PL2061991T3 - Integralnie utworzony jednoelementowy przewód świetlny z diod elektroluminescencyjnych - Google Patents
Integralnie utworzony jednoelementowy przewód świetlny z diod elektroluminescencyjnychInfo
- Publication number
- PL2061991T3 PL2061991T3 PL07818126T PL07818126T PL2061991T3 PL 2061991 T3 PL2061991 T3 PL 2061991T3 PL 07818126 T PL07818126 T PL 07818126T PL 07818126 T PL07818126 T PL 07818126T PL 2061991 T3 PL2061991 T3 PL 2061991T3
- Authority
- PL
- Poland
- Prior art keywords
- single piece
- integrally formed
- formed single
- light wire
- emitting diode
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Electroluminescent Light Sources (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US84418406P | 2006-09-12 | 2006-09-12 | |
PCT/EP2007/007948 WO2008031580A1 (en) | 2006-09-12 | 2007-09-12 | Integrally formed single piece light emitting diode light wire |
EP07818126A EP2061991B1 (en) | 2006-09-12 | 2007-09-12 | Integrally formed single piece light emitting diode light wire |
Publications (1)
Publication Number | Publication Date |
---|---|
PL2061991T3 true PL2061991T3 (pl) | 2011-08-31 |
Family
ID=38645763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PL07818126T PL2061991T3 (pl) | 2006-09-12 | 2007-09-12 | Integralnie utworzony jednoelementowy przewód świetlny z diod elektroluminescencyjnych |
Country Status (13)
Country | Link |
---|---|
US (2) | US7988332B2 (pl) |
EP (1) | EP2061991B1 (pl) |
JP (3) | JP2009528685A (pl) |
KR (1) | KR101070066B1 (pl) |
CN (1) | CN101360947B (pl) |
AT (1) | ATE503149T1 (pl) |
AU (1) | AU2007296902B2 (pl) |
CA (2) | CA2751510C (pl) |
DE (1) | DE602007013419D1 (pl) |
ES (1) | ES2362804T3 (pl) |
HK (1) | HK1127796A1 (pl) |
PL (1) | PL2061991T3 (pl) |
WO (1) | WO2008031580A1 (pl) |
Families Citing this family (79)
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US8052303B2 (en) * | 2006-09-12 | 2011-11-08 | Huizhou Light Engine Ltd. | Integrally formed single piece light emitting diode light wire and uses thereof |
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2007
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- 2007-09-12 EP EP07818126A patent/EP2061991B1/en active Active
- 2007-09-12 CA CA2751510A patent/CA2751510C/en not_active Expired - Fee Related
- 2007-09-12 WO PCT/EP2007/007948 patent/WO2008031580A1/en active Application Filing
- 2007-09-12 AU AU2007296902A patent/AU2007296902B2/en active Active
- 2007-09-12 PL PL07818126T patent/PL2061991T3/pl unknown
- 2007-09-12 DE DE602007013419T patent/DE602007013419D1/de active Active
- 2007-09-12 ES ES07818126T patent/ES2362804T3/es active Active
- 2007-09-12 AT AT07818126T patent/ATE503149T1/de not_active IP Right Cessation
- 2007-09-12 US US11/854,145 patent/US7988332B2/en active Active
- 2007-09-12 JP JP2008556729A patent/JP2009528685A/ja active Pending
- 2007-09-12 CN CN2007800017123A patent/CN101360947B/zh active Active
- 2007-09-12 CA CA2656198A patent/CA2656198C/en not_active Expired - Fee Related
-
2009
- 2009-06-10 HK HK09105225.7A patent/HK1127796A1/xx unknown
-
2011
- 2011-07-15 US US13/184,079 patent/US8789971B2/en active Active
- 2011-11-09 JP JP2011245422A patent/JP5430635B2/ja active Active
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- 2013-05-02 JP JP2013096787A patent/JP5599912B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR20090057115A (ko) | 2009-06-03 |
US20110305011A1 (en) | 2011-12-15 |
JP2012039154A (ja) | 2012-02-23 |
CA2656198A1 (en) | 2008-03-20 |
JP2009528685A (ja) | 2009-08-06 |
US7988332B2 (en) | 2011-08-02 |
JP2013153224A (ja) | 2013-08-08 |
CA2751510C (en) | 2015-05-19 |
US8789971B2 (en) | 2014-07-29 |
CA2751510A1 (en) | 2008-03-20 |
CA2656198C (en) | 2012-02-14 |
KR101070066B1 (ko) | 2011-10-04 |
ES2362804T3 (es) | 2011-07-13 |
HK1127796A1 (en) | 2009-10-09 |
CN101360947B (zh) | 2012-08-08 |
EP2061991A1 (en) | 2009-05-27 |
ATE503149T1 (de) | 2011-04-15 |
CN101360947A (zh) | 2009-02-04 |
JP5599912B2 (ja) | 2014-10-01 |
WO2008031580A1 (en) | 2008-03-20 |
EP2061991B1 (en) | 2011-03-23 |
AU2007296902B2 (en) | 2011-08-25 |
JP5430635B2 (ja) | 2014-03-05 |
AU2007296902A1 (en) | 2008-03-20 |
US20080137332A1 (en) | 2008-06-12 |
DE602007013419D1 (de) | 2011-05-05 |
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