SU558037A1 - Aqueous solution for etching copper and its alloys - Google Patents
Aqueous solution for etching copper and its alloysInfo
- Publication number
- SU558037A1 SU558037A1 SU2199187A SU2199187A SU558037A1 SU 558037 A1 SU558037 A1 SU 558037A1 SU 2199187 A SU2199187 A SU 2199187A SU 2199187 A SU2199187 A SU 2199187A SU 558037 A1 SU558037 A1 SU 558037A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- aqueous solution
- alloys
- ferric chloride
- triethanolamine
- film
- Prior art date
Links
- 238000005530 etching Methods 0.000 title claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 4
- 229910052802 copper Inorganic materials 0.000 title claims description 4
- 239000010949 copper Substances 0.000 title claims description 4
- 239000007864 aqueous solution Substances 0.000 title claims description 3
- 229910045601 alloy Inorganic materials 0.000 title description 3
- 239000000956 alloy Substances 0.000 title description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 5
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims 1
- ZDYUUBIMAGBMPY-UHFFFAOYSA-N oxalic acid;hydrate Chemical compound O.OC(=O)C(O)=O ZDYUUBIMAGBMPY-UHFFFAOYSA-N 0.000 claims 1
- 150000004760 silicates Chemical class 0.000 claims 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 238000012993 chemical processing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Description
(54) ВОДНЫЙ РАСТВОР ДЛЯ ТРАВЛЕНИЯ МЕДИ И ЕЕ СПЛАВОВ(54) AQUEOUS SOLUTION FOR PROMOVING THE COPPER AND ITS ALLOYS
1one
Изобретение относитс к химической обработке металлов, в частности, к травлению меди и ее сплавов.This invention relates to the chemical treatment of metals, in particular, to the etching of copper and its alloys.
Наиболее близким к описываемому изобретению по технической сущности и достигаемому результату вл етс раствор дл химической обработки меди и ее силавов, содержащий хлорное железо, пленкообразующий компонент , например этилептиомочевину, и органическую кислоту алифатического р да, например аскарбиповую 1.The closest to the described invention to the technical essence and the achieved result is a solution for chemical processing of copper and its salts, containing ferric chloride, a film-forming component, for example, ethylethiourea, and an organic acid of aliphatic series, for example, ascarbipic 1.
Однако в указанном растворе происходит значительное подтравливание боковых граней рельефных элементов. И, кроме того, он нестабилен в работе.However, in this solution a significant undercutting of the side faces of the relief elements occurs. And besides, he is unstable in work.
Целью насто щего изобретени вл етс снижение бокового иодтравливани рельефных элементов.The object of the present invention is to reduce the lateral iodotraying of the relief elements.
. Эта цель достигаетс тем, что раствор на основе хлорного железа в качестве пленкообразующего компонента п органической кислоты алифатического р да содержит соответственно триэтаноламин п щавелевую кислоту при следующем соотнощении компонентов.. This goal is achieved by the fact that the ferric chloride-based solution as a film-forming component of organic acid of the aliphatic series contains, respectively, triethanolamine and oxalic acid at the following ratio of components.
вес. %:weight. %:
Хлорное железо Ferric chloride
35-40 Триэтаноламин 0,05-0,1 Щавелева кислота 35-40 Triethanolamine 0.05-0.1 oxalic acid
10-20 Остальное. Вода10-20 Else. Water
Основное преимущество нредложенного раствора заключаетс в том, что он стабилен в работе в течение длительного времени, в св зи с чем процесс травлени в насто щем растворе без корректировки (до истощени раствора) быть возобновлен в любой момент.The main advantage of the proposed solution is that it is stable in operation for a long time, and therefore the etching process in the present solution without correction (before depletion of the solution) can be resumed at any time.
%1II% 1II
40404040
10101010
0,050,10.050.1
ОстальноеRest
IЦЦICC
600600500600600500
333333333333
202020202020
510550320510550320
3-5 Стремитс 10-203-5 Stremits 10-20
к 0° to 0 °
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2199187A SU558037A1 (en) | 1975-10-30 | 1975-10-30 | Aqueous solution for etching copper and its alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2199187A SU558037A1 (en) | 1975-10-30 | 1975-10-30 | Aqueous solution for etching copper and its alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU558037A1 true SU558037A1 (en) | 1977-05-15 |
Family
ID=20640381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU2199187A SU558037A1 (en) | 1975-10-30 | 1975-10-30 | Aqueous solution for etching copper and its alloys |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU558037A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5807493A (en) * | 1995-08-01 | 1998-09-15 | Mec Co., Ltd. | Microetching method for copper or copper alloy |
-
1975
- 1975-10-30 SU SU2199187A patent/SU558037A1/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5807493A (en) * | 1995-08-01 | 1998-09-15 | Mec Co., Ltd. | Microetching method for copper or copper alloy |
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