[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SE307620B - - Google Patents

Info

Publication number
SE307620B
SE307620B SE12237/64A SE1223764A SE307620B SE 307620 B SE307620 B SE 307620B SE 12237/64 A SE12237/64 A SE 12237/64A SE 1223764 A SE1223764 A SE 1223764A SE 307620 B SE307620 B SE 307620B
Authority
SE
Sweden
Application number
SE12237/64A
Inventor
T Moore
Original Assignee
American Mach & Foundry
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Mach & Foundry filed Critical American Mach & Foundry
Publication of SE307620B publication Critical patent/SE307620B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49787—Obtaining plural composite product pieces from preassembled workpieces

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Motors, Generators (AREA)
SE12237/64A 1963-10-11 1964-10-12 SE307620B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US315647A US3295089A (en) 1963-10-11 1963-10-11 Semiconductor device

Publications (1)

Publication Number Publication Date
SE307620B true SE307620B (xx) 1969-01-13

Family

ID=23225411

Family Applications (1)

Application Number Title Priority Date Filing Date
SE12237/64A SE307620B (xx) 1963-10-11 1964-10-12

Country Status (4)

Country Link
US (1) US3295089A (xx)
DE (1) DE1254251B (xx)
GB (1) GB1040876A (xx)
SE (1) SE307620B (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3368122A (en) * 1965-10-14 1968-02-06 Gen Electric Semiconductor devices
US3783348A (en) * 1972-10-30 1974-01-01 Rca Corp Encapsulated semiconductor device assembly
JPS5116302B2 (xx) * 1973-10-22 1976-05-22
US4107515A (en) * 1976-09-09 1978-08-15 Texas Instruments Incorporated Compact PTC resistor
US4385310A (en) * 1978-03-22 1983-05-24 General Electric Company Structured copper strain buffer
US4392153A (en) * 1978-05-01 1983-07-05 General Electric Company Cooled semiconductor power module including structured strain buffers without dry interfaces
US4204628A (en) * 1978-07-24 1980-05-27 General Electric Company Method for thermo-compression diffusion bonding
DE2855493A1 (de) * 1978-12-22 1980-07-03 Bbc Brown Boveri & Cie Leistungs-halbleiterbauelement
JPS6142430B2 (xx) * 1979-03-08 1986-09-20 Gen Electric
US4257156A (en) * 1979-03-09 1981-03-24 General Electric Company Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers
US4315591A (en) * 1979-03-08 1982-02-16 General Electric Company Method for thermo-compression diffusion bonding a structured copper strain buffer to each side of a substrateless semiconductor device wafer
US4290080A (en) * 1979-09-20 1981-09-15 General Electric Company Method of making a strain buffer for a semiconductor device
US4252263A (en) * 1980-04-11 1981-02-24 General Electric Company Method and apparatus for thermo-compression diffusion bonding
US4361717A (en) * 1980-12-05 1982-11-30 General Electric Company Fluid cooled solar powered photovoltaic cell
US4574299A (en) * 1981-03-02 1986-03-04 General Electric Company Thyristor packaging system
US4366713A (en) * 1981-03-25 1983-01-04 General Electric Company Ultrasonic bond testing of semiconductor devices
US4444352A (en) * 1981-09-17 1984-04-24 General Electric Company Method of thermo-compression diffusion bonding together metal surfaces
DE3212592C2 (de) * 1982-04-03 1984-01-12 Philips Kommunikations Industrie AG, 8500 Nürnberg Kühleinrichtung für Geräte der Nachrichtentechnik
US6703707B1 (en) * 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
EP1182701A1 (de) * 2000-08-21 2002-02-27 Abb Research Ltd. Verfahren zur Herstellung eines Pufferelementes zur Verminderung von mechanischen Spannungen
US11495517B2 (en) 2017-09-15 2022-11-08 Finar Module Sagl Packaging method and joint technology for an electronic device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2321071A (en) * 1941-06-18 1943-06-08 Bell Telephone Labor Inc Method of assembling dry rectifiers and the like with solder
FR1094755A (xx) * 1955-01-20 1955-05-24
NL204361A (xx) * 1955-04-22 1900-01-01
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
DE1057241B (de) * 1955-12-12 1959-05-14 Siemens Ag Gleichrichteranordnung mit Halbleiterelement
US2977558A (en) * 1958-06-19 1961-03-28 Cutler Hammer Inc Thermal responsive resistance devices
FR1213484A (fr) * 1958-08-04 1960-04-01 Thomson Houston Comp Francaise Milieu conducteur non isotrope pour flux thermique intense
US2978661A (en) * 1959-03-03 1961-04-04 Battelle Memorial Institute Semiconductor devices
NL263391A (xx) * 1960-06-21
AT222227B (de) * 1960-06-23 1962-07-10 Siemens Ag Halbleiteranordnung
DE1141029B (de) * 1960-06-23 1962-12-13 Siemens Ag Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE1250005B (xx) * 1961-02-06 1967-09-14

Also Published As

Publication number Publication date
US3295089A (en) 1966-12-27
DE1254251B (de) 1967-11-16
GB1040876A (en) 1966-09-01

Similar Documents

Publication Publication Date Title
BE627012A (xx)
BE632399A (xx)
BE643045A (xx)
BE31062A (xx)
BE462764A (xx)
BE465565A (xx)
BE507458A (xx)
BE533484A (xx)
BE547422A (xx)
BE571209A (xx)
BE582314A (xx)
BE603935A (xx)
BE608372A (xx)
BE612803A (xx)
BE614220A (xx)
BE616247A (xx)
BE616830A (xx)
BE616967A (xx)
BE619061A (xx)
BE620325A (xx)
BE621232A (xx)
BE621517A (xx)
BE622160A (xx)
BE623117A (xx)
BE623220A (xx)