[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SG104292A1 - Flip chip bonder and method therefor - Google Patents

Flip chip bonder and method therefor

Info

Publication number
SG104292A1
SG104292A1 SG200200076A SG200200076A SG104292A1 SG 104292 A1 SG104292 A1 SG 104292A1 SG 200200076 A SG200200076 A SG 200200076A SG 200200076 A SG200200076 A SG 200200076A SG 104292 A1 SG104292 A1 SG 104292A1
Authority
SG
Singapore
Prior art keywords
flip chip
method therefor
chip bonder
bonder
therefor
Prior art date
Application number
SG200200076A
Inventor
Chew Hwee Seng Jimmy
Tay Hock Lau
Kok Yeow Lim
You Teng Lim
Ismail Abdullah
Original Assignee
Advance Systems Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advance Systems Automation Ltd filed Critical Advance Systems Automation Ltd
Priority to SG200200076A priority Critical patent/SG104292A1/en
Priority to PCT/SG2002/000286 priority patent/WO2003058708A1/en
Priority to CNB028268482A priority patent/CN100338754C/en
Priority to MYPI20024853A priority patent/MY141298A/en
Priority to TW092100101A priority patent/TW200304197A/en
Publication of SG104292A1 publication Critical patent/SG104292A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B65G2203/042—Sensors
    • B65G2203/044—Optical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200200076A 2002-01-07 2002-01-07 Flip chip bonder and method therefor SG104292A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SG200200076A SG104292A1 (en) 2002-01-07 2002-01-07 Flip chip bonder and method therefor
PCT/SG2002/000286 WO2003058708A1 (en) 2002-01-07 2002-12-09 Flip chip bonder and method therefor
CNB028268482A CN100338754C (en) 2002-01-07 2002-12-09 Flip chip bonder and method therefor
MYPI20024853A MY141298A (en) 2002-01-07 2002-12-23 Flip chip bonder and method therefor
TW092100101A TW200304197A (en) 2002-01-07 2003-01-03 Flip chip bonder and method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200200076A SG104292A1 (en) 2002-01-07 2002-01-07 Flip chip bonder and method therefor

Publications (1)

Publication Number Publication Date
SG104292A1 true SG104292A1 (en) 2004-06-21

Family

ID=20430889

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200200076A SG104292A1 (en) 2002-01-07 2002-01-07 Flip chip bonder and method therefor

Country Status (5)

Country Link
CN (1) CN100338754C (en)
MY (1) MY141298A (en)
SG (1) SG104292A1 (en)
TW (1) TW200304197A (en)
WO (1) WO2003058708A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459489A (en) * 2015-10-16 2019-11-15 米尔鲍尔有限两合公司 Element control system

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004007703B3 (en) * 2004-02-16 2005-06-23 Mühlbauer Ag Electronic component testing and rotating device, e.g. for flip-chip testing, with reception elements for electronic components on opposite sides of rotatable component rotated through 180 degrees
DE102005021831A1 (en) * 2005-05-11 2006-11-23 Mühlbauer Ag Device for transporting platelets
DE102005034062A1 (en) * 2005-06-13 2006-12-28 Mühlbauer Ag Device for receiving and placing of flip-chips on a foil-shaped support has boundary elements which exhibits soldered connections in sections of a smaller height
WO2007072714A1 (en) * 2005-12-22 2007-06-28 Shibaura Mechatronics Corporation Apparatus and method for mounting electronic component
DE102006002367B3 (en) * 2006-01-17 2007-10-04 Mühlbauer Ag Apparatus and method for transferring a plurality of chips from a wafer to a substrate
US7764366B2 (en) 2006-07-11 2010-07-27 Besi North America, Inc. Robotic die sorter with optical inspection system
DE102006051607B4 (en) * 2006-11-02 2008-11-20 Mühlbauer Ag Method and device for the standard application and mounting of electronic components on substrates
CH698718B1 (en) 2007-01-31 2009-10-15 Oerlikon Assembly Equipment Ag A device for mounting a flip chip on a substrate.
MY144526A (en) * 2008-04-18 2011-09-30 Khoo Hun Sniah Semiconductor die sorter for wafer level packaging
CN103703551A (en) * 2011-06-03 2014-04-02 豪锐恩科技私人有限公司 Method and systems for semiconductor chip pick & transfer and bonding
CN102267008B (en) * 2011-06-21 2013-06-05 中国电子科技集团公司第二研究所 Precise control mechanism of welding pressure
US9105760B2 (en) 2011-11-07 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
US8546802B2 (en) * 2011-11-07 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
CH705802B1 (en) * 2011-11-25 2016-04-15 Esec Ag Means for the mounting of semiconductor chips.
JP2013137285A (en) 2011-12-28 2013-07-11 Advantest Corp Pitch change device, electronic component handling device and electronic component testing device
CN103489811A (en) * 2012-06-11 2014-01-01 北京中电科电子装备有限公司 Dual-path chip-pickup turning mechanism on bonding equipment
CN103489800B (en) * 2012-06-11 2016-09-21 北京中电科电子装备有限公司 Two-way keying features on bonding apparatus
US9196521B2 (en) * 2012-11-05 2015-11-24 Infineon Technologies Ag Adjustable pick-up head and method for manufacturing a device
KR101425613B1 (en) * 2013-03-28 2014-08-01 한미반도체 주식회사 Flip chip bonding apparatus and flip chip bonding method
KR20140146852A (en) * 2013-06-18 2014-12-29 삼성테크윈 주식회사 Flip-chip mounter and mounting mehtod using it
CN103367175B (en) * 2013-07-02 2015-08-19 华中科技大学 A kind of multiple degrees of freedom bonding head for flip-chip
KR101566714B1 (en) * 2013-07-25 2015-11-13 한미반도체 주식회사 Flip chip bonding device
CN105789086B (en) * 2014-12-24 2019-03-05 北京中电科电子装备有限公司 A kind of device of chip double-side scaling powder coating
EP3250487B1 (en) * 2015-01-28 2022-04-20 KLA-Tencor Corporation Flipping apparatus, system and method for processing articles
US9783372B2 (en) 2015-01-28 2017-10-10 Kla-Tencor Corporation Flipping apparatus, system and method for processing articles
MY184276A (en) * 2015-02-16 2021-03-30 Exis Tech Sdn Bhd Device and method for conveying and flipping a component
CN104701199B (en) * 2015-03-20 2018-03-13 北京中电科电子装备有限公司 A kind of flip-chip bonding apparatus
CN104752283B (en) * 2015-04-07 2018-02-13 嘉兴景焱智能装备技术有限公司 Flip-chip device
DE102015013495B4 (en) * 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Receiving device for components and methods for removing defective components from this
CN106783668A (en) * 2015-11-25 2017-05-31 京元电子股份有限公司 Semiconductor element turn-over rig and its test equipment
JP5975556B1 (en) 2015-12-11 2016-08-23 上野精機株式会社 Transfer equipment
TWI632626B (en) * 2016-01-06 2018-08-11 日商新川股份有限公司 Electronic parts processing unit
GB2549250B (en) 2016-02-15 2021-06-30 Pragmatic Printing Ltd Apparatus and method for manufacturing plurality of electronic circuits
CN107134422A (en) * 2016-02-29 2017-09-05 上海微电子装备（集团）股份有限公司 Chip bonding device and method
CN107134446B (en) * 2016-02-29 2019-05-31 上海微电子装备（集团）股份有限公司 A kind of chip bonding device and bonding method
CN107134418B (en) * 2016-02-29 2020-02-18 上海微电子装备（集团）股份有限公司 Flip chip bonding device and bonding method
MY191024A (en) * 2016-04-27 2022-05-29 Mit Semiconductor Pte Ltd Transfer system for flipping and multiple checking of electronic devices
CN106057709A (en) * 2016-07-28 2016-10-26 合肥矽迈微电子科技有限公司 Chip mounting equipment and application thereof
CN106057717A (en) * 2016-07-28 2016-10-26 合肥矽迈微电子科技有限公司 Chip taking and placing device
CN107665828A (en) * 2016-07-29 2018-02-06 上海微电子装备（集团）股份有限公司 A kind of automated bonding device and method
US10056278B2 (en) * 2016-08-22 2018-08-21 Asm Technology Singapore Pte Ltd Apparatus and method for transferring electronic devices
CN107887295B (en) 2016-09-30 2019-07-23 上海微电子装备（集团）股份有限公司 A kind of chip bonding device and bonding method
CN106373912A (en) * 2016-10-14 2017-02-01 广东楚天龙智能卡有限公司 In-situ turnover mechanism of chip
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
CN108122787B (en) * 2016-11-30 2019-09-17 上海微电子装备（集团）股份有限公司 Chip bonding device and die bonding method
CN106783717A (en) * 2016-12-23 2017-05-31 合肥矽迈微电子科技有限公司 Flip-chip patch device and method
WO2018188731A1 (en) * 2017-04-11 2018-10-18 Muehlbauer GmbH & Co. KG Component receiving device with optical sensor
DE102017008869B3 (en) * 2017-09-21 2018-10-25 Mühlbauer Gmbh & Co. Kg component centering
MY186148A (en) * 2017-11-27 2021-06-28 Mi Equipment M Sdn Bhd Setup camera auto height alignment
EP3503172B1 (en) * 2017-12-20 2024-04-03 Nexperia B.V. Apparatus and system
CN108155124A (en) * 2017-12-25 2018-06-12 北京中电科电子装备有限公司 A kind of chip attachment device and method
CN110137100B (en) * 2018-02-09 2021-05-07 上海微电子装备（集团）股份有限公司 Bonding apparatus and bonding method
US11330746B2 (en) 2018-02-28 2022-05-10 Raytheon Company Device and method for reworking flip chip components
CN108565241B (en) * 2018-05-22 2020-03-24 苏州艾科瑞思智能装备股份有限公司 Chip flip-chip micro-assembling machine
CN108962791B (en) * 2018-07-10 2021-08-03 唐人制造（宁波）有限公司 Chip alignment and mounting device and method thereof
CN109588036A (en) * 2018-11-30 2019-04-05 江门市三兴照明科技有限公司 A kind of lamp bead mounting device
JP2020138861A (en) * 2019-03-01 2020-09-03 テーブルマーク株式会社 Food material transport device
CN109808227A (en) * 2019-03-21 2019-05-28 浙江新立机械有限公司 Double disc paper cup machine
US10748794B1 (en) * 2019-07-09 2020-08-18 Asm Technology Singapore Pte Ltd Apparatus for transferring electronic devices
TWI700234B (en) * 2019-08-30 2020-08-01 均華精密工業股份有限公司 Die selecting apparatus
WO2021091478A1 (en) 2019-11-08 2021-05-14 Semiconductor Technologies & Instruments Pte Ltd Component handler
TWI738238B (en) * 2020-03-04 2021-09-01 均華精密工業股份有限公司 High productivity die bonding apparatus
CN112103210B (en) * 2020-08-13 2023-03-31 上饶市广丰时代科技有限公司 Chip bonding process equipment for semiconductor chip packaging
EP4258327A1 (en) * 2022-04-05 2023-10-11 Nexperia B.V. An apparatus for transferring semiconductor circuits
US12131926B2 (en) 2022-11-08 2024-10-29 Canon Kabushiki Kaisha Apparatus including arrays of pick-up heads and bonding heads and a method of using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012799A (en) * 1983-07-01 1985-01-23 三洋電機株式会社 Remaining amount detector of chip-shaped electronic part
JPH07193397A (en) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd Suction point correction device of mounting device
US5671530A (en) * 1995-10-30 1997-09-30 Delco Electronics Corporation Flip-chip mounting assembly and method with vertical wafer feeder
US6171049B1 (en) * 1996-02-29 2001-01-09 Alphasem Ag Method and device for receiving, orientating and assembling of components
IT1292841B1 (en) * 1997-04-08 1999-02-11 Azionaria Costruzioni Acma Spa METHOD AND DEVICE FOR THE ALIGNMENT OF PRODUCTS.
JPH11254367A (en) * 1998-03-13 1999-09-21 Shibuya Kogyo Co Ltd Processing head
US6083566A (en) * 1998-05-26 2000-07-04 Whitesell; Andrew B. Substrate handling and processing system and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110459489A (en) * 2015-10-16 2019-11-15 米尔鲍尔有限两合公司 Element control system
CN110459489B (en) * 2015-10-16 2023-04-11 米尔鲍尔有限两合公司 Component handling system

Also Published As

Publication number Publication date
TW200304197A (en) 2003-09-16
MY141298A (en) 2010-04-16
CN1613146A (en) 2005-05-04
CN100338754C (en) 2007-09-19
WO2003058708A1 (en) 2003-07-17

Similar Documents

Publication Publication Date Title
SG104292A1 (en) Flip chip bonder and method therefor
TW531052U (en) Flip chip and flip chip packaging substrate
TWI348218B (en) Semiconductor chip and method for manufacturing the same
AU2003259040A8 (en) Chip package sealing method
AU2003218145A1 (en) Semiconductor device having a bond pad and method therefor
EP1513195A4 (en) Semiconductor device and its manufacturing method
SG111069A1 (en) Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
AU2003218146A8 (en) Semiconductor device having a wire bond pad and method therefor
HK1048890A1 (en) Semiconductor device and package, and method of manufacture therefor
GB0216876D0 (en) Bonding apparatus, and bonding method
AU2002324848A1 (en) Flip chip resistor and its manufacturing method
AU2003266557A8 (en) Bonding device and method
HK1064807A1 (en) Structure and method of direct chip attach
HK1073722A1 (en) Direct chip attach structure and method
GB2426573B (en) Chip sorting device
EP1461823A4 (en) Apparatus and process for precise encapsulation of flip chip interconnects
EP1498955A4 (en) Semiconductor device and its manufacturing method
HK1062956A1 (en) Integrated circuit and laminated leadframe package
IL157598A0 (en) Semiconductor chip and production method for housing
EP1480341A4 (en) Semiconductor integrated circuit and its reset method
SG111128A1 (en) Integrated circuit package and manufacturing method therefor
SG111092A1 (en) Semiconductor device package and method of manufacture
SG117482A1 (en) Flip chip bonder
AU2003265881A1 (en) Semiconductor device and method therefor
EP1473774A4 (en) Semiconductor device and its manufacturing method