[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SG118157A1 - Photosensitive resin composition and printed wiring board - Google Patents

Photosensitive resin composition and printed wiring board

Info

Publication number
SG118157A1
SG118157A1 SG200205544A SG200205544A SG118157A1 SG 118157 A1 SG118157 A1 SG 118157A1 SG 200205544 A SG200205544 A SG 200205544A SG 200205544 A SG200205544 A SG 200205544A SG 118157 A1 SG118157 A1 SG 118157A1
Authority
SG
Singapore
Prior art keywords
resin composition
wiring board
printed wiring
photosensitive resin
photosensitive
Prior art date
Application number
SG200205544A
Inventor
Ono Takao
Miura Ichiro
Hasegawa Yasuyuki
Original Assignee
Tamura Kaken Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Kaken Corp filed Critical Tamura Kaken Corp
Publication of SG118157A1 publication Critical patent/SG118157A1/en

Links

SG200205544A 2001-09-21 2002-09-16 Photosensitive resin composition and printed wiring board SG118157A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20010288818 2001-09-21

Publications (1)

Publication Number Publication Date
SG118157A1 true SG118157A1 (en) 2006-01-27

Family

ID=36118028

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200205544A SG118157A1 (en) 2001-09-21 2002-09-16 Photosensitive resin composition and printed wiring board

Country Status (1)

Country Link
SG (1) SG118157A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115232510A (en) * 2022-08-04 2022-10-25 广东诚展科技股份有限公司 Liquid photosensitive LDI inner-layer ink and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009982A (en) * 1985-04-19 1991-04-23 Taiyo Ink Manufacturing Co., Ltd. Resist ink composition
JPH04165357A (en) * 1990-10-30 1992-06-11 Mitsubishi Kasei Corp Photosensitive resin compound
JPH09160239A (en) * 1995-12-05 1997-06-20 Asahi Chem Res Lab Ltd Soldering resist resin composition
JPH11119429A (en) * 1997-10-20 1999-04-30 Tamura Kaken Co Ltd Photosensitive resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5009982A (en) * 1985-04-19 1991-04-23 Taiyo Ink Manufacturing Co., Ltd. Resist ink composition
US5009982B1 (en) * 1985-04-19 1994-03-15 Taiyo Ink Manufacturing Co.,Ltd. Resist ink composition
JPH04165357A (en) * 1990-10-30 1992-06-11 Mitsubishi Kasei Corp Photosensitive resin compound
JPH09160239A (en) * 1995-12-05 1997-06-20 Asahi Chem Res Lab Ltd Soldering resist resin composition
JPH11119429A (en) * 1997-10-20 1999-04-30 Tamura Kaken Co Ltd Photosensitive resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115232510A (en) * 2022-08-04 2022-10-25 广东诚展科技股份有限公司 Liquid photosensitive LDI inner-layer ink and preparation method thereof

Similar Documents

Publication Publication Date Title
AU2002224832A1 (en) Positive type photosensitive epoxy resin composition and printed circuit board using the same
AU1648701A (en) Resin composition and flexible printed circuit board
HK1058741A1 (en) Flexible printed wiring board
GB9928031D0 (en) Printed wiring board
AU2001271381A1 (en) Vialess printed circuit board
HK1041154B (en) Printed wiring board
HK1048666A1 (en) Printed circuit boards
EP1282010A4 (en) Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board
GB0024401D0 (en) Printed circuit board
AU2002308354A1 (en) Multilayer printed circuit board
IL151278A0 (en) Printed circuit board assembly
GB2361695B (en) Electroconductive composition and printed circuit board using the same
AU2002353536A1 (en) Photosensitive composition and production processes for photosensitive film and printed wiring board
SG118156A1 (en) Photosensitive resin composition and printed wiring board
AU2001230439A1 (en) Printed circuit board
AU2002217554A1 (en) Photosensitive resin composition and printed wiring boards
GB2337862B (en) Printed circuit board
SG91272A1 (en) Printed wiring board
GB2377080B (en) Integrated circuit package and printed circuit board arrangement
AU2001234248A1 (en) Printed circuit board
IL148041A0 (en) Printed circuit board arrangement
GB2343995B (en) Printed wiring board
GB0010730D0 (en) Printed circuit boards
SG118157A1 (en) Photosensitive resin composition and printed wiring board
TW491489U (en) Assemble device for flexible circuit board and printed circuit board