SG11201607714WA - Method for coating cavities of a semiconductor substrate - Google Patents
Method for coating cavities of a semiconductor substrateInfo
- Publication number
- SG11201607714WA SG11201607714WA SG11201607714WA SG11201607714WA SG11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor substrate
- coating cavities
- cavities
- coating
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014104239.5A DE102014104239A1 (en) | 2014-03-26 | 2014-03-26 | Process for coating cavities of a semiconductor substrate |
PCT/EP2015/050283 WO2015144319A1 (en) | 2014-03-26 | 2015-01-09 | Method for coating cavities of a semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201607714WA true SG11201607714WA (en) | 2016-11-29 |
Family
ID=52345234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201607714WA SG11201607714WA (en) | 2014-03-26 | 2015-01-09 | Method for coating cavities of a semiconductor substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US9786487B2 (en) |
EP (1) | EP3123503B1 (en) |
DE (1) | DE102014104239A1 (en) |
SG (1) | SG11201607714WA (en) |
TW (1) | TWI680536B (en) |
WO (1) | WO2015144319A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017111952A1 (en) | 2015-12-22 | 2017-06-29 | Intel Corporation | Ultra small molded module integrated with die by module-on-wafer assembly |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4433846C2 (en) * | 1994-09-22 | 1999-06-02 | Fraunhofer Ges Forschung | Method of making a vertical integrated circuit structure |
EP1420483A1 (en) | 2002-11-12 | 2004-05-19 | Senstronic (Société Anonyme) | Electric connector having a removable rotation locking device |
US20060243701A1 (en) * | 2005-04-19 | 2006-11-02 | Shogo Ono | Liquid discharge head and liquid discharge head manufacturing method, chip element, and printing apparatus |
CN101356637B (en) * | 2005-11-08 | 2012-06-06 | Nxp股份有限公司 | Producing a covered through substrate via using a temporary cap layer |
KR100799121B1 (en) | 2005-12-22 | 2008-01-29 | 주식회사 하이닉스반도체 | Method for manufacturing a semiconductor device having a bulb recess gate |
EP1840940B8 (en) | 2006-03-28 | 2014-11-26 | Thallner, Erich, Dipl.-Ing. | Apparatus and process for coating micro or nanostructured substrates |
CN101459066B (en) | 2007-12-13 | 2010-08-11 | 中芯国际集成电路制造(上海)有限公司 | Gate, shallow slot isolation region forming method and flattening method for silicon base etching surface |
US8703605B2 (en) | 2007-12-18 | 2014-04-22 | Byung Chun Yang | High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability |
US7923379B2 (en) | 2008-11-12 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-step process for forming high-aspect-ratio holes for MEMS devices |
TWI466258B (en) * | 2009-04-10 | 2014-12-21 | Nanya Technology Corp | Conductive through connection and forming method thereof |
US8999179B2 (en) | 2010-07-13 | 2015-04-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive vias in a substrate |
DE102011013228B4 (en) * | 2011-03-07 | 2014-05-28 | Austriamicrosystems Ag | Method of manufacturing a semiconductor device for 3D integration |
-
2014
- 2014-03-26 DE DE102014104239.5A patent/DE102014104239A1/en not_active Ceased
-
2015
- 2015-01-09 WO PCT/EP2015/050283 patent/WO2015144319A1/en active Application Filing
- 2015-01-09 US US15/118,914 patent/US9786487B2/en active Active
- 2015-01-09 EP EP15700204.9A patent/EP3123503B1/en active Active
- 2015-01-09 SG SG11201607714WA patent/SG11201607714WA/en unknown
- 2015-01-26 TW TW104102588A patent/TWI680536B/en active
Also Published As
Publication number | Publication date |
---|---|
EP3123503A1 (en) | 2017-02-01 |
DE102014104239A1 (en) | 2015-10-01 |
WO2015144319A1 (en) | 2015-10-01 |
US9786487B2 (en) | 2017-10-10 |
TW201537680A (en) | 2015-10-01 |
EP3123503B1 (en) | 2019-10-16 |
US20160365241A1 (en) | 2016-12-15 |
TWI680536B (en) | 2019-12-21 |
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