Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/30—Stacked capacitors
  • H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/12—Using specific substances
  • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
  • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
  • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
  • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
• Ceramic Capacitors (AREA)
• Laminated Bodies (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Parts Printed On Printed Circuit Boards (AREA)
• Compositions Of Oxide Ceramics (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=23582798

Family Applications (4)

Family Applications Before (3)

Country Status (18)

Families Citing this family (9)

Family Cites Families (3)

• 1974
  • 1974-08-21 IL IL45512A patent/IL45512A/en unknown
  • 1974-09-13 ZA ZA00745838A patent/ZA745838B/en unknown
  • 1974-09-16 IN IN2052/CAL/74A patent/IN143579B/en unknown
  • 1974-09-17 AU AU73375/74A patent/AU500529B2/en not_active Expired
  • 1974-09-17 IE IE1929/74A patent/IE40174B1/en unknown
  • 1974-09-20 DE DE19742461996 patent/DE2461996A1/en active Pending
  • 1974-09-20 DE DE2461997A patent/DE2461997C2/en not_active Expired
  • 1974-09-20 DE DE2445086A patent/DE2445086C2/en not_active Expired
  • 1974-09-20 DE DE2461995A patent/DE2461995C3/en not_active Expired
  • 1974-09-20 BR BR7820/74A patent/BR7407820D0/en unknown
  • 1974-09-21 JP JP49109444A patent/JPS6258124B2/ja not_active Expired
  • 1974-09-23 CH CH1282774A patent/CH586994A5/xx not_active IP Right Cessation
  • 1974-09-23 NO NO743408A patent/NO743408L/no unknown
  • 1974-09-23 ES ES430301A patent/ES430301A1/en not_active Expired
  • 1974-09-23 SE SE7411924A patent/SE7411924L/xx unknown
  • 1974-09-23 FR FR7432066A patent/FR2245063B1/fr not_active Expired
  • 1974-09-23 IT IT27592/74A patent/IT1022218B/en active
  • 1974-09-24 AR AR255732A patent/AR216889A1/en active
  • 1974-09-24 NL NL7412599.A patent/NL162504C/en not_active IP Right Cessation
  • 1974-09-24 GB GB41564/74A patent/GB1486308A/en not_active Expired
  • 1974-09-24 BE BE148847A patent/BE820287A/en unknown
• 1976
  • 1976-06-30 ES ES449378A patent/ES449378A1/en not_active Expired
  • 1976-06-30 ES ES449379A patent/ES449379A1/en not_active Expired
• 1978
  • 1978-01-02 SE SE7800026A patent/SE7800026L/en unknown
  • 1978-01-02 SE SE7800027A patent/SE7800027L/en unknown
  • 1978-01-02 SE SE7800028A patent/SE7800028L/en unknown

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