same | |
WO2008105077A1 (ja) | 化合物半導体装置とその製造方法 | |
TW200636999A (en) | Thick semi-insulating or insulating epitaxial gallium nitride layers and devices incorporating same | |
EP2996154A3 (en) | Non-planar germanium quantum well devices | |
TW200644163A (en) | Multilevel semiconductor devices and methods of manufacturing the same | |
TW200725756A (en) | Method for forming a semiconductor structure and structure thereof | |
TW200611312A (en) | Shallow source mosfet | |
SG164318A1 (en) | Crack stop structure enhancement of the integrated circuit seal ring | |
EP2416349A3 (en) | Method of forming vias in silicon carbide and resulting devices and circuits | |
WO2008003041A3 (en) | Circuit and method of reducing body diode reverse recovery time of lateral power semiconduction devices | |
WO2008070491A3 (en) | Structure and method for forming a planar schottky contact | |
JP2014521229A5 (zh) | ||
EP2325871A3 (en) | Semiconductor device and method of manufacturing the same | |
TW200636983A (en) | Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices | |
EP2333823A3 (en) | Highly conductive source/drain contacts in lll- nitride transistors | |
TW200518206A (en) | Metal-oxide-semiconductor device formed in silicon-on-insulator | |
US10854734B1 (en) | Manufacturing method of semiconductor device |