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SG11201701774SA - Method and system for inspecting wafers for electronics, optics or optoelectronics - Google Patents

Method and system for inspecting wafers for electronics, optics or optoelectronics

Info

Publication number
SG11201701774SA
SG11201701774SA SG11201701774SA SG11201701774SA SG11201701774SA SG 11201701774S A SG11201701774S A SG 11201701774SA SG 11201701774S A SG11201701774S A SG 11201701774SA SG 11201701774S A SG11201701774S A SG 11201701774SA SG 11201701774S A SG11201701774S A SG 11201701774SA
Authority
SG
Singapore
Prior art keywords
optoelectronics
optics
electronics
inspecting wafers
inspecting
Prior art date
Application number
SG11201701774SA
Inventor
De Gevigney Mayeul Durand
Philippe Gastaldo
Original Assignee
Unity Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unity Semiconductor filed Critical Unity Semiconductor
Publication of SG11201701774SA publication Critical patent/SG11201701774SA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9505Wafer internal defects, e.g. microcracks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/30Testing of optical devices, constituted by fibre optics or optical waveguides
    • G01M11/33Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face
    • G01M11/331Testing of optical devices, constituted by fibre optics or optical waveguides with a light emitter being disposed at one fibre or waveguide end-face, and a light receiver at the other end-face by using interferometer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9503Wafer edge inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8874Taking dimensions of defect into account

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201701774SA 2014-09-29 2015-09-29 Method and system for inspecting wafers for electronics, optics or optoelectronics SG11201701774SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1459172A FR3026485B1 (en) 2014-09-29 2014-09-29 METHOD AND SYSTEM FOR INSPECTING PLATELETS FOR ELECTRONICS, OPTICS OR OPTOELECTRONICS
PCT/EP2015/072364 WO2016050735A1 (en) 2014-09-29 2015-09-29 Method and system for inspecting wafers for electronics, optics or optoelectronics

Publications (1)

Publication Number Publication Date
SG11201701774SA true SG11201701774SA (en) 2017-04-27

Family

ID=51866250

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201701774SA SG11201701774SA (en) 2014-09-29 2015-09-29 Method and system for inspecting wafers for electronics, optics or optoelectronics

Country Status (8)

Country Link
US (1) US9857313B2 (en)
EP (1) EP3201609B1 (en)
JP (1) JP6530063B2 (en)
KR (1) KR20170066366A (en)
CN (1) CN107076547B (en)
FR (1) FR3026485B1 (en)
SG (1) SG11201701774SA (en)
WO (1) WO2016050735A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10183732B2 (en) * 2015-04-09 2019-01-22 University of New Hamphire Pose detection and control of unmanned underwater vehicles (UUVs) utilizing an optical detector array
FR3049710B1 (en) * 2016-03-31 2020-06-19 Unity Semiconductor LASER DOPPLER EFFECT INSPECTION METHOD AND SYSTEM FOR MICROELECTRONICS OR OPTICS
EP3382378B1 (en) * 2017-03-29 2022-10-26 Mitsubishi Electric R&D Centre Europe B.V. Optical monitoring
KR102491575B1 (en) 2017-09-28 2023-01-25 삼성전자주식회사 Method for inspecting a semiconductor substrate and method for manufacturing a semiconductor device
DE102017129356B3 (en) * 2017-12-08 2019-03-07 Infineon Technologies Ag INSPECTION PROCEDURE FOR SEMICONDUCTOR SUBSTRATES USING TILTING DATA AND INSPECTION DEVICE
FR3076618B1 (en) 2018-01-05 2023-11-24 Unity Semiconductor METHOD AND SYSTEM FOR OPTICAL INSPECTION OF A SUBSTRATE
FR3087011B1 (en) * 2018-10-08 2022-12-30 Unity Semiconductor DARK FIELD OPTICAL INSPECTION DEVICE

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030830A (en) * 1976-01-05 1977-06-21 Atlantic Research Corporation Process and apparatus for sensing defects on a smooth surface
GB2231221B (en) * 1989-05-06 1993-06-16 Rolls Royce Plc A method of measuring the three dimensional velocity components of a particle in a fluid flow
US5712701A (en) * 1995-03-06 1998-01-27 Ade Optical Systems Corporation Surface inspection system and method of inspecting surface of workpiece
WO1997026529A1 (en) * 1996-01-19 1997-07-24 Phase Metrics Surface inspection apparatus and method
US20020191179A1 (en) 2000-11-13 2002-12-19 Tukker Teunis Willem Measurement of surface defects
FR2927175B1 (en) * 2008-02-05 2011-02-18 Altatech Semiconductor DEVICE FOR INSPECTING SEMICONDUCTOR WAFERS

Also Published As

Publication number Publication date
CN107076547A (en) 2017-08-18
EP3201609B1 (en) 2018-11-07
US9857313B2 (en) 2018-01-02
JP6530063B2 (en) 2019-06-12
JP2017533421A (en) 2017-11-09
WO2016050735A1 (en) 2016-04-07
CN107076547B (en) 2018-09-14
US20170219496A1 (en) 2017-08-03
KR20170066366A (en) 2017-06-14
FR3026485A1 (en) 2016-04-01
FR3026485B1 (en) 2016-09-23
EP3201609A1 (en) 2017-08-09

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