[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SG10201502625RA - Measuring Method, Stage Apparatus, And Exposure Apparatus - Google Patents

Measuring Method, Stage Apparatus, And Exposure Apparatus

Info

Publication number
SG10201502625RA
SG10201502625RA SG10201502625RA SG10201502625RA SG10201502625RA SG 10201502625R A SG10201502625R A SG 10201502625RA SG 10201502625R A SG10201502625R A SG 10201502625RA SG 10201502625R A SG10201502625R A SG 10201502625RA SG 10201502625R A SG10201502625R A SG 10201502625RA
Authority
SG
Singapore
Prior art keywords
measuring method
stage
exposure apparatus
exposure
stage apparatus
Prior art date
Application number
SG10201502625RA
Inventor
Dai Arai
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of SG10201502625RA publication Critical patent/SG10201502625RA/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/7015Details of optical elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • G03F7/70725Stages control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709Vibration, e.g. vibration detection, compensation, suppression or isolation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Optical Transform (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
SG10201502625RA 2007-07-18 2008-07-16 Measuring Method, Stage Apparatus, And Exposure Apparatus SG10201502625RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007187649 2007-07-18

Publications (1)

Publication Number Publication Date
SG10201502625RA true SG10201502625RA (en) 2015-05-28

Family

ID=40259688

Family Applications (3)

Application Number Title Priority Date Filing Date
SG2011073137A SG175598A1 (en) 2007-07-18 2008-07-16 Measuring method, stage apparatus, and exposure apparatus
SG10201502625RA SG10201502625RA (en) 2007-07-18 2008-07-16 Measuring Method, Stage Apparatus, And Exposure Apparatus
SG2012053211A SG183050A1 (en) 2007-07-18 2008-07-16 Measuring method, stage apparatus, and exposure apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2011073137A SG175598A1 (en) 2007-07-18 2008-07-16 Measuring method, stage apparatus, and exposure apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012053211A SG183050A1 (en) 2007-07-18 2008-07-16 Measuring method, stage apparatus, and exposure apparatus

Country Status (9)

Country Link
US (5) US9316917B2 (en)
EP (7) EP2177867B1 (en)
JP (8) JPWO2009011356A1 (en)
KR (8) KR101614666B1 (en)
CN (7) CN105487351A (en)
HK (10) HK1201945A1 (en)
SG (3) SG175598A1 (en)
TW (7) TWI497218B (en)
WO (1) WO2009011356A1 (en)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009026862A (en) * 2007-07-18 2009-02-05 Canon Inc Optical element positioning system, projection optical system, and exposure apparatus
KR101614666B1 (en) * 2007-07-18 2016-04-21 가부시키가이샤 니콘 Measurement method, stage apparatus, and exposure apparatus
JP2009036637A (en) * 2007-08-01 2009-02-19 Sony Corp Displacement measuring device
US8760629B2 (en) * 2008-12-19 2014-06-24 Nikon Corporation Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body
US8493547B2 (en) * 2009-08-25 2013-07-23 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
EP2299472B1 (en) * 2009-09-22 2020-07-08 EV Group E. Thallner GmbH Device for aligning two substrates
NL2006913A (en) * 2010-07-16 2012-01-17 Asml Netherlands Bv Lithographic apparatus and method.
NL2007155A (en) * 2010-08-25 2012-02-28 Asml Netherlands Bv Stage apparatus, lithographic apparatus and method of positioning an object table.
JP4846051B1 (en) * 2010-11-05 2011-12-28 株式会社ナナオ Sensor unit operating mechanism and liquid crystal display device including the sensor unit operating mechanism
NL2008272A (en) * 2011-03-09 2012-09-11 Asml Netherlands Bv Lithographic apparatus.
DE102011005885A1 (en) 2011-03-22 2012-09-27 Carl Zeiss Smt Gmbh lithography apparatus
NL2008980A (en) 2011-07-11 2013-01-14 Asml Netherlands Bv A fluid handling structure, a lithographic apparatus and a device manufacturing method.
TWI467126B (en) * 2011-11-09 2015-01-01 Zygo Corp Thermally stable optical sensor mount
WO2013100061A1 (en) * 2011-12-28 2013-07-04 株式会社ニコン Encoder, production method for encoder scale, production method for encoder, and drive device
JP6093965B2 (en) 2012-02-17 2017-03-15 株式会社ミツトヨ Photoelectric encoder
JP6251559B2 (en) * 2013-02-28 2017-12-20 株式会社ニューフレアテクノロジー Sample support device
CN105593644B (en) * 2013-10-02 2018-11-13 株式会社尼康 Scale for encoder, encoder, driving device and bearing table device
DE112014005893B4 (en) * 2013-12-21 2023-02-16 Kla-Tencor Corporation A method of measuring positions of structures on a mask and thereby determining errors in the manufacture of masks
JP2016043453A (en) * 2014-08-25 2016-04-04 株式会社ディスコ Processing device
NL2015639A (en) 2014-11-28 2016-09-20 Asml Netherlands Bv Encoder, position measurement system and lithographic apparatus.
EP3264030B1 (en) * 2015-02-23 2020-07-22 Nikon Corporation Measurement device, lithography system and exposure device, and device manufacturing method
TWI768409B (en) 2015-02-23 2022-06-21 日商尼康股份有限公司 Substrate processing system and substrate processing method, and device manufacturing method
CN107250915B (en) 2015-02-23 2020-03-13 株式会社尼康 Measuring apparatus, lithography system, exposure apparatus, management method, overlay measuring method, and device manufacturing method
US10191393B2 (en) 2015-03-23 2019-01-29 Asml Netherlands B.V. Lithographic apparatus, and device manufacturing method
JP6738542B2 (en) * 2015-03-31 2020-08-12 株式会社ニコン Exposure apparatus, flat panel display manufacturing method, device manufacturing method, and exposure method
US9630836B2 (en) 2015-09-30 2017-04-25 Mems Drive, Inc. Simplified MEMS device fabrication process
CN108139678B (en) * 2015-09-30 2022-03-15 株式会社尼康 Exposure apparatus, method for manufacturing flat panel display, and method for manufacturing device
US9617142B1 (en) * 2015-09-30 2017-04-11 Mems Drive, Inc. MEMS grid for manipulating structural parameters of MEMS devices
CN109791364B (en) * 2016-09-30 2021-04-27 株式会社尼康 Movable body apparatus, moving method, exposure apparatus, exposure method, flat panel display manufacturing method, and device manufacturing method
WO2018065157A1 (en) * 2016-10-04 2018-04-12 Asml Netherlands B.V. Athermalization of an alignment system
WO2018074306A1 (en) * 2016-10-17 2018-04-26 株式会社ニコン Exposure system and lithography system
KR102291903B1 (en) 2017-02-03 2021-08-24 에이에스엠엘 네델란즈 비.브이. exposure device
CN110268332A (en) * 2017-02-10 2019-09-20 Asml荷兰有限公司 Lithographic equipment and device making method
US10600614B2 (en) * 2017-09-29 2020-03-24 Hitachi High-Technologies Corporation Stage device and charged particle beam device
DE102017217967A1 (en) * 2017-10-09 2019-04-11 Sieb & Meyer Ag Method for determining positional errors of holes and securing the drilling process
JP6493481B2 (en) * 2017-10-18 2019-04-03 株式会社ニコン Exposure apparatus and device manufacturing method
CN108010873B (en) * 2017-12-29 2024-04-19 无锡固电半导体股份有限公司 Automatic wafer expanding machine
TWI725875B (en) * 2018-01-16 2021-04-21 美商伊路米納有限公司 Structured illumination imaging system and method of creating a high-resolution image using structured light
JP7051455B2 (en) * 2018-01-16 2022-04-11 キオクシア株式会社 Manufacturing method of pattern forming device and semiconductor device
US10281268B1 (en) 2018-04-20 2019-05-07 Seagate Technology Llc Automated and accurate high-throughput slider-level flatness inspection
JP7056411B2 (en) * 2018-06-29 2022-04-19 株式会社リコー Reading device and modeling device
CN112703451A (en) * 2018-09-12 2021-04-23 西默有限公司 Measurement of body for gas discharge station
CN111380464B (en) * 2018-12-28 2021-05-07 上海微电子装备(集团)股份有限公司 Installation device and installation method of grating ruler, grating measurement system and photoetching machine
JP2020112605A (en) * 2019-01-08 2020-07-27 キヤノン株式会社 Exposure apparatus and control method of the same, and method for manufacturing article
US11450552B2 (en) * 2019-08-01 2022-09-20 Micron Technology, Inc. Methods and apparatus for adjusting surface topography of a substrate support apparatus
CN110931412B (en) * 2019-10-15 2024-02-06 北京烁科中科信电子装备有限公司 High-precision and high-efficiency silicon wafer orientation device
CN111272089B (en) * 2020-03-03 2022-06-28 中国科学院光电技术研究所 In-situ gap detection device and detection method
CN111550955A (en) * 2020-04-29 2020-08-18 合肥芯碁微电子装备股份有限公司 Temperature monitoring system
US11244474B1 (en) * 2020-10-01 2022-02-08 Kla Corporation Sample positioning system and method
CN114351247B (en) * 2022-01-12 2023-06-27 苏州天准科技股份有限公司 Crystal pulling shaking monitoring method, storage medium, terminal and crystal pulling equipment

Family Cites Families (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4780617A (en) 1984-08-09 1988-10-25 Nippon Kogaku K.K. Method for successive alignment of chip patterns on a substrate
JPS6144429A (en) 1984-08-09 1986-03-04 Nippon Kogaku Kk <Nikon> Alignment method
JPH04211202A (en) 1990-03-19 1992-08-03 Canon Inc Reflection type diffraction grating and device by use of same deffraction grating
DE4033556A1 (en) 1990-10-22 1992-04-23 Suess Kg Karl MEASURING ARRANGEMENT FOR X, Y, (PHI) COORDINATE TABLES
JPH05129184A (en) * 1991-10-30 1993-05-25 Canon Inc Projection aligner
US5469260A (en) * 1992-04-01 1995-11-21 Nikon Corporation Stage-position measuring apparatus
JP3089802B2 (en) 1992-04-01 2000-09-18 株式会社ニコン Stage position measuring apparatus, projection exposure apparatus and projection exposure method
JP2629109B2 (en) 1992-04-08 1997-07-09 新日本製鐵株式会社 Cutting device in waste melting furnace charging device
KR100300618B1 (en) 1992-12-25 2001-11-22 오노 시게오 EXPOSURE METHOD, EXPOSURE DEVICE, AND DEVICE MANUFACTURING METHOD USING THE DEVICE
JP3316833B2 (en) 1993-03-26 2002-08-19 株式会社ニコン Scanning exposure method, surface position setting device, scanning type exposure device, and device manufacturing method using the method
US6753948B2 (en) 1993-04-27 2004-06-22 Nikon Corporation Scanning exposure method and apparatus
JP3375076B2 (en) 1993-04-27 2003-02-10 株式会社ニコン Projection exposure method and apparatus, and element manufacturing method
JPH07270122A (en) * 1994-03-30 1995-10-20 Canon Inc Displacement detection device, aligner provided with said displacement detection device and manufacture of device
JPH07335529A (en) * 1994-06-09 1995-12-22 Nikon Corp Projection exposing device
US6018384A (en) 1994-09-07 2000-01-25 Nikon Corporation Projection exposure system
JP3379238B2 (en) 1994-09-08 2003-02-24 株式会社ニコン Scanning exposure equipment
US5552888A (en) * 1994-12-02 1996-09-03 Nikon Precision, Inc. Apparatus for measuring position of an X-Y stage
JP3387075B2 (en) 1994-12-12 2003-03-17 株式会社ニコン Scanning exposure method, exposure apparatus, and scanning exposure apparatus
JPH08178694A (en) * 1994-12-27 1996-07-12 Canon Inc Scale for displacement sensor
US5877843A (en) 1995-09-12 1999-03-02 Nikon Corporation Exposure apparatus
US5806193A (en) * 1995-11-09 1998-09-15 Nikon Corporation Tilt and movement apparatus using flexure and air cylinder
US6069416A (en) 1996-06-24 2000-05-30 Anorad Corporation Two-axis motor platen and method for making
US5825043A (en) 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
JPH11274029A (en) 1998-03-19 1999-10-08 Asahi Kasei Micro Syst Co Ltd Scanning stepper
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
JP3554186B2 (en) * 1998-04-08 2004-08-18 キヤノン株式会社 Exposure apparatus, device manufacturing method, and reaction force receiving method
JP3413122B2 (en) * 1998-05-21 2003-06-03 キヤノン株式会社 Positioning apparatus, exposure apparatus using the same, and device manufacturing method
JP3302926B2 (en) * 1998-07-02 2002-07-15 株式会社東芝 Inspection method for exposure equipment
US6496528B2 (en) * 1999-09-03 2002-12-17 Cymer, Inc. Line narrowing unit with flexural grating mount
JP2001102279A (en) 1999-09-27 2001-04-13 Nikon Corp Stage device and aligner
JP2001126977A (en) 1999-10-27 2001-05-11 Nikon Corp Stage system, aligner, and processing method for circuit device
CN2421670Y (en) * 1999-11-30 2001-02-28 中国科学院光电技术研究所 Optical pre-alignment device of submicron photoetching machine
US6480008B2 (en) * 1999-12-03 2002-11-12 Mitutoyo Corporation Capacitive distance sensor for surface configuration determining apparatus
JP3406889B2 (en) 1999-12-03 2003-05-19 株式会社ミツトヨ Distance measuring device
TW546699B (en) * 2000-02-25 2003-08-11 Nikon Corp Exposure apparatus and exposure method capable of controlling illumination distribution
JP2001313250A (en) 2000-02-25 2001-11-09 Nikon Corp Aligner, its adjusting method, and method for fabricating device using aligner
US20020041377A1 (en) 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method
JP2002014005A (en) 2000-04-25 2002-01-18 Nikon Corp Measuring method of spatial image, measuring method of imaging characteristic, measuring device for spatial image, and exposuring device
US7561270B2 (en) * 2000-08-24 2009-07-14 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
US6958808B2 (en) 2000-11-16 2005-10-25 Nikon Corporation System and method for resetting a reaction mass assembly of a stage assembly
JP3762307B2 (en) * 2001-02-15 2006-04-05 キヤノン株式会社 Exposure apparatus including laser interferometer system
US6564752B2 (en) 2001-07-06 2003-05-20 Wallace H. Jerome Poultry coop unloader, and methods
US6801301B2 (en) * 2001-10-12 2004-10-05 Canon Kabushiki Kaisha Exposure apparatus
JP3890233B2 (en) * 2002-01-07 2007-03-07 キヤノン株式会社 Positioning stage apparatus, exposure apparatus, and semiconductor device manufacturing method
CN1279403C (en) * 2002-02-06 2006-10-11 Asml荷兰有限公司 Method for producing photoetching equipment and device
EP1420298B1 (en) 2002-11-12 2013-02-20 ASML Netherlands B.V. Lithographic apparatus
KR20050085235A (en) * 2002-12-10 2005-08-29 가부시키가이샤 니콘 Exposure system and device producing method
WO2004053956A1 (en) 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus, exposure method and method for manufacturing device
TW586139B (en) 2003-03-17 2004-05-01 Taiwan Semiconductor Mfg Dynamic flow pattern controller for uniformity control and the method thereof
US6757113B1 (en) * 2003-03-18 2004-06-29 Lucent Technologies Inc. Optical grating mount
WO2004109357A1 (en) * 2003-06-06 2004-12-16 Nikon Corporation Optical element holding device, lens barrel, exposing device, and device producing method
JP4164414B2 (en) * 2003-06-19 2008-10-15 キヤノン株式会社 Stage equipment
JP3862678B2 (en) * 2003-06-27 2006-12-27 キヤノン株式会社 Exposure apparatus and device manufacturing method
ATE489724T1 (en) * 2003-07-09 2010-12-15 Nikon Corp EXPOSURE DEVICE AND METHOD FOR PRODUCING COMPONENTS
JP2005234359A (en) * 2004-02-20 2005-09-02 Ricoh Co Ltd Optical characteristic measuring apparatus of scanning optical system, method of calibrating optical characteristic measuring apparatus of scanning optical system, scanning optical system and image forming apparatus
TWI606485B (en) * 2004-03-25 2017-11-21 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
TW200605191A (en) * 2004-03-30 2006-02-01 Nikon Corp Exposure apparatus, exposure method, device manufacturing method, and surface shape detecting device
US7898642B2 (en) 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8520184B2 (en) 2004-06-09 2013-08-27 Nikon Corporation Immersion exposure apparatus and device manufacturing method with measuring device
US7256871B2 (en) 2004-07-27 2007-08-14 Asml Netherlands B.V. Lithographic apparatus and method for calibrating the same
US8675174B2 (en) * 2004-09-17 2014-03-18 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
JP4656448B2 (en) 2004-09-30 2011-03-23 株式会社ニコン Projection optical apparatus and exposure apparatus
US20090213357A1 (en) * 2004-10-08 2009-08-27 Dai Arai Exposure apparatus and device manufacturing method
TWI649790B (en) * 2004-11-18 2019-02-01 日商尼康股份有限公司 Position measurement method, position control method, measurement method, loading method, exposure method and exposure device, and element manufacturing method
JP2006269940A (en) 2005-03-25 2006-10-05 Canon Inc Exposure device and exposure method
US20090047607A1 (en) * 2005-03-31 2009-02-19 Hiroyuki Nagasaka Exposure method, exposure apparatus and device fabricating methods
US7161659B2 (en) * 2005-04-08 2007-01-09 Asml Netherlands B.V. Dual stage lithographic apparatus and device manufacturing method
US7515281B2 (en) * 2005-04-08 2009-04-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4410216B2 (en) 2005-05-24 2010-02-03 エーエスエムエル ネザーランズ ビー.ブイ. Two-stage lithography apparatus and device manufacturing method
JP4868113B2 (en) * 2005-06-27 2012-02-01 株式会社ニコン Support apparatus, stage apparatus, and exposure apparatus
JP2007019225A (en) * 2005-07-07 2007-01-25 Nikon Corp Reflective member structure of position measuring device, stage device and exposure device
US7348574B2 (en) * 2005-09-02 2008-03-25 Asml Netherlands, B.V. Position measurement system and lithographic apparatus
KR100869306B1 (en) * 2005-09-13 2008-11-18 에이에스엠엘 네델란즈 비.브이. Lithographic apparatus and device manufacturing method
US7362446B2 (en) * 2005-09-15 2008-04-22 Asml Netherlands B.V. Position measurement unit, measurement system and lithographic apparatus comprising such position measurement unit
JP2007115758A (en) * 2005-10-18 2007-05-10 Nikon Corp Exposure method and exposure apparatus
JP2007113939A (en) * 2005-10-18 2007-05-10 Nikon Corp Measuring device and method therefor, stage device, and exposure device and method therefor
JP2007123332A (en) * 2005-10-25 2007-05-17 Nikon Corp Stage device, exposure device and manufacturing method of device
JP4800901B2 (en) 2005-12-12 2011-10-26 矢崎総業株式会社 Voltage detection device and insulation interface
JP4715505B2 (en) 2005-12-26 2011-07-06 株式会社ニコン Exposure apparatus and device manufacturing method
TWI457977B (en) * 2005-12-28 2014-10-21 尼康股份有限公司 A pattern forming method and a pattern forming apparatus, and an element manufacturing method
JP5169221B2 (en) * 2005-12-28 2013-03-27 株式会社ニコン Exposure apparatus and manufacturing method thereof
US7483120B2 (en) * 2006-05-09 2009-01-27 Asml Netherlands B.V. Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method
WO2007129753A1 (en) * 2006-05-10 2007-11-15 Nikon Corporation Exposure apparatus and device manufacturing method
US20080158531A1 (en) * 2006-11-15 2008-07-03 Nikon Corporation Exposure apparatus, exposure method, and method for producing device
US7903866B2 (en) * 2007-03-29 2011-03-08 Asml Netherlands B.V. Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object
US7804579B2 (en) * 2007-06-21 2010-09-28 Asml Netherlands B.V. Control system, lithographic projection apparatus, method of controlling a support structure, and a computer program product
KR101614666B1 (en) * 2007-07-18 2016-04-21 가부시키가이샤 니콘 Measurement method, stage apparatus, and exposure apparatus
DE102007046927A1 (en) 2007-09-28 2009-04-02 Carl Zeiss Smt Ag Calibration of a position measuring device of an optical device

Also Published As

Publication number Publication date
CN105301918B (en) 2018-02-16
KR101538246B1 (en) 2015-07-20
KR20150024894A (en) 2015-03-09
CN104111589A (en) 2014-10-22
US20090231561A1 (en) 2009-09-17
KR101923356B1 (en) 2018-11-28
WO2009011356A1 (en) 2009-01-22
JPWO2009011356A1 (en) 2010-09-24
US20180011410A1 (en) 2018-01-11
KR20180030261A (en) 2018-03-21
EP2818926A3 (en) 2015-03-11
EP3447582A1 (en) 2019-02-27
JP2012181196A (en) 2012-09-20
KR20130088195A (en) 2013-08-07
KR20150121256A (en) 2015-10-28
EP2177867A1 (en) 2010-04-21
KR101538245B1 (en) 2015-07-20
TWI579655B (en) 2017-04-21
TWI497234B (en) 2015-08-21
KR101614666B1 (en) 2016-04-21
KR101706884B1 (en) 2017-02-14
EP2933683B1 (en) 2016-08-24
JP5787001B2 (en) 2015-09-30
HK1143632A1 (en) 2011-01-07
EP2818926A2 (en) 2014-12-31
KR20130088196A (en) 2013-08-07
JP2016136268A (en) 2016-07-28
CN105652603A (en) 2016-06-08
SG175598A1 (en) 2011-11-28
US9316917B2 (en) 2016-04-19
HK1204093A1 (en) 2015-11-06
EP2177867A4 (en) 2015-03-18
JP6274235B2 (en) 2018-02-07
TW200912557A (en) 2009-03-16
TWI610148B (en) 2018-01-01
JP2018063446A (en) 2018-04-19
CN104111588B (en) 2016-08-03
KR20170018111A (en) 2017-02-15
JP5655893B2 (en) 2015-01-21
TW201346459A (en) 2013-11-16
US9372410B2 (en) 2016-06-21
CN104111587B (en) 2017-01-11
JP6128172B2 (en) 2017-05-17
KR20180126088A (en) 2018-11-26
KR101488048B1 (en) 2015-01-29
SG183050A1 (en) 2012-08-30
EP2177867B1 (en) 2016-04-20
CN104111588A (en) 2014-10-22
CN105301918A (en) 2016-02-03
TW201535073A (en) 2015-09-16
CN105487351A (en) 2016-04-13
KR101843699B1 (en) 2018-03-29
CN105652603B (en) 2018-07-27
EP3056945A1 (en) 2016-08-17
JP5900666B2 (en) 2016-04-06
JP5655809B2 (en) 2015-01-21
JP2014195093A (en) 2014-10-09
EP2818927A3 (en) 2015-03-11
EP2818927B1 (en) 2016-04-27
JP2016014881A (en) 2016-01-28
KR20100059799A (en) 2010-06-04
US20160209764A1 (en) 2016-07-21
TW201723679A (en) 2017-07-01
TWI641924B (en) 2018-11-21
HK1222716A1 (en) 2017-07-07
EP3246755A1 (en) 2017-11-22
JP2013219377A (en) 2013-10-24
JP6555334B2 (en) 2019-08-07
US20130308109A1 (en) 2013-11-21
EP3246755B1 (en) 2018-12-12
CN101755188A (en) 2010-06-23
HK1220515A1 (en) 2017-05-05
US20130308108A1 (en) 2013-11-21
EP2933683A1 (en) 2015-10-21
EP2818926B1 (en) 2016-04-27
EP3056945B1 (en) 2017-08-23
TWI498683B (en) 2015-09-01
TWI497218B (en) 2015-08-21
EP2818927A2 (en) 2014-12-31
TW201809912A (en) 2018-03-16
US9804506B2 (en) 2017-10-31
CN104111587A (en) 2014-10-22
TW201843537A (en) 2018-12-16
HK1214002A1 (en) 2016-07-15
HK1201944A1 (en) 2015-09-11
JP2015119187A (en) 2015-06-25
HK1201945A1 (en) 2015-09-11
HK1204094A1 (en) 2015-11-06
HK1201943A1 (en) 2015-09-11
TW201346458A (en) 2013-11-16
HK1220514A1 (en) 2017-05-05

Similar Documents

Publication Publication Date Title
HK1204093A1 (en) Measurement method, stage apparatus, and exposure apparatus
HK1252345A1 (en) Exposure apparatus and exposure method
HK1248325B (en) Exposure apparatus, exposure method, and device manufacturing method
HK1247995A1 (en) Exposure apparatus, exposure method and device manufacturing method
HK1244893A1 (en) Exposure apparatus and method, and device manufacturing method
HK1243498A1 (en) Exposure apparatus, exposure method and device manufacturing method
HK1243499A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1218186A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1218675A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1169861A1 (en) Exposure apparatus, exposure method and device manufacturing method
HK1136878A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1181124A1 (en) Exposure apparatus, exposure method, and device manufacturing method
IL210126A0 (en) Overlay measurement apparatus, lithographic apparatus, and device manufacturing method using such overlay measurement apparatus
GB0703423D0 (en) Calibration method and apparatus
HK1155821A1 (en) Exposure apparatus, exposure method, and device manufacturing method
HK1150888A1 (en) Exposure apparatus, exposure method, and device manufacturing method
EP2109133A4 (en) Stage apparatus, exposure apparatus and device manufacturing method
HK1137077A1 (en) Exposure apparatus, exposure method and device manufacturing method
GB0719460D0 (en) Measurement apparatus and method
HK1182184A1 (en) Exposure method, exposure apparatus, and method for producing device
GB0709041D0 (en) Calibration method and apparatus
GB2453745B (en) Testing apparatus and method