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KR970043334A - Plating amount deviation prevention device - Google Patents

Plating amount deviation prevention device Download PDF

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Publication number
KR970043334A
KR970043334A KR1019950061784A KR19950061784A KR970043334A KR 970043334 A KR970043334 A KR 970043334A KR 1019950061784 A KR1019950061784 A KR 1019950061784A KR 19950061784 A KR19950061784 A KR 19950061784A KR 970043334 A KR970043334 A KR 970043334A
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KR
South Korea
Prior art keywords
plating
control signal
current
amount
cell
Prior art date
Application number
KR1019950061784A
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Korean (ko)
Other versions
KR100256353B1 (en
Inventor
이효수
김대혁
김동윤
Original Assignee
김종진
포항종합제철 주식회사
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Publication date
Application filed by 김종진, 포항종합제철 주식회사 filed Critical 김종진
Priority to KR1019950061784A priority Critical patent/KR100256353B1/en
Publication of KR970043334A publication Critical patent/KR970043334A/en
Application granted granted Critical
Publication of KR100256353B1 publication Critical patent/KR100256353B1/en

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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

전기 도금 설비의 도금량 편차 방지 장치에 관한 것으로, 비지니스 컴퓨터로 부터 소재 사양에 필요한 데이터, 목표 도금량, 강종 등의 데이터를 수신하여 도금효율에 의한 전류 제어신호 및 도금 용액 제어신호 등을 출력하는 프로세스 컴퓨터와, 상기 프로세스 커뮤터로 부터 전류 제어신호를 구신하여 전류 투입 제어신호를 출력하는 PLC와, 강판에 전기도금을 실행하는 플레이팅 셀과, 상기 PLC로 부터 제어신호를 받아 상기 플레이팅 셀로 전류를 출력하는 전류 투입부와, 상기 프로세스 컴퓨터로 부터 도금 용액 제어 신호를 입력 받아 이온 투입 제어신호를 출력하는 계장 제어부와, 상기 계장 제어부로 부터 이온 투입 제어신호를 입력받아 상기 플래이팅 셀에 이온을 투입하는 이온 투입부와, 상기 플레이팅 셀에서 도금 용액을 분석하여 그 결과를 상기 계장 제어부로 출력하는 도금 용액 분석부르 구비하여 도금용액량 조절로써 전체적인 전압 균일화를 이루어 버닝현사을 방지하고, 최적의 도금효율을 산출하여 도금량 제어의 편차를 최소화함으로써 품질향상을 이루어질 수 있다.The present invention relates to a plating amount variation prevention device of an electroplating equipment. A process computer for receiving data necessary for material specification, target plating amount, and steel grade from a business computer to output current control signals and plating solution control signals based on plating efficiency. And a PLC for outputting a current input control signal by receiving a current control signal from the process commutator, a plating cell for performing electroplating on a steel plate, and receiving a control signal from the PLC and outputting current to the plating cell. A current controller configured to receive a plating solution control signal from the process computer and output an ion implantation control signal, and an ion implantation control signal from the instrumentation controller to inject ions into the plating cell. Analysis of the plating solution in the ion input unit and the plating cell and the result Group can be made to improve performance by providing plating bath analysis call for output to the instrumentation control by the overall voltage made uniform by adjusting the amount of the plating solution hyeonsaeul prevent burning and, by calculating the optimum plating efficiency minimizing the deviation of the coating weight control.

Description

도금량 편차 방지장치Plating amount deviation prevention device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 종래의 플레이팅 셀의 구성도이다.1 is a block diagram of a conventional plating cell.

제2도는 본 발명에 의한 도금량 편차 방지장치의 구성을 보이는 블록도이다2 is a block diagram showing the structure of the plating amount deviation preventing apparatus according to the present invention.

Claims (3)

전기도금설비의 도금량 편차 방지장치에 있어서, 비지니스 컴퓨터로 소재 사양에 필요한 데이터,목표 도금량, 강종 등의 데이터를 수신하여 도금효율에 의한 전류 제어신호 및 도금 용액 제어신호 등을 출력하는 프로세스 컴퓨터와, 상기 프로세스 커뮤터로 부터 전류 제어신호를 수신하여 전류 투입 제어신호를 출력하는 PLC와, 강판에 전기도금을 실행하는 플레이팅 셀과, 상기 PLC로 부터 제어신호를 작아 상기 플레이팅 셀로 전류를 출력하는 전류 투입부와, 상기 프로세스 컴퓨터로 부터 도금 용액 제어 신호를 입력받아 이온 투입 제어 신호를 출력하는 계장 제어부와, 상기 계장 제어부로 부터 이온 투입 제어신호를 입력받아 상기 플래이팅 셀에 이온을 투입하는 이온 투입부와, 상기 플레이팅 셀에서 도금 용액을 분석하여 그 결과를 상기 계장 제어부로 출력하는 도금 용액 분석부를 구비하는 것을 특징으로 하는 도금량 편차 방지장치.A device for preventing variation in plating amount of an electroplating equipment, comprising: a process computer for receiving data necessary for material specification, target plating amount, steel grade, etc. from a business computer and outputting current control signal and plating solution control signal according to plating efficiency; PLC for receiving a current control signal from the process commutator and outputting a current input control signal, a plating cell for electroplating a steel plate, and a current for outputting current to the plating cell with a small control signal from the PLC. An input unit, an instrumentation control unit that receives a plating solution control signal from the process computer and outputs an ion implantation control signal, and an ion implanter that receives an ion implantation control signal from the instrumentation control unit and injects ions into the plating cell A plating solution in the plating cell and analyzing the plating solution. Coating weight deviation prevention device characterized in that comprising a plating bath analysis outputting portion. 제1항에 있어서, 상기 프로세스 컴퓨터는 상기 강판 소재에 대한 데이터를 근거로 하여 도금효율을 산출하고 그 산출된 도금효율에 의해 효율-전류밀도 테이블에서 전류량을 산출하는 것을 특징으로 하는 도금량 편차 방지장치.The apparatus of claim 1, wherein the process computer calculates a plating efficiency based on data on the steel sheet material and calculates a current amount in an efficiency-current density table based on the calculated plating efficiency. . 제1항에 있어서, 상기 프로세스 컴퓨터는 총 아연 도금량을 산출하고 용액량 제어모델에 의해 도금용 액량을 산출하여 상기 이온 투입부에 출력하여 도금용액을 플레이팅 셀에 투입하도록 제어하는 것을 특징으로 하는 도금량 편차 방지장치.The method of claim 1, wherein the process computer calculates a total zinc plating amount, calculates a plating liquid amount by a solution amount control model, and outputs the plating liquid to the ion input unit to control the plating solution into the plating cell. Plating amount deviation prevention device.
KR1019950061784A 1995-12-28 1995-12-28 The prevention device of the deflection for the electroplating mass KR100256353B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950061784A KR100256353B1 (en) 1995-12-28 1995-12-28 The prevention device of the deflection for the electroplating mass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950061784A KR100256353B1 (en) 1995-12-28 1995-12-28 The prevention device of the deflection for the electroplating mass

Publications (2)

Publication Number Publication Date
KR970043334A true KR970043334A (en) 1997-07-26
KR100256353B1 KR100256353B1 (en) 2000-05-15

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KR1019950061784A KR100256353B1 (en) 1995-12-28 1995-12-28 The prevention device of the deflection for the electroplating mass

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101889197B1 (en) * 2016-12-23 2018-08-16 주식회사 포스코 Apparatus and method for controlling plating to material
CN110528057A (en) * 2019-09-23 2019-12-03 俊杰机械(深圳)有限公司 Electroplating device control system
KR102435753B1 (en) 2021-10-25 2022-08-25 임지훈 System for improving deviation of electroplating apparatus

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