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TW200502606A - Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method - Google Patents

Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method

Info

Publication number
TW200502606A
TW200502606A TW093111262A TW93111262A TW200502606A TW 200502606 A TW200502606 A TW 200502606A TW 093111262 A TW093111262 A TW 093111262A TW 93111262 A TW93111262 A TW 93111262A TW 200502606 A TW200502606 A TW 200502606A
Authority
TW
Taiwan
Prior art keywords
hybrid substrate
optoelectric hybrid
optical waveguide
producing method
optoelectric
Prior art date
Application number
TW093111262A
Other languages
English (en)
Chinese (zh)
Other versions
TWI340262B (ja
Inventor
Gen Itokawa
Hideaki Kojima
Naoki Yoneda
Nobuhito Itoh
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200502606A publication Critical patent/TW200502606A/zh
Application granted granted Critical
Publication of TWI340262B publication Critical patent/TWI340262B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW093111262A 2003-04-23 2004-04-22 Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method TW200502606A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003118882 2003-04-23

Publications (2)

Publication Number Publication Date
TW200502606A true TW200502606A (en) 2005-01-16
TWI340262B TWI340262B (ja) 2011-04-11

Family

ID=33308084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111262A TW200502606A (en) 2003-04-23 2004-04-22 Optical waveguide, optoelectric hybrid substrate, and optoelectric hybrid substrate producing method

Country Status (5)

Country Link
JP (1) JPWO2004095093A1 (ja)
KR (1) KR100791186B1 (ja)
CN (1) CN100346184C (ja)
TW (1) TW200502606A (ja)
WO (1) WO2004095093A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9008480B2 (en) 2009-03-31 2015-04-14 Panasonic Intellectual Property Management Co., Ltd. Method of manufacturing optical waveguide core, method of manufacturing optical waveguide, optical waveguide, and optoelectric composite wiring board

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5035244B2 (ja) 2006-07-20 2012-09-26 日立化成工業株式会社 光電気混載基板
WO2008035658A1 (fr) * 2006-09-22 2008-03-27 Hitachi Chemical Company, Ltd. Procédé de fabrication de guide de lumière
JP5269449B2 (ja) * 2007-03-24 2013-08-21 株式会社ダイセル ナノインプリント用硬化性樹脂組成物
JP5444696B2 (ja) * 2007-11-22 2014-03-19 大日本印刷株式会社 異種部材一括形成用ネガ型レジスト組成物
CN101971065A (zh) * 2008-03-18 2011-02-09 日立化成工业株式会社 光波导的制造方法
KR20110029881A (ko) * 2009-09-16 2011-03-23 한국전자통신연구원 플라스틱 기판 및 이의 제조방법
CN102316662A (zh) * 2010-06-29 2012-01-11 欣兴电子股份有限公司 光电线路板及其制造方法
JP5767540B2 (ja) * 2011-09-14 2015-08-19 積水化学工業株式会社 エピスルフィド樹脂材料であるｂステージフィルム、多層基板及び積層フィルム

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JPH06258537A (ja) * 1993-03-08 1994-09-16 Mitsubishi Rayon Co Ltd ドライフィルムレジストおよびそれを用いたプリント配線板
JP3254572B2 (ja) * 1996-06-28 2002-02-12 バンティコ株式会社 光重合性熱硬化性樹脂組成物
JP4095163B2 (ja) * 1998-05-01 2008-06-04 太陽インキ製造株式会社 プリント配線板用感光性樹脂組成物並びにそれから形成されるソルダーレジスト皮膜や樹脂絶縁層を有するプリント配線板
JP3491677B2 (ja) * 1999-06-24 2004-01-26 日本電気株式会社 光電気混載基板およびその製造方法
JP2000356720A (ja) * 1999-06-16 2000-12-26 Sony Corp 光導波路用材料並びに光導波路およびその製造方法
KR100633794B1 (ko) * 2000-03-29 2006-10-16 각고우호우진 가나가와 다이가쿠 활성 에너지선 경화성 수지, 그 제조 방법 및광경화성·열경화성 수지 조성물
TWI284780B (en) * 2000-03-29 2007-08-01 Univ Kanagawa Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same
JP2002107562A (ja) * 2000-09-28 2002-04-10 Mitsubishi Paper Mills Ltd 高分子光導波路の製造方法
JP2002289911A (ja) * 2000-12-06 2002-10-04 Ibiden Co Ltd 光通信用デバイス
JP2002236228A (ja) * 2000-12-06 2002-08-23 Ibiden Co Ltd 多層プリント配線板
JP4789381B2 (ja) * 2000-12-06 2011-10-12 イビデン株式会社 多層プリント配線板
JP3771169B2 (ja) * 2000-12-06 2006-04-26 イビデン株式会社 光通信用デバイス
JP4036644B2 (ja) * 2000-12-22 2008-01-23 イビデン株式会社 Ｉｃチップ実装用基板、ｉｃチップ実装用基板の製造方法、および、光通信用デバイス
JP2002341169A (ja) * 2001-03-15 2002-11-27 Sumitomo Bakelite Co Ltd プラスチック光導波路の製造方法
JP2002277663A (ja) * 2001-03-21 2002-09-25 Sumitomo Bakelite Co Ltd 光導波路製造方法
JP2002327049A (ja) * 2001-04-27 2002-11-15 Jsr Corp 含フッ素共重合体、その製造方法、および光学用樹脂
JP2003020403A (ja) * 2001-07-10 2003-01-24 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003040971A (ja) * 2001-07-31 2003-02-13 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003048932A (ja) * 2001-08-07 2003-02-21 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003048956A (ja) * 2001-08-09 2003-02-21 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2003113221A (ja) * 2001-10-05 2003-04-18 Nippon Kayaku Co Ltd 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9008480B2 (en) 2009-03-31 2015-04-14 Panasonic Intellectual Property Management Co., Ltd. Method of manufacturing optical waveguide core, method of manufacturing optical waveguide, optical waveguide, and optoelectric composite wiring board

Also Published As

Publication number Publication date
KR20050109628A (ko) 2005-11-21
WO2004095093A1 (ja) 2004-11-04
KR100791186B1 (ko) 2008-01-02
TWI340262B (ja) 2011-04-11
CN1777827A (zh) 2006-05-24
CN100346184C (zh) 2007-10-31
JPWO2004095093A1 (ja) 2006-07-13

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