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SG11202006294RA - Mounting apparatus - Google Patents

Mounting apparatus

Info

Publication number
SG11202006294RA
SG11202006294RA SG11202006294RA SG11202006294RA SG11202006294RA SG 11202006294R A SG11202006294R A SG 11202006294RA SG 11202006294R A SG11202006294R A SG 11202006294RA SG 11202006294R A SG11202006294R A SG 11202006294RA SG 11202006294R A SG11202006294R A SG 11202006294RA
Authority
SG
Singapore
Prior art keywords
mounting apparatus
mounting
Prior art date
Application number
SG11202006294RA
Inventor
Kohei Seyama
Tetsuya Utano
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202006294RA publication Critical patent/SG11202006294RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/14—Mechanisms in which power is applied to web roll, e.g. to effect continuous advancement of web
    • B65H18/145—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/14—Mechanisms in which power is applied to web roll, e.g. to effect continuous advancement of web
    • B65H18/16—Mechanisms in which power is applied to web roll, e.g. to effect continuous advancement of web by friction roller
    • H—ELECTRICITY
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
SG11202006294RA 2017-12-01 2018-11-28 Mounting apparatus SG11202006294RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017232106 2017-12-01
PCT/JP2018/043737 WO2019107395A1 (en) 2017-12-01 2018-11-28 Mounting device

Publications (1)

Publication Number Publication Date
SG11202006294RA true SG11202006294RA (en) 2020-07-29

Family

ID=66664966

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202006294RA SG11202006294RA (en) 2017-12-01 2018-11-28 Mounting apparatus

Country Status (7)

Country Link
US (1) US11664344B2 (en)
JP (1) JP6787613B2 (en)
KR (1) KR102398994B1 (en)
CN (1) CN111344848A (en)
SG (1) SG11202006294RA (en)
TW (1) TWI702695B (en)
WO (1) WO2019107395A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11202006294RA (en) * 2017-12-01 2020-07-29 Shinkawa Kk Mounting apparatus
TWI743726B (en) * 2019-04-15 2021-10-21 日商新川股份有限公司 Package device
JP2022017145A (en) * 2020-07-13 2022-01-25 晃三朗 宮崎 Contamination-on-keyboard prevention device
US20220415845A1 (en) * 2020-07-16 2022-12-29 Shinkawa Ltd. Mounting apparatus
US11610861B2 (en) * 2020-09-14 2023-03-21 Infineon Technologies Austria Ag Diffusion soldering with contaminant protection

Family Cites Families (20)

* Cited by examiner, † Cited by third party
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