[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SG10201407704TA - Device and method for inspecting moving semiconductor wafers - Google Patents

Device and method for inspecting moving semiconductor wafers

Info

Publication number
SG10201407704TA
SG10201407704TA SG10201407704TA SG10201407704TA SG10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA SG 10201407704T A SG10201407704T A SG 10201407704TA
Authority
SG
Singapore
Prior art keywords
semiconductor wafers
detecting
inspecting
wafer
moving semiconductor
Prior art date
Application number
SG10201407704TA
Inventor
Philippe Gastaldo
Frédéric Pernot
Olivier Piffard
Original Assignee
Altatech Semiconductor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altatech Semiconductor filed Critical Altatech Semiconductor
Publication of SG10201407704TA publication Critical patent/SG10201407704TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

DEVICE AND METHOD FOR INSPECTING MOVING SEMICONDUCTOR WAFERS Device for inspecting defects in semiconductor wafers, comprising a member for detecting surface defects using variations in the slope of a surface of the wafer, a member for detecting surface defects using variations in the light intensity reflected by a surface of the wafer, at a plurality of points, a member for detecting light intensity scattered by the surface of the wafer, a light source, and a detecting and classifying mechanism connected upstream of said detecting members. FIG. 1
SG10201407704TA 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers SG10201407704TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1001958A FR2959864B1 (en) 2010-05-06 2010-05-06 DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR MOVING PLATELETS.

Publications (1)

Publication Number Publication Date
SG10201407704TA true SG10201407704TA (en) 2014-12-30

Family

ID=43086412

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201407704TA SG10201407704TA (en) 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers
SG2012077640A SG184943A1 (en) 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012077640A SG184943A1 (en) 2010-05-06 2011-05-04 Device and method for inspecting moving semiconductor wafers

Country Status (6)

Country Link
US (1) US8817249B2 (en)
JP (1) JP5840677B2 (en)
FR (1) FR2959864B1 (en)
IL (1) IL222480A (en)
SG (2) SG10201407704TA (en)
WO (1) WO2011138524A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9491412B2 (en) * 2012-09-13 2016-11-08 General Electric Technology Gmbh Method and system for determining quality of tubes
KR20140122608A (en) * 2013-04-10 2014-10-20 삼성전자주식회사 Apparatus and method for extracting depth information of defect, and method for improving semiconductor process using the depth information of defect
KR102161160B1 (en) 2013-10-31 2020-09-29 삼성전자주식회사 Method of inspecting a surface of a substrate and apparatus for performing the same
CN104458764B (en) * 2014-12-14 2017-03-22 中国科学技术大学 Curved uneven surface defect identification method based on large-field-depth stripped image projection
JP6617050B2 (en) * 2016-02-22 2019-12-04 東京エレクトロン株式会社 Substrate imaging device
CN108155110B (en) * 2016-12-05 2019-12-31 上海新昇半导体科技有限公司 Wafer surface flatness measuring system
US10872794B2 (en) * 2017-06-20 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic in-line inspection system
JP7135297B2 (en) * 2017-10-27 2022-09-13 株式会社ニコン Inspection device, inspection system, and inspection method
DE102017129356B3 (en) * 2017-12-08 2019-03-07 Infineon Technologies Ag INSPECTION PROCEDURE FOR SEMICONDUCTOR SUBSTRATES USING TILTING DATA AND INSPECTION DEVICE
CN108226187A (en) * 2017-12-28 2018-06-29 南京联信自动化科技有限公司 A kind of detection device of planar surface pad pasting
CN108288288B (en) * 2018-01-16 2021-09-10 华东交通大学 Method, device and system for measuring precision shaft dimension based on visual identification
US10684563B2 (en) 2018-01-22 2020-06-16 Kla-Tencor Corporation On the fly target acquisition
WO2019143371A1 (en) * 2018-01-22 2019-07-25 Kla-Tencor Corporation On the fly target acquisition
US10937705B2 (en) * 2018-03-30 2021-03-02 Onto Innovation Inc. Sample inspection using topography
CN111238392B (en) * 2018-11-28 2021-11-02 Oppo（重庆）智能科技有限公司 Carrier and detection device of electronic equipment
US11776859B2 (en) 2018-12-19 2023-10-03 Kla Corporation Care area based swath speed for throughput and sensitivity improvement
CN111640085B (en) * 2019-02-14 2023-08-29 深圳中科飞测科技股份有限公司 Image processing method and apparatus, detection method and apparatus, and storage medium
TWI718594B (en) * 2019-07-19 2021-02-11 和淞科技股份有限公司 Wafer inspection machine and wafer inspection method
CN110617771B (en) * 2019-10-18 2024-07-12 杭州中为光电技术有限公司 Device for automatically detecting thickness of sapphire wafer
KR102453258B1 (en) * 2020-01-15 2022-10-11 주식회사 커미조아 Apparatus and Method for Detecting of Awafer Edge
CN111156931A (en) * 2020-02-25 2020-05-15 成都威博恩科技有限公司 High-precision flatness detection device and method
WO2021202029A1 (en) * 2020-04-02 2021-10-07 Applied Materials, Inc. Inspection system
CN112040123B (en) * 2020-08-26 2021-09-28 浙江中烟工业有限责任公司 Automatic all-round collection system of piece cigarette package vision of angle regulation
US11686690B2 (en) * 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
CN112304957A (en) * 2020-11-20 2021-02-02 天津朗硕机器人科技有限公司 Machine vision-based intelligent detection method and system for appearance defects
CN112730460A (en) * 2020-12-08 2021-04-30 北京航天云路有限公司 Welding defect and intensive rosin joint detection technology for communication IC chip
CN113092500A (en) * 2021-03-30 2021-07-09 福建晶安光电有限公司 Device for detecting substrate and using method thereof
CN113720853B (en) * 2021-09-07 2024-06-25 中国烟草总公司郑州烟草研究院 Continuous cigar appearance rapid detection device with relay between belts
CN115078402B (en) * 2022-06-15 2025-02-11 西安奕斯伟材料科技股份有限公司 System for detecting silicon wafer
CN116913797B (en) * 2023-07-14 2024-02-13 无锡九霄科技有限公司 Wafer bonding quality detection device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06100555B2 (en) * 1990-12-19 1994-12-12 東洋ガラス株式会社 Defect inspection method and device for transparent object
US5416594A (en) * 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
US5734742A (en) * 1994-09-19 1998-03-31 Nissan Motor Co., Ltd. Inspection system and process
US6288780B1 (en) 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
US6512631B2 (en) 1996-07-22 2003-01-28 Kla-Tencor Corporation Broad-band deep ultraviolet/vacuum ultraviolet catadioptric imaging system
JPH1056046A (en) 1996-08-08 1998-02-24 Nikon Corp Wafer inspecting device
JP4147682B2 (en) * 1998-04-27 2008-09-10 旭硝子株式会社 Defect inspection method and inspection apparatus for test object
US7061601B2 (en) 1999-07-02 2006-06-13 Kla-Tencor Technologies Corporation System and method for double sided optical inspection of thin film disks or wafers
US6870611B2 (en) * 2001-07-26 2005-03-22 Orbotech Ltd. Electrical circuit conductor inspection
US20040032581A1 (en) * 2002-01-15 2004-02-19 Mehrdad Nikoonahad Systems and methods for inspection of specimen surfaces
US7105848B2 (en) * 2002-04-15 2006-09-12 Wintriss Engineering Corporation Dual level out-of-focus light source for amplification of defects on a surface
KR20040024795A (en) 2002-09-16 2004-03-22 삼성전자주식회사 Wafer holder and a scope for inspecting a wafer equipped with the wafer holder
JP4510521B2 (en) * 2004-06-02 2010-07-28 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 Semiconductor wafer inspection apparatus and method
US7259869B2 (en) * 2004-06-29 2007-08-21 Kla-Tencor Technologies Corporation System and method for performing bright field and dark field optical inspection
JP4768014B2 (en) * 2006-04-26 2011-09-07 シャープ株式会社 Color filter inspection method, color filter manufacturing method, and color filter inspection apparatus
FR2914422B1 (en) * 2007-03-28 2009-07-03 Soitec Silicon On Insulator METHOD FOR DETECTING SURFACE DEFECTS OF A SUBSTRATE AND DEVICE USING THE SAME
FR2927175B1 (en) 2008-02-05 2011-02-18 Altatech Semiconductor DEVICE FOR INSPECTING SEMICONDUCTOR WAFERS
GB0802478D0 (en) * 2008-02-11 2008-03-19 Cmosis Nv Tiem delay integration in imaging device
FR2931295B1 (en) 2008-05-13 2010-08-20 Altatech Semiconductor DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS
FR2942533B1 (en) 2009-02-25 2011-06-24 Altatech Semiconductor DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS
SG177786A1 (en) * 2010-07-13 2012-02-28 Semiconductor Tech & Instr Inc System and method for capturing illumination reflected in multiple directions

Also Published As

Publication number Publication date
FR2959864A1 (en) 2011-11-11
FR2959864B1 (en) 2013-01-18
IL222480A (en) 2016-12-29
IL222480A0 (en) 2012-12-31
JP2013527925A (en) 2013-07-04
US20130044316A1 (en) 2013-02-21
WO2011138524A9 (en) 2011-12-29
SG184943A1 (en) 2012-12-28
JP5840677B2 (en) 2016-01-06
WO2011138524A1 (en) 2011-11-10
US8817249B2 (en) 2014-08-26

Similar Documents

Publication Publication Date Title
SG10201407704TA (en) Device and method for inspecting moving semiconductor wafers
MY182409A (en) Surface inspection method and surface inspection apparatus
FR2959305B1 (en) OPTICAL DEVICE AND METHOD FOR INSPECTING STRUCTURED OBJECTS.
WO2012176106A3 (en) Method and apparatus for inspection of light emitting semiconductor devices using photoluminescence imaging
FR2927175B1 (en) DEVICE FOR INSPECTING SEMICONDUCTOR WAFERS
WO2007131945A3 (en) Microvolume analysis system
UA109704C2 (en) Sorting unit
FR2931295B1 (en) DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR WAFERS
MY179047A (en) Apparatus for optical inspection
MX2016005635A (en) Method and apparatus for detecting matter.
EP2648234A4 (en) Light receiving element, semiconductor epitaxial wafer, method for manufacturing the light receiving element and the semiconductor epitaxial wafer, and detecting apparatus
CL2013000233A1 (en) Apparatus for manufacturing a structure, comprises a combination of a particulate material and a substrate material, where the apparatus includes a first endless surface in motion with a direction of movement and with one or more receptacles, a second endless surface in motion with a direction of movement that carries a substrate material; process.
PH12011000187A1 (en) Wafer converying device and location sensing system and vision inspecting system having the same
GB201203186D0 (en) Measurement apparatus
EP2766926A4 (en) PLANARIZED SEMICONDUCTOR PARTICLES PLACED ON A SUBSTRATE
IL280010A (en) Multimode defect classification in semiconductor inspection
EP2709145A3 (en) Inline metrology for attaining full wafer map of uniformity and surface charge
MX2013003772A (en) Device and method for determining soiling of objects.
MY176794A (en) Apparatus and method for selectively inspecting component sidewalls
NL2003179A1 (en) Lithographic apparatus and device manufacturing method and scatterometry method and measurement system used therein.
SG149809A1 (en) Patterned wafer defect inspection system and method
WO2012033301A3 (en) Wafer inspection device and wafer inspection system comprising same
PH12013501814A1 (en) Improved system for substrate processing
WO2013060524A3 (en) Device and method for inspecting a reflective coating
EP2605285A3 (en) Photovoltaic device