KR970701227A - 방사 경화성 실리콘 이형 조성물과 코팅된 기판(radiation curable sili one release compositions and coated substrates) - Google Patents
방사 경화성 실리콘 이형 조성물과 코팅된 기판(radiation curable sili one release compositions and coated substrates)Info
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- KR970701227A KR970701227A KR1019960704746A KR19960704746A KR970701227A KR 970701227 A KR970701227 A KR 970701227A KR 1019960704746 A KR1019960704746 A KR 1019960704746A KR 19960704746 A KR19960704746 A KR 19960704746A KR 970701227 A KR970701227 A KR 970701227A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/334—Applications of adhesives in processes or use of adhesives in the form of films or foils as a label
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/005—Presence of (meth)acrylic polymer in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Laminated Bodies (AREA)
- Silicon Polymers (AREA)
- Adhesive Tapes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Paints Or Removers (AREA)
Abstract
(A) 하기 식으로 특징되는 오르가노폴리실록산 혼합물로서
RSi(CH3)2-O-(Si(CH3)2O)n(Si(CH3) (R)O)mSi(CH3)2R (Ⅰ)
(A-1) 각 R이 -R1-O(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 15까지의 수 그리고 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 오르가노폴리실록산 약 25∼95wt%, (A-2) R이 -R1-OCH2CH(OH)CH2O-(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 25까지의 수, 그리고 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 또다른 오르가노폴리실록산 약 5∼75wt%를 포함하는 혼합물 및 (B) 광개시제 약 0∼5wt%를 포함하는 방사경화성 실리콘 이형 조성물이 기술된다. 실리콘 이형 코팅된 기판을 제조하는 방법, 이 방법에 의해 제조된 이형 코팅된 제품 그리고 실리콘 이형층이 도입된 다층제품 또는 구조물도 기술된다. 실리콘 조성물이 전자빔 방사선 같은 것에 의해 경화되었을 때 경화된 조성물은 라벨 제조과정에 사용되는 것과 같은 고속에서 바람직한 고도의 제어된 이형력을 나타낸다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (16)
- (A) 하기 식으로 특징되는 오르가노폴리실록산 혼합물로서RSi(CH3)2-O-(Si(CH3)2O)n(Si(CH3) (R)O)mSi(CH3)2R (Ⅰ)(A-1) 각 R이 -R1-O(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 15까지의 수, 및 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 오르가노폴리실록산 약 25∼95wt%, (A-2)각 R이 -R1-OCH2CH(OH)CH2O-(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 25까지의 수, 및 n은 약 50에서 300까지의 수인 식 Ⅰ로 특징되는 적어도 하나의 또다른 오르가노폴리실록산 약 5∼75wt%를 포함하는 물, 및 (B) 광개시제 약 0∼5wt%를 포함하는 방사경화성 실리콘 이형 조성물.
- 제1항에 있어서, 약 40∼80wt%의 (A-1) 및 약 20∼60wt%의 (A-2)를 포함하는 이형 조성물.
- 제1항에 있어서, R1이 약 1∼10개의 탄소원자를 포함하는 2가의 알킬렌기인 이형 조성물.
- 제1항에 있어서, 각각의 R2가 수소인 이형 조성물.
- 제1항에 있어서, 하나 이상의 아크릴화 또는 메타크릴화된 유기 폴리하이드록시 화합물 또는 폴리아미노 화합물(C)을 더 함유하는 이형 조성물.
- 제1항에 있어서, 하나 이상의 아크릴화 또는 메타크릴화된 폴리하이드록시 화합물을 더 함유하는 이형 조성물.
- 제6항에 있어서, 하나 이상의 액체 유기 모노아크릴레이트 에스테르 화합물을 더 함유하는 이형 조성물.
- 제1항에 있어서, 전자 빔 조사에 의해 경화가능한 이형 조성물.
- (A) 하기 식으로 특징되는 오르가노폴리실록산 혼합물로서RSi(CH3)2-O-(Si(CH3)2O)n(Si(CH3)(R)O)|mSi(CH3)2R (Ⅰ)(A-1) 각 R이 -R1-O(O)C-C(R2)=CH2이고, R1은 1∼10의 탄소원자를 함유하는 하이드로카르빌렌기, R2는 수소, m은 약 1에서 15까지의 수, 및 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 오르가노폴리실록산 약 40∼80wt%, (A-2) 각 R이 -R1-OCH2CH(OH)CH2O-(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 25까지의 수 및 n은 약 50에서 300까지의 수인 식 Ⅰ로 특징되는 적어도 하나의 또다른 오르가노폴리실록산 약 20∼60wt%를 포함하는 혼합물을 포함하는 전자빔 경화성 실리콘 이형 조성물.
- 제9항에 있어서, 유기 폴리하이드록시 화합물 중 하나 이상의 디-, 트리-, 또는 테트라-아크릴레이트 에스테르(C)를 더 함유하는 이형 조성물.
- (A) 제1항의 조성물로 이루어진 코팅물을 기판에 도포하고, (B) 방사선에 코팅물을 노출시키므로서 기판위의 코팅물을 경화하는 것을 포함하는 실리콘 이형 코팅된 기판을 제조하는 방법.
- 제11항에 있어서, 조성물이 전자빔으로 경화되는 방법.
- 제1항의 이형 코팅조성물로 코팅되고 방사선에 노출됨으로서 경화된 기판을 포함하는 이형 코팅 제품.
- 제13항에 있어서, 기판이 종이인 이형 코팅 제품.
- (A) 제1기판; (B) 제2기판; (C) 방사선에 노출됨으로서 경화된, 제1항의 실리콘 이형 조성물을 포함하는 실리콘 이형 층; 및 (D) 압력 민감성 접착제 층을 포함하며, 여기에서 실리콘 이형층(C)은 제1기판과 압력 민감성 접착제의 층(D) 사이에 놓여서 바람직하게는 제1기판에 부착되며, 압력 민감성 접착제 층(D)은 이형층과 제2기판 사이에 놓여서 바람직하게는 두 번째 기판에 부착되는 것을 특징으로 하는 다층 제품.
- 제15항에 있어서, 제1기판과 제2기판이 종이인 다층 제품.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20477294A | 1994-03-02 | 1994-03-02 | |
US08/204,772 | 1994-03-02 | ||
PCT/US1995/002414 WO1995023694A1 (en) | 1994-03-02 | 1995-02-27 | Radiation curable silicone release compositions and coated substrates |
Publications (1)
Publication Number | Publication Date |
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KR970701227A true KR970701227A (ko) | 1997-03-17 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019960704746A KR970701227A (ko) | 1994-03-02 | 1995-02-27 | 방사 경화성 실리콘 이형 조성물과 코팅된 기판(radiation curable sili one release compositions and coated substrates) |
Country Status (9)
Country | Link |
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US (2) | US5494945A (ko) |
KR (1) | KR970701227A (ko) |
CN (1) | CN1143346A (ko) |
AU (1) | AU1933095A (ko) |
BR (1) | BR9507124A (ko) |
DE (1) | DE19581563T1 (ko) |
GB (1) | GB2301369B (ko) |
MX (1) | MX9603759A (ko) |
WO (1) | WO1995023694A1 (ko) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU5158896A (en) * | 1995-03-31 | 1996-10-16 | Ferguson International Holdings Plc | Improvements in and relating to lamination of sheet material s |
US5953170A (en) * | 1996-06-26 | 1999-09-14 | Penalty Kick Management Ltd. | Label for container |
EP0845516B1 (en) * | 1996-11-29 | 2003-02-05 | LINTEC Corporation | Pressure-sensitive adhesive sheet |
AU1063699A (en) * | 1997-10-07 | 1999-04-27 | Avery Dennison Corporation | Release compositions |
DE19832026A1 (de) * | 1998-07-16 | 2000-01-27 | Wacker Chemie Gmbh | Strahlungshärtende, Copolymere enthaltende Zusammensetzungen |
DE19836246A1 (de) * | 1998-08-11 | 2000-02-24 | Goldschmidt Ag Th | Strahlenhärtbare Beschichtungsmassen |
US6022050A (en) | 1998-09-02 | 2000-02-08 | Monarch Marking Systems, Inc. | Silicone release coating composition |
GB9828654D0 (en) * | 1998-12-23 | 1999-02-17 | Avery Dennison Corp | Release coating composition |
US7622159B2 (en) * | 1999-01-28 | 2009-11-24 | Loparex, Inc. | Release liners and processes for making the same |
US6299945B1 (en) | 1999-01-28 | 2001-10-09 | Loparex Inc. | Processes for making release liners |
EP1076081A1 (en) * | 1999-08-12 | 2001-02-14 | 3M Innovative Properties Company | Pressure-sensitive adhesive tape suitable for low noise / high unwind speed applications |
KR100778130B1 (ko) * | 1999-11-22 | 2007-11-27 | 스미또모 가가꾸 가부시키가이샤 | 용이박리성 적층체 및 그것에 사용되는 수지조성물 |
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BRPI0919628A2 (pt) | 2008-10-29 | 2015-12-01 | 3M Innovative Proferties Company | materiais de liberação de silicone curado com feixe de elétrons |
US8822560B2 (en) | 2008-10-29 | 2014-09-02 | 3M Innovative Properties Company | Electron beam cured silicone release materials |
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US20110054062A1 (en) * | 2009-08-26 | 2011-03-03 | Desanto Jr Ronald F | UV Pressure-Sensitive Adhesive for Stickers and Labels |
US20110165362A1 (en) * | 2010-01-04 | 2011-07-07 | Desanto Jr Ronald F | Method and format for stickers and labels |
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CN102869829A (zh) | 2010-04-29 | 2013-01-09 | 3M创新有限公司 | 电子束固化的硅化纤维幅材 |
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-
1995
- 1995-02-27 KR KR1019960704746A patent/KR970701227A/ko not_active Application Discontinuation
- 1995-02-27 WO PCT/US1995/002414 patent/WO1995023694A1/en active Application Filing
- 1995-02-27 AU AU19330/95A patent/AU1933095A/en not_active Abandoned
- 1995-02-27 CN CN95191916A patent/CN1143346A/zh active Pending
- 1995-02-27 BR BR9507124A patent/BR9507124A/pt not_active Application Discontinuation
- 1995-02-27 GB GB9618222A patent/GB2301369B/en not_active Expired - Fee Related
- 1995-02-27 MX MX9603759A patent/MX9603759A/es unknown
- 1995-02-27 DE DE19581563T patent/DE19581563T1/de not_active Withdrawn
- 1995-05-11 US US08/439,477 patent/US5494945A/en not_active Expired - Fee Related
- 1995-06-06 US US08/476,745 patent/US5654093A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB2301369B (en) | 1997-08-13 |
GB2301369A (en) | 1996-12-04 |
GB9618222D0 (en) | 1996-10-09 |
BR9507124A (pt) | 1997-09-30 |
WO1995023694A1 (en) | 1995-09-08 |
MX9603759A (es) | 1997-12-31 |
AU1933095A (en) | 1995-09-18 |
CN1143346A (zh) | 1997-02-19 |
US5494945A (en) | 1996-02-27 |
DE19581563T1 (de) | 1997-02-27 |
US5654093A (en) | 1997-08-05 |
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