SU523380A1

SU523380A1 - Composition for film photoresist

Info

Publication number: SU523380A1
Application number: SU1787861A
Authority: SU
Inventors: Валентин Петрович Шерстюк; Георгий Григорьевич Хорт; Людмила Марковна Карачунская; Лидия Даниловна Гузь
Original assignee: Всесоюзный научно-исследовательский и проектный институт химической промышленности
Priority date: 1972-05-23
Filing date: 1972-05-23
Publication date: 1976-07-30

Description

1one

Изобретение относитс к области фоторезистов , использующихс в радио и микроэлектронике дл получени печатного монтажа , печатных схем, микросхем.The invention relates to the field of photoresists used in radio and microelectronics for producing printed wiring, printed circuits, and microcircuits.

Известен состав пленочного фоторезиста на основе олигомера, раствора светочувствительного полимера - полиамидной смолы в смеси с мономером в этиловом спирте, инициаторе фотополимеризации, ингибитора, сенсибилизатора . Однако известный фоторезист имеет нестабильные свойства и малые технологические возможности; токсичен.The known composition of film photoresist based on oligomer, solution of photosensitive polymer - polyamide resin in mixture with monomer in ethanol, initiator of photopolymerization, inhibitor, sensitizer. However, the known photoresist has unstable properties and small technological capabilities; toxic

С целью увеличени разрешающей способности фоторезиста и увеличени адгезии к подложке предлагают в состав дл пленочного фоторезиста на основе олигомера, светочувствительного полимера, инициатора фотополимеризации , сенсибилизатора и ингибитора дополнительно вводить пластификатор- бутанол.In order to increase the resolution of the photoresist and increase adhesion to the substrate, it is proposed to additionally introduce a plasticizer, butanol, for film photoresist based on oligomer, photosensitive polymer, photopolymerization initiator, sensitizer and inhibitor.

Предлагаемый состав содержит в качестве олигомера, например, этиленгликольдиметакрилат , светочувствительного полимера - полиамид , мономера - метакриловую кислоту. В качестве инициатора фотополимеризации в предлагаемый состав ввод т бензоин или его метиловый эфир, или бензоинформальдегидную смолу.The proposed composition contains as oligomer, for example, ethylene glycol dimethacrylate, a photosensitive polymer - polyamide, monomer - methacrylic acid. Benzoin or its methyl ester or benzoin-formaldehyde resin is introduced into the composition as an initiator of photopolymerization.

В состав ввод т в качестве сенсибилизатора и ингибитора термической полимеризации краситель, например метиленовый синий.A dye, such as methylene blue, is introduced into the formulation as a sensitizer and a thermal polymerization inhibitor.

Компоненты в предлагаемом составе используют в следующем соотношении, вес. ч. Олигомер, например этиленгликольметакрилат18-26Components in the proposed composition is used in the following ratio, weight. h. Oligomer, for example ethylene glycol methacrylate18-26

Светочувствительный полимер-полиамидна смола 100 Мономер, например метакрилова кислота36-52Photosensitive polymer-polyamide resin 100 Monomer, for example, methacrylic acid36-52

Фотоинициатор, напримерPhotoinitiator, for example

бепзоин1-30bepsoin1-30

Пластификатор - бутанол5-20Plasticizer - butanol5-20

Сенсибилизатор и ингибитор , например краситель метиленовый синий0,01-2The sensitizer and the inhibitor, for example, the dye methylene blue 0,01-2

Claims

Solvent, e.g. ethyl alcohol 300-400 A composition of this composition is applied to a polyethylene terephthalate film, the layer is dried, and a protective polyethylene film is rolled onto it. Adhesion layer is good for both films. Before using the film resist, the polyethylene film is separated and the resist layer is rolled along with the polyethylene terephthalate film to the substrate, the photoresist is exposed through a photographic negative or positive, and the irradiated areas are washed out with an alcohol developing solution. Get a clear image with the exposure of copper areas, which is etched with a solution of ferric chloride or subjected to electroplating. The proposed composition is suitable for the manufacture of film photoresist, which is a photosensitive film, marked between two protective polymer films, one of which is transparent to UV light. This compound, when used as a palletizing photoresist in the production of printed circuit board electronic circuits, provides a high resolution and release ability of the photosensitive layer, is resistant to pickling solutions and electroplating baths, retains photosensitivity when applied to a copper substrate, and adheres to it. The proposed composition allows photopolymerization in a photoresist layer on copper plates, despite the inhibitory effect of the substrate. The photoresist, obtained from the composition proposed, is resistant to the galvanic plant and to herbal agents. The invention Composition for film photoresist based on oligomer, for example ethylene glycol dimethacrylate, solution of photosensitive polymer - polyamide resin mixed with; monomer, e.g. methacrylic acid, in ethanol, photopolymerization initiator, e.g. benzoin, sensitizer, and inhibitor, e.g. methylene blue, characterized in that, ol in the following ratio of components, weight. %: Oligomer18-26 Polyamide resin100 Monomer36-52 Initiator1-30 Butanol5-20 Sensitizer and inhibitor0, 01-2 Ethyl alcohol300-400