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SE520151C2 - Module for radio communication - Google Patents

Module for radio communication

Info

Publication number
SE520151C2
SE520151C2 SE0001943A SE0001943A SE520151C2 SE 520151 C2 SE520151 C2 SE 520151C2 SE 0001943 A SE0001943 A SE 0001943A SE 0001943 A SE0001943 A SE 0001943A SE 520151 C2 SE520151 C2 SE 520151C2
Authority
SE
Sweden
Prior art keywords
card
module
antenna
integrated
pcb
Prior art date
Application number
SE0001943A
Other languages
Swedish (sv)
Other versions
SE0001943L (en
SE0001943D0 (en
Inventor
Shaofang Gong
Johan Nilsson
Original Assignee
Shaofang Gong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shaofang Gong filed Critical Shaofang Gong
Priority to SE0001943A priority Critical patent/SE520151C2/en
Publication of SE0001943D0 publication Critical patent/SE0001943D0/en
Priority to PCT/SE2001/000949 priority patent/WO2001095679A1/en
Priority to AU56895/01A priority patent/AU5689501A/en
Publication of SE0001943L publication Critical patent/SE0001943L/en
Publication of SE520151C2 publication Critical patent/SE520151C2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

A module for radio communication in accordance with the Blue Tooth concept and/or in accordance with the wireless-LAN concept, wherein the module comprises a transmitter-and-receiver circuit and an antenna. The invention is characterised in that the module comprises a carrier in the form of a laminated PCB-card (1) (Printed Circuit Board) that includes a number of electrically conductive metal layers (M1-M5) and so-called microvias; in that a first side (11) of the card (1) has an integrated antenna (10) formed in the metal layer (M5) on said side and connected to the remainder of the module; in that a radio frequency chip (13) is surface-mounted on the PCB-card (1) on other side (12) of said card; in that passive components (14, 15), such as filters, Baluns, inductors and capacitors, are integrated in the PCB-card (1) and connected to different microvias; and in that terminals in the form of BGA balls (16, 17) (Ball Grid Array) are provided on said second side (12) of the card.

Description

70 75 20 25 30 520 151 tet förefinns en integrerad antenn utbildad i metallagret (M5) på nämnda sida, där antennen väsentligen har samma yta som nämnda sida där den är utbildad och vilken antenn är an~ sluten till resterande del av modulen, av att på den andra sidan om kortet är ett radiofrekvenschip ytmonterat på PCB- kortet och av att passiva komponenter, såsom filter, baluner, induktorer och kondensatorer är integrerade i PCB~kortet och anslutna med olika mikrovior samt av att terminaler i form av BGA kulor (Ball Grid Array) förefinns pà nämnda andra sida om kortet. There is an integrated antenna formed in the metal bearing (M5) on said side, the antenna having substantially the same surface as said side where it is formed and which antenna is connected to the remainder of the module, by on the other side of the card is a radio frequency chip surface mounted on the PCB card and that passive components, such as filters, baluners, inductors and capacitors are integrated in the PCB card and connected with different microviori and that terminals in the form of BGA balls Grid Array) is located on the said other side of the card.

Nedan beskrives uppfinningen närmare, delvis i samband med ett på bifogade ritning visat utföringsexempel av uppfinning- en, där - figur 1 visar en sidovy av en modul enligt uppfinningen - figur 2 visar ett snitt genom.ett PCB-kort med s.k. mikro- vior och en genomgående via - figur 3 visar en integrerad kondensator sedd uppifrån - figur 4 visar en integrerad spole sedd uppifrån.The invention is described in more detail below, partly in connection with an exemplary embodiment of the invention shown in the accompanying drawing, in which - figure 1 shows a side view of a module according to the invention - figure 2 shows a section through a PCB card with so-called microwaves and a continuous via - figure 3 shows an integrated capacitor seen from above - figure 4 shows an integrated coil seen from above.

Enligt känd teknik monteras passiva radiofrekvenskomponenter som diskreta komponenter tillsammans med halvledarchips på ett konventionellt PCB-kort (Printed Circuit Board). Enligt en mer avancerad teknik används tunna filmer och keramiska multilager för att integrera vissa passiva komponenter, såsom filter och induktanser. Emellertid medför dessa tekniker en högre produktionskostnad än konventionell PCB-teknik.According to the prior art, passive radio frequency components are mounted as discrete components together with semiconductor chips on a conventional PCB (Printed Circuit Board) board. According to a more advanced technology, thin films and ceramic multilayers are used to integrate certain passive components, such as filters and inductors. However, these techniques entail a higher production cost than conventional PCB technology.

Föreliggande uppfinning avser en helintegrerad modul för Bluetooth eller WLAN.The present invention relates to a fully integrated module for Bluetooth or WLAN.

Uppfinningen hänför sig således till en modul för radiokommu- nikation enligt konceptet Bluetooth och/eller enligt koncep- K:\Patent\000069se\S1utföreläggande 03-03-l3.doc , 2003-03-13 70 15 20 25 30 520 151 tet wireless LAN innefattande en sändar- och mottagarkrets samt en antenn.The invention thus relates to a module for radio communication according to the concept of Bluetooth and / or according to the concept K 03 \ Patent \ 000069se \ S1utföreläggande 03-03-l3.doc, 2003-03-13 70 15 20 25 30 520 151 tet wireless LAN comprising a transmitter and receiver circuit and an antenna.

Enligt uppfinningen har modulen en bärare i form av ett lami- nerat PCB-kort (Printed Circuit Board) l innefattande ett an- tal elektriskt ledande lager sammankopplade med s.k. mikrovi- or. I figur 2 illusteras mikrovior 2, 3, 4. Beteckningarna M1, M2, M3, M4 och M5 avser metallager åtskilda av dielekt- riskt material 6, 7, 8 och 9. Det dielektriska lagret 6 har lämpligen en tjocklek av 0.8 till 1.5 millimeter, medan lag- ren 7, 8 och 9 har en tjocklek av 0.05 millimeter.According to the invention, the module has a carrier in the form of a laminated PCB (Printed Circuit Board) card 1 comprising a number of electrically conductive layers connected to so-called mikrovi- or. Figure 2 illustrates microwaves 2, 3, 4. The designations M1, M2, M3, M4 and M5 refer to metal layers separated by dielectric material 6, 7, 8 and 9. The dielectric layer 6 preferably has a thickness of 0.8 to 1.5 millimeters. , while bearings 7, 8 and 9 have a thickness of 0.05 millimeters.

Nämnda mikrovior tjänar dels till att förbinda de olika metallagren med varandra, dels for att ansluta komponenter till kortet 1.Said microviors serve partly to connect the different metal layers to each other, and partly to connect components to the card 1.

I figur 2 används lagret M5 för att mönstra och utbilda antennen 10. Lagren M1 - M4 används som transmissionsled- ningar och integrerade passiva komponenter, såsom filter, baluner, induktanser och kapacitanser.In Figure 2, the bearing M5 is used to pattern and train the antenna 10. The bearings M1 - M4 are used as transmission lines and integrated passive components, such as filters, baluners, inductances and capacitances.

Enligt uppfinningen förefinns på en forsta sida 11 om kortet 1 antennen lO, vilken är ansluten med en genomgående via 18 till skiktet M1. I figur 1 har antennen ritats med for stor tjocklek. Antennen är lämpligen en kvarts vàglängds s.k. patch-antenn. Emellertid kan andra antenntyper, såsom en s.k. microstripantenn eller en loopantenn användas.According to the invention, the antenna 10 is present on a first side 11 of the card 1, which is connected with a continuous via 18 to the layer M1. In figure 1, the antenna has been drawn with too great a thickness. The antenna is suitably a quarter of a wavelength so-called patch antenna. However, other types of antenna, such as a so-called microstrip antenna or a loop antenna can be used.

På den andra sidan 12 om kortet är ett radiofrekvenschip 13 ytmonterat. Passiva komponenter 14, 15, såsom filter, balu- ner, induktorer och kondensatorer är integrerade i PCB-kor- tet.On the other side 12 of the card, a radio frequency chip 13 is surface mounted. Passive components 14, 15, such as filters, balloons, inductors and capacitors are integrated in the PCB board.

K:\Patent\000069se\S1utförelåggande 03-03-13.doc , 2003-03- 13 70 20 25 30 520 151 Vidare förefinns enligt uppfinningen terminaler i form av BGA kulor 16, 17 kortet.K: \ Patent \ 000069se \ S1utförelåggande 03-03-13.doc, 2003-03- 13 70 20 25 30 520 151 Furthermore, according to the invention there are terminals in the form of BGA balls 16, 17 card.

(Ball Grid Array) på nämnda andra sida 12 om Härigenom är en helt integrerad kommunikationsmodul utbildad som ansluts till ett kretskort via BGA-kulorna.(Ball Grid Array) on the said second page 12 about Hereby a fully integrated communication module is trained which is connected to a circuit board via the BGA balls.

Givetvis kan antalet metallager vara större eller mindre än vad som beskrivits ovan.Of course, the number of metal layers may be larger or smaller than described above.

Enligt en föredragen utföringsform är en eller flera passiva komponenter av nämnt slag integrerade i kortet 1 och utbilda- de medelst nämnda metallager M1 - M4. I figur 2 illustreras i den mittre delen 18 av figuren en kondensator utbildad me- delst metallagren. I figur 3 visas kondensatorn uppifrån så- som den är utbildad i metallagren M1 - M4.According to a preferred embodiment, one or more passive components of said kind are integrated in the card 1 and formed by means of said metal bearings M1 - M4. Figure 2 illustrates in the middle part 18 of the figure a capacitor formed by means of the metal bearings. Figure 3 shows the capacitor from above as it is formed in the metal bearings M1 - M4.

I figur 1 visas med pilar var kondensatorn 14 och spolen 15 är belägna inuti PCB-kortet.Figure 1 shows with arrows where the capacitor 14 and the coil 15 are located inside the PCB board.

I figur 4 visas en spole uppifrån som är utbildad i metall- lagret M1 eller M2 i den högra delen 19 av figur 2.Figure 4 shows a coil from above which is formed in the metal layer M1 or M2 in the right-hand part 19 of figure 2.

Jämfört med känd teknik medför föreliggande uppfinning en rad betydelsefulla fördelar. En stor fördel är att modulen kan göras mycket liten. Med en kvartsvåglängdsantenn kan modulen göras med yttermàtten 16x18x2.5 millimeter. Vidare erhålles hög radiokvalitet på grund av att inga parasitiska kapacitan- ser och induktanser finns i elförbindelser. En annan fördel är hög känslighet på grund av att erforderliga filter och ba- luner är integrerade i strukturen. Dessutom är tillverknings- kostnaden låg.Compared to the prior art, the present invention offers a number of significant advantages. A big advantage is that the module can be made very small. With a quarter-wavelength antenna, the module can be made with the outer dimensions 16x18x2.5 millimeters. Furthermore, high radio quality is obtained due to the fact that no parasitic capacitances and inductances are present in electrical connections. Another advantage is high sensitivity due to the fact that the required filters and balconies are integrated in the structure. In addition, the manufacturing cost is low.

K:\Patent\000069se\Slutíöre1äggande 03-03-13.doc , 2003-03-13 520 151 Ovan har ett antal utföringsexempel beskrivits. Det är dock uppenbart att modulen kan detaljförändras beroende på önskad uppbyggnad och önskade prestanda.K: \ Patent \ 000069se \ Slutíöre1äggande 03-03-13.doc, 2003-03-13 520 151 A number of embodiments have been described above. However, it is obvious that the module can be changed in detail depending on the desired structure and desired performance.

Föreliggande uppfinning skall därför inte anses begränsad till de ovan angivna utföringsexemplen utan kan varieras inom dess av bifogade patentkrav angivna ram.The present invention is, therefore, not to be construed as limited to the above embodiments, but may be varied within the scope of the appended claims.

K:\Patent\0O0069se\S1utföreläggande 03-03-13.doc , 2003-03-13K: \ Patent \ 0O0069se \ S1utföreläggande 03-03-13.doc, 2003-03-13

Claims (3)

20 25 30 520 151 Patentkrav20 25 30 520 151 Patent claims 1. Modul for radiokommunikation enligt konceptet Bluetooth och/eller enligt konceptet wireless LAN innefattande en sän- dar- och mottagarkrets samt en antenn, där modulen har en bä- rare i form av ett laminerat PCB - kort (l) (Printed Circuit Board) innefattande ett antal elektriskt ledande metallager (Ml-M5) och s.k. mikrovior, k ä n n e t e c k n a d a v, att (ll) om kortet (l) utbildad i metallagret (M5) på en första sida forefinns en integrerad antenn (10) på nämnda sida, där antennen väsentligen har samma yta som nämnda sida där den är utbildad och vilken antenn är ansluten till resterande del av (12) av att på den andra sidan om kortet är ett ra- (13) modulen, ytmonterat på PCB-kortet (l) och av att (l4,l5), diofrekvenschip passiva komponenter såsom filter, baluner, indukto- rer och kondensatorer är integrerade i PCB-kortet (l) och an- slutna med olika mikrovior samt av att terminaler i form av BGA.kulor (l6, 17) (12) (Ball Grid Array) forefinns på nämnda and- ra sida om kortet.Module for radio communication according to the concept Bluetooth and / or according to the concept wireless LAN comprising a transmitter and receiver circuit and an antenna, where the module has a carrier in the form of a laminated PCB card (l) (Printed Circuit Board) comprising a number of electrically conductive metal bearings (M1-M5) and so-called microviori, characterized in that (ll) if the card (l) formed in the metal layer (M5) on a first side there is an integrated antenna (10) on said side, the antenna having substantially the same surface as said side where it is formed and which antenna is connected to the remaining part of (12) by the fact that on the other side of the card is a RA (13) module, surface mounted on the PCB board (1) and by having (l4, l5), diofrequency chip passive components such as filters , baluners, inductors and capacitors are integrated in the PCB board (1) and connected with different microviori and in that terminals in the form of BGA balls (16, 17) (12) (Ball Grid Array) are present on the said other side of the card. 2. Modul enligt krav l, k ä n n e t e c k n a d a v, att passiva komponenter av nämnt slag är integrerade i kortet (l) och utbildade medelst nämnda metallager (Ml~M4).Module according to claim 1, characterized in that passive components of said kind are integrated in the card (1) and formed by means of said metal bearings (M1 ~ M4). 3. Modul enligt krav 1 eller 2, k ä n n e t e c k n a d a V, att nämnda antenn (10) är ansluten medelst en genomgåen- (l8) (Ml) (12). de via till det metallager som finns på nämnda and- ra sida K:\Patent\000069se\Slutföreläggande 03 -03- 1 3 .doc , 2003-03-13Module according to claim 1 or 2, characterized in that said antenna (10) is connected by means of a through- (l8) (M1) (12). they via to the metal warehouse located on the said other side K: \ Patent \ 000069se \ Slutföreläggande 03 -03- 1 3 .doc, 2003-03-13
SE0001943A 2000-06-07 2000-06-07 Module for radio communication SE520151C2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (en) 2000-06-07 2000-06-07 Module for radio communication
PCT/SE2001/000949 WO2001095679A1 (en) 2000-06-07 2001-05-03 Module for radio communication
AU56895/01A AU5689501A (en) 2000-06-07 2001-05-03 Module for radio communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001943A SE520151C2 (en) 2000-06-07 2000-06-07 Module for radio communication

Publications (3)

Publication Number Publication Date
SE0001943D0 SE0001943D0 (en) 2000-06-07
SE0001943L SE0001943L (en) 2001-12-08
SE520151C2 true SE520151C2 (en) 2003-06-03

Family

ID=20279824

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001943A SE520151C2 (en) 2000-06-07 2000-06-07 Module for radio communication

Country Status (3)

Country Link
AU (1) AU5689501A (en)
SE (1) SE520151C2 (en)
WO (1) WO2001095679A1 (en)

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US7260890B2 (en) 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
KR20040003890A (en) * 2002-07-04 2004-01-13 (주)에이엔티테크놀러지 A radio frequency module
US7489914B2 (en) 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
EP1731006B1 (en) * 2004-02-23 2007-09-19 Georgia Tech Research Corporation Liquid crystalline polymer- and multilayer polymer-based passive signal processing components for rf/wireless multi-band applications
US7724109B2 (en) * 2005-11-17 2010-05-25 Cts Corporation Ball grid array filter
DE102006007381A1 (en) * 2006-02-15 2007-08-23 Infineon Technologies Ag Ultra-wide-band semiconductor component for ultra-wide-band standard in communication, comprises semiconductor component, ultra-wide-band semiconductor chip and multilevel circuit substrate with lower and upper metal layer
US7808434B2 (en) 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7940148B2 (en) 2006-11-02 2011-05-10 Cts Corporation Ball grid array resonator
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
US7646255B2 (en) 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
DE102006057332B4 (en) 2006-12-05 2018-01-25 Infineon Technologies Ag Assembly comprising a substrate and a chip mounted on the substrate
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CN102074534B (en) * 2009-11-24 2013-05-29 上海长丰智能卡有限公司 Micro PCB radio frequency module and packaging method thereof

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Also Published As

Publication number Publication date
SE0001943L (en) 2001-12-08
AU5689501A (en) 2001-12-17
SE0001943D0 (en) 2000-06-07
WO2001095679A1 (en) 2001-12-13

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