[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SG11202000675TA - Epitaxially coated semiconductor wafer of monocrystalline silicon and method for the production thereof - Google Patents

Epitaxially coated semiconductor wafer of monocrystalline silicon and method for the production thereof

Info

Publication number
SG11202000675TA
SG11202000675TA SG11202000675TA SG11202000675TA SG11202000675TA SG 11202000675T A SG11202000675T A SG 11202000675TA SG 11202000675T A SG11202000675T A SG 11202000675TA SG 11202000675T A SG11202000675T A SG 11202000675TA SG 11202000675T A SG11202000675T A SG 11202000675TA
Authority
SG
Singapore
Prior art keywords
production
semiconductor wafer
monocrystalline silicon
coated semiconductor
epitaxially coated
Prior art date
Application number
SG11202000675TA
Inventor
Reinhard Schauer
Jörg Haberecht
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG11202000675TA publication Critical patent/SG11202000675TA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24Deposition of silicon only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/481Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/08Reaction chambers; Selection of materials therefor
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/10Heating of the reaction chamber or the substrate
    • C30B25/105Heating of the reaction chamber or the substrate by irradiation or electric discharge
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/16Controlling or regulating
    • C30B25/165Controlling or regulating the flow of the reactive gases
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/20Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C30B29/68Crystals with laminate structure, e.g. "superlattices"
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02634Homoepitaxy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14632Wafer-level processed structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687Wafer level processing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG11202000675TA 2017-07-26 2018-07-12 Epitaxially coated semiconductor wafer of monocrystalline silicon and method for the production thereof SG11202000675TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017212799.6A DE102017212799A1 (en) 2017-07-26 2017-07-26 Epitaxially coated semiconductor wafer of monocrystalline silicon and process for its preparation
PCT/EP2018/068888 WO2019020387A1 (en) 2017-07-26 2018-07-12 Epitaxially coated semiconductor wafer of monocrystalline silicon and method for the production thereof

Publications (1)

Publication Number Publication Date
SG11202000675TA true SG11202000675TA (en) 2020-02-27

Family

ID=62916662

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202000675TA SG11202000675TA (en) 2017-07-26 2018-07-12 Epitaxially coated semiconductor wafer of monocrystalline silicon and method for the production thereof

Country Status (10)

Country Link
US (1) US11578424B2 (en)
EP (1) EP3659173A1 (en)
JP (1) JP7059351B2 (en)
KR (1) KR102320760B1 (en)
CN (1) CN110998787B (en)
DE (1) DE102017212799A1 (en)
IL (1) IL271984B2 (en)
SG (1) SG11202000675TA (en)
TW (1) TWI672402B (en)
WO (1) WO2019020387A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019216267A1 (en) 2019-10-23 2021-04-29 Siltronic Ag Process for the production of semiconductor wafers
FI3940124T3 (en) 2020-07-14 2024-04-03 Siltronic Ag Monocrystalline silicon crystal article
EP3957776A1 (en) * 2020-08-17 2022-02-23 Siltronic AG Method for depositing an epitaxial layer on a substrate wafer
CN114093989B (en) * 2021-09-30 2023-11-14 华灿光电(浙江)有限公司 Deep ultraviolet light-emitting diode epitaxial wafer and manufacturing method thereof

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441212A (en) * 1987-08-07 1989-02-13 Nec Corp Semiconductor crystal growth method
JP2781616B2 (en) 1989-09-29 1998-07-30 株式会社日立製作所 Semiconductor wafer heat treatment equipment
US5227330A (en) * 1991-10-31 1993-07-13 International Business Machines Corporation Comprehensive process for low temperature SI epit axial growth
JP2822756B2 (en) * 1992-03-10 1998-11-11 日本電気株式会社 Vapor phase growth apparatus and thin film forming method thereof
JP2000091237A (en) 1998-09-09 2000-03-31 Shin Etsu Handotai Co Ltd Manufacture of semiconductor wafer
US6437290B1 (en) * 2000-08-17 2002-08-20 Tokyo Electron Limited Heat treatment apparatus having a thin light-transmitting window
JP2002064069A (en) * 2000-08-17 2002-02-28 Tokyo Electron Ltd Heat treatment device
DE10065895C1 (en) * 2000-11-17 2002-05-23 Infineon Technologies Ag Electronic component used as an integrated circuit comprises a screen for electromagnetic scattering, a semiconductor chip made from a semiconductor substrate and an electrically conducting trenched layer
US6879777B2 (en) * 2002-10-03 2005-04-12 Asm America, Inc. Localized heating of substrates using optics
JP5216183B2 (en) * 2004-04-13 2013-06-19 日産自動車株式会社 Semiconductor device
US8501594B2 (en) * 2003-10-10 2013-08-06 Applied Materials, Inc. Methods for forming silicon germanium layers
DE102004054564B4 (en) * 2004-11-11 2008-11-27 Siltronic Ag Semiconductor substrate and method for its production
DE102006055038B4 (en) 2006-11-22 2012-12-27 Siltronic Ag An epitaxated semiconductor wafer and apparatus and method for producing an epitaxied semiconductor wafer
US7820527B2 (en) * 2008-02-20 2010-10-26 Varian Semiconductor Equipment Associates, Inc. Cleave initiation using varying ion implant dose
DE102008023054B4 (en) 2008-05-09 2011-12-22 Siltronic Ag Process for producing an epitaxied semiconductor wafer
US8048807B2 (en) 2008-09-05 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for thinning a substrate
JP5141541B2 (en) 2008-12-24 2013-02-13 株式会社Sumco Epitaxial wafer manufacturing method
DE102009010556B4 (en) 2009-02-25 2013-11-07 Siltronic Ag Process for producing epitaxial silicon wafers
JP5446760B2 (en) 2009-11-16 2014-03-19 株式会社Sumco Epitaxial growth method
KR20110087440A (en) * 2010-01-26 2011-08-03 주식회사 엘지실트론 Susceptor for manufacturing semiconductor and apparatus comprising thereof
DE102010026351B4 (en) 2010-07-07 2012-04-26 Siltronic Ag Method and apparatus for inspecting a semiconductor wafer
JP2012146697A (en) 2011-01-06 2012-08-02 Shin Etsu Handotai Co Ltd Manufacturing apparatus and manufacturing method of epitaxial wafer
JP5470414B2 (en) 2012-03-09 2014-04-16 株式会社半導体エネルギー研究所 LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE
CN104142259A (en) * 2013-05-10 2014-11-12 河南协鑫光伏科技有限公司 Making method of solar monocrystalline silicon test wafer

Also Published As

Publication number Publication date
JP7059351B2 (en) 2022-04-25
CN110998787B (en) 2023-11-03
US11578424B2 (en) 2023-02-14
KR20200015763A (en) 2020-02-12
TW201910571A (en) 2019-03-16
JP2020529127A (en) 2020-10-01
WO2019020387A1 (en) 2019-01-31
IL271984B2 (en) 2023-04-01
KR102320760B1 (en) 2021-11-01
IL271984A (en) 2020-02-27
EP3659173A1 (en) 2020-06-03
TWI672402B (en) 2019-09-21
CN110998787A (en) 2020-04-10
IL271984B (en) 2022-12-01
DE102017212799A1 (en) 2019-01-31
US20210087705A1 (en) 2021-03-25

Similar Documents

Publication Publication Date Title
SG11202108351YA (en) Preparation method and application of monocrystalline silicon wafer
EP3352200A4 (en) SiC EPITAXIAL WAFER, SiC EPITAXIAL WAFER PRODUCTION DEVICE, SiC EPITAXIAL WATER PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
IL271984A (en) Epitaxially coated semiconductor wafer of monocrystalline silicon and method for production thereof
SG10201706480TA (en) METHOD OF PRODUCING SiC WAFER
GB2561426B (en) Process of forming epitaxial substrate and semiconductor optical device
SG11202111703YA (en) Methods of semiconductor device fabrication
EP3617351A4 (en) Silicon wafer horizontal growth device and method
SG11201803021YA (en) Monocrystalline semiconductor wafer and method for producing a semiconductor wafer
SG11202100905XA (en) Semiconductor package and method of forming the same
EP3396030A4 (en) Semiconductor substrate, and epitaxial wafer and method for producing same
SG11201909787SA (en) Method for polishing silicon wafer
EP3811408A4 (en) Semiconductor device and method of fabrication thereof
EP3260581A4 (en) Method for producing silicon carbide single crystal epitaxial wafer and silicon carbide single crystal epitaxial wafer
PL3775328T3 (en) Device for manufacturing aiii-bv-crystals and substrate wafers manufactured thereof free of residual stress and dislocations
SG11201708416PA (en) Silicon epitaxial wafer and method of producing same
EP3266907A4 (en) Sic epitaxial wafer and method for manufacturing sic epitaxial wafer
GB2589335B (en) Integrated III-V/silicon optoelectronic device and method of manufacture thereof
EP3671816A4 (en) Evaluation method and evaluation device of edge shape of silicon wafer, silicon wafer, and selection method and manufacturing method thereof
IL271789B (en) Semiconductor wafer made of single-crystal silicon and process for the production thereof
EP3904825A4 (en) Semiconductor wafer evaluation method and semiconductor wafer production method
EP3591102C0 (en) Compound semiconductor and method for producing single crystal of compound semiconductor
SG11201705935YA (en) Epitaxially coated semiconductor wafer, and method for producing an epitaxially coated semiconductor wafer
EP3141635A4 (en) Semiconductor substrate, epitaxial wafer, and method for manufacturing epitaxial wafer
SG10201503181VA (en) Semiconductor Wafer Composed Of Silicon And Method For Producing Same
GB2589092B (en) III-V / Silicon optoelectronic device and method of manufacture thereof