SG10201607915YA - Cleaning formulations - Google Patents
Cleaning formulationsInfo
- Publication number
- SG10201607915YA SG10201607915YA SG10201607915YA SG10201607915YA SG10201607915YA SG 10201607915Y A SG10201607915Y A SG 10201607915YA SG 10201607915Y A SG10201607915Y A SG 10201607915YA SG 10201607915Y A SG10201607915Y A SG 10201607915YA SG 10201607915Y A SG10201607915Y A SG 10201607915YA
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning formulations
- formulations
- cleaning
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title 1
- 238000009472 formulation Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3245—Aminoacids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/10—Salts
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562222259P | 2015-09-23 | 2015-09-23 | |
US15/264,078 US10233413B2 (en) | 2015-09-23 | 2016-09-13 | Cleaning formulations |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201607915YA true SG10201607915YA (en) | 2017-04-27 |
Family
ID=58276729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201607915YA SG10201607915YA (en) | 2015-09-23 | 2016-09-22 | Cleaning formulations |
Country Status (7)
Country | Link |
---|---|
US (1) | US10233413B2 (en) |
JP (1) | JP6470239B2 (en) |
KR (1) | KR101960351B1 (en) |
CN (2) | CN114940926A (en) |
PH (1) | PH12016000330A1 (en) |
SG (1) | SG10201607915YA (en) |
TW (1) | TWI626305B (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI647337B (en) * | 2015-03-31 | 2019-01-11 | 美商慧盛材料美國責任有限公司 | Cleaning formula |
KR101966808B1 (en) * | 2016-09-30 | 2019-04-08 | 세메스 주식회사 | Anhydrous substrate cleaning compositions, substrate cleaning method and substrate treating apparatus |
US10062560B1 (en) * | 2017-04-26 | 2018-08-28 | Globalfoundries Inc. | Method of cleaning semiconductor device |
US10879076B2 (en) * | 2017-08-25 | 2020-12-29 | Versum Materials Us, Llc | Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/silicon stack during manufacture of a semiconductor device |
US10475654B2 (en) | 2017-08-31 | 2019-11-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wrap-around contact plug and method manufacturing same |
US20190103282A1 (en) * | 2017-09-29 | 2019-04-04 | Versum Materials Us, Llc | Etching Solution for Simultaneously Removing Silicon and Silicon-Germanium Alloy From a Silicon-Germanium/Silicon Stack During Manufacture of a Semiconductor Device |
CN109976108A (en) * | 2017-12-27 | 2019-07-05 | 安集微电子(上海)有限公司 | A kind of cleaning solution for semiconductor |
CN110713868A (en) * | 2018-07-13 | 2020-01-21 | 巴斯夫欧洲公司 | Post etch residue cleaning solution capable of removing titanium nitride |
CN108998267A (en) * | 2018-08-29 | 2018-12-14 | 李少伟 | A kind of semiconductor devices corrosion inhibitor cleaning agent and preparation method |
WO2020195343A1 (en) * | 2019-03-26 | 2020-10-01 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | Cleaning liquid |
EP3986997A4 (en) * | 2019-06-19 | 2023-07-19 | Versum Materials US, LLC | Cleaning composition for semiconductor substrates |
CN111041539B (en) * | 2020-01-02 | 2021-07-30 | 杭州和韵科技有限公司 | Aluminum anode oxidation dyeing pre-double-step surface conditioner and preparation and application thereof |
KR102192954B1 (en) * | 2020-03-26 | 2020-12-18 | 동우 화인켐 주식회사 | Composition for cleaning polymer |
KR102611875B1 (en) * | 2020-09-22 | 2023-12-08 | 주식회사 엘지화학 | Stripper composition for removing photoresist and stripping method of photoresist using the same |
CN113913835A (en) * | 2021-10-20 | 2022-01-11 | 淄博倍尔科新型材料有限公司 | Novel composition for removing large-volume solid stubborn oil stains |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
US6896826B2 (en) | 1997-01-09 | 2005-05-24 | Advanced Technology Materials, Inc. | Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
US6773873B2 (en) | 2002-03-25 | 2004-08-10 | Advanced Technology Materials, Inc. | pH buffered compositions useful for cleaning residue from semiconductor substrates |
WO2004094581A1 (en) | 2003-04-18 | 2004-11-04 | Ekc Technology, Inc. | Aqueous fluoride compositions for cleaning semiconductor devices |
US20050205835A1 (en) * | 2004-03-19 | 2005-09-22 | Tamboli Dnyanesh C | Alkaline post-chemical mechanical planarization cleaning compositions |
CN100549236C (en) * | 2004-04-09 | 2009-10-14 | 上海月旭半导体科技有限公司 | Scavenging solution behind the semi-conductor chip cmp |
CN101366107B (en) * | 2005-10-05 | 2011-08-24 | 高级技术材料公司 | Oxidizing aqueous cleaner for the removal of post-etch residues |
TWI513799B (en) * | 2005-11-09 | 2015-12-21 | Entegris Inc | Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon |
KR101833158B1 (en) | 2007-05-17 | 2018-02-27 | 엔테그리스, 아이엔씨. | New antioxidants for post-cmp cleaning formulations |
JP5086893B2 (en) | 2008-05-26 | 2012-11-28 | 花王株式会社 | Cleaning solution for semiconductor device substrates |
US8361237B2 (en) * | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
US8877640B2 (en) | 2010-07-06 | 2014-11-04 | United Microelectronics Corporation | Cleaning solution and damascene process using the same |
KR20120078607A (en) * | 2010-12-31 | 2012-07-10 | 제일모직주식회사 | Cleaning composition for semiconductor device and cleaning method of semiconductor device using the same |
US8889609B2 (en) * | 2011-03-16 | 2014-11-18 | Air Products And Chemicals, Inc. | Cleaning formulations and method of using the cleaning formulations |
US9224643B2 (en) | 2011-09-19 | 2015-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for tunable interconnect scheme |
SG11201400840UA (en) * | 2011-10-05 | 2014-04-28 | Avantor Performance Mat Inc | Microelectronic substrate cleaning compositions having copper/azole polymer inhibition |
CN102533470A (en) | 2011-12-29 | 2012-07-04 | 镇江市港南电子有限公司 | Silicon wafer cleaning liquid |
KR20140013310A (en) * | 2012-07-23 | 2014-02-05 | 삼성디스플레이 주식회사 | Etchant and manufacturing method of metal wiring and thin film transistor array panel using the same |
CN103668206A (en) * | 2012-09-19 | 2014-03-26 | 东友精细化工有限公司 | Etching solution combination for copper/titanium layers |
US9536730B2 (en) * | 2012-10-23 | 2017-01-03 | Air Products And Chemicals, Inc. | Cleaning formulations |
KR20140092077A (en) * | 2013-01-15 | 2014-07-23 | 주식회사 코원이노텍 | Cleaner Composition for Process of manufacturing Semicondunctor and Display |
US9957469B2 (en) * | 2014-07-14 | 2018-05-01 | Versum Materials Us, Llc | Copper corrosion inhibition system |
-
2016
- 2016-09-13 US US15/264,078 patent/US10233413B2/en active Active
- 2016-09-22 TW TW105130675A patent/TWI626305B/en active
- 2016-09-22 PH PH12016000330A patent/PH12016000330A1/en unknown
- 2016-09-22 SG SG10201607915YA patent/SG10201607915YA/en unknown
- 2016-09-23 CN CN202210709283.1A patent/CN114940926A/en active Pending
- 2016-09-23 KR KR1020160122407A patent/KR101960351B1/en active IP Right Grant
- 2016-09-23 JP JP2016185676A patent/JP6470239B2/en not_active Expired - Fee Related
- 2016-09-23 CN CN201610847724.9A patent/CN106547178A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US10233413B2 (en) | 2019-03-19 |
CN106547178A (en) | 2017-03-29 |
US20170081622A1 (en) | 2017-03-23 |
PH12016000330A1 (en) | 2018-03-26 |
JP2017071766A (en) | 2017-04-13 |
TW201712110A (en) | 2017-04-01 |
JP6470239B2 (en) | 2019-02-13 |
CN114940926A (en) | 2022-08-26 |
KR101960351B1 (en) | 2019-03-20 |
TWI626305B (en) | 2018-06-11 |
KR20170039575A (en) | 2017-04-11 |
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