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SG107148A1 - Substrates assembly apparatus - Google Patents

Substrates assembly apparatus

Info

Publication number
SG107148A1
SG107148A1 SG200303898A SG200303898A SG107148A1 SG 107148 A1 SG107148 A1 SG 107148A1 SG 200303898 A SG200303898 A SG 200303898A SG 200303898 A SG200303898 A SG 200303898A SG 107148 A1 SG107148 A1 SG 107148A1
Authority
SG
Singapore
Prior art keywords
assembly apparatus
substrates assembly
substrates
assembly
Prior art date
Application number
SG200303898A
Inventor
Nakayama Yukinori
Murayama Takao
Hirai Akira
Yawata Satoshi
Original Assignee
Hitachi Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ind Co Ltd filed Critical Hitachi Ind Co Ltd
Publication of SG107148A1 publication Critical patent/SG107148A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Optical Record Carriers (AREA)
SG200303898A 2002-07-19 2003-07-17 Substrates assembly apparatus SG107148A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002210443 2002-07-19

Publications (1)

Publication Number Publication Date
SG107148A1 true SG107148A1 (en) 2004-11-29

Family

ID=29997189

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200303898A SG107148A1 (en) 2002-07-19 2003-07-17 Substrates assembly apparatus

Country Status (4)

Country Link
KR (1) KR100550648B1 (en)
CN (1) CN100405185C (en)
SG (1) SG107148A1 (en)
TW (1) TW594297B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3693972B2 (en) 2002-03-19 2005-09-14 富士通株式会社 Bonded substrate manufacturing apparatus and substrate bonding method
US7349060B2 (en) * 2003-12-02 2008-03-25 Lg.Philips Lcd Co., Ltd. Loader and bonding apparatus for fabricating liquid crystal display device and loading method thereof
JP4213610B2 (en) * 2004-03-15 2009-01-21 富士通株式会社 Bonded board manufacturing equipment
TWI285758B (en) * 2004-10-08 2007-08-21 Au Optronics Corp A method for combining set of substrates and apparatus of the same
KR100969754B1 (en) 2005-01-13 2010-07-13 삼성전자주식회사 Method for transmitting broadcast channel in cellular wireless communication system
CN100458513C (en) * 2006-05-22 2009-02-04 旭东机械(昆山)有限公司 Glass substrate fetching device
JP5190433B2 (en) * 2009-10-27 2013-04-24 日東電工株式会社 Wiring circuit board inspection method, wiring circuit board manufacturing method, and wiring circuit board inspection apparatus
JP5554617B2 (en) * 2010-04-12 2014-07-23 株式会社ディスコ Holding table
KR101383282B1 (en) * 2011-12-28 2014-04-08 엘아이지에이디피 주식회사 Substrate bonding apparatus
JP5810207B1 (en) * 2014-11-14 2015-11-11 株式会社日立製作所 Board assembly apparatus and board assembly method using the same
CN104570419B (en) * 2014-12-26 2018-01-30 深圳市华星光电技术有限公司 Absorption type microscope carrier and its adsorption method
CN105113318A (en) * 2015-08-28 2015-12-02 重庆三好纸业有限公司 Chinese art paper drying device
TWI587968B (en) 2015-10-08 2017-06-21 財團法人工業技術研究院 Support device, support unit system and support unit control system
CN105676492B (en) * 2016-04-06 2019-02-01 深圳市华星光电技术有限公司 Vacuum adsorption platform and glass substrate transport method
CN108602342B (en) * 2016-10-17 2020-06-12 信越工程株式会社 Vacuum laminating device for laminating device
SG11202009058SA (en) * 2018-07-30 2020-10-29 Ulvac Techno Ltd Substrate lifting apparatus and substrate transferring method
CN110730611B (en) * 2019-09-30 2020-12-08 云谷（固安）科技有限公司 Curved surface display screen binding device and curved surface display screen binding method
KR20210134097A (en) 2020-04-29 2021-11-09 삼성디스플레이 주식회사 Apparatus for manufacturing display device and method for manufacturing display device
KR102606055B1 (en) * 2023-04-25 2023-11-24 주식회사 에이치비테크놀러지 Glass Substrate Installation Apparatus for Seating the Warped Glass Substrate Completely

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020062787A1 (en) * 2000-11-30 2002-05-30 Fujitsu Limited Apparatus for manufacturing bonded substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0980404A (en) * 1995-09-11 1997-03-28 Hitachi Ltd Substrate suction device
JPH1159894A (en) * 1997-08-07 1999-03-02 Hitachi Electron Eng Co Ltd Handling device for large-sized glass board
JP3410983B2 (en) * 1999-03-30 2003-05-26 株式会社 日立インダストリイズ Substrate assembly method and apparatus
JP3693972B2 (en) * 2002-03-19 2005-09-14 富士通株式会社 Bonded substrate manufacturing apparatus and substrate bonding method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020062787A1 (en) * 2000-11-30 2002-05-30 Fujitsu Limited Apparatus for manufacturing bonded substrate

Also Published As

Publication number Publication date
KR100550648B1 (en) 2006-02-08
TW200401927A (en) 2004-02-01
CN1469171A (en) 2004-01-21
CN100405185C (en) 2008-07-23
KR20040010244A (en) 2004-01-31
TW594297B (en) 2004-06-21

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