KR970003174Y1 - Sensor of shutter closure in metal deposition apparatus - Google Patents
Sensor of shutter closure in metal deposition apparatus Download PDFInfo
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- KR970003174Y1 KR970003174Y1 KR2019940008879U KR19940008879U KR970003174Y1 KR 970003174 Y1 KR970003174 Y1 KR 970003174Y1 KR 2019940008879 U KR2019940008879 U KR 2019940008879U KR 19940008879 U KR19940008879 U KR 19940008879U KR 970003174 Y1 KR970003174 Y1 KR 970003174Y1
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- shutter
- sensor
- rod
- drive cylinder
- dead center
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
내용없음.None.
Description
제1도는 종래장치의 설치상태를 나타낸 종단면도.1 is a longitudinal sectional view showing a state of installation of a conventional apparatus.
제2a, b도는 개구부의 개폐상태를나타낸 개략도.2a and b are schematic views showing the opening and closing state of the opening.
제3도는 본 고안의 설치상태를 나타낸 종단면도.Figure 3 is a longitudinal sectional view showing an installation state of the present invention.
제4a, b도는 본 고안에 적용되는 구동실린더의 작동상태를 나타낸 정면도.Figure 4a, b is a front view showing the operating state of the drive cylinder applied to the present invention.
제5도는 본 고안의 모니터를 나타낸 정면도.5 is a front view showing a monitor of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
2 : 구동실린더 4 : 축2: driving cylinder 4: shaft
7 : 셧터 8 : 감지봉7: shutter 8: sensing rod
9, 10 : 센서 11 : 모니터9, 10: sensor 11: monitor
12 : LED 13 : 부저12 LED 13 Buzzer
본 고안은 웨이퍼의 제조공정시 웨이퍼의 표면에 금속막을 증착시키는데 사용되는 금속증착장비의 셧터개폐 감지장치에 관한 것으로서, 좀더 구체적으로는 공정진행시 장비내에서 발생되는 기계적인 구동불량을 조기에 감지할 수 있도록 한 것이다.The present invention relates to a shutter opening and closing detection device of a metal deposition apparatus used to deposit a metal film on the surface of a wafer during a manufacturing process of a wafer, and more specifically, to detect mechanical driving defects generated in the equipment early in the process. It is to be done.
첨부도면 제1도는 종래장치의 설치상태를 나타낸 종단면도로서, 챔버(1)의 외측에 구동실린더(2)가 브라켓(3)으로 지지설치되어 있고 상기 구동실린더의 로드에는 챔버의 외부와 내부를 연결하는 축(4)이 연결되어 있으며 상기 축의 끝단에는 공정에 따라 건 소오스(Gun source)(5)에 형성된 개구부(6)를 개폐시키는 셧터(7)가 고정되어 있다.1 is a longitudinal cross-sectional view showing a state of installation of a conventional apparatus, in which a driving cylinder 2 is supported by a bracket 3 on an outer side of the chamber 1 and a rod of the driving cylinder is connected to the outside and the inside of the chamber. A connecting shaft 4 is connected, and a shutter 7 for opening and closing the opening 6 formed in the gun source 5 is fixed to the end of the shaft.
따라서 메인 프로그램(Main progrom)에서 공정진행의 명령어를 주고 장비의 가동을 스타트하면 웨이퍼가 일정 스테이션에 위치하게 된다.Therefore, when the main program is commanded and the equipment is started, the wafer is placed in a station.
이러한 상태에서 프로세스 콘트롤러에서 셧터(7)를 개방하라는 명령이 표시되면 솔레노이드 밸브(도시는 생략함)가 동작되므로 압축공기가 구동실린더(2)로 인입되어 로드를 상승시키게 되므로 축(4)이 회전된다.In this state, when a command to open the shutter (7) is displayed in the process controller, the solenoid valve (not shown) is operated, and thus, the compressed air is introduced into the drive cylinder (2) to raise the load, thereby causing the shaft (4) to rotate. do.
이에따라 축(4)의 끝에 고정되어 제2도의 (a)와 같이 개구부(6)를 폐쇄시키고 있던 셧터(7)가 회전되어 (b)와 같이 개구부(6)를 개방시키게 되므로 웨이퍼의 표면에 금속박막을 증착시킬 수 있게 된다.Accordingly, the shutter 7 fixed to the end of the shaft 4 and closing the opening 6 as shown in FIG. 2 (a) is rotated to open the opening 6 as shown in (b). It is possible to deposit a thin film.
상기 동작에 따라 웨이퍼의 표면에 금속박막이 일정두께로 증착되고 나면 메인 프로그램에 의해 셧터(7)의 폐쇄 명령어가 표시되어 구동실린더(2)를 초기 상태로 환원시키게 되므로 셧터(7)가 개구부(6)를 폐쇄시키게 된다.After the metal thin film is deposited on the surface of the wafer according to the above operation, the closing command of the shutter 7 is displayed by the main program to reduce the driving cylinder 2 to the initial state. 6) will be closed.
그러나 이러한 종래의 장치는 프로세스 콘트롤러에서 단지 셧터의 개폐 명령만을 기계적인 셧터의 개폐상태를 감지하지 못하게 되어 있어 공정진행시 발생되는 열에 의해 셧터가 건 소오스나 전면부로 변형(휨)이 발생될 경우 셧터가 동작되지 않게 되므로 원하는 금속박막을 얻을 수 없게 되어 불량품이 양산되는 결과르 초래하였다.However, such a conventional device does not detect only the shut-off command of the shut-off in the process controller, so that the shut-off occurs when the shutter is deformed to the gun source or the front part by the heat generated during the process. Since it was not operated, the desired metal thin film could not be obtained, resulting in mass production of defective products.
본 고안은 종래의 이와 같은 문제점을 해결하기 위해 안출한 것으로 그 구조를 개선하여 셧터의 변형에 따라 셧터가 동작되는 것을 감지하도록 하므로서 불량품이 양산되는 것을 미연에 방지하는데 그 목적이 있다.The present invention has been made to solve such a problem in the prior art is to improve the structure to detect the operation of the shutter in accordance with the deformation of the shutter to prevent the production of defective products in advance.
상기 목적을 달성하기 위한 본 고안의 형태에 따르면, 챔버의 외측에 구동실린더를 설치하고 상기 구동실린더의 구동에 따라 회전되는 축에는 셧터를 고정하도록 된 것에 있어서, 구동실린더의 로드선단에 감지봉을 고정하고 상기 감지봉의 하사점과 상사점의 위치에는 각각 발광소자와 수광소자로 이루어진 센서를 설치하며 장비의 전면에 설치되는 모터에는 LED를 설치하여서 된 금속증착장비의 셧터개폐 감지장치가 제공된다.According to an aspect of the present invention for achieving the above object, in order to install a drive cylinder on the outside of the chamber and to fix the shutter to the axis rotated in accordance with the drive of the drive cylinder, the sensing rod at the rod end of the drive cylinder Fixing and installing the sensor consisting of a light emitting element and a light receiving element at the bottom dead center and the top dead center of the sensing rod, respectively, and the shutter opening and closing detection device of the metal deposition equipment is provided by the LED installed on the motor.
이하, 본 고안을 일 실시예로 도시한 첨부된 도면 제3도 내지 제5도를 참고로하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS. 3 to 5 of the accompanying drawings.
첨부도면 제3도는 본 고안의 설치상태를 나타낸 종단면도이고 제4도의 (a)(b)는 본 고안에 적용되는 구동실린더의 작동상태를 나타낸 정면도이며 제5도는 본 고안의 모니터를 나타낸 정면도로서, 종래의 장치와 구성이 동일한 부분은 그 설명을 생략하고 동일부호를 부여하기로 한다.3 is a longitudinal sectional view showing an installation state of the present invention, and (a) and (b) of FIG. 4 are front views showing an operating state of a driving cylinder applied to the present invention, and FIG. 5 is a front view showing a monitor of the present invention. The same parts as those of the conventional apparatus will be omitted and the same reference numerals will be given.
본 고안은 셧터(7)와 고정된 축(4)을 회전시키는 구동실린더(2)의 로드선단에 감지봉(8)이 고정되어 있고 상기 구동실린더(2)의 구동에 따라 이동되는 감지봉의 상사점과 하사점에는 각각 발광소자(9a)(10a)와 수광소자(9b)(10b)로 이루어진 센서(9)(10)가 설치되어 있으며 장비의 전면에 설치되는 모니터(11)에는 감지봉(8)을 감지하는 센서의 동작에 따라 셧터(7)의 개폐상태를 나타내도록 점멸되는 LED(12)가 설치되어 있다.According to the present invention, the sensing rod 8 is fixed to the rod end of the driving cylinder 2 which rotates the shutter 7 and the fixed shaft 4, and is similar to the sensing rod that is moved in accordance with the driving of the driving cylinder 2. At the bottom and bottom dead centers, sensors 9 and 10 are formed of light emitting elements 9a and 10a and light receiving elements 9b and 10b, respectively. 8) In accordance with the operation of the sensor for detecting the LED 12 is provided to blink to indicate the open and close state of the shutter (7).
그리고 구동실린더(2)가 동작시에도 감지봉(8)의 상사점과 하사점에 위치된 센서(9)(10)가 감지봉(8)을 감지하지 못할 때 동작되는 부저(13)가 모니터(11)에 설치되어 있다.The buzzer 13 which is operated when the sensors 9 and 10 located at the top dead center and the bottom dead center of the sensing rod 8 does not detect the sensing rod 8 even when the driving cylinder 2 is operated is monitored. It is installed in (11).
이는 구동실린더(2)의 동작시 셧터(7)가 동시에 동작되지 않음을 작업자에게 청각적으로 알려 불량품이 양산되는 것을 미연에 방지하기 위함이다.This is to audibly inform the operator that the shutter 7 is not operated at the same time during the operation of the drive cylinder 2, to prevent mass production of defective products.
이와 같이 구성된 본 고안의 작용. 효과를 설명하면 다음과 같다.The operation of the present invention configured as described above. The effect is as follows.
먼저 웨이퍼의 표면에 금속박막을 증착하기 위해 메인 프로그램에 공정진행 명령어를 주고 스타트하면 웨이퍼가 일정 스테이션에 머무르는 상태에서 구동실린더(2)가 동작하여 제4도의 (a)와같이 있던 구동실린더의 로드를 인출시키게 되므로 상기 구동실린거의 로드에 고정된 축(4)이 회전되고, 이에 따라 축(4)에 고정된 셧터(7)가 개구부(6)를 개방시키게 된다.First, when the process program command is given to the main program to start the deposition of the metal thin film on the surface of the wafer, the drive cylinder 2 is operated while the wafer stays at a station and the load of the drive cylinder as shown in FIG. Since the shaft 4 fixed to the rod of the driving cylinder is rotated, the shutter 7 fixed to the shaft 4 opens the opening 6.
상기 동작시 구동실린더의 로드에 고정된 감지봉(8)은 제4도의 (b)와같이 상사점에 도달하게 되는데, 이러한 상태는 상사점에 위치된 발과소자(10a) 및 수광소자(10b)로 이루어진 센서(10)가 감지봉(8)을 감지하여 모니터(11)에 설치된 셧터의 개방측 LED(12)인 녹색 LED을 온(ON)시키게 되므로 장비의 정상적인 동작을 작업자에게 알게 된다.In this operation, the sensing rod 8 fixed to the rod of the driving cylinder reaches a top dead center as shown in FIG. 4 (b), and this state is the overcommitted element 10a and the light receiving element 10b located at the top dead center. The sensor 10 made of) detects the sensing rod 8 and turns on the green LED which is the open LED 12 of the shutter installed in the monitor 11 so that the operator knows the normal operation of the equipment.
그러나 셧터(7)의 변형등으로 셧터가 개구부(6)를 개방시키지 못하였을 경우에는 상사점에 설치된 센서(10)가 감지봉(8)을 감지하여 못하게 되어 모이터(11)에 설치된 폐쇄측 LED(12)적색 LED을 온시킴과 동시에 부저(13)을 올리게 되므로 작업자가 시각과 청각을 셧터(7)가 개방되지 않았음을 알게 되어 장비의 동작을 중단시키고 응급조치를 취할 수 있게 된다.However, when the shutter fails to open the opening 6 due to the deformation of the shutter 7, the sensor 10 installed at the top dead center cannot detect the sensing rod 8, and thus the closed side installed in the motor 11. The LED 12 turns on the red LED and at the same time raises the buzzer 13, so that the operator knows that the shutter 7 is not opened, so that the operation of the equipment can be stopped and emergency measures can be taken.
모이터(11)에 설치된 녹색 LED가 온된 상태, 즉 개구부(6)가 개방된 상태에서 공정이 진행되어 웨이퍼의 표면에 금속박막이 전부 증착되고 나면 셧터의 폐쇄 명령이 자동으로 입력되어 구동실린더(2)가 동작되므로 로드를 잡아 당기게 된다.After the process is performed while the green LED installed in the motor 11 is turned on, that is, the opening 6 is opened, and the metal thin film is deposited on the surface of the wafer, the shut-off command of the shutter is automatically input and the driving cylinder ( 2) is operated so it pulls the rod.
이에따라 로드의 선단에 고정된 감지봉(8)은 초기 상태인 제4도의 (a)와 같이 하사점에 위치되므로 감지봉의 위치이동을 하사점에 위치된 센서(9)가 감지하게 된다.Accordingly, since the sensing rod 8 fixed to the tip of the rod is located at the bottom dead center as shown in FIG. 4A, the sensor 9 positioned at the bottom dead center detects the movement of the sensing rod.
이와 같이 센서(9)에 의해 감지봉이 감지되면 전술한 바와 같이 모니터(11)에 설치된 녹색 LED가 온되어 장비의 정상적인 동작을 작업자에게 알리고, 감지봉이 감지되지 않으면 적색 LED가 온됨과 동시에 부저(13)를 울려 기계적인 에러가 발생되었음을 작업자에게 알리게 되므로 작업자가 장비의 구동을 중단시켜 웨이퍼의 표면으로 금속박막이 계속해서 증착되어 불량이 발생되는 것을 미연에 방지하게 된다.As described above, when the sensing rod is detected by the sensor 9, the green LED installed in the monitor 11 turns on as described above to inform the operator of the normal operation of the equipment, and when the sensing rod is not detected, the red LED is turned on and at the same time the buzzer 13 By ringing) to notify the operator that a mechanical error has occurred, the operator stops the operation of the equipment to prevent the metal thin film is continuously deposited on the surface of the wafer to prevent defects.
이상에서와 같이 본 고안은 셧터의 변형등에 의한 기계적인 구동에러를 작업자가 즉시 식별할 수 있게 되므로 웨이퍼에 증착되는 금속박막의 두께불량을 미연에 방지하게 되는 효과를 얻게 된다.As described above, the present invention enables the operator to immediately identify mechanical driving errors due to deformation of the shutter, thereby obtaining an effect of preventing a thickness defect of the metal thin film deposited on the wafer.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940008879U KR970003174Y1 (en) | 1994-04-26 | 1994-04-26 | Sensor of shutter closure in metal deposition apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940008879U KR970003174Y1 (en) | 1994-04-26 | 1994-04-26 | Sensor of shutter closure in metal deposition apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR950031476U KR950031476U (en) | 1995-11-22 |
| KR970003174Y1 true KR970003174Y1 (en) | 1997-04-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940008879U Expired - Lifetime KR970003174Y1 (en) | 1994-04-26 | 1994-04-26 | Sensor of shutter closure in metal deposition apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970003174Y1 (en) |
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1994
- 1994-04-26 KR KR2019940008879U patent/KR970003174Y1/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| KR950031476U (en) | 1995-11-22 |
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