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SG11201405729QA - Semiconductor device, die attaching material, and method for manufacturing semiconductor device - Google Patents

Semiconductor device, die attaching material, and method for manufacturing semiconductor device

Info

Publication number
SG11201405729QA
SG11201405729QA SG11201405729QA SG11201405729QA SG11201405729QA SG 11201405729Q A SG11201405729Q A SG 11201405729QA SG 11201405729Q A SG11201405729Q A SG 11201405729QA SG 11201405729Q A SG11201405729Q A SG 11201405729QA SG 11201405729Q A SG11201405729Q A SG 11201405729QA
Authority
SG
Singapore
Prior art keywords
semiconductor device
die attaching
attaching material
manufacturing semiconductor
manufacturing
Prior art date
Application number
SG11201405729QA
Inventor
Koji Makihara
Shuey Seng Low
Lynn Sum Man
Original Assignee
Sumitomo Bakelite Co
Sumitomo Bakelite Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co, Sumitomo Bakelite Singapore Pte Ltd filed Critical Sumitomo Bakelite Co
Publication of SG11201405729QA publication Critical patent/SG11201405729QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
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    • H01L2224/834—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
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    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10H20/036—Manufacture or treatment of packages

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)
SG11201405729QA 2012-04-10 2013-04-10 Semiconductor device, die attaching material, and method for manufacturing semiconductor device SG11201405729QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012089337 2012-04-10
PCT/JP2013/002430 WO2013153803A1 (en) 2012-04-10 2013-04-10 Semiconductor device, die attaching material, and method for manufacturing semiconductor device

Publications (1)

Publication Number Publication Date
SG11201405729QA true SG11201405729QA (en) 2014-11-27

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SG11201405729QA SG11201405729QA (en) 2012-04-10 2013-04-10 Semiconductor device, die attaching material, and method for manufacturing semiconductor device

Country Status (9)

Country Link
US (1) US20150060889A1 (en)
EP (1) EP2838126A4 (en)
JP (1) JP6247204B2 (en)
KR (1) KR20150003287A (en)
CN (1) CN104221171B (en)
MY (1) MY170959A (en)
SG (1) SG11201405729QA (en)
TW (1) TWI577767B (en)
WO (1) WO2013153803A1 (en)

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JP6356582B2 (en) * 2014-11-25 2018-07-11 日東電工株式会社 Adhesive sheet, adhesive sheet with dicing sheet, and method for manufacturing semiconductor device
JP6675155B2 (en) * 2015-05-20 2020-04-01 京セラ株式会社 Die attach paste for semiconductor and semiconductor device
JP6791626B2 (en) * 2015-12-14 2020-11-25 デクセリアルズ株式会社 Manufacturing method of thermosetting adhesive sheet and semiconductor device
JP2018141106A (en) * 2017-02-28 2018-09-13 住友ベークライト株式会社 Thermosetting resin composition, resin sheet with carrier base material and semiconductor device
WO2020101236A1 (en) * 2018-11-14 2020-05-22 주식회사 엘지화학 Resin composition for semiconductor adhesion, semiconductor adhesive film using same, dicing die bonding film and semiconductor wafer dicing method
KR102376144B1 (en) 2018-11-14 2022-03-18 주식회사 엘지화학 Resin composition for bonding semiconductor, adhesive film for semiconductor, dicing diebonding film, and method for dicing of semiconductor wafer using the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291259A (en) * 1996-04-26 1997-11-11 Sumitomo Bakelite Co Ltd Low-temperature heating curable type anisotropic electroconductive adhesive
JP2000265119A (en) * 1999-03-16 2000-09-26 Sumitomo Bakelite Co Ltd Die attach paste
JP2001019722A (en) 1999-07-05 2001-01-23 Sumitomo Bakelite Co Ltd Die-attaching paste and semiconductor device using the same
JP2001019912A (en) 1999-07-05 2001-01-23 Sumitomo Bakelite Co Ltd Die attach paste and semiconductor device using the same
JP3871828B2 (en) 1999-07-05 2007-01-24 住友ベークライト株式会社 Die attach paste and semiconductor device using the same
JP2002363218A (en) * 2001-06-07 2002-12-18 Hitachi Chem Co Ltd Resin paste composition and semiconductor device using the same
JP2004266134A (en) * 2003-03-03 2004-09-24 Kanegafuchi Chem Ind Co Ltd Resin paste for die bonding and light emitting diode using it
JP4395350B2 (en) 2003-10-09 2010-01-06 信越化学工業株式会社 Curable resin composition and conductive adhesive
CN101123286A (en) * 2006-08-09 2008-02-13 刘胜 LED encapsulation structure and method
JP5000259B2 (en) * 2006-10-18 2012-08-15 株式会社ダイセル Transparent sealing material
JP5070107B2 (en) 2008-03-31 2012-11-07 ナミックス株式会社 Epoxy resin composition
JP2009256400A (en) * 2008-04-11 2009-11-05 Shin Etsu Chem Co Ltd Silicone adhesive for semiconductor element
WO2010038574A1 (en) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 Acrylic dielectric adhesive
JP5562574B2 (en) 2009-04-14 2014-07-30 信越化学工業株式会社 Thermally conductive adhesive
JP4766180B2 (en) * 2009-05-13 2011-09-07 日立化成工業株式会社 Adhesive composition
JP5246880B2 (en) * 2009-09-15 2013-07-24 信越化学工業株式会社 Underfill material composition and optical semiconductor device
JP5621236B2 (en) * 2009-10-05 2014-11-12 日立化成株式会社 Urethane resin composition, cured body, and optical semiconductor device using cured body
JP5544819B2 (en) 2009-10-20 2014-07-09 住友金属鉱山株式会社 Epoxy group-containing adhesive resin composition and optical semiconductor adhesive using the same
JP2011100927A (en) * 2009-11-09 2011-05-19 Sony Chemical & Information Device Corp Bonding agent composition
KR101667000B1 (en) * 2010-05-21 2016-10-17 덴카 주식회사 Composition and adhesive

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US20150060889A1 (en) 2015-03-05
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TW201345994A (en) 2013-11-16
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