SG11201703250YA - Film for forming protective coating and composite sheet for forming protective coating - Google Patents
Film for forming protective coating and composite sheet for forming protective coatingInfo
- Publication number
- SG11201703250YA SG11201703250YA SG11201703250YA SG11201703250YA SG11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA
- Authority
- SG
- Singapore
- Prior art keywords
- protective coating
- forming protective
- film
- composite sheet
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/402—Coloured
- B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014220295 | 2014-10-29 | ||
PCT/JP2015/079973 WO2016068042A1 (en) | 2014-10-29 | 2015-10-23 | Film for forming protective coat and composite sheet for forming protective coat |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201703250YA true SG11201703250YA (en) | 2017-05-30 |
Family
ID=55857381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201703250YA SG11201703250YA (en) | 2014-10-29 | 2015-10-23 | Film for forming protective coating and composite sheet for forming protective coating |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6585068B2 (en) |
KR (1) | KR102467143B1 (en) |
CN (2) | CN107112219A (en) |
SG (1) | SG11201703250YA (en) |
TW (1) | TWI671338B (en) |
WO (1) | WO2016068042A1 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI796297B (en) * | 2016-04-28 | 2023-03-21 | 日商琳得科股份有限公司 | Composite sheet for forming protective film |
TWI731964B (en) * | 2016-04-28 | 2021-07-01 | 日商琳得科股份有限公司 | Complex sheet for forming protective film |
TWI642544B (en) * | 2016-10-11 | 2018-12-01 | 武漢市三選科技有限公司 | Sheet for forming cut-off substrate protective film, preparation method thereof, circuit board therewith and preparation method thereof |
MY192914A (en) * | 2017-02-09 | 2022-09-15 | Lintec Corp | Curable resin film and sheet for forming a first protective film |
CN111065656B (en) * | 2017-09-25 | 2022-03-29 | 富士胶片株式会社 | Curable composition, film, infrared transmission filter, solid-state imaging element, and optical sensor |
KR102448152B1 (en) * | 2017-10-27 | 2022-09-27 | 린텍 가부시키가이샤 | A film for forming a protective film, a composite sheet for forming a protective film, and a method for manufacturing a semiconductor chip |
WO2019082968A1 (en) | 2017-10-27 | 2019-05-02 | リンテック株式会社 | Composite sheet for forming protective film and method for manufacturing semiconductor chip |
JP6979081B2 (en) * | 2017-10-27 | 2021-12-08 | リンテック株式会社 | A method for manufacturing a protective film forming film, a protective film forming composite sheet, and a semiconductor chip. |
WO2019082961A1 (en) | 2017-10-27 | 2019-05-02 | リンテック株式会社 | Composite sheet for forming protective film and method for manufacturing semiconductor chip |
TWI786209B (en) | 2017-10-27 | 2022-12-11 | 日商琳得科股份有限公司 | Composite sheet for forming protective film and method for manufacturing semiconductor chip |
KR102175717B1 (en) | 2017-12-14 | 2020-11-06 | 주식회사 엘지화학 | Dicing die-bonding film |
JP6916836B2 (en) * | 2019-05-14 | 2021-08-11 | 日東電工株式会社 | Method of manufacturing a laminate |
JP7333211B2 (en) * | 2019-06-21 | 2023-08-24 | リンテック株式会社 | Composite sheet for forming protective film and method for manufacturing semiconductor chip with protective film |
JP7520497B2 (en) * | 2019-11-08 | 2024-07-23 | リンテック株式会社 | Adhesive films and composite adhesive sheets |
JP7555758B2 (en) | 2020-08-12 | 2024-09-25 | リンテック株式会社 | Sheet for forming protective film and processing method for sheet for forming protective film |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3511346B2 (en) * | 1996-12-05 | 2004-03-29 | 三井化学株式会社 | Method for grinding back surface of semiconductor wafer and pressure-sensitive adhesive film used in the method |
JP3544362B2 (en) * | 2001-03-21 | 2004-07-21 | リンテック株式会社 | Method for manufacturing semiconductor chip |
JP2003305792A (en) * | 2002-04-15 | 2003-10-28 | Toray Ind Inc | Laminated resin sheet |
JP4585164B2 (en) * | 2002-07-18 | 2010-11-24 | 日東電工株式会社 | UV curable adhesive sheet |
JP5090695B2 (en) | 2006-09-08 | 2012-12-05 | 大倉工業株式会社 | Manufacturing method of polarizing plate |
JP2009036797A (en) * | 2007-07-31 | 2009-02-19 | Nitto Denko Corp | Optical film, polarizing plate, and image display device |
JP2009138026A (en) | 2007-12-03 | 2009-06-25 | Furukawa Electric Co Ltd:The | Energy ray-curable chip protecting film |
JP5640051B2 (en) | 2009-01-30 | 2014-12-10 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP5249290B2 (en) | 2010-07-20 | 2013-07-31 | 日東電工株式会社 | Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, semiconductor device manufacturing method, and flip chip type semiconductor device |
CN102516889B (en) * | 2011-12-07 | 2013-09-25 | 深圳市鑫东邦科技有限公司 | Ultraviolet curable adhesive with high light transmittance |
-
2015
- 2015-10-23 WO PCT/JP2015/079973 patent/WO2016068042A1/en active Application Filing
- 2015-10-23 CN CN201580058160.4A patent/CN107112219A/en active Pending
- 2015-10-23 KR KR1020177011036A patent/KR102467143B1/en active IP Right Grant
- 2015-10-23 JP JP2016556539A patent/JP6585068B2/en active Active
- 2015-10-23 CN CN202111107427.8A patent/CN113980535A/en active Pending
- 2015-10-23 SG SG11201703250YA patent/SG11201703250YA/en unknown
- 2015-10-26 TW TW104135068A patent/TWI671338B/en active
Also Published As
Publication number | Publication date |
---|---|
TW201620963A (en) | 2016-06-16 |
KR20170078630A (en) | 2017-07-07 |
CN107112219A (en) | 2017-08-29 |
TWI671338B (en) | 2019-09-11 |
WO2016068042A1 (en) | 2016-05-06 |
KR102467143B1 (en) | 2022-11-14 |
JPWO2016068042A1 (en) | 2017-08-10 |
CN113980535A (en) | 2022-01-28 |
JP6585068B2 (en) | 2019-10-02 |
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