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SG11201607714WA - Method for coating cavities of a semiconductor substrate - Google Patents

Method for coating cavities of a semiconductor substrate

Info

Publication number
SG11201607714WA
SG11201607714WA SG11201607714WA SG11201607714WA SG11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA SG 11201607714W A SG11201607714W A SG 11201607714WA
Authority
SG
Singapore
Prior art keywords
semiconductor substrate
coating cavities
cavities
coating
semiconductor
Prior art date
Application number
SG11201607714WA
Inventor
Andreas Fehkührer
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201607714WA publication Critical patent/SG11201607714WA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0014Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11201607714WA 2014-03-26 2015-01-09 Method for coating cavities of a semiconductor substrate SG11201607714WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014104239.5A DE102014104239A1 (en) 2014-03-26 2014-03-26 Process for coating cavities of a semiconductor substrate
PCT/EP2015/050283 WO2015144319A1 (en) 2014-03-26 2015-01-09 Method for coating cavities of a semiconductor substrate

Publications (1)

Publication Number Publication Date
SG11201607714WA true SG11201607714WA (en) 2016-11-29

Family

ID=52345234

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607714WA SG11201607714WA (en) 2014-03-26 2015-01-09 Method for coating cavities of a semiconductor substrate

Country Status (6)

Country Link
US (1) US9786487B2 (en)
EP (1) EP3123503B1 (en)
DE (1) DE102014104239A1 (en)
SG (1) SG11201607714WA (en)
TW (1) TWI680536B (en)
WO (1) WO2015144319A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017111952A1 (en) 2015-12-22 2017-06-29 Intel Corporation Ultra small molded module integrated with die by module-on-wafer assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4433846C2 (en) * 1994-09-22 1999-06-02 Fraunhofer Ges Forschung Method of making a vertical integrated circuit structure
EP1420483A1 (en) 2002-11-12 2004-05-19 Senstronic (Société Anonyme) Electric connector having a removable rotation locking device
US20060243701A1 (en) * 2005-04-19 2006-11-02 Shogo Ono Liquid discharge head and liquid discharge head manufacturing method, chip element, and printing apparatus
CN101356637B (en) * 2005-11-08 2012-06-06 Nxp股份有限公司 Producing a covered through substrate via using a temporary cap layer
KR100799121B1 (en) 2005-12-22 2008-01-29 주식회사 하이닉스반도체 Method for manufacturing a semiconductor device having a bulb recess gate
EP1840940B8 (en) 2006-03-28 2014-11-26 Thallner, Erich, Dipl.-Ing. Apparatus and process for coating micro or nanostructured substrates
CN101459066B (en) 2007-12-13 2010-08-11 中芯国际集成电路制造(上海)有限公司 Gate, shallow slot isolation region forming method and flattening method for silicon base etching surface
US8703605B2 (en) 2007-12-18 2014-04-22 Byung Chun Yang High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability
US7923379B2 (en) 2008-11-12 2011-04-12 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-step process for forming high-aspect-ratio holes for MEMS devices
TWI466258B (en) * 2009-04-10 2014-12-21 Nanya Technology Corp Conductive through connection and forming method thereof
US8999179B2 (en) 2010-07-13 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive vias in a substrate
DE102011013228B4 (en) * 2011-03-07 2014-05-28 Austriamicrosystems Ag Method of manufacturing a semiconductor device for 3D integration

Also Published As

Publication number Publication date
EP3123503A1 (en) 2017-02-01
DE102014104239A1 (en) 2015-10-01
WO2015144319A1 (en) 2015-10-01
US9786487B2 (en) 2017-10-10
TW201537680A (en) 2015-10-01
EP3123503B1 (en) 2019-10-16
US20160365241A1 (en) 2016-12-15
TWI680536B (en) 2019-12-21

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