SG11201406632SA - Epoxy resin composition and cured product - Google Patents
Epoxy resin composition and cured productInfo
- Publication number
- SG11201406632SA SG11201406632SA SG11201406632SA SG11201406632SA SG11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA SG 11201406632S A SG11201406632S A SG 11201406632SA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- epoxy resin
- cured product
- cured
- product
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
- C08G59/3272—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/060211 WO2013157061A1 (en) | 2012-04-16 | 2012-04-16 | Epoxy resin composition and cured product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201406632SA true SG11201406632SA (en) | 2014-11-27 |
Family
ID=49383052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201406632SA SG11201406632SA (en) | 2012-04-16 | 2012-04-16 | Epoxy resin composition and cured product |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20150008108A (en) |
| CN (1) | CN104245775B (en) |
| SG (1) | SG11201406632SA (en) |
| WO (1) | WO2013157061A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6113454B2 (en) * | 2012-10-11 | 2017-04-12 | 新日鉄住金化学株式会社 | Epoxy resin composition and cured product |
| CN105305364A (en) * | 2015-10-20 | 2016-02-03 | 宁波东昊电缆附件有限公司 | Copper housing of 110kV straight joint |
| KR102112866B1 (en) * | 2017-11-09 | 2020-05-19 | 삼성에스디아이 주식회사 | Composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same |
| KR20210146339A (en) | 2019-03-27 | 2021-12-03 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | Naphthol resin, epoxy resin, epoxy resin composition and cured product thereof |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3268498B2 (en) * | 1990-05-01 | 2002-03-25 | 東都化成株式会社 | Phosphorus-containing flame-retardant epoxy resin |
| JP3146320B2 (en) * | 1991-11-18 | 2001-03-12 | 東都化成株式会社 | Epoxy resin composition |
| JP3318871B2 (en) * | 1992-01-22 | 2002-08-26 | 東都化成株式会社 | Epoxy resin composition |
| JP3579800B2 (en) * | 1994-12-14 | 2004-10-20 | 東都化成株式会社 | Low dielectric epoxy resin composition |
| JP3533973B2 (en) * | 1998-01-27 | 2004-06-07 | 東都化成株式会社 | Phosphorus-containing epoxy resin composition |
| JP2000336146A (en) * | 1999-05-26 | 2000-12-05 | Takeda Chem Ind Ltd | Flame-retardant epoxy resin composition |
| JP3875210B2 (en) * | 2003-04-22 | 2007-01-31 | エア・ウォーター株式会社 | Thermosetting resin composition and use thereof |
| WO2009045817A1 (en) * | 2007-09-28 | 2009-04-09 | Dow Global Technologies Inc. | Epoxy resin formulations |
| JP2010053293A (en) * | 2008-08-29 | 2010-03-11 | Nippon Kayaku Co Ltd | Epoxy resin composition |
| JP2010077262A (en) * | 2008-09-25 | 2010-04-08 | Panasonic Electric Works Co Ltd | Epoxy resin composition, prepreg, metal foil with resin, resin sheet, laminate, and multilayer board |
| JP5547386B2 (en) * | 2008-09-25 | 2014-07-09 | パナソニック株式会社 | Epoxy resin composition for prepreg, prepreg, and multilayer printed wiring board |
| JP5320130B2 (en) * | 2009-03-31 | 2013-10-23 | 新日鉄住金化学株式会社 | Polyvalent hydroxy resin, epoxy resin, production method thereof, epoxy resin composition and cured product thereof |
| JP5720118B2 (en) * | 2009-06-01 | 2015-05-20 | 三菱レイヨン株式会社 | Epoxy resin composition, prepreg and fiber reinforced composite material |
| JP5570380B2 (en) * | 2010-10-07 | 2014-08-13 | 新日鉄住金化学株式会社 | Epoxy resin composition and cured product |
-
2012
- 2012-04-16 KR KR1020147031874A patent/KR20150008108A/en not_active Application Discontinuation
- 2012-04-16 SG SG11201406632SA patent/SG11201406632SA/en unknown
- 2012-04-16 WO PCT/JP2012/060211 patent/WO2013157061A1/en active Application Filing
- 2012-04-16 CN CN201280072418.2A patent/CN104245775B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013157061A1 (en) | 2013-10-24 |
| CN104245775A (en) | 2014-12-24 |
| KR20150008108A (en) | 2015-01-21 |
| CN104245775B (en) | 2016-08-17 |
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