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SE8200131L - PROCEDURE AND APPARATUS FOR PREPARING PRINTED CIRCUITS - Google Patents

PROCEDURE AND APPARATUS FOR PREPARING PRINTED CIRCUITS

Info

Publication number
SE8200131L
SE8200131L SE8200131A SE8200131A SE8200131L SE 8200131 L SE8200131 L SE 8200131L SE 8200131 A SE8200131 A SE 8200131A SE 8200131 A SE8200131 A SE 8200131A SE 8200131 L SE8200131 L SE 8200131L
Authority
SE
Sweden
Prior art keywords
board
polymer
imaging
liquid
coating
Prior art date
Application number
SE8200131A
Other languages
Swedish (sv)
Other versions
SE459708B (en
Inventor
F J Rendulic
R K Trasavage
P A Boduch
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grace W R & Co filed Critical Grace W R & Co
Publication of SE8200131L publication Critical patent/SE8200131L/en
Publication of SE459708B publication Critical patent/SE459708B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/056—Using an artwork, i.e. a photomask for exposing photosensitive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

Printed circuit boards are made by imaging a liquid polymer which has been coated onto the board. The imaging is accomplished while the polymer is wet with the photo tool in a close air gap relationship with the coated board. The uncured polymer which remains liquid is removed after imaging so that the board can be processed by etch resist, plate resist, or solder mask techniques. The cured polymer is removed by stripping with an alkaline solution. The apparatus consists of single station or multi- station equipment to carry out the unit operations of maintaining the board in a set position, coating with a liquid polymer, placing a photo tool in registration with the circuit board blank and in close relationship with the coating, and imaging the liquid polymer via the photo tool to cause areas of the coating to solidify and other areas to remain liquid.
SE8200131A 1981-01-16 1982-01-12 PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS AND APPLIANCES SE459708B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22581081A 1981-01-16 1981-01-16

Publications (2)

Publication Number Publication Date
SE8200131L true SE8200131L (en) 1982-07-17
SE459708B SE459708B (en) 1989-07-24

Family

ID=22846343

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8200131A SE459708B (en) 1981-01-16 1982-01-12 PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS AND APPLIANCES

Country Status (11)

Country Link
JP (1) JPS57164595A (en)
AU (1) AU557941B2 (en)
CA (1) CA1158091A (en)
DE (1) DE3201577A1 (en)
FR (1) FR2498410B1 (en)
GB (3) GB2091493B (en)
IT (1) IT1196537B (en)
NL (1) NL8200133A (en)
PH (1) PH19408A (en)
SE (1) SE459708B (en)
ZA (1) ZA8244B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591265A (en) * 1982-04-01 1986-05-27 Sullivan Donald F System for contact printing with liquid photopolymers
JPS6244461U (en) * 1985-09-06 1987-03-17
IT1234376B (en) * 1989-08-07 1992-05-15 3B Spa EQUIPMENT FOR COATING A SURFACE AND THE EDGES OF A WOODEN OR SIMILAR PANEL WITH A SHEET OF HEAT-DEFORMABLE MATERIAL.
CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
US5449429A (en) * 1993-12-03 1995-09-12 Langenbrunner; James R. Apparatus for stretching and mounting films
AUPM527894A0 (en) * 1994-04-26 1994-05-19 Fawcett, Alan John Magnetic holding device
GB201000858D0 (en) * 2010-01-20 2010-03-10 Th Group Ltd Electronic circuit assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1099566A (en) * 1965-04-06 1968-01-17 Dunham Tool Company Inc Universal rotary chuck
DE1764456C3 (en) * 1968-06-08 1979-10-11 Robert Bosch Gmbh, 7000 Stuttgart Process for the imaging of a pattern on a photoresist layer
US3579376A (en) * 1968-07-23 1971-05-18 United Aircraft Corp Method of forming a resist pattern on a circuit board or the like
FR2029328A5 (en) * 1969-01-24 1970-10-16 Grace W R Ltd Photographic print setting apparatus and - materials
GB1323415A (en) * 1969-07-04 1973-07-18 British United Shoe Machinery Workpiece holding devices
GB1289075A (en) * 1970-04-30 1972-09-13
BE793732A (en) * 1972-01-10 1973-05-02 Grace W R & Co COMPOSITION CONTAINING A POLYENE AND A POLYTHIOL
US3907268A (en) * 1974-03-29 1975-09-23 Thomas F Hale Valve means for vacuum holding device
JPS51123140A (en) * 1975-04-19 1976-10-27 Nippon Paint Co Ltd Photosensitive compositions and processing method thereof
SE444991B (en) * 1978-05-01 1986-05-20 Minnesota Mining & Mfg PHOTOPOLYMERIZABLE COMPOSITION AND SUBSTRATE COATED WITH THE COMPOSITION
US4158141A (en) * 1978-06-21 1979-06-12 Hughes Aircraft Company Process for channeling ion beams
US4228232A (en) * 1979-02-27 1980-10-14 Minnesota Mining And Manufacturing Company Photopolymerizable composition containing ethylenically unsaturated oligomers

Also Published As

Publication number Publication date
GB2091493B (en) 1985-10-23
DE3201577A1 (en) 1982-09-23
ZA8244B (en) 1982-11-24
PH19408A (en) 1986-04-10
GB8504266D0 (en) 1985-03-20
IT1196537B (en) 1988-11-16
GB2152861A (en) 1985-08-14
FR2498410A1 (en) 1982-07-23
GB2151519A (en) 1985-07-24
IT8247576A0 (en) 1982-01-15
AU7926382A (en) 1982-07-22
AU557941B2 (en) 1987-01-15
GB8419444D0 (en) 1984-09-05
JPS57164595A (en) 1982-10-09
NL8200133A (en) 1982-08-16
SE459708B (en) 1989-07-24
CA1158091A (en) 1983-12-06
GB2152861B (en) 1985-11-13
FR2498410B1 (en) 1986-05-23
GB2151519B (en) 1985-12-24
GB2091493A (en) 1982-07-28

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