KR960007835A - 청색 발광성 질화갈륨 적층막의 제조방법 - Google Patents
청색 발광성 질화갈륨 적층막의 제조방법 Download PDFInfo
- Publication number
- KR960007835A KR960007835A KR1019940020711A KR19940020711A KR960007835A KR 960007835 A KR960007835 A KR 960007835A KR 1019940020711 A KR1019940020711 A KR 1019940020711A KR 19940020711 A KR19940020711 A KR 19940020711A KR 960007835 A KR960007835 A KR 960007835A
- Authority
- KR
- South Korea
- Prior art keywords
- gallium nitride
- laser beam
- substrate
- nitride
- gallium
- Prior art date
Links
- 229910002601 GaN Inorganic materials 0.000 title claims abstract 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract 8
- 238000004519 manufacturing process Methods 0.000 title claims abstract 4
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract 5
- 239000000376 reactant Substances 0.000 claims abstract 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000013078 crystal Substances 0.000 claims abstract 3
- 229910052733 gallium Inorganic materials 0.000 claims abstract 3
- 238000011065 in-situ storage Methods 0.000 claims abstract 2
- 150000004767 nitrides Chemical class 0.000 claims 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 4
- 229910052594 sapphire Inorganic materials 0.000 claims 3
- 239000010980 sapphire Substances 0.000 claims 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 229910021529 ammonia Inorganic materials 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 238000006552 photochemical reaction Methods 0.000 claims 2
- 230000005284 excitation Effects 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000005001 laminate film Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000001427 coherent effect Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract 1
- 238000006303 photolysis reaction Methods 0.000 abstract 1
- 230000015843 photosynthesis, light reaction Effects 0.000 abstract 1
- 229910052700 potassium Inorganic materials 0.000 abstract 1
- 239000011591 potassium Substances 0.000 abstract 1
- -1 potassium nitride Chemical class 0.000 abstract 1
- 238000000927 vapour-phase epitaxy Methods 0.000 abstract 1
- 229910052984 zinc sulfide Inorganic materials 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
- C30B25/105—Heating of the reaction chamber or the substrate by irradiation or electric discharge
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Led Devices (AREA)
- Recrystallisation Techniques (AREA)
- Semiconductor Lasers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
본 발명은 질화칼륨(Gallium Nitride, GaN)을 집광성 레이저광 여기(coherent laser aided vapour phase epitaxy, LVPE)방법에 의해 육방정계의 부루자이트(Wurtzite) 단결정 격자구조로 피복성장시키는 방법에 관한 것으로서 더욱 상세하게는 기판위에 질화알루미늄(Aluminum nitride, AIN)완충막을 인시츄(in-situ)방법에 의해 도입하고 갈륨 함유 반응물과 질소함유 반응물을 약 800℃의 낮은 온도와 0.1~3.8torr의 낮은 증기압하에서 공명적 에너지 광분해 증착법에 의해 단결정 두께 2~20μm를 갖는 청색 발광성 질화갈륨 적층막(epitaxial film)을 제조하는 방법에 관한 것이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 레이저 빔 조사방식의 개요도.
제2도는 본 발명에서 사용된 집광성 레이저 유도증측 실험장치의 개략도이다.
Claims (13)
- 이종의 기판상에서 집광성 레이저 여기(LVPE)에 의해 Ⅲ족 갈륨과 Ⅴ족 질소로 구성된 질화갈륨을 적층막으로 성장시키는 방법에 있어서 사파이어 기판위에 질화알루미늄 완충막을 인시츄(in-situ)로 증착시키고 그 위에 반응물과 파장공명적 광화학 반응을 일으키는 레이저 빔을 조사하여 질화 갈륨 적층을 증착시키는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 질화알루미늄은 200~300Å 두께로 증착시키는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 광화학 반응은 0.1~3.8torr, 800±100℃에서 15~60분동안 진행되는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 레이저 빔으로 193nmArF, 248nmKrF 또는 308nmXeCl 집광성 엑시머 레이저를 사용하는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 반응물은 삼메틸갈륨과 암모니아를 사용하는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 사파이어 기판은 a(1120)이면 m(1110)면, c(001)면 R(1012)면 또는 이들면에 대해 3~10° 기울어진 단결정을 사용하는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 질화알루미늄 완충막은 1100~1850℃ 온도에서 암모니아를 사용하며 제조되는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 레이저 빔은 기판표면에 평행하게 조사하는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 레이저 빔은 기판표면에 비스듬하게 조사하는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 레이저 빔은 기판표면에 수직하게 조사하는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항에 있어서 상기 레이저 빔은 기판표면에 평행 그리고 수직하게 조사하는 것을 특징으로 하는 질화갈륨 적층막의 제조방법.
- 제1항의 조사방법에 따른 2~3μm 두께의 육각형 결정구조를 갖는 청색발광성 질화갈륨 적층막.
- 제12항에 있어서 상기 질화갈륨 적층막의 조성은 GamAlnNm(1-x)이고, 광증착된 표면층은 GamAlnNm(1-x)(이때, 0≤n≤m이고, 0≤x〈0.07)임.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940020711A KR960007835A (ko) | 1994-08-22 | 1994-08-22 | 청색 발광성 질화갈륨 적층막의 제조방법 |
AU80380/94A AU679277B2 (en) | 1994-08-22 | 1994-12-13 | A process for growth of gallium nitride |
DE4447177A DE4447177A1 (de) | 1994-08-22 | 1994-12-30 | Verfahren zum heteroepitaxischen Wachstum von blaues Licht emittierendem Galliumnitrid |
JP7015496A JPH0878728A (ja) | 1994-08-22 | 1995-01-05 | 青色発光窒化ガリウムのヘテロエピタキシャル成長方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940020711A KR960007835A (ko) | 1994-08-22 | 1994-08-22 | 청색 발광성 질화갈륨 적층막의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960007835A true KR960007835A (ko) | 1996-03-22 |
Family
ID=19390878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940020711A KR960007835A (ko) | 1994-08-22 | 1994-08-22 | 청색 발광성 질화갈륨 적층막의 제조방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH0878728A (ko) |
KR (1) | KR960007835A (ko) |
AU (1) | AU679277B2 (ko) |
DE (1) | DE4447177A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100287362B1 (ko) * | 1997-11-21 | 2001-05-02 | 박호군 | 이온빔을이용한산화물기판표면의전처리방법및이를이용한질화물박막형성방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3347002B2 (ja) * | 1996-11-08 | 2002-11-20 | 株式会社東芝 | 半導体発光素子の製造方法 |
JP2002374003A (ja) * | 2001-06-14 | 2002-12-26 | Ngk Insulators Ltd | 半導体素子、及び半導体素子用基板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2631285B2 (ja) * | 1987-01-31 | 1997-07-16 | 豊田合成 株式会社 | 窒化ガリウム系化合物半導体の気相成長方法 |
JP2829319B2 (ja) * | 1988-09-16 | 1998-11-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
JP2704181B2 (ja) * | 1989-02-13 | 1998-01-26 | 日本電信電話株式会社 | 化合物半導体単結晶薄膜の成長方法 |
JP3026087B2 (ja) * | 1989-03-01 | 2000-03-27 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体の気相成長方法 |
JPH03183173A (ja) * | 1989-12-13 | 1991-08-09 | Canon Inc | 光学素子 |
JPH04187597A (ja) * | 1990-11-22 | 1992-07-06 | Matsushita Electric Ind Co Ltd | 窒化ガリウム薄膜の製造方法 |
JPH088217B2 (ja) * | 1991-01-31 | 1996-01-29 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体の結晶成長方法 |
-
1994
- 1994-08-22 KR KR1019940020711A patent/KR960007835A/ko not_active Application Discontinuation
- 1994-12-13 AU AU80380/94A patent/AU679277B2/en not_active Ceased
- 1994-12-30 DE DE4447177A patent/DE4447177A1/de not_active Withdrawn
-
1995
- 1995-01-05 JP JP7015496A patent/JPH0878728A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100287362B1 (ko) * | 1997-11-21 | 2001-05-02 | 박호군 | 이온빔을이용한산화물기판표면의전처리방법및이를이용한질화물박막형성방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH0878728A (ja) | 1996-03-22 |
AU679277B2 (en) | 1997-06-26 |
AU8038094A (en) | 1996-03-14 |
DE4447177A1 (de) | 1996-02-29 |
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