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SG11201811778PA - Substrate supporting apparatus - Google Patents

Substrate supporting apparatus

Info

Publication number
SG11201811778PA
SG11201811778PA SG11201811778PA SG11201811778PA SG11201811778PA SG 11201811778P A SG11201811778P A SG 11201811778PA SG 11201811778P A SG11201811778P A SG 11201811778PA SG 11201811778P A SG11201811778P A SG 11201811778PA SG 11201811778P A SG11201811778P A SG 11201811778PA
Authority
SG
Singapore
Prior art keywords
shanghai
road
bld
cailun
zhangjiang
Prior art date
Application number
SG11201811778PA
Inventor
Fufa Chen
Zhiyou Fang
Jun Wu
Hui Wang
Fuping Chen
Wenjun Wang
Original Assignee
Acm Research Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Research Shanghai Inc filed Critical Acm Research Shanghai Inc
Publication of SG11201811778PA publication Critical patent/SG11201811778PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
  • Road Signs Or Road Markings (AREA)

Abstract

INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property 1111111111111111111111111111111111111111111111111111111111111111111111111110111111 Organization International Bureau (10) International Publication Number (43) International Publication Date ......0\" WO 2018/006283 Al 11 January 2018 (11.01.2018) W I PO I PCT (51) International Patent Classification: Road, Zhangjiang High-tech Park, Shanghai 201203 (CN). HO1L 21/67 (2006.01) CHEN, Fuping; Bld. 4, No. 1690 Cailun Road, Zhangjiang (21) International Application Number: High-tech Park, Shanghai 201203 (CN). WANG, Wenjun; PCT/CN2016/088754 Bld. 4, No. 1690 Cailun Road, Zhangjiang High-tech Park, Shanghai 201203 (CN). (22) International Filing Date: (74) Agent: SHANGHAI PATENT & TRADEMARK LAW 06 July 2016 (06.07.2016) OFFICE, LLC; 435 Guiping Road, Shanghai 200233 (25) Filing Language: English (CN). (26) Publication Language: English (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, (71) Applicant: ACM RESEARCH (SHANGHAI) INC. AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, [CN/CN]; Bld. 4, No. 1690 Cailun Road, Zhangjiang High- CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, tech Park, Shanghai 201203 (CN). EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, (72) Inventors: CHEN, Fufa; Bld. 4, No. 1690 Cailun HU, ID, IL, IN, IR, IS, JP, KE, KG, KN, KP, KR, KZ, LA, Road, Zhangjiang High-tech Park, Shanghai 201203 (CN). LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, FANG, Zhiyou; Bld. 4, No. 1690 Cailun Road, Zhangjiang MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, High-tech Park, Shanghai 201203 (CN). WU, Jun; Bld. 4, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, No. 1690 Cailun Road, Zhangjiang High-tech Park, Shang- hai 201203 (CN). WANG, Hui; Bld. 4, No. 1690 Cailun — = (54) Title: SUBSTRATE SUPPORTING APPARATUS = 305a 301 305b Ariimr .. . largrer , 41 r = Li 40 - 4- '4 = ....pg. = OM 411.11W3 327 343 = 303 = — 325 = 341 ------ = 323 I I IV _ -- 327 pia ...... 325 .\"--- = i = 321 ---- = salliir — 323 -- 321 319 ,-1 .4 M GC el (57) : A substrate supporting apparatus (300) for cleaning 4: apparatus (300) has a hollow shaft (319) and a rotary spindle (303). spacing is formed between an outer wall of the rotary spindle (303) and an inner wall of the hollow shaft (319). The outer wall of the 0 —. rotary spindle (303) defines a blocking wall (322) and a recess (324) GC , 1 which is formed on the hollow shaft (319) and supplies gas to a front © the front side of the substrate (107), which improves the quality of ei FIG 16 a back side of a substrate (107) is provided. The substrate supporting The rotary spindle (303) is set in the hollow shaft (319) and a to prevent particles in the spacing from entering a gas groove (325) side of the substrate (107), avoiding the particles contaminating semiconductor devices. C [Continued on next page] WO 2018/006283 Al MIDEDIMOMOIDEIREEMOOVIEMIOHNOMMOIMIE SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3))
SG11201811778PA 2016-07-06 2016-07-06 Substrate supporting apparatus SG11201811778PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/088754 WO2018006283A1 (en) 2016-07-06 2016-07-06 Substrate supporting apparatus

Publications (1)

Publication Number Publication Date
SG11201811778PA true SG11201811778PA (en) 2019-01-30

Family

ID=60901426

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201811778PA SG11201811778PA (en) 2016-07-06 2016-07-06 Substrate supporting apparatus

Country Status (6)

Country Link
US (1) US10770335B2 (en)
JP (1) JP6758587B2 (en)
KR (1) KR102512826B1 (en)
CN (1) CN109478524B (en)
SG (1) SG11201811778PA (en)
WO (1) WO2018006283A1 (en)

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Publication number Priority date Publication date Assignee Title
CN108333884A (en) * 2018-01-30 2018-07-27 无锡中微掩模电子有限公司 A kind of novel developing apparatus
JP6979935B2 (en) * 2018-10-24 2021-12-15 三菱電機株式会社 Semiconductor manufacturing equipment and semiconductor manufacturing method
CN112786521A (en) * 2019-11-08 2021-05-11 盛美半导体设备(上海)股份有限公司 Static conductive substrate holding device
CN111341718B (en) * 2020-03-12 2023-03-21 北京北方华创微电子装备有限公司 Chuck structure of semiconductor cleaning equipment and semiconductor cleaning equipment
JP7471170B2 (en) * 2020-08-03 2024-04-19 東京エレクトロン株式会社 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
JP7592434B2 (en) 2020-08-28 2024-12-02 株式会社荏原製作所 Workpiece supporting device and workpiece supporting method
CN114141691B (en) * 2021-12-14 2022-06-17 北京北方华创微电子装备有限公司 Semiconductor processing equipment
CN114334726A (en) * 2021-12-23 2022-04-12 上海新昇半导体科技有限公司 Cleaning device and cleaning method
US20230282506A1 (en) * 2022-03-02 2023-09-07 Applied Materials, Inc. Biasable rotating pedestal
US20230415204A1 (en) * 2022-06-23 2023-12-28 Taiwan Semiconductor Manufacturing Company, Ltd. Wet cleaning tool and method
WO2024158681A1 (en) * 2023-01-26 2024-08-02 Applied Materials, Inc. Purge system to clean wafer backside for ring susceptor

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Publication number Priority date Publication date Assignee Title
US6689221B2 (en) 2000-12-04 2004-02-10 Applied Materials, Inc. Cooling gas delivery system for a rotatable semiconductor substrate support assembly
JP4054248B2 (en) * 2002-11-18 2008-02-27 大日本スクリーン製造株式会社 Substrate processing equipment
JP2005082837A (en) 2003-09-05 2005-03-31 Shin Meiwa Ind Co Ltd Vacuum film forming method, apparatus, and filter manufactured using them
JP2005332889A (en) * 2004-05-18 2005-12-02 Kobe Steel Ltd Pressure treatment device
JP2007176637A (en) * 2005-12-27 2007-07-12 Harmotec Corp Non-contact conveying device
CN104813460A (en) * 2012-11-27 2015-07-29 盛美半导体设备（上海）有限公司 Substrate supporting apparatus
JP6093234B2 (en) * 2013-05-01 2017-03-08 日本ピラー工業株式会社 Multi-port rotary joint
CN105318129A (en) * 2014-05-30 2016-02-10 盛美半导体设备（上海）有限公司 Rotary shaft with a vent groove
KR102301413B1 (en) * 2014-06-06 2021-09-14 에이씨엠 리서치 (상하이) 인코포레이티드 Apparatus and method for removing film on edge of backside of wafer
JP5764246B1 (en) * 2014-09-24 2015-08-19 株式会社日立国際電気 Substrate processing apparatus, gas introduction shaft and gas supply plate

Also Published As

Publication number Publication date
US10770335B2 (en) 2020-09-08
JP2019521519A (en) 2019-07-25
CN109478524A (en) 2019-03-15
CN109478524B (en) 2022-01-25
KR20190025614A (en) 2019-03-11
KR102512826B1 (en) 2023-03-23
JP6758587B2 (en) 2020-09-23
US20190311938A1 (en) 2019-10-10
WO2018006283A1 (en) 2018-01-11

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