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SG152176A1 - Mems microphone package - Google Patents

Mems microphone package

Info

Publication number
SG152176A1
SG152176A1 SG200807780-2A SG2008077802A SG152176A1 SG 152176 A1 SG152176 A1 SG 152176A1 SG 2008077802 A SG2008077802 A SG 2008077802A SG 152176 A1 SG152176 A1 SG 152176A1
Authority
SG
Singapore
Prior art keywords
mems microphone
pcb substrate
case
chip
microphone package
Prior art date
Application number
SG200807780-2A
Inventor
Chung-Dam Song
Original Assignee
Bse Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co Ltd filed Critical Bse Co Ltd
Publication of SG152176A1 publication Critical patent/SG152176A1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

Provided is a MEMS microphone package that can shield a MEMS microphone chip from noise to greatly improve sound quality and reduce manufacturing costs, by inserting a PCB substrate to which the MEMS microphone chip is mounted into a metal case, and then by ground-connecting the metal case to a main board using an assembly process including bending and clamping an end of the case. The MEMS microphone package includes a tetragonal container-shaped metal case having an open-side to insert components into an inner space, and a chamfered end on the open-side to easily perform a curling operation, a PCB substrate to which a MEMS microphone chip and an ASIC chip are mounted, the PCB substrate being inserted into the case, and a support configured to support the PCB substrate and define a space between the case and the PCB substrate.
SG200807780-2A 2007-10-18 2008-10-17 Mems microphone package SG152176A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070104981A KR100925558B1 (en) 2007-10-18 2007-10-18 Mems microphone package

Publications (1)

Publication Number Publication Date
SG152176A1 true SG152176A1 (en) 2009-05-29

Family

ID=40260696

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200807780-2A SG152176A1 (en) 2007-10-18 2008-10-17 Mems microphone package

Country Status (8)

Country Link
EP (1) EP2051539A1 (en)
JP (1) JP4777406B2 (en)
KR (1) KR100925558B1 (en)
CN (1) CN201195694Y (en)
MY (1) MY150111A (en)
SG (1) SG152176A1 (en)
TW (1) TWM345339U (en)
WO (1) WO2009051317A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101109102B1 (en) * 2010-01-18 2012-01-31 주식회사 비에스이 Mems microphone package
TWI401774B (en) * 2010-01-18 2013-07-11 Chipmos Technologies Inc Mems chip package and method for making the same
CN102238455A (en) * 2010-04-23 2011-11-09 安国国际科技股份有限公司 Sound sensor with electromagnetic wave receiver
US8737674B2 (en) 2011-02-11 2014-05-27 Infineon Technologies Ag Housed loudspeaker array
US8879767B2 (en) * 2011-08-19 2014-11-04 Knowles Electronics, Llc Acoustic apparatus and method of manufacturing
KR101320574B1 (en) 2011-11-30 2013-10-23 주식회사 비에스이 Microphone
US20130284537A1 (en) * 2012-04-26 2013-10-31 Knowles Electronics, Llc Acoustic Assembly with Supporting Members
KR101224448B1 (en) * 2012-04-30 2013-01-21 (주)파트론 Sensor package and method for producting of the same
KR101339909B1 (en) * 2012-04-30 2013-12-10 전자부품연구원 Microphone package
KR101334578B1 (en) * 2012-05-11 2013-11-28 한국기계연구원 Package for electronic equipment with opening part
KR101493510B1 (en) * 2014-01-03 2015-02-16 주식회사 비에스이 MEMS microphone system
KR20160127212A (en) 2015-04-23 2016-11-03 (주)이미지스테크놀로지 MEMS microphone and manufacturing method thereof
KR101700571B1 (en) 2016-06-24 2017-02-01 (주)이미지스테크놀로지 MEMS microphone
KR101698312B1 (en) 2016-06-24 2017-01-23 (주)이미지스테크놀로지 MEMS microphone and manufacturing method thereof
KR101949594B1 (en) 2017-05-30 2019-04-29 서울대학교산학협력단 Mems transducer package and mems device inlcuding the same
KR101949593B1 (en) 2017-05-30 2019-02-18 서울대학교산학협력단 Mems device
CN108282731B (en) * 2018-03-07 2024-01-16 钰太芯微电子科技（上海）有限公司 Acoustic sensor and micro-electromechanical microphone packaging structure
CN110278519A (en) * 2019-08-01 2019-09-24 华景科技无锡有限公司 A kind of silicon microphone
CN110808240A (en) * 2019-10-31 2020-02-18 北京燕东微电子有限公司 Package-on-package structure and method for manufacturing the same
CN111050259A (en) * 2019-12-26 2020-04-21 歌尔科技有限公司 Microphone packaging structure and electronic equipment
KR20240014978A (en) 2022-07-26 2024-02-02 엘지이노텍 주식회사 MEMS Microphone
KR20240014980A (en) 2022-07-26 2024-02-02 엘지이노텍 주식회사 MEMS Microphone
KR20240014979A (en) 2022-07-26 2024-02-02 엘지이노텍 주식회사 MEMS Microphone
KR20240014981A (en) 2022-07-26 2024-02-02 엘지이노텍 주식회사 MEMS Microphone
CN115665635B (en) * 2022-11-10 2023-09-05 广范企业发展（连云港）有限公司 MEMS microphone and production method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3574774B2 (en) * 2000-03-22 2004-10-06 ホシデン株式会社 Electret condenser microphone
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
KR100544283B1 (en) 2004-01-20 2006-01-24 주식회사 비에스이 A parallelepiped type condenser microphone for SMD
KR100544279B1 (en) * 2004-02-27 2006-01-23 주식회사 비에스이 A parallelepiped type directional condenser microphone for SMD
KR100675024B1 (en) * 2005-06-13 2007-01-30 주식회사 비에스이 Conductive Base of Condenser Microphone and Condenser Microphone Using the Same
KR100675027B1 (en) * 2005-08-10 2007-01-30 주식회사 비에스이 Silicon based condenser microphone and mounting method for the same
US7419853B2 (en) * 2005-08-11 2008-09-02 Hymite A/S Method of fabrication for chip scale package for a micro component
SG130158A1 (en) 2005-08-20 2007-03-20 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
KR100632694B1 (en) * 2005-08-20 2006-10-16 주식회사 비에스이 Electret condenser microphone
JP2007150507A (en) * 2005-11-25 2007-06-14 Matsushita Electric Works Ltd Microphone package
CN101189909B (en) * 2006-06-02 2011-08-17 宝星电子株式会社 Condenser microphone for SMD using sealing pad and method of making the same
KR100797440B1 (en) * 2006-09-05 2008-01-23 주식회사 비에스이 Electret condenser microphone

Also Published As

Publication number Publication date
JP4777406B2 (en) 2011-09-21
KR100925558B1 (en) 2009-11-05
MY150111A (en) 2013-11-29
CN201195694Y (en) 2009-02-18
KR20090039375A (en) 2009-04-22
JP2009100471A (en) 2009-05-07
TWM345339U (en) 2008-11-21
WO2009051317A1 (en) 2009-04-23
EP2051539A1 (en) 2009-04-22

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