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SG11201507587QA - Optical acoustic substrate assessment system and method - Google Patents

Optical acoustic substrate assessment system and method

Info

Publication number
SG11201507587QA
SG11201507587QA SG11201507587QA SG11201507587QA SG11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA SG 11201507587Q A SG11201507587Q A SG 11201507587QA
Authority
SG
Singapore
Prior art keywords
assessment system
optical acoustic
acoustic substrate
substrate assessment
optical
Prior art date
Application number
SG11201507587QA
Inventor
Todd Murray
Manjusha Mehendale
Michael Kotelyanskii
Robin Mair
Priya Mukundhan
Original Assignee
Rudolph Technologies Inc
Univ Colorado Regents
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rudolph Technologies Inc, Univ Colorado Regents filed Critical Rudolph Technologies Inc
Publication of SG11201507587QA publication Critical patent/SG11201507587QA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41Refractivity; Phase-affecting properties, e.g. optical path length
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04Analysing solids
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2418Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N2021/8461Investigating impurities in semiconductor, e.g. Silicon
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/061Sources
    • G01N2201/06113Coherent sources; lasers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/01Indexing codes associated with the measuring variable
    • G01N2291/011Velocity or travel time
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/028Material parameters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • G01N2291/0423Surface waves, e.g. Rayleigh waves, Love waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • G01N2291/0426Bulk waves, e.g. quartz crystal microbalance, torsional waves
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02296Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/0231Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to electromagnetic radiation, e.g. UV light
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
SG11201507587QA 2013-03-15 2014-02-05 Optical acoustic substrate assessment system and method SG11201507587QA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361799448P 2013-03-15 2013-03-15
US201361799089P 2013-03-15 2013-03-15
PCT/US2014/014890 WO2014149213A1 (en) 2013-03-15 2014-02-05 Optical acoustic substrate assessment system and method

Publications (1)

Publication Number Publication Date
SG11201507587QA true SG11201507587QA (en) 2015-10-29

Family

ID=51580584

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201507587QA SG11201507587QA (en) 2013-03-15 2014-02-05 Optical acoustic substrate assessment system and method

Country Status (5)

Country Link
US (1) US9576862B2 (en)
CN (2) CN105453243B (en)
SG (1) SG11201507587QA (en)
TW (1) TWI623746B (en)
WO (1) WO2014149213A1 (en)

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WO2016054067A1 (en) * 2014-09-29 2016-04-07 Manjusha Mehendale Non-destructive acoustic metrology for void detection
JP2018042208A (en) * 2016-09-09 2018-03-15 株式会社ディスコ Manufacturing method for surface elastic wave device chip
US10679908B2 (en) * 2017-01-23 2020-06-09 Globalwafers Co., Ltd. Cleave systems, mountable cleave monitoring systems, and methods for separating bonded wafer structures
KR102480090B1 (en) * 2017-11-01 2022-12-23 삼성디스플레이 주식회사 Manufacturing method of deposition mask
JP2019105616A (en) * 2017-12-15 2019-06-27 株式会社日立製作所 Laser ultrasonic device
JP6852008B2 (en) * 2018-03-19 2021-03-31 株式会社東芝 Optical inspection equipment, semiconductor devices and optical inspection methods
US11079285B2 (en) 2018-05-04 2021-08-03 Raytheon Technologies Corporation Automated analysis of thermally-sensitive coating and method therefor
US10958843B2 (en) 2018-05-04 2021-03-23 Raytheon Technologies Corporation Multi-camera system for simultaneous registration and zoomed imagery
US10473593B1 (en) 2018-05-04 2019-11-12 United Technologies Corporation System and method for damage detection by cast shadows
US10685433B2 (en) 2018-05-04 2020-06-16 Raytheon Technologies Corporation Nondestructive coating imperfection detection system and method therefor
US10902664B2 (en) 2018-05-04 2021-01-26 Raytheon Technologies Corporation System and method for detecting damage using two-dimensional imagery and three-dimensional model
US11268881B2 (en) 2018-05-04 2022-03-08 Raytheon Technologies Corporation System and method for fan blade rotor disk and gear inspection
US10943320B2 (en) 2018-05-04 2021-03-09 Raytheon Technologies Corporation System and method for robotic inspection
US10914191B2 (en) 2018-05-04 2021-02-09 Raytheon Technologies Corporation System and method for in situ airfoil inspection
US10488371B1 (en) * 2018-05-04 2019-11-26 United Technologies Corporation Nondestructive inspection using thermoacoustic imagery and method therefor
US10928362B2 (en) 2018-05-04 2021-02-23 Raytheon Technologies Corporation Nondestructive inspection using dual pulse-echo ultrasonics and method therefor
US11391700B2 (en) * 2018-07-04 2022-07-19 Samsung Electronics Co., Ltd. Defect detection device
US11073500B2 (en) * 2018-11-07 2021-07-27 The Boeing Company Systems and methods for automatic alignment and focusing of light in laser ultrasound testing
KR102583749B1 (en) * 2019-05-23 2023-09-26 온투 이노베이션 아이엔씨. Non-destructive testing and manufacturing metrology systems and methods
JP7401383B2 (en) * 2020-04-06 2023-12-19 株式会社ディスコ detection device
CN115667907A (en) * 2020-04-13 2023-01-31 昂图创新有限公司 Characterizing patterned structures using acoustic metrology
US11519720B2 (en) * 2020-10-12 2022-12-06 Applied Materials Israel Ltd. Depth profiling of semiconductor structures using picosecond ultrasonics
US11668644B2 (en) 2021-03-30 2023-06-06 Onto Innovation Inc. Opto-acoustic measurement of a transparent film stack
WO2024003850A1 (en) * 2022-06-30 2024-01-04 Nova Ltd. Evaluation of abnormalities of a sample
US20240329005A1 (en) * 2023-03-31 2024-10-03 Onto Innovation Inc. Multi pump-probe encoding-decoding for opto-acoustic metrology

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US5982482A (en) * 1997-07-31 1999-11-09 Massachusetts Institute Of Technology Determining the presence of defects in thin film structures
US6795198B1 (en) * 1998-05-28 2004-09-21 Martin Fuchs Method and device for measuring thin films and semiconductor substrates using reflection mode geometry
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Also Published As

Publication number Publication date
CN108565205B (en) 2022-09-27
CN105453243A (en) 2016-03-30
US20160043008A1 (en) 2016-02-11
CN108565205A (en) 2018-09-21
CN105453243B (en) 2018-05-22
WO2014149213A1 (en) 2014-09-25
US9576862B2 (en) 2017-02-21
TW201439532A (en) 2014-10-16
TWI623746B (en) 2018-05-11

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