RU2689267C2 - Light emitting device and adaptive system of driving lights - Google Patents

Abstract

FIELD: physics.SUBSTANCE: invention relates to a light-emitting device and an adaptive driving beam system. Light-emitting device includes a substrate having a first base surface; plurality of first connection circuits, which are formed on a first main surface and extend in a first direction; plurality of second connection circuits, which are formed on first main surface, extend in second direction and are segmented in each second connection scheme; and a plurality of light emitting elements equipped with a first electrode and a second electrode, located on the same front side of the semiconductor folded layers of the structure, wherein plurality of light emitting elements is located along second direction, wherein first electrode is connected opposite first connection circuit, second electrode has first connecting part and second connecting part, which is connected to first connecting part, and the first connecting part and the second connecting part are connected to the second connection circuit and shunt at least two of the segmented second connection circuits in the second direction.EFFECT: invention provides for formation of light-emitting device and adaptive system of driving lights, with which individual switching on and off with complete realization of light-emitting elements efficiency is possible.12 cl, 20 dwg

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority according to Japanese Patent Application No. 2014-222249, filed on October 31, 2014, and No. 2015-187821, filed on September 25, 2015. The contents of Japanese patent applications No. 2014-222249 and 2015-187821 are fully incorporated into the present application by reference.

BACKGROUND

The technical field to which the invention relates.

The present invention relates to a light-emitting device and an adaptive high-beam headlamp system.

Prior art

As for the light-emitting device with light-emitting diodes (LEDs) or other similar light-emitting elements, many light-emitting elements are mounted on an insulated substrate, on which the matrix wiring is already formed. As a result, achieve high brightness, and in recent years, such devices are used as automotive light sources and the like.

However, in the case of forming a matrix connection scheme on a substrate, especially in order to individually turn on and off each of the plurality of light-emitting elements, a multi-layer connection scheme is required, leading to a complex configuration, which requires a complicated manufacturing process and increased production costs. It also leads to an increase in the size of the substrate, preventing the miniaturization of the light-emitting device.

In the past, the product of clamping, attaching, or otherwise attaching a thin-film template of a compound scheme to a raw film of aluminum oxide or other similar ceramics with subsequent calcination, as for example, in JP 2009, was used as a multilayer connection scheme or a circuit board with an inner layer. -135535 A. However, for a light source that requires high mounting density to achieve high brightness, such as for a car light source, the width, pitch, and similar parameters of the circuit pattern are neo microminiaturize; and a decrease in the dimensional accuracy of the pattern of the wiring diagram, caused by the shrinkage that accompanies the firing of ceramics, makes it difficult to design the wiring diagram of the matrix board.

Also, although various types of matrix wiring diagrams for light-emitting devices have already been proposed, for example, in JP 2009-302542 A, it is necessary to design a light-emitting device that matches the pattern of the wiring diagram of the circuit board to adequately guarantee the effectiveness of individual light-emitting elements.

SUMMARY OF INVENTION

The aim of the present invention is to provide a light-emitting device and an adaptive high-beam headlamp system, with which individual switching on and off with the full realization of the efficiency of light-emitting elements is possible.

A light emitting device according to the present invention includes: a substrate having a first major surface; a plurality of first wiring diagrams that are formed on the first major surface and extend in the first direction; a plurality of second connection diagrams that are formed on the first main surface extend in a second direction and segmented in each second connection diagram; and a plurality of light-emitting elements equipped with a first electrode and a second electrode located on the same front side of the semiconductor folded structure. A plurality of light-emitting elements are arranged along a second direction, the first electrode being connected opposite the first coupling circuit, the second electrode having a first connecting part and a second connecting part, which is connected to the first connecting part. The first connecting part and the second connecting part are connected opposite the second connection scheme and at least two of the segmented second connection schemes are shunted in the second direction.

Additionally, the adaptive high-beam headlamp system includes the aforementioned light-emitting device, an on-board camera that recognizes the position of the vehicle in front; and an electronic control unit that determines the light distribution pattern and the area to be shaded.

The present invention can provide a light-emitting device, with which a smaller size is achieved with a simple structure and the possibility of individual switching on and off while achieving sufficient efficiency of the light-emitting elements.

Additionally, a light-emitting device can be used to provide a highly efficient adaptive high-beam headlamp system.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a simplified plan view of an excitation substrate in an embodiment of a light-emitting device disclosed herein;

FIG. 1B is a simplified plan view of the drive substrate of FIG. 1A, onto which light-emitting elements are mounted;

FIG. 1C is a simplified plan view of a light-emitting element showing the arrangement of the electrodes of the light-emitting elements mounted on the excitation substrate of FIG. 1A;

FIG. 1D is a simplified plan view of a light-emitting element showing another arrangement of electrodes for light-emitting elements mounted on the excitation substrate of FIG. 1A;

FIG. 1E is a cross section along the line A-A ’in FIG. 1D;

FIG. 1F is a cross section along the line B-B ’in FIG. 1G;

FIG. 1G is a matrix circuit using an excitation substrate on which light-emitting elements are mounted;

FIG. 2A is a simplified cross section (cut along the line A-A ’in FIG. 1A) of the steps for manufacturing the light-emitting device disclosed herein;

FIG. 2B is a simplified cross section of manufacturing steps for a light-emitting device according to an embodiment of the present invention;

FIG. 2C is a simplified cross section of manufacturing steps for a light-emitting device according to an embodiment of the present invention;

FIG. 2D is a simplified plan view of the light emitting device of FIG. 2C;

FIG. 3A is a simplified plan view showing an example of a drive substrate according to an embodiment of the present invention;

FIG. 3B is a simplified plan view of the drive substrate of FIG. 3A, on which light-emitting elements are mounted;

FIG. 4A is a simplified plan view showing an example of a field substrate according to an embodiment of the present invention;

FIG. 4B is a simplified plan view of the drive substrate of FIG. 4A, on which light-emitting elements are mounted;

FIG. 4C is a simplified plan view of a light emitting element showing the arrangement of the electrodes of the light emitting elements mounted on the excitation substrate of FIG. 4a.

FIG. 5A is a simplified plan view showing an example of a field substrate according to an embodiment of the present invention;

FIG. 5B is a simplified plan view of the drive substrate of FIG. 5A, on which light-emitting elements are mounted;

FIG. 6A is a block diagram of an electrical configuration of an adaptive high-beam headlamp system according to an embodiment of the present invention; and

FIG. 6B is a flowchart of control operations in an adaptive high-beam headlamp according to an embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS

The dimensions and interrelationships of the layout of the components in each of the drawings are sometimes shown in an enlarged view to facilitate explanation. Additionally, in the following description, the same designations or reference numerals may in principle refer to the same or similar components, the repeated descriptions of which are omitted accordingly.

Light emitting device

The light emitting device of this embodiment has an excitation substrate that includes a substrate having a first major surface, a plurality of first connection diagrams that extend in a first direction, and a plurality of second connection diagrams that are formed on the first primary surface, extend in a second direction and segmented on their layout, as well as a multitude of light-emitting elements that are mounted on this excitation substrate and equipped with a first electrode and a second e an electrode located on the same front side of a semiconductor structure folded in layers.

Excitation substrate

Substrate

The substrate has a first major surface. Preferably, the substrate also has a second major surface as the major surface on the opposite side with respect to the first major surface. The first major surface and / or the second major surface should preferably be flat. Preferably, the shape of the substrate is, for example, a rectangular flat plate.

The thickness and size of the substrate can be adjusted accordingly in accordance with the size, quantity, etc. light emitting elements to be mounted. For example, the thickness of the substrate may be from about 0.05 to 10 mm, with a preference from about 0.1 to 1 mm. For example, the size may be from about 50 × 50 mm to 100 × 100 mm.

The substrate can be formed from a material with insulating properties, examples of which include aluminum oxide, aluminum nitride and other similar ceramic substrates, glass substrates, epoxy-glass-reinforced plastic substrates, bakelized paper substrates, paper-based substrates and epoxy resins, glass composite substrates , low temperature ceramic substrates (LTCC), thermoplastic resin substrates, thermoactive resin substrates and other similar resins. Of these, a ceramic substrate is preferred, and a substrate made of aluminum nitride is more preferable from the point of view of heat dissipation. It is also preferable that the thermal conductivity is at least 170 W / m⋅K.

Preferably, the substrate has a monolayer structure, with a ceramic substrate with a monolayer structure being particularly preferred. However, in the manufacturing process, two or more layers can be folded, and finally integrated to form the substrate.

When using a ceramic substrate, it can be made by the method of joint roasting, but preference should be given to the post-roasting method in order to obtain a substrate with a higher dimensional accuracy. Post-firing is a method in which a circuit is formed on a ceramic plate that has already been fired. When the circuit is formed by post-firing, a miniature pattern can be formed by electrolytic deposition, sputtering, vacuum vapor deposition, or the like, including applying the peeling method using a mask pattern using photolithography technology.

The first wiring diagrams and the second wiring diagrams

The first and second connection schemes are formed on the first main surface of the substrate.

The first and second wiring diagrams, for example, are electrically connected to the light-emitting elements and an external power source and are used to supply voltage from an external power source to the light-emitting elements. As discussed below, the first wiring diagrams are connected to the first electrodes of the light emitting elements, and the second wiring diagrams are connected to the second electrodes of the light emitting elements. The first wiring diagrams and the second wiring diagrams can correspond either to the anode or cathode, but preferably, the first wiring diagrams correspond to the cathode, and the second wiring diagrams correspond to the anode.

On the first main surface of the substrate, there are a number of independent first connection schemes, extending in the first direction. Here the “first direction” can be any direction, for example, it can be the direction corresponding to the x axis in two dimensions (such as the direction in a straight line). The concept of a strike in the first electrode is not limited to a straight stroke (as 11 in Fig. 1A and 21 in Fig. 3A), but also encompasses a strike to the first direction in a step shape (41 in Fig. 5A), a curved shape, or a combination thereof . While one first connection diagram extends to the first direction, the first connection diagram may partially branch (split into two, into three (31 in FIG. 4A), etc.) or it may have a part that partially branches. Preferably, the branched first connection patterns are contiguous with each other and extend substantially parallel.

The second wiring diagrams extend in the second direction on the first major surface of the substrate, and they are segmented (thus, as 22x ... in Fig. 3A), and preferably a plurality of these second connection diagrams are located independently of each other (thus, as 22x, 22y and 22z in Fig. 3A, 32x, 32y and 32z in Fig. 4A and 42x, 42y and 42z in Fig. 5A). This second direction here can be any direction as long as it intersects the first connection diagrams extending in the first direction. Preferably, the angle of this intersection is perpendicular to the direction (such as the direction of the columns corresponding to the y axis). However, the term “perpendicular” as used here implies the possibility of deviation of the order of ± 10 °. Also, the concept of location along the second direction is not limited to location in a straight line, but also extends to location along a stepped line, curve, or a combination of these forms, when such a line extends to the second direction.

The term “plurality” as used herein means that the plurality of second connection diagrams are arranged such that they create pairs with a plurality of first connection diagrams. Also, when the second connection diagrams extend along the second direction, they usually intersect the first connection diagrams in one or more places, but in these places corresponding to these intersection points, the second connection diagrams are located without intersecting the first connection diagrams, but being separated from the first connection diagrams. In other words, since the second wiring diagrams are segmented and located at locations corresponding to the intersection with the first wiring diagrams, this can also mean that one of the second wiring diagrams, which is paired with one of the first wiring diagrams, is composed of many segmented parts (segmented sections second connection diagrams). While one of the second connection diagrams is located along the second direction, the second connection diagrams can be arranged parallel and adjacent to each other so as to correspond to branching into two (12 in FIG. 1A), branching into three, etc. They may also be parts that are partially branched.

Preferably, the outer periphery of the first wiring diagrams and the second wiring diagrams are arranged in a regular pattern along the directions of the column and row to create, for example, square, rectangular, diamond shape or the like.

The first and second connection schemes can be formed from materials that conduct electricity, such as a single-layer film or a folded film of gold (Au), silver (Ag), copper (Cu), tungsten (W), nickel (Ni), or other similar metal or alloy. The thickness of the first and second connection diagrams may each be of the same thickness or may differ in thickness. The total thickness of the first wiring diagrams and the second wiring diagrams is approximately, for example, from 1 to 100 μm.

In the case of the formation of the first wiring diagrams and / or second wiring diagrams using folded films, the first wiring diagrams and / or the second wiring diagrams may have partially different structures in the thickness direction or in the plane. For example, a portion of the surface of the first wiring diagrams or second wiring diagrams is removed by laser fit, and the exposed surface of the first wiring diagrams or second wiring diagrams, thus obtained, can be converted to oxide. More specifically, in the case where the first connections are formed with a folded TiW / Cu / Ni / Au structure, the Au film can be removed by laser fitting to expose Ni and the exposed Ni surface can be oxidized.

The width and spacing for the first and second connection diagrams can be adjusted accordingly to obtain size, quantity, density, brightness, etc. light emitting elements mounted on an excitation substrate. For example, preferably, the width of the first wiring diagrams is approximately at least from one fifth to less than half the length of one side of the light emitting element. In the case where two or more first wiring diagrams are arranged for each light-emitting element, their combined width may be approximately in this range. Preferably, the width of the second wiring diagrams is more than one-fifth, but not more than about half the length of one side of the light-emitting element. In the case when two or more second connection diagrams are arranged for each light-emitting element, their combined width can be approximately in this range. Particularly preferably, the second connection schemes are wider than the first connection schemes. Here, the term “wider” means that the length of the second connection diagrams in the first direction (M in FIG. 1A) or in the case when the second connection diagrams branch out, the combined width of the branches (N1 + N2 in FIG. 1A) is greater than the length of the first schemes connections in the second direction (Q in FIG. 1A). This also means that in the case when the first connection schemes branch, the width of the second connection schemes (M in FIG. 4A) is greater than the combined length of the branches of the first connection schemes in the second direction (P1 + P2 + P3 in FIG. 4A).

Performing the second connection diagrams with a width exceeding the width of the first connection diagrams makes it possible to efficiently remove heat from the wider second connection diagrams created in the light-emitting layer during radiation. That is, the area in the light-emitting element (discussed below), in which there is a second conductive layer connected through the second electrode, is an area in which there is a light-emitting layer, and in which heat is generated during radiation. Thus, when this heat is removed first by the second conductive layer, then by the second electrode, and then by the second connection diagrams, it is possible to provide more efficient heat dissipation if the second connection diagrams are broader.

The first wiring diagrams and the second wiring diagrams are located separately from each other on the first main surface of the substrate. In other words, they are not arranged three-dimensionally, but instead are preferably formed by the same layer. Therefore, it is preferable that both of them are formed from the same metal material, namely, one layer or a folded layer of the same metal or alloy. For example, they are preferably formed at the same time by metallic layers of the same composition, using a mask pattern.

The first major surface of the substrate may further include flat-pad electrodes for connecting to electronic parts, such as connectors, routing circuits for guiding the aforementioned first wiring diagrams and second wiring diagrams towards the end of the substrate. With such routing schemes, etc. for example, an electrical connection can be made to an external power source via connectors and other similar electronic parts mounted on the substrate. Preferably, electrodes with a flat contact pad are formed wider than the routing circuit.

When using an excitation substrate configured in this way, the matrix connection scheme can be formed in a single-layer structure on a single-layer substrate. Thus, many light-emitting elements can be mounted with high density, varying the width, length, spacing, etc. connection diagrams as desired. In particular, since there is no need to form a so-called matrix connection scheme with a multi-layer structure, it can be made thinner and smaller. Also, since the steps involved in the manufacturing process of the excitation substrate are extremely simple, it helps not only to prevent an increase in production costs, but also to avoid shrinking the substrate, which makes it possible to obtain an excitation substrate with high accuracy. In addition, since a single-layer structure is used, even when light-emitting elements are placed with high density, heat due to heat generation by the light-emitting elements will not be retained inside the substrate, but instead will be quickly released through the front and back sides of the substrate, so that heat dissipation is even improving.

Also, when using the specified excitation substrate, especially since each of the second connection circuits is segmented by the first connection circuits, in this state the plurality of second connection circuits are not electrically connected to each other. However, as discussed below, in the case where the light-emitting elements are mounted so that they shunt the segmented second wiring diagrams, these segmented wiring diagrams can be interconnected. Thus, a plurality of electrically connected second circuit diagrams are arranged in pairs with the first circuit diagrams. As a result, an excitation substrate can be obtained in which it is possible to provide independent control of the excitation of each of the plurality of light-emitting elements.

Light emitting elements

As light-emitting elements, it is preferable to use light-emitting diodes. Light-emitting elements have, for example, a semiconductor layered structure comprising a first conductive layer, a light-emitting layer and a second conductive layer, formed by any of various semiconductors such as InN, AlN, GaN, InGaN, AlGaN, InGaAlN and other similar nitride semiconductors , compound semiconductors of III-V groups, compound semiconductors of II-VI groups, etc., on a substrate; and also the first electrode and the second electrode are formed. Examples of the substrate of light-emitting elements include sapphire substrates and other similar insulating substrates, as well as substrates of SiC, silicon, GaN, GaAs and other similar conductive substrates. However, in the end, the light-emitting elements do not have to have these substrates, that is, the substrate can be removed after being added together by layers of a semiconductor layer.

The first electrode and the second electrode

The first electrode and the second electrode are connected to the first conductive layer and the second conductive layer, respectively, but it is usually preferable that, in the case of connecting the first electrode to the first conductive layer exposed by removing part of the second conductive layer and the light-emitting layer laid over the first conductive layer, the second The electrode is connected on the second layer of a conductive type semiconductor, the first electrode and the second electrode being located on the same front side of the folded pattern tours. The first conductive layer is preferably n-type, and the second conductive layer is p-type.

The first electrode and the second electrode are usually located inside the light-emitting elements in plan view. The position and size of the first and second electrodes is preferably adjusted in order to ensure a reliable connection with the first connection and the second connection of the excitation substrate.

For example, the first electrode is preferably located in the central part of the light-emitting element, and the second electrode is positioned so that it surrounds the first electrode. The first wiring diagram, connected to the first electrode, is located covering the segmented second wiring diagram from two sides, so that the first electrode preferably has a width that is the same or smaller than the width of the first wiring diagram. A plurality of first electrodes may also be located on the surface of the second conductive layer.

The second electrode usually has a wide-area electrode covering virtually the entire surface of the second conductive layer so that the current is evenly distributed in the plane to the second conductive layer, and an electrode with a flat contact pad, whose upper surface is the connecting section for connecting the second wiring, . The wide electrode is preferably an ohmic electrode that can provide a good electrical connection to the second conductive layer. A wide electrode is usually formed over the entire surface of a semiconductor layer with a folded structure different from the area where the first electrode is formed, so that the entire surface other than the area where the electrode with the flat contact pad is formed is preferably covered with an insulating protective film or the like. Preferably, there are a plurality of connecting portions, such as a first connecting portion and a second connecting portion, and there may be additionally one or more other connecting portions. These connecting portions are electrically connected to the wide electrode. The width of the first connecting portion and the second connecting portion of the second electrode preferably corresponds to the width of the second wiring diagram. These sections may all have the same width, but may have different widths.

Since, thus, the second electrode is connected to a plurality of second connection circuits by interconnected connecting portions, the segmented second connection circuits can be connected by the second electrode of the light-emitting elements, so that the connection diagram pattern can be made more miniature and the matrix connection diagram can be made template, that is, without the use of a multi-layer connection scheme of the substrate of the connection scheme. In addition, the current can flow through the segmented second wiring diagram using the second electrode, in addition to the inside of the semiconductor structure folded in layers, so that the conductive resistance can be reduced when the current is applied. This makes it possible to reduce the heat generated during the illumination of the light-emitting element, as a result of which the reliability of the light-emitting device can be improved.

The second electrode may have an area opposite the first wiring diagram when mounting the light-emitting elements on the excitation substrate. In this case there may be a gap, such that the second electrode and the first electrode will not contact. Alternatively, as discussed above, an insulating protective film can be formed on the surface of the first circuit in the region opposite the second electrode or on the surface of the second electrode in the region opposite the first circuit. This reliably prevents short circuits.

Examples of an insulating protective film include oxides, nitrides, and fluorides of silicon, aluminum, niobium, zirconium, titanium, and the like, either as a single-layer film or a multi-layer film. Film thickness can be adjusted if necessary.

The first electrode and the second electrode can be formed, for example, from aluminum, silver, gold, platinum, palladium, rhodium, nickel, tungsten, molybdenum, chromium, titanium or another similar metal or their alloy, or ITO or other similar oxide conducting material, either in the form of a single-layer film or a multi-layer film. The thickness of the film can be any that is used in this area.

The wide electrode also acts as a reflective layer, which reflects the light emitted by the light-emitting layer in the direction of the surface that produces the light. Thus, this wide electrode is preferably formed in such a way that it has a good reflectivity for a wavelength of at least light emitted by a light-emitting layer. The wide electrode is preferably, for example, a single-layer film consisting of silver or silver alloy with high optical reflectivity. The wide electrode can also be a multilayer film with a film consisting of nickel or titanium or the like, in which the aforementioned silver or silver alloy film is the bottommost layer.

When using silver as a wide-spread electrode, it is preferable to provide a covering electrode that will cover the wide-spread electrode. The covering electrode dissipates current over the entire surface of the second conductive layer in the same way as a wide-spread electrode. In addition, the cover electrode covers the top and side surfaces of the wide-spread electrode, shields the electrode and prevents contact between the wide-spread electrode and the second electrode. Thus, the coating electrode functions as a barrier layer to prevent migration of the material of the wide-spread electrode and, in particular, silver. The coating electrode may be formed, for example, from one or more metals selected from the group comprising titanium, gold, tungsten, aluminum, copper, etc., or an alloy of these metals. The covering electrode may be a single layer film or a multilayer film. More specifically, the coating electrode may be a single-layer film of Al-Cu alloy, Al-Cu-Si alloy or the like, or a multi-layer film that includes such a film. Both the wide-spread electrode and the covering electrode can be formed by sputtering, vapor deposition, or the like.

The surfaces of the first electrode and the second electrode are usually not at the same level, since the first electrode and the second electrode are connected to different surfaces at different levels in the semiconductor layer. However, it is preferable that in the case where the thickness of the first electrode and the second electrode is adjustable, or a bar electrode, a conductive single-layer film or a folded film or the like. located on the first electrode and the second electrode, so that these two surfaces are formed essentially at the same height, that is, so that their surfaces are at the same height. Such a configuration makes it more reliable to mount the excitation substrate of a light-emitting device without short circuits.

Light-emitting elements can usually be mounted face-up when the insulated side of the substrate of the light-emitting elements is bonded to the excitation substrate, but preference should be given to mounting using an inverted-chip method. For this installation, it is preferable to use a bonding component selected from the following list: tin-bismuth, tin-copper, tin-silver, gold-tin solder, conductive silver, gold, palladium paste or the like. , a bushing (a printed bushing, a pin bushing, a bushing formed by electrolytic deposition, etc.), an anisotropic conductor, low melting point metal or, for example, other similar solder or the like

When mounting light-emitting elements using the inverted crystal method, the first electrode and / or the second electrode are preferably connected to the first connection circuit and / or the second connection circuit via a pin pin or a ball pin from the solder. It is especially desirable for the second electrode to be connected to the second circuit via a male pin. Since the second electrode functions as a metal component that shunts the segmented second circuit, it is necessary that it is not electrically connected to the first circuit, but connected to the second circuit not less than at two points. Accordingly, it is preferable that this connection is made using a component capable of withstanding a constant height, without spreading, in order to prevent contact with the first wiring diagram, which is positioned so that it segments the second electrode. The term "pin bar pin" as used here means that there is a wire (pin) of a specific length (height) on the pressure ball, which is pressed into the electrode. Typically, a pin barb terminal may be formed by a device for fastening wires or a device for fastening bar lines. The light-emitting elements that are connected in this way preferably have the aforementioned bonding component mounted between the electrode and the wiring diagram to strengthen the bonding.

The solder ball lead preferably has a core and a coating on the outside of the core, the melting point of which is below the melting point of the core. The core must retain its shape during flashing of the solder using a ball pin from the solder. More specifically, it is preferable that when copper is used as the main component of the core, the coating is made of an alloy containing gold and at least one or more of: silicon, germanium and / or tin. It is also desirable to have a special underlying layer surrounding the core with a tin-based film coating. Nickel, Ni-B, Ni-P or the like can be used as the underlying layer. Here the tin-based coating film may be a single-layer tin alloy coating film, or it may be a multilayer film of tin and other constituent alloys or tin alloy. In this case, a multilayer film of tin or other components of the alloy or alloy of tin, tin and other components of the alloy or tin alloy melts at the stage of melting the solder to form a bar pin of the copper core ball over the mounting of the excitation substrate, which forms a uniform layer of melt.

Preferably, the core contains copper as its main component (i.e., the copper content is at least 50% of its mass). In particular, it is desirable to use a ball pin from a copper alloy with one or several components: tin, phosphorus, nickel, gold, molybdenum or tungsten, or a ball pin with a copper content of at least 99% of its mass, which will provide excellent thermal conductivity and electrical conductivity.

To prevent the bonding component from spreading, as described above, part of the surface of the first circuit or second circuit is preferably removed by laser fitting, and the exposed surface of the first circuit or second circuit is thus converted to oxide. This makes it possible to stabilize the position and shape of the fastening component even when a barbed pin or the like is used to secure the connection scheme and electrode.

When using a light-emitting device disclosed herein, light-emitting elements are mounted over the first connection scheme of the above-mentioned excitation substrate and over at least two of the second connection schemes (two or more, when the second connection scheme is segmented) that are located separately from each other on either side of the first connection scheme . The first electrode of the light-emitting elements is connected in the first circuit, and the second electrode in the second circuit. Preferably, two or more light-emitting elements are placed in the second direction, but even more preferably, two or more elements are placed in both the first and second direction. Thus, the first wiring diagram and the second wiring diagram are electrically connected in a matrix, for example, in the first direction and in the second direction, or in a row in the second direction by arranging the light-emitting elements in the locations corresponding to their intersection points. This allows you to independently control the excitation of light-emitting elements. In this way, the required number of light-emitting elements can be turned on or off at the required places. It is also possible to control the amount of current for the desired light-emitting elements, and an appropriate contrast can be provided in the light-emitting device. In particular, as discussed above, when the second electrode of the light-emitting elements is connected to two or more segmented second junction circuits, the current can flow through the segmented second junction circuits using the second electrode in addition to the inside of the semiconductor layered structure, so that the conductive resistance can be lower current supply time.

And since a light-emitting device can be obtained, with which the light-emitting elements can be switched on and off as desired, this can be effectively used in an adaptive headlight system in the form of a so-called adaptive headlight, as discussed below.

Reflective component

Preferably, each of the light emitting elements mounted on the excitation substrate has a reflective component formed around the light emitting element. The reflective components are preferably arranged in contact with the side surfaces of the light-emitting elements. The reflective components are arranged so that they surround the connecting components of the first electrode and the first circuit, the second electrode, and the second circuit between the substrate and the light-emitting elements. The reflective components may be arranged for each light-emitting element or for a group of light-emitting elements, but preferably they are integrally formed with respect to all the light-emitting elements. This makes it possible to efficiently output the light emitted by the light-emitting elements from the side of the surface that outputs the light (upper or lower surfaces of the light-emitting elements). It also makes it possible to achieve clear boundaries of brightness between the radiation area and the area from which there is no radiation, providing a state of radiation that gives better visibility.

As a reflective material from which the reflective component is made, it is preferable to use a material capable of effectively reflecting the light emitted by light-emitting elements, etc., but it is even more preferable to use a material capable of reflecting at least 80%, and more preferably 90% The peak wavelength of this light. Preferably, this is an insulating material.

There are no specific limitations on the reflective material, but a material capable of reflecting light, such as particles of SiO ₂ , TiO ₂ , ZrO ₂ , BaSO ₄ , MgO, ZnO, etc., is preferable. These materials can be used alone or in combination with two or more types. These materials are usually used as a mixture with thermosetting resins, thermoplastic resins, or the like, specific examples of which include epoxy resin compositions, mixtures of silicone resins; silicone modified epoxy resins and other similar mixtures of modified epoxy resins; epoxy-modified silicone resin compositions and other mixtures of such modified silicone resins; hybrid silicone resins; mixtures of polyimide resins and mixtures of modified polyimide resins; polyphthalamide (PPA); polycarbonate resins; polyphenylene sulfide (PPS), liquid crystal polymers (LCP); ABS resin; phenolic resins; acrylic resins; PBT resins and other similar resins.

The thickness of the reflective element is preferably, for example, from 1 to 100 μm. Particularly preferably, when the upper surface of the reflective component does not cover the upper surfaces of the light-emitting elements, it is formed so that it is located either at the actual level of the upper surface of the light-emitting elements or above the upper surfaces of the light-emitting elements. This prevents scattering of the set of light-emitting elements in the lateral direction. Also, the reflective element can block strong light emitted from the side surfaces of the semiconductor layer including the light-emitting layer, and the color unevenness can be reduced. It is also preferable that the aforementioned reflective material comprises at least 40% of the total mass of the reflective element to increase the reflectivity.

Wavelength conversion layer

The wavelength conversion layer converts the light from the light-emitting elements to another wavelength, and is preferably located in the light-emitting device on the side with the light-emitting elements producing light. Phosphor or quantum dots can be used as a layer for wavelength conversion.

Examples of the phosphor forming the phosphor layer as one of the wavelength conversion layers include nitride-based phosphors or oxynitride-based phosphors, mainly activated by lanthanides, such as europium or cerium, and sialon-based phosphors. More specific,

(A) phosphors based on α- or β-sialons or various phosphors based on silicates of alkaline-earth metal nitrides, which are activated by europium,

(B) phosphates based on alkaline earth metal apatites of halogens, phosphors based on alkaline earth metal halogen silicates, phosphors based on alkaline earth metal silicates, phosphors based on alkaline earth metal borates halogens, phosphors based on alkaline earth metal aluminates, phosphors based on silicates of alkaline-earth metals, phosphors based on sulfides of alkaline-earth metals, phosphors based on thiogallates of alkaline-earth metals, phosphors based on silicates Trid alkaline earth metal germanate phosphors are based on salts, which are activated lanthanide, such as europium, or transition metals such as manganese,

(C) phosphates based on aluminates of rare earth metals, phosphors based on silicates of rare earth metals, which are activated by lanthanides, such as cerium, or

(D) organic matter and organic complexes that are activated by a lanthanoid element, such as europium.

Examples of quantum dots include nanosized highly dispersed particles of semiconductor materials, for example, semiconductors from group II-VI, group III-V and group IV-VI, in particular Cd-Se, CdS _X Se _1-X / ZnS, core-shell type , GaP, InP, and GaAs. In addition, InP, InAs, InAsP, InGaP, ZnTe, ZnSeTe, ZnSnP, and ZnSnP ₂ are included in these examples.

The phosphor layer is usually located on the upper surfaces of the light-emitting elements, at about the same time that the light-emitting elements are mounted on an excitation substrate of substantially the same size and shape as the light-emitting elements or with a somewhat larger size.

The phosphor layer can be formed by adhesive bonding, electroplating, electrostatic coating, spraying, vapor deposition, sealing, photolithography, sputtering, or another similar method. Adhesive bonding allows you to form a phosphor layer simply by fixing a sheet or plate that evenly includes the phosphor layer. Electrodeposition, electrostatic coating, sputtering and vapor deposition allow the phosphor layer to be fixed without using a binder material over the entire substrate and light-emitting elements. After fixing the phosphor layer, it can be impregnated with a resin or the like, which serves as a binder. The phosphor can be selectively fixed by using the phosphor distributed in the translucent element during sealing, photolithography or spraying. Here, the translucent element can be formed from a material capable of transmitting at least 60%, preferably at least 70%, and even more preferably at least 80% of the peak wavelength of the light-emitting elements and can be selected when necessary from among the above-mentioned thermoplastic resins, thermosetting resins, etc.

The thickness of the phosphor layer can be adjusted in accordance with the manufacturing method, such as the conditions and duration of the deposition of the phosphor particles. For example, preferably from 0.01 to 100 microns. Preferably, the phosphor layer has a substantially uniform thickness.

When forming the reflective component as discussed above, it is also preferable to cover the side surfaces of the phosphor layer, as is done with the side surfaces of the light-emitting elements. This allows you to reliably output the light emitted by light-emitting elements from surfaces that emit light, regardless of the switching on and off of adjacent light-emitting elements. It is preferable to cover all side surfaces of the phosphor layer with a reflective component both in the thickness direction and around the outside. This allows you to more effectively achieve the above results.

In addition, in accordance with the layout of the above-mentioned routing schemes, etc., connectors or other similar electronic parts can be mounted. A protective element can also be mounted.

Adaptive High Beam Headlamp System

When using an adaptive high-beam headlamp system, when driving a vehicle with the high-beam headlights on when there is a vehicle in front (for example, a vehicle in the oncoming lane or a vehicle in the same lane), or in front of the vehicle means a pedestrian appears, the on-board camera recognizes the position of the vehicle in front or the pedestrian, reduces the light only in this place and maintains high brightness of the rays in other places eniyah. The shaded area is automatically distinguished from the area illuminated by the headlights so that it coincides with the location of the vehicle in front or the person, which prevents the driver from blinding the vehicle in front of the vehicle or pedestrian. On the other hand, the driver of this vehicle will always have a field of view close to the field when driving with a high beam, so that the driver can easily see pedestrians, road signs, the shape of a road from a distance, etc., resulting in a safer driving.

This system has the aforementioned light-emitting device, an onboard camera that recognizes the position of the vehicle in front or the person, etc., and an electronic control unit that determines the area to be shaded, and the light distribution pattern. With this configuration, the light-emitting device performs the role of an adaptive high-beam headlamp, which is used to control the shading or illumination of a specific place by turning on and off individual light-emitting elements as a result of the corresponding action of the onboard camera, electronic control unit, etc.

Thus, there is no need to have a drive unit (ACT) for moving the lenses or the hinge lamp assembly or the like, which is required in devices of traditional automotive high beam headlights, and similar control can be achieved simply by turning the light-emitting elements on and off.

A light emitting device typically acts as a pair of adaptive car headlights, located on the left and right side of the vehicle. As discussed above, each light-emitting device is equipped with a plurality of light-emitting elements. In addition to these light-emitting elements, the light-emitting device may also have a projection lens, a reflective mirror, headlight housings to accommodate them, etc.

The on-board camera captures the image of what is in front of the vehicle and transmits the results to an electronic control unit.

An electronic control unit typically consists of a microprocessor that includes a central processing unit (CPU), random access memory (RAM), read-only memory (ROM) and / or input / output (I / O), etc. Programs for managing light distribution, etc. stored in ROM. RAM is used as a workspace when the CPU performs calculations of various kinds, etc.

An electronic control unit connected to the onboard camera detects front-going vehicles (oncoming vehicles, vehicles in the same lane, pedestrians), as well as other objects on the road, carriageway dividing lines, etc., and calculates the data necessary to control the light distribution, such as attributes, positions, etc. these objects. The electronic control unit determines the light distribution pattern suitable for the driving situation based on the calculated data.

The electronic control unit then determines the amount of control for the light-emitting device necessary to obtain the specified light distribution pattern. The scope of control here is, for example, position, range, etc. the shaded area, and the control details for the various light-emitting elements in the light-emitting device (regardless of whether they are turned on or off, power on, etc.) are determined based on the amount of control.

The electronic control unit is usually connected to light-emitting devices through a pathogen. Thus, certain control details are sent by the driver to the light-emitting device, and the specific on / off switching of the light-emitting elements in the light-emitting device is controlled.

Next, with reference to the drawings using specific terms, embodiments of the excitation substrate, a light-emitting device, and an adaptive high-beam headlamp system disclosed herein are described.

Option 1 implementation

Excitation substrate

As shown in FIG. 1A, the excitation substrate 10 used by the light-emitting device 90 in this embodiment has a substrate 13, first connection schemes 11 (examples of components of the first connection scheme) and second connection schemes 12 (examples of components of the second connection scheme).

The substrate 13 is formed in the form of a single-layer structure made of aluminum nitride. Its size is 10 × 10 mm, and the thickness, for example, is 0.5 mm.

The first connection scheme 11 and the second connection scheme 12 are formed as TiW / Cu / Ni / Au folded structure (starting from the substrate 13) on the first main surface 13a of the substrate 13. TiW and copper films are each 0.1 μm thick formed spraying through a mask on the substrate 13, and films of nickel and gold are formed on its surface by applying a coating with a thickness of 1.27 μm and 1.5 μm, respectively.

When the first major surface 13a of the substrate 13 is in the xy plane, for example, there are four first connection schemes 11 arranged extending in the x-axis direction (as the first direction) as indicated by the arrow. For example, the width Q of the first connection circuit 11 is 100 μm and its length is 3 mm. The interval between adjacent first connection circuits 11 is 500 μm.

The second connection schemes 12 are arranged in an amount corresponding to four to form pairs with the first four connection schemes 11, along the y axis (as the second direction), as indicated by the arrow. The second connection diagrams 12 located along the y-axis direction are located separately from each other. Also, one second circuit 12 of connections forks into two from the other end. Thus, the two second connection circuits 12 are located adjacent from the far end of the first connection circuits 11 and between the connection circuits 11. The width M of the second connection circuit 12 is 540 μm, the width of the N1 and N2 of one branch of the second connection circuit 12 is 220 μm, the interval between the branched adjacent second connection circuits 12 is 100 μm, and its length is 480 μm.

Thus, the second connection circuits 12 are segmented by the first connection circuits 11, and in this state of the excitation substrate 10, the second connection circuits 12 are not electrically connected to each other. However, the segmented second connection circuits 12 are connected as a result of mounting the light-emitting elements (discussed below), and then the plurality of electrically connected second connection circuits 12 (here there are four) are arranged in such a way that they form pairs with the first connection circuits 11. The result is an excitation substrate that allows you to excite many light-emitting elements to control independently of each other.

The first connection circuits 11 and the second connection circuits 12 are respectively connected to the routing circuits 11a and 12a from the other end (other than the distal end), with the routing circuits 11a and 12a extending to the electrodes 11b and 12b with a flat contact area used as connectors, located at the end of the substrate 10 excitation. The excitation substrate 10 thus configured makes it possible to form matrix connection schemes in a single-layer structure on a single-layer substrate 13, so that a plurality of light-emitting elements can be mounted with high density by varying the width, length, spacing, etc. wiring diagrams as needed. In particular, since it is not necessary to form matrix connection schemes from a multilayer structure, its thickness or dimensions can be kept small. Also, the use of a single-layer structure means that even if the light-emitting elements are high-density, the heat accompanying the radiation of the light-emitting elements will not be retained inside the substrate, but can be quickly released from the front and rear surfaces, so that more efficient heat dissipation can be provided.

Since the stages of manufacturing such an excitation substrate are extremely simple, it is possible to contain the growth of costs for its manufacture. In addition, the expansion and contraction of the substrate, etc., can be avoided, which makes it possible to obtain an excitation substrate with more accurate dimensions.

Light emitting device

As shown in Figures 2C and 2D, the light emitting device 90 in this embodiment is configured so that sixteen light emitting elements 14 are mounted on the above excitation substrate 10, as shown in FIG. 1B.

As shown in Figures 1D, 1E and 1F, for example, each light-emitting element 14 contains a semiconductor folded SC plastic, which includes a first conductive layer, a light-emitting layer and a second conductive layer on a sapphire substrate S, the first electrode 15 and the second electrodes 16 formed on the same side of the specified semiconductor plastic folded layers of SC.

As shown in FIG. 1C, the first electrode 15 and the second electrodes 16 are located inside the light-emitting element 14 in plan view. The first electrode 15 has a circular shape with a diameter of approximately one quarter to one third of one side of the light-emitting element 14, for example, and is located in the center of the light-emitting element 14. The second electrodes 16 are placed so that they surround the first electrode 15, the outer shape of which approximately coincides or has a slightly smaller size than the light-emitting element 14.

The first electrode 15 and the second electrodes 16 have different positions on the connected semiconductor layer, so that the surface of the semiconductor layer on which these electrodes are formed is stepped at the beginning. However, the surfaces of the first electrode 15 and the second electrodes 16 can be formed at almost the same level, that is, formed so that they are located at the same height by adjusting the thickness of the conductive single-layer film or the folded film layers, for example, the electrode used for an external connection connected to the first electrode and the second electrodes, or the thickness of the first electrode and the second electrodes.

When said light-emitting elements 14 are mounted on excitation substrate 10, the light-emitting elements 14 are mounted face up. In this embodiment, the first electrode 15 is connected to the first connection circuit 11 via a pin pin made of gold, and the second electrodes 16 are connected to the second connection circuit 12 via a pin pin, also made of gold.

In the case where the second electrodes 16 and the second circuits 12 of the joints 12 are connected with AuSn or other solder material as a bonding component, for example, instead of using the pin bar, the solder material will spread along the shape of the second electrodes 16. As shown in Figures 1B and 1C, a part of the first connection circuit is opposite the second electrodes 16 of the light-emitting elements 14. Accordingly, with this use of the bonding component, a short circuit can be prevented between the first mi connection circuits 11 and second electrodes by forming a protective film consisting, for example, of SiO ₂ , for example, in the region opposite the second electrodes 16 of the first connection circuit 11. When a component other than solder is used as the bonding component, i.e., the bar terminal is used as described above, it is also preferable to form a protective film in the region opposite the second electrodes 16 of the first connection circuits 11.

More specifically, as shown in Figures 1D-1F, on the surface of the second electrodes 16, it is preferable to form a protective film 19 so as to expose at least two connecting parts or 16a and 16b (for example, four connecting components 16a, 16b, 16c and 16d), and also expose the first electrode 15.

The light emitting element 14 is fixed by the binding component, so that the first electrode 15, located in the center, is located in the center in the x direction of the two second connection circuits 12, which are separate arcs from each other on either side of the first connection circuit 11 (for branching, two on each side ). Also, the light-emitting element is fixed by the fastening element so that both sides of the second electrodes 16 surrounding the first electrode 15 are each arranged on two of the second circuits 12 connections. Therefore, the second connection circuits 12 are electrically connected in the y direction by the light-emitting element 14 at mutually isolated points without intersection.

Accordingly, an independent control of the excitation of each of the light-emitting elements can be provided. As a result, the light-emitting elements can be turned on or off in the desired places and in the required amount. You can also adjust the amount of current for the respective light-emitting elements, and you can ensure the contrast in the light-emitting device.

In addition, since the second electrodes 16 are connected to the second connections 12, which are segmented by a plurality of connection components 16a-16d, current can flow through the segmented second connection circuits using the second electrode, so that the conductive resistance can be lower when current is applied.

The phosphor layer is provided in the form of a wavelength conversion layer 17 for each of the light emitting elements 14 on the surface opposite the excitation substrate 10. The wavelength conversion layers 17 are actually the same size and shape as the light-emitting elements 14. The wavelength conversion layers 17 are formed of glass containing YAG and have a uniform thickness over the entire surface, which is 100 μm.

The reflective element 18 is integrally formed on the substrate 10 excitation, where sixteen light-emitting elements 14 are mounted so that the reflective element 18 is in contact with the surfaces of the inner side of the light-emitting elements 14 and is located between the light-emitting elements 14 and the excitation substrate 10.

The reflective element 18 is formed from a silicone resin with a 30% TiO ₂ content by weight. The size of the reflective element 18 is 2.5 × 2.5 mm, and its thickness is about 0.25 mm.

The reflective element 18 also covers all side surfaces of the wavelength conversion layers 17, and its upper surface coincides with the upper surface of the wavelength conversion layers. Therefore, the light of the light-emitting elements can be reliably output from the light output surface, regardless of the switching on and off of the adjacent light-emitting elements.

As shown in FIG. 1G, the light-emitting device 90, configured as described above, has a complete matrix circuit as a result of mounting the light-emitting elements, so that it is possible to freely control the on and off of the corresponding light-emitting elements in the desired quantity.

The manufacture of the aforementioned light-emitting device can be made as follows.

First, as shown in FIG. 2A, preparation of the excitation substrate 10 and the light-emitting elements 14 is being performed. The light-emitting elements 14 are mounted by means of the dummy bar terminals in a 4 × 4 matrix. The interval between the light emitting elements 14 is, for example, 100 μm.

Then, as shown in FIG. 2B, the wavelength conversion layers 17 are applied to the light-emitting elements 14. The wavelength conversion layer 17 can be fixed to the light-emitting elements 14, for example, with a translucent adhesive agent.

After that, as shown in FIG. 2C, 16, the light-emitting elements 14 are integrally covered by the reflective component 18. The reflective component 18 is formed, for example, by pressing in the upper and lower forms. The surfaces of the inner side of the light-emitting elements 14 and between the light-emitting elements 14 and the substrate 13 are covered with a reflective component 18, and the upper surface of the reflective component 18 coincides with the upper surface of the wavelength conversion layers.

Modified Example 1: Excitation Substrate

As shown in FIG. 3A, the excitation substrate 20 in this modified example has a substrate 13, first connection circuits 21, and second connection circuits 22. The first connection circuits 21 and the second connection circuits 22 extend in the direction of the x-axis and in the direction of the y-axis, respectively, so that the light-emitting elements are arranged in a 3 × 3 matrix.

The first connection circuit 21 is disposed extending in three parallel rows in the x-axis direction as indicated by the first connection circuits 21x, 21y and 21z.

The second connection circuit 22 is arranged in an amount corresponding to three rows for the formation of pairs with three rows of the first connection circuit 21 along the y-axis direction, as indicated by the second connection circuits 22x, 22y and 22z. However, the second connection circuits 22x, 22y and 22z, located along the y-axis direction, two are located between the first connection circuits 21, one at the far end of the first connection circuits 21 and the other at the other end, all four being separated from each other.

The width M of the second circuit 22 of the connections is 540 μm, and the length 480 μm. The width Q of the first circuit 21 of the connections 21 is 100 μm.

Otherwise, this configuration essentially coincides with the configuration of the excitation substrate in Embodiment 1.

As shown in FIG. 3B, the light-emitting elements 14 are fixed by the bonding component on the excitation substrate 20, so that the first electrode located in the center is located centrally in the x-axis direction of the two second excitation circuits 22 located separately from each other on each side of the first connection circuit 21. They are also fixed by the fastening component so that both sides of the second electrodes located around the first electrode are located each on two of the second circuits 22 connections.

Therefore, the first connection circuit 21 and the second connection circuit 22 are electrically connected to each other in a low resistance state in the x direction and the y direction, by means of the light emitting elements 14 at their intersection points, but disconnected from each other. Thus, the result is essentially the same as embodiment 1 of the excitation substrate.

An implementation option 2

Excitation substrate

As shown in FIG. 4A, the excitation substrate 30 in this embodiment has a substrate 13, a first connection circuit 31, and a second connection circuit 32. The first connection circuit 31 and the second connection circuit 32 are located in the x-axis direction and the y-axis direction, so that the light-emitting elements are located in a 3 * 3 matrix.

The first circuit 31 of the connections is located extending in three rows in the direction of the x axis. However, one row of the first circuit 31 of the connections forks into three.

The second connection circuit 32 is arranged in an amount corresponding to three rows for forming pars with three rows of the first connection circuit 31 along the y-axis direction, as indicated by the second connection circuits 32x, 32u, 32z. However, the second circuits 32x, 32u, 32z located along the y-axis direction, two between the first circuits 31 connections are located, one at the far end of the first connection circuit 31 and one at the other end, all four of which are separated from each other.

Otherwise, this configuration essentially coincides with the configuration of the excitation substrate in Embodiment 1. Light emitting elements

When using the light-emitting device of this embodiment, as shown in FIG. 4C, the light emitting elements 24 are such that the semiconductor folded SC plastic, including the first conductive layer, the light emitting layer and the second conductive layer, is superimposed on the sapphire substrate S, and the first electrodes 15 and the second electrodes 16 are formed on the same front side that and semiconductor layered plastic SC.

In the plan view, three electrodes from among the first electrodes 15 are arranged parallel to each other within the light-emitting elements 24 in accordance with the pattern of the first wiring diagrams of the excitation substrate discussed above. The width of the first electrodes 15 is about 70 microns, and the length is about 420 microns. Above and below are four second electrodes 16 parallel to the electrodes 15 as connecting components 16a-16g.

Otherwise, this configuration is essentially the same as the configuration of the light-emitting device in Embodiment 1.

As shown in FIG. 4B, the light emitting element 14 is fixed by the bonding component on the excitation substrate 30, so that the first electrodes located in the center are centered in the x direction of the two second circuits 32 connections arranged separately arcs from each other on either side of the first electrode 31. It is also fixed binder component, so that both sides of the second electrodes surrounding the first electrodes are located on the two second connections 32.

Thus, the first connection circuits 31, the second connection circuits 32 are electrically connected to each other in a state of low resistance in the x direction and the y axis direction by the light emitting elements 14 at the places where these connections do not intersect and are separated from each other. Thus, essentially the same effect is achieved as in the excitation substrate of Embodiment 1.

Modified example 2: substrate excitation

As shown in FIG. 5A, the excitation substrate 40 in this modified example has a substrate 13, a first connection circuit 41 and a second connection circuit 42. The first connection circuit 41 and the second connection circuit 42 are located in the x-axis direction (in a stepwise manner) and in the y-axis direction, respectively, so that the light-emitting elements are arranged in a 3 × 3 mother.

The first connection circuit 41 is arranged in three step rows in the direction of the x axis. The number of placed second connection circuits 42 corresponds to three rows for pairing with three rows of first connection circuits 41 in the y-axis direction, as indicated by the second connection circuits 42x, 42y and 42z. However, the two rows of the second connection circuit 42, located in the y-axis direction, are located between the first connection circuit 41: one at the far end of the first connection circuit 41, and the other at the other end, all four being separated from each other. Three rows of the second connection circuit 42 are shifted in the direction of the y axis in accordance with the steps of the first connection circuit 41. Otherwise, this configuration essentially coincides with the configuration of the excitation substrate in Embodiment 1.

 As shown in FIG. 5B, the light-emitting element 14 is fixed by the bonding component on the excitation substrate 40, so that the first electrodes are centrally located in the center in the x-direction of the two second connection circuits 42, placed separately from each other on either side of the first electrode 41. They are also fixed fastening component, so that both sides of the second electrodes surrounding the first electrodes, are located on the two second circuits 22 connections.

Thus, the first connection circuit 41 and the second connection circuit 42 are electrically connected to each other in a low resistance state in the x direction and the y axis direction by the light-emitting elements 14 at the places where these connections do not intersect, and are separated from each other. Thus, essentially the same effect is achieved as in the excitation substrate of Embodiment 1.

An implementation option 6: Adaptive headlamp beam system

As shown in FIG. 6A, the adaptive high-beam headlamp system 50 in this embodiment has a light-emitting device of embodiment 2 in the form of adaptive high-beam headlights 51 and also has an onboard camera 52 that recognizes the position of the vehicle in front, as well as an electronic control unit 54, which defines the light distribution pattern and the area to be shaded.

Light-emitting devices function as a pair of adaptive automotive headlights 51 high beam, located on the left and right side of the vehicle. Light-emitting devices are equipped with light-emitting elements, as well as a projection lens and headlamp housing for placement.

The on-board camera 52 captures the image of what is in front of the vehicle and transmits the results to the electronic control unit 54 through the exciter 53.

The electronic control unit 54 typically consists of a microprocessor, which includes a central processing unit (CPU), random access memory (RAM), read-only memory (ROM) and / or input / output (I / O), etc. Programs to perform light distribution control, etc. stored in ROM. RAM is used as a workspace when the CPU performs calculations of various kinds, etc.

Sequence of management operations

An adaptive high-beam headlamp system 50 configured in this way can perform the control as shown in FIG. 6B.

First, the on-board camera 52 captures the necessary data from the front of the vehicle (S10). This data represents the image in front of the vehicle, the speed of the vehicle, the distance between the vehicles, the shape of the road, the light distribution diagram, etc. The received data is sent to the electronic unit 54 controls.

The electronic control unit 54 performs data processing based on the obtained data (S20). As a result of processing this data, attributes of an object that is in front of the vehicle (traffic lights, street lights, etc.), attributes of vehicles, etc. are calculated. (oncoming vehicle, vehicle in front on a given lane, pedestrian) vehicle speed, distance between vehicles, object brightness, road profile (lane width, straight road section), etc.

Next, the electronic control unit 54 determines, based on the calculated data (S30), a suitable light distribution pattern. The selected light distribution pattern is, for example, a high beam distribution pattern, a focused light distribution pattern used when driving a vehicle at high speed, a diffuse light distribution pattern used when driving a vehicle at low speed, a passing beam pattern used in detecting an opposing light. vehicle etc.

The electronic control unit 54 determines the amount of control regarding whether to turn on or off certain light-emitting elements in the adaptive headlamp 51 of the main beam, and whether the power is turned on (S40).

The electronic control unit 54 converts certain amounts of control into the data of the pathogen and controls the excitation of the adaptive high-beam headlamp 51 via the exciter S53 (S50). That is, for the implementation of the required light distribution pattern, the required number of light-emitting elements located in the required places in the adaptive headlight 51 are turned on or off.

This sequence of flow steps is repeated at specific time intervals.

With this adaptive high-beam headlamp system according to this embodiment, when the vehicle is moving with the high-beam headlights on, if there is a vehicle in front (for example, a vehicle in the opposite lane or a vehicle in the same lane), or if a pedestrian appears in the vehicle, the on-board camera recognizes the position of the vehicle in front or the pedestrian, reduces the light only in this place, and maintains the high brightness of the rays other locations. That is, the shaded area is automatically separated from the area illuminated by the headlights so that it coincides with the location of the vehicle in front of you or the person, which prevents the driver from blinding with the light of the vehicle in front of them or the pedestrian. On the other hand, the driver of this vehicle will always have a field of view close to the field when driving with a high beam, so that the driver can easily see pedestrians, road signs, the shape of the road from a distance, etc., resulting in more safe driving.

Industrial Applicability

The excitation substrate disclosed herein may be used for mounting various types of electrical elements, such as semiconductor elements, light-emitting elements, and the like. There is also a light-emitting device in which this substrate is used to operate, turn on and off and otherwise control individual light-emitting elements. This light-emitting device can be used in an adaptive high-beam headlamp system, with which you can control the light distribution pattern and the area to be shaded in blocks with light-emitting elements.

It should be understood that, although the present invention has been described with reference to preferred embodiments thereof, specialists in the art can suggest various other embodiments and versions that are not beyond its scope and nature, and it is assumed here that such other options the implementation and version of the invention should be covered by the following claims.

Claims (32)

1. A light emitting device comprising: a substrate having a first major surface; a plurality of components of the first wiring diagrams that are formed on the first major surface and extend in the first direction; the plurality of components of the second wiring diagrams, which are formed on the first major surface and extend in the second direction, each of the components of the second wiring diagrams segmented into a plurality of sections of the second wiring diagrams; and a plurality of light-emitting elements arranged along the second direction, each of the light-emitting elements comprising a first electrode, a second electrode and a semiconductor layers folded structure, wherein the first electrode and the second electrode are located on the same front side of the semiconductor folded structure, the first electrode is connected to the corresponding one of the first components of the wiring, the second electrode has a first connecting part and a second connecting part, otorrhea connected with the first connecting portion and first connecting portion and second connecting portion connected to corresponding one of the second component compounds and shunt circuits, at least two of the segmented portions of the second wiring diagrams in the second direction. 2. The light-emitting device according to claim 1, wherein the first electrode is connected to the corresponding one of the components of the first wiring diagrams via a pin pin or a ball pin from solder or the second electrode is connected to the corresponding one of the components of the second connection diagrams via a pin-type pin or a ball pin from the solder. 3. The light-emitting device according to claim 1, wherein the second electrode surrounds the first electrode and the surfaces of the first electrode and the second electrode are located at the same height. 4. The light-emitting device according to claim 1, wherein each of the components of the first circuit has an area facing the second electrode, and An insulating protective film is formed on the surface of each of the components of the first circuit in the region or on the surface of the second electrode in the region. 5. The light-emitting device of claim 1, further comprising reflective element in contact with the side surfaces of the light-emitting elements. 6. The light-emitting device according to claim 1, wherein control of the excitation of a plurality of light-emitting elements is performed independently of each other. 7. The light-emitting device according to claim 1, wherein the components of the first circuit and the components of the second circuit are formed from the same metallic material. 8. The light-emitting device according to claim 1, wherein the substrate is a ceramic substrate with a single-layer structure. 9. The light-emitting device according to claim 1, wherein the components of the first connection scheme and the components of the second connection scheme are arranged in a regular pattern in the line and row directions. 10. The light-emitting device according to claim 1, wherein at least one of the components of the first circuit or at least one of the components of the second circuit has a partially branched part. 11. The light-emitting device according to claim 1, wherein at least one of the components of the second connection scheme is wider than at least one of the components of the first connection scheme. 12. An adaptive high-beam headlamp containing The aforementioned light-emitting device according to claim 1; an onboard camera configured and configured to recognize the position of the vehicle in front; and an electronic control unit configured to determine the light distribution pattern and the area to be shaded.

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