SG11201507587QA - Optical acoustic substrate assessment system and method - Google Patents
Optical acoustic substrate assessment system and methodInfo
- Publication number
- SG11201507587QA SG11201507587QA SG11201507587QA SG11201507587QA SG11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA
- Authority
- SG
- Singapore
- Prior art keywords
- assessment system
- optical acoustic
- acoustic substrate
- substrate assessment
- optical
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8461—Investigating impurities in semiconductor, e.g. Silicon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/011—Velocity or travel time
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0423—Surface waves, e.g. Rayleigh waves, Love waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0426—Bulk waves, e.g. quartz crystal microbalance, torsional waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/0231—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to electromagnetic radiation, e.g. UV light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Acoustics & Sound (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361799448P | 2013-03-15 | 2013-03-15 | |
US201361799089P | 2013-03-15 | 2013-03-15 | |
PCT/US2014/014890 WO2014149213A1 (en) | 2013-03-15 | 2014-02-05 | Optical acoustic substrate assessment system and method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201507587QA true SG11201507587QA (en) | 2015-10-29 |
Family
ID=51580584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201507587QA SG11201507587QA (en) | 2013-03-15 | 2014-02-05 | Optical acoustic substrate assessment system and method |
Country Status (5)
Country | Link |
---|---|
US (1) | US9576862B2 (en) |
CN (2) | CN105453243B (en) |
SG (1) | SG11201507587QA (en) |
TW (1) | TWI623746B (en) |
WO (1) | WO2014149213A1 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6044893B2 (en) * | 2013-03-08 | 2016-12-14 | 株式会社Screenホールディングス | Inspection apparatus and inspection method |
WO2016054067A1 (en) * | 2014-09-29 | 2016-04-07 | Manjusha Mehendale | Non-destructive acoustic metrology for void detection |
JP2018042208A (en) * | 2016-09-09 | 2018-03-15 | 株式会社ディスコ | Manufacturing method for surface elastic wave device chip |
US10679908B2 (en) * | 2017-01-23 | 2020-06-09 | Globalwafers Co., Ltd. | Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures |
KR102480090B1 (en) * | 2017-11-01 | 2022-12-23 | 삼성디스플레이 주식회사 | Manufacturing method of deposition mask |
JP2019105616A (en) * | 2017-12-15 | 2019-06-27 | 株式会社日立製作所 | Laser ultrasonic device |
JP6852008B2 (en) * | 2018-03-19 | 2021-03-31 | 株式会社東芝 | Optical inspection equipment, semiconductor devices and optical inspection methods |
US11079285B2 (en) | 2018-05-04 | 2021-08-03 | Raytheon Technologies Corporation | Automated analysis of thermally-sensitive coating and method therefor |
US10958843B2 (en) | 2018-05-04 | 2021-03-23 | Raytheon Technologies Corporation | Multi-camera system for simultaneous registration and zoomed imagery |
US10473593B1 (en) | 2018-05-04 | 2019-11-12 | United Technologies Corporation | System and method for damage detection by cast shadows |
US10685433B2 (en) | 2018-05-04 | 2020-06-16 | Raytheon Technologies Corporation | Nondestructive coating imperfection detection system and method therefor |
US10902664B2 (en) | 2018-05-04 | 2021-01-26 | Raytheon Technologies Corporation | System and method for detecting damage using two-dimensional imagery and three-dimensional model |
US11268881B2 (en) | 2018-05-04 | 2022-03-08 | Raytheon Technologies Corporation | System and method for fan blade rotor disk and gear inspection |
US10943320B2 (en) | 2018-05-04 | 2021-03-09 | Raytheon Technologies Corporation | System and method for robotic inspection |
US10914191B2 (en) | 2018-05-04 | 2021-02-09 | Raytheon Technologies Corporation | System and method for in situ airfoil inspection |
US10488371B1 (en) * | 2018-05-04 | 2019-11-26 | United Technologies Corporation | Nondestructive inspection using thermoacoustic imagery and method therefor |
US10928362B2 (en) | 2018-05-04 | 2021-02-23 | Raytheon Technologies Corporation | Nondestructive inspection using dual pulse-echo ultrasonics and method therefor |
US11391700B2 (en) * | 2018-07-04 | 2022-07-19 | Samsung Electronics Co., Ltd. | Defect detection device |
US11073500B2 (en) * | 2018-11-07 | 2021-07-27 | The Boeing Company | Systems and methods for automatic alignment and focusing of light in laser ultrasound testing |
KR102583749B1 (en) * | 2019-05-23 | 2023-09-26 | 온투 이노베이션 아이엔씨. | Non-destructive testing and manufacturing metrology systems and methods |
JP7401383B2 (en) * | 2020-04-06 | 2023-12-19 | 株式会社ディスコ | detection device |
CN115667907A (en) * | 2020-04-13 | 2023-01-31 | 昂图创新有限公司 | Characterizing patterned structures using acoustic metrology |
US11519720B2 (en) * | 2020-10-12 | 2022-12-06 | Applied Materials Israel Ltd. | Depth profiling of semiconductor structures using picosecond ultrasonics |
US11668644B2 (en) | 2021-03-30 | 2023-06-06 | Onto Innovation Inc. | Opto-acoustic measurement of a transparent film stack |
WO2024003850A1 (en) * | 2022-06-30 | 2024-01-04 | Nova Ltd. | Evaluation of abnormalities of a sample |
US20240329005A1 (en) * | 2023-03-31 | 2024-10-03 | Onto Innovation Inc. | Multi pump-probe encoding-decoding for opto-acoustic metrology |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5982482A (en) * | 1997-07-31 | 1999-11-09 | Massachusetts Institute Of Technology | Determining the presence of defects in thin film structures |
US6795198B1 (en) * | 1998-05-28 | 2004-09-21 | Martin Fuchs | Method and device for measuring thin films and semiconductor substrates using reflection mode geometry |
CN101290907B (en) * | 2003-12-26 | 2010-12-08 | 瑞萨电子株式会社 | Fabrication method of semiconductor integrated circuit device |
US7327448B2 (en) * | 2004-07-29 | 2008-02-05 | Optech Ventures Llc | Laser-ultrasonic detection of flip chip attachment defects |
GB2417126A (en) * | 2004-08-09 | 2006-02-15 | Qinetiq Ltd | Method for fabricating lateral semiconductor device |
US20060256916A1 (en) * | 2005-05-13 | 2006-11-16 | Rudolph Technologies, Inc. | Combined ultra-fast x-ray and optical system for thin film measurements |
CA2653228C (en) * | 2006-05-24 | 2016-09-13 | Tarilian Laser Technologies, Limited | Optical vital sign detection method and measurement device |
GB0900705D0 (en) * | 2009-01-16 | 2009-03-04 | Univ Huddersfield | Surface measurement system |
WO2011044473A1 (en) * | 2009-10-09 | 2011-04-14 | Rudolph Technologies, Inc. | Substrate analysis using surface acoustic wave metrology |
KR101184489B1 (en) * | 2009-11-16 | 2012-09-19 | 삼성전기주식회사 | Inspection method for circuit pattern of substrate |
KR20120125485A (en) * | 2010-01-08 | 2012-11-15 | 워싱톤 유니버시티 | Method and apparatus for high resolution photon detection based on extraordinary optoconductance eoc effects |
KR20130022829A (en) | 2011-08-26 | 2013-03-07 | 삼성전자주식회사 | Method for detecting defect of multi-chip packaging device and method for manufacturing the multi-chip packaging device using the same |
-
2014
- 2014-02-05 US US14/776,953 patent/US9576862B2/en active Active
- 2014-02-05 CN CN201480025735.8A patent/CN105453243B/en active Active
- 2014-02-05 WO PCT/US2014/014890 patent/WO2014149213A1/en active Application Filing
- 2014-02-05 SG SG11201507587QA patent/SG11201507587QA/en unknown
- 2014-02-05 CN CN201810216175.4A patent/CN108565205B/en active Active
- 2014-02-06 TW TW103103917A patent/TWI623746B/en active
Also Published As
Publication number | Publication date |
---|---|
CN108565205B (en) | 2022-09-27 |
CN105453243A (en) | 2016-03-30 |
US20160043008A1 (en) | 2016-02-11 |
CN108565205A (en) | 2018-09-21 |
CN105453243B (en) | 2018-05-22 |
WO2014149213A1 (en) | 2014-09-25 |
US9576862B2 (en) | 2017-02-21 |
TW201439532A (en) | 2014-10-16 |
TWI623746B (en) | 2018-05-11 |
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