SG10201908263RA - Nonvolatile memory device and operating method of the same - Google Patents
Nonvolatile memory device and operating method of the sameInfo
- Publication number
- SG10201908263RA SG10201908263RA SG10201908263RA SG10201908263RA SG10201908263RA SG 10201908263R A SG10201908263R A SG 10201908263RA SG 10201908263R A SG10201908263R A SG 10201908263RA SG 10201908263R A SG10201908263R A SG 10201908263RA SG 10201908263R A SG10201908263R A SG 10201908263RA
- Authority
- SG
- Singapore
- Prior art keywords
- same
- memory device
- nonvolatile memory
- operating method
- operating
- Prior art date
Links
- 238000011017 operating method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5628—Programming or writing circuits; Data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5621—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge storage in a floating gate
- G11C11/5642—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/56—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
- G11C11/5671—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using charge trapping in an insulator
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0483—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
- G11C16/3404—Convergence or correction of memory cell threshold voltages; Repair or recovery of overerased or overprogrammed cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
- H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
- H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/12—Programming voltage switching circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Read Only Memory (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180124579A KR102631354B1 (en) | 2018-10-18 | 2018-10-18 | Nonvolatile memory device and operating method of the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201908263RA true SG10201908263RA (en) | 2020-05-28 |
Family
ID=70279702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201908263RA SG10201908263RA (en) | 2018-10-18 | 2019-09-06 | Nonvolatile memory device and operating method of the same |
Country Status (4)
Country | Link |
---|---|
US (2) | US10885983B2 (en) |
KR (1) | KR102631354B1 (en) |
CN (1) | CN111081299A (en) |
SG (1) | SG10201908263RA (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11250911B2 (en) | 2018-10-18 | 2022-02-15 | Samsung Electronics Co., Ltd. | Nonvolatile memory device and operating method of the same |
KR102631354B1 (en) * | 2018-10-18 | 2024-01-31 | 삼성전자주식회사 | Nonvolatile memory device and operating method of the same |
US11672126B2 (en) * | 2020-06-18 | 2023-06-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Three-dimensional memory device and manufacturing method thereof |
KR20220056919A (en) | 2020-10-28 | 2022-05-09 | 삼성전자주식회사 | Non-volatile memory device, controller for controlling the ame, storage device having the same, and reading method thereof |
KR20220060572A (en) | 2020-11-04 | 2022-05-12 | 삼성전자주식회사 | Non-volatile memory device, controller for controlling the ame, storage device having the same, and reading method thereof |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9378831B2 (en) * | 2010-02-09 | 2016-06-28 | Samsung Electronics Co., Ltd. | Nonvolatile memory devices, operating methods thereof and memory systems including the same |
KR101691088B1 (en) | 2010-02-17 | 2016-12-29 | 삼성전자주식회사 | Nonvolatile memory device, operating method thereof and memory system including the same |
KR101117589B1 (en) | 2010-02-19 | 2012-02-20 | 서울대학교산학협력단 | Fabrication method of single crystalline silicon stacked array and 3d nand flash memory array using the same |
US8570808B2 (en) * | 2010-08-09 | 2013-10-29 | Samsung Electronics Co., Ltd. | Nonvolatile memory device with 3D memory cell array |
JP2013543266A (en) | 2010-10-18 | 2013-11-28 | アイメック | Vertical semiconductor memory device and manufacturing method thereof |
KR101762828B1 (en) * | 2011-04-05 | 2017-07-31 | 삼성전자주식회사 | Nonvolatile memory device and operating method of nonvolatile memory device |
KR102024850B1 (en) * | 2012-08-08 | 2019-11-05 | 삼성전자주식회사 | Memory system including three dimensional nonvolatile memory device and programming method thereof |
US9305654B2 (en) | 2012-12-19 | 2016-04-05 | Intel Corporation | Erase and soft program for vertical NAND flash |
US8988945B1 (en) | 2013-10-10 | 2015-03-24 | Sandisk Technologies Inc. | Programming time improvement for non-volatile memory |
KR20150059499A (en) * | 2013-11-22 | 2015-06-01 | 에스케이하이닉스 주식회사 | Non-volatile memory device and erase method thereof |
US9343369B2 (en) | 2014-05-19 | 2016-05-17 | Qualcomm Incorporated | Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systems |
JP6084246B2 (en) | 2014-05-21 | 2017-02-22 | マクロニクス インターナショナル カンパニー リミテッド | 3D independent double gate flash memory |
US9397110B2 (en) | 2014-05-21 | 2016-07-19 | Macronix International Co., Ltd. | 3D independent double gate flash memory |
KR102293136B1 (en) | 2014-10-22 | 2021-08-26 | 삼성전자주식회사 | Nonvolatile memory device, storage device having the same, operating method thereof |
US9245642B1 (en) | 2015-03-30 | 2016-01-26 | Sandisk Technologies Inc. | Temperature dependent voltage to unselected drain side select transistor during program of 3D NAND |
KR102398666B1 (en) | 2015-08-19 | 2022-05-16 | 삼성전자주식회사 | Non volatile memory devices and non volatile memory system comprising thereof |
KR20170056072A (en) | 2015-11-12 | 2017-05-23 | 삼성전자주식회사 | Nonvolatile memory device including multi-plane |
KR20170065076A (en) * | 2015-12-02 | 2017-06-13 | 에스케이하이닉스 주식회사 | Memory system and operating method of memory system |
US9711228B1 (en) * | 2016-05-27 | 2017-07-18 | Micron Technology, Inc. | Apparatus and methods of operating memory with erase de-bias |
KR102533016B1 (en) * | 2016-07-28 | 2023-05-17 | 에스케이하이닉스 주식회사 | Memory device and operating method thereof |
KR102631354B1 (en) * | 2018-10-18 | 2024-01-31 | 삼성전자주식회사 | Nonvolatile memory device and operating method of the same |
KR102650996B1 (en) | 2018-11-06 | 2024-03-26 | 삼성전자주식회사 | Semiconductor device |
-
2018
- 2018-10-18 KR KR1020180124579A patent/KR102631354B1/en active IP Right Grant
-
2019
- 2019-06-28 CN CN201910572730.1A patent/CN111081299A/en active Pending
- 2019-07-01 US US16/458,222 patent/US10885983B2/en active Active
- 2019-09-06 SG SG10201908263RA patent/SG10201908263RA/en unknown
-
2020
- 2020-12-07 US US17/113,939 patent/US11164631B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US11164631B2 (en) | 2021-11-02 |
KR20200043769A (en) | 2020-04-28 |
US20200126621A1 (en) | 2020-04-23 |
KR102631354B1 (en) | 2024-01-31 |
CN111081299A (en) | 2020-04-28 |
US10885983B2 (en) | 2021-01-05 |
US20210118509A1 (en) | 2021-04-22 |
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