SU361025A1 - Method of soldering under pressure - Google Patents

Description

one

This invention relates to the field of soldering.

Soldering techniques are known that transfer pressure to the parts to be joined using rigid metal or ceramic mandrels. Such mandrels do not protect the molded parts from oxidation, since air remains in the space between them and the parts. It is difficult in most cases to displace it by making mandrels that fit snugly to parts, and when soldering parts with complex surface relief, it is impossible. The parts and solders are protected from oxidation by soldering in vacuum or gas. This requires the use of special equipment and an increase in production space.

According to the proposed method, the pressure on the parts to be given is transmitted through an elastic gasket. It is placed between the soldered parts and the metal plate so that it covers not only the area of the soldered parts, but also the areas beyond its borders along the perimeter. The transfer of pressure not only to the surface of the soldered parts, but also to areas outside of it along the perimeter, eliminates air leaks into the soldering zone.

The proposed method was tested by soldering groups of 80X100 mm from silicon photovoltaic energy converters. Photo converters area

10 x 20 mm and 0.5 mm thick ended with contacts of chemically deposited nickel, onto which a layer of copper (3-5 µm n silver (3-5 µm)) was deposited electrochemically.

With parallel connection, the photoconverters were located in the joint, and their serial connection had a tiled profile, thus giving the surface of the group a complex relief.

The bases of the soldering device were made of aluminum alloy. A gasket of heat-resistant silicone rubber 10 mm thick with an area of 100X140 mm was placed between the upper plate of the fixture and the pair of parts located on the base. To prevent the adhesion of the rubber to the surface of the parts, it was covered in a thin film (0.1 mm) of fluoroplastic. Lead soldering was performed. Abundant application of rosin-based flux contributed to the final displacement of air from the soldering zone. Melting point 310-340 ° C, soldering time 10 min, pressing pressure 1-3 kg / cm.

25

Subject invention

Pressure soldering method, but which

pressure on the working element is passed through

30 metal plate, characterized in that 3, in order to increase the uniformity of pressure transfer, an elastic gasket is placed between the solder and the metal plate.

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