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SG11201703250YA - Film for forming protective coating and composite sheet for forming protective coating - Google Patents

Film for forming protective coating and composite sheet for forming protective coating

Info

Publication number
SG11201703250YA
SG11201703250YA SG11201703250YA SG11201703250YA SG11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA SG 11201703250Y A SG11201703250Y A SG 11201703250YA
Authority
SG
Singapore
Prior art keywords
protective coating
forming protective
film
composite sheet
forming
Prior art date
Application number
SG11201703250YA
Inventor
Rikiya Kobashi
Daisuke Yamamoto
Akio Kabuto
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201703250YA publication Critical patent/SG11201703250YA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/402Coloured
    • B32B2307/4026Coloured within the layer by addition of a colorant, e.g. pigments, dyes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
SG11201703250YA 2014-10-29 2015-10-23 Film for forming protective coating and composite sheet for forming protective coating SG11201703250YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014220295 2014-10-29
PCT/JP2015/079973 WO2016068042A1 (en) 2014-10-29 2015-10-23 Film for forming protective coat and composite sheet for forming protective coat

Publications (1)

Publication Number Publication Date
SG11201703250YA true SG11201703250YA (en) 2017-05-30

Family

ID=55857381

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703250YA SG11201703250YA (en) 2014-10-29 2015-10-23 Film for forming protective coating and composite sheet for forming protective coating

Country Status (6)

Country Link
JP (1) JP6585068B2 (en)
KR (1) KR102467143B1 (en)
CN (2) CN107112219A (en)
SG (1) SG11201703250YA (en)
TW (1) TWI671338B (en)
WO (1) WO2016068042A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI796297B (en) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 Composite sheet for forming protective film
TWI731964B (en) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 Complex sheet for forming protective film
TWI642544B (en) * 2016-10-11 2018-12-01 武漢市三選科技有限公司 Sheet for forming cut-off substrate protective film, preparation method thereof, circuit board therewith and preparation method thereof
MY192914A (en) * 2017-02-09 2022-09-15 Lintec Corp Curable resin film and sheet for forming a first protective film
CN111065656B (en) * 2017-09-25 2022-03-29 富士胶片株式会社 Curable composition, film, infrared transmission filter, solid-state imaging element, and optical sensor
KR102448152B1 (en) * 2017-10-27 2022-09-27 린텍 가부시키가이샤 A film for forming a protective film, a composite sheet for forming a protective film, and a method for manufacturing a semiconductor chip
WO2019082968A1 (en) 2017-10-27 2019-05-02 リンテック株式会社 Composite sheet for forming protective film and method for manufacturing semiconductor chip
JP6979081B2 (en) * 2017-10-27 2021-12-08 リンテック株式会社 A method for manufacturing a protective film forming film, a protective film forming composite sheet, and a semiconductor chip.
WO2019082961A1 (en) 2017-10-27 2019-05-02 リンテック株式会社 Composite sheet for forming protective film and method for manufacturing semiconductor chip
TWI786209B (en) 2017-10-27 2022-12-11 日商琳得科股份有限公司 Composite sheet for forming protective film and method for manufacturing semiconductor chip
KR102175717B1 (en) 2017-12-14 2020-11-06 주식회사 엘지화학 Dicing die-bonding film
JP6916836B2 (en) * 2019-05-14 2021-08-11 日東電工株式会社 Method of manufacturing a laminate
JP7333211B2 (en) * 2019-06-21 2023-08-24 リンテック株式会社 Composite sheet for forming protective film and method for manufacturing semiconductor chip with protective film
JP7520497B2 (en) * 2019-11-08 2024-07-23 リンテック株式会社 Adhesive films and composite adhesive sheets
JP7555758B2 (en) 2020-08-12 2024-09-25 リンテック株式会社 Sheet for forming protective film and processing method for sheet for forming protective film

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3511346B2 (en) * 1996-12-05 2004-03-29 三井化学株式会社 Method for grinding back surface of semiconductor wafer and pressure-sensitive adhesive film used in the method
JP3544362B2 (en) * 2001-03-21 2004-07-21 リンテック株式会社 Method for manufacturing semiconductor chip
JP2003305792A (en) * 2002-04-15 2003-10-28 Toray Ind Inc Laminated resin sheet
JP4585164B2 (en) * 2002-07-18 2010-11-24 日東電工株式会社 UV curable adhesive sheet
JP5090695B2 (en) 2006-09-08 2012-12-05 大倉工業株式会社 Manufacturing method of polarizing plate
JP2009036797A (en) * 2007-07-31 2009-02-19 Nitto Denko Corp Optical film, polarizing plate, and image display device
JP2009138026A (en) 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The Energy ray-curable chip protecting film
JP5640051B2 (en) 2009-01-30 2014-12-10 日東電工株式会社 Manufacturing method of semiconductor device
JP5249290B2 (en) 2010-07-20 2013-07-31 日東電工株式会社 Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, semiconductor device manufacturing method, and flip chip type semiconductor device
CN102516889B (en) * 2011-12-07 2013-09-25 深圳市鑫东邦科技有限公司 Ultraviolet curable adhesive with high light transmittance

Also Published As

Publication number Publication date
TW201620963A (en) 2016-06-16
KR20170078630A (en) 2017-07-07
CN107112219A (en) 2017-08-29
TWI671338B (en) 2019-09-11
WO2016068042A1 (en) 2016-05-06
KR102467143B1 (en) 2022-11-14
JPWO2016068042A1 (en) 2017-08-10
CN113980535A (en) 2022-01-28
JP6585068B2 (en) 2019-10-02

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