KR970706600A - APPARATUS AND METHOD FOR BONDING TAPE - Google Patents
APPARATUS AND METHOD FOR BONDING TAPEInfo
- Publication number
- KR970706600A KR970706600A KR1019970702271A KR19970702271A KR970706600A KR 970706600 A KR970706600 A KR 970706600A KR 1019970702271 A KR1019970702271 A KR 1019970702271A KR 19970702271 A KR19970702271 A KR 19970702271A KR 970706600 A KR970706600 A KR 970706600A
- Authority
- KR
- South Korea
- Prior art keywords
- tape
- length
- anisotropic conductive
- conductive tape
- anisotropic
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims 7
- 239000000758 substrate Substances 0.000 claims abstract 20
- 238000003825 pressing Methods 0.000 claims abstract 14
- 239000002390 adhesive tape Substances 0.000 claims abstract 11
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 230000032258 transport Effects 0.000 abstract 3
- 238000000926 separation method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Adhesive Tape Dispensing Devices (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
기판(4)에 이방성 전기전도 테이프(2)를 접착하는 장치는 대항면중 하나에 접착된 비등성 전기전도 테이프(2)의 길이를 지닌 리더테이프(1)의 길이를 공급하는 테이프 공급유닛(21): 이송방향(M)으로 공급된 리더테이프(1)의 길이를 이송하는 테이프 이송유닛(22): 소정의 길이의 이방성 전기전도 테이프 세그먼트(107)를 제공하기 위해 이방성 전기전도 테이프(2)의 길이만을 절단하는 절단유닛(23): 이방성 전기전도 테이프 새그먼트(107)가 접착되는 기판(4)을 위치시키는 기판위치 저절유닛(10); 및 기판(4)에 대해 이방성 전기전도 테이프새그먼트(107)를 프레싱하여 상기 새그먼트를 기판에 접촉시키는 테이프 적용유닛(19);을 구비하고 있다. 절단유닛(23)은 이방성 전기전도 테이프의 길이를 이방성 전기전도 테이프 새그먼트(2)와 나머지 이방성 전기전도 테이프로 분할하는 분리공간(95)을 남기도록 절단사이에 접착된 이방성 전기전도 테이프(2)의 조각을 제거하는데 이용되는 접착테이프의 길이와 이방성 전기전도 테이프(2)의 길이에 각각의 절단을 형성하는 두 개의 컷터 브레이드 (93,94)를 포함한다.The apparatus for bonding the anisotropic conductive tape 2 to the substrate 4 includes a tape supply unit 21 for supplying the length of the leader tape 1 having the length of the non-conforming electroconductive tape 2 adhered to one of the opposing surfaces : An anisotropic conductive tape (2) is provided to provide an anisotropic conductive tape segment (107) of a predetermined length. The tape transport unit (22) transports the length of the leader tape (1) fed in the transport direction (23) for cutting only the length of the anisotropic conductive tape segment (107); a substrate position switching unit (10) for positioning the substrate (4) to which the anisotropic conductive tape segment (107) is adhered; And a tape applying unit (19) for pressing the anisotropic conductive tape segment (107) against the substrate (4) to bring the segment into contact with the substrate. The cutting unit 23 has an anisotropic electrically conductive tape 2 bonded between the cuts so as to leave a separation space 95 for dividing the length of the anisotropic electrically conductive tape into the anisotropic electrically conductive tape segment 2 and the remaining anisotropic electrically conductive tape. And two cutter blades 93,94 which form respective cuts in the length of the anisotropic conductive tape 2 and the length of the adhesive tape used to remove the pieces of the anisotropic conductive tape 2. [
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제2도는 테이프 접착장치에 이용되는 기판위치 조절유닛과 테이프 적용유닛의 확대 사시도, 제10도는 본 발명의 테이프 접착장치에 이용되는 리더테이프 테이크업 유닛의 개략적인 단면도, 제18도는 본 발명의 테이프 접착장치에 이용되는 제어시스템의 블록도.FIG. 10 is a schematic cross-sectional view of a leader tape take-up unit used in the tape bonding apparatus of the present invention. FIG. 18 is a schematic cross-sectional view of a tape cassette of the present invention Block diagram of control system used in bonding apparatus.
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24279094A JP3206331B2 (en) | 1994-10-06 | 1994-10-06 | Apparatus for attaching anisotropic conductive tape and method for attaching anisotropic conductive tape |
JP94-242790 | 1994-10-06 | ||
PCT/JP1995/002019 WO1996011494A1 (en) | 1994-10-06 | 1995-10-04 | Apparatus and method for bonding tape |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970706600A true KR970706600A (en) | 1997-11-03 |
KR100293893B1 KR100293893B1 (en) | 2001-11-30 |
Family
ID=17094337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970702271A KR100293893B1 (en) | 1994-10-06 | 1995-10-04 | Apparatus and method for bonding anisotropic conductive tape |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3206331B2 (en) |
KR (1) | KR100293893B1 (en) |
TW (1) | TW280983B (en) |
WO (1) | WO1996011494A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100861507B1 (en) * | 2002-04-15 | 2008-10-02 | 삼성테크윈 주식회사 | Apparatus and method for attaching a film-like lead frame to a carrier frame |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000015583A (en) * | 1998-08-31 | 2000-03-15 | 김규현 | Circuit film and elastomer tape adhesion apparatus for fabricating a semiconductor package |
KR100370847B1 (en) * | 1998-08-31 | 2003-07-10 | 앰코 테크놀로지 코리아 주식회사 | Lamination device and method of wafer and circuit tape for manufacturing semiconductor package |
KR20000015592A (en) * | 1998-08-31 | 2000-03-15 | 김규현 | Adhesion apparatus of circuit tape and wafer for semiconductor package |
JP3704502B2 (en) | 2002-01-15 | 2005-10-12 | 松下電器産業株式会社 | A pressure-sensitive adhesive sheet sticking apparatus, a pressure-sensitive adhesive sheet sticking method, a component mounting machine, and a display panel manufacturing method. |
JP4137725B2 (en) | 2002-07-10 | 2008-08-20 | 松下電器産業株式会社 | Method and apparatus for determining processing dimension of joining member |
JP4546820B2 (en) * | 2004-12-24 | 2010-09-22 | 立山マシン株式会社 | Film sticking device |
KR100802660B1 (en) * | 2006-02-28 | 2008-02-13 | 주식회사 탑 엔지니어링 | Tape Guide Width Adjuster of Bonding Equipment |
JP2007302398A (en) * | 2006-05-11 | 2007-11-22 | Matsushita Electric Ind Co Ltd | Device and method for affixing joining sheet |
JP4607815B2 (en) * | 2006-05-11 | 2011-01-05 | パナソニック株式会社 | Joining sheet affixing device and method |
JP4392766B2 (en) * | 2007-08-21 | 2010-01-06 | 株式会社日立ハイテクノロジーズ | ACF pasting device |
JP5266582B2 (en) * | 2008-12-26 | 2013-08-21 | Nltテクノロジー株式会社 | ACF sticking device and display device manufacturing method |
JP2012119418A (en) | 2010-11-30 | 2012-06-21 | Hitachi High-Technologies Corp | Conductive film pasting apparatus, crystal-type solar cell module assembly apparatus, and connection method of crystal-type solar cell |
US9731922B2 (en) | 2012-04-18 | 2017-08-15 | Fuji Machine Mfg. Co., Ltd. | Automatic splicing device |
KR20210050622A (en) | 2019-10-28 | 2021-05-10 | 삼성디스플레이 주식회사 | Method of manufacturing display device, display device manufactured by the same, and acf attaching apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02293721A (en) * | 1989-05-08 | 1990-12-04 | Sharp Corp | Method for sticking anisotropic conductive film |
JP2769263B2 (en) * | 1992-06-22 | 1998-06-25 | ケル株式会社 | Method and apparatus for producing anisotropic adhesive tape for transfer |
JP3045427B2 (en) * | 1992-06-22 | 2000-05-29 | ソニー株式会社 | Method and apparatus for attaching anisotropic conductive film |
KR100706601B1 (en) * | 2003-12-03 | 2007-04-11 | 한국전자통신연구원 | Object-based Content-Added Data Conversion Device |
-
1994
- 1994-10-06 JP JP24279094A patent/JP3206331B2/en not_active Expired - Fee Related
-
1995
- 1995-10-04 KR KR1019970702271A patent/KR100293893B1/en not_active IP Right Cessation
- 1995-10-04 WO PCT/JP1995/002019 patent/WO1996011494A1/en active IP Right Grant
- 1995-10-05 TW TW084110485A patent/TW280983B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100861507B1 (en) * | 2002-04-15 | 2008-10-02 | 삼성테크윈 주식회사 | Apparatus and method for attaching a film-like lead frame to a carrier frame |
Also Published As
Publication number | Publication date |
---|---|
JPH08107268A (en) | 1996-04-23 |
KR100293893B1 (en) | 2001-11-30 |
JP3206331B2 (en) | 2001-09-10 |
TW280983B (en) | 1996-07-11 |
WO1996011494A1 (en) | 1996-04-18 |
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